JPH0516268B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for manufacturing a coreless armature coil in which the ends of the coil wires of an inner layer coil and an outer layer coil are electrically connected at the end face of the coil. It is related to.

[Prior Art] Conventionally, in the manufacturing method of this type of coil,
The inner layer coil 1 and the outer layer coil 2 are overlapped as shown in FIG. However, the ends of the coil wires 3 of the inner and outer layer coils 1 were electrically connected to produce a cylindrical coil.

[Problems to be Solved by the Invention] However, in such a conventional example, when a positional shift (hereinafter referred to as a phase shift) of the coil wire 3 in the circumferential direction occurs between the inner and outer layer coils 1 and 2 as shown in FIG. , a rectangular connecting line 4 as shown in FIG.
When the connecting wire 4 is placed on the end face of the coil, the connection wire 4 comes into contact with the coil strands 3 adjacent in the circumferential direction, causing a problem of rare short. So connecting line 4
One possible method is to make the wire thinner to ensure electrical connection, but ideally it is better to use a connecting wire 4 with the same area as the coil wire 3 in order to reduce the electrical resistance of this connecting portion. On the other hand, there was a problem in that the cross-sectional area of the connecting wire 4 became too small and the electrical resistance at the connecting portion increased too much. In addition, in order to prevent the above-mentioned rare shot, a method of deforming the shape of the connecting wire 4 according to the phase shift may be considered, but this requires a large deformation compared to the shape of the connecting wire 4, which greatly reduces the productivity. There was a problem that made it worse.

The present invention is an attempt to solve the above-mentioned problems, and its purpose is to prevent the coil end face from being dislocated even when the arrangement precision of the coil wires in the circumferential direction is poor and a slight phase shift occurs. The electrical connection of the coil wires of the inner and outer layer coils can be made well, and the electrical connection of the coil wires can be made simultaneously for all the coil wires, increasing the speed and improving reliability and mass productivity. The present invention provides a method for manufacturing a coreless armature coil.

[Means for Solving the Problems] In order to achieve the above object, the method for manufacturing a coreless armature coil according to the present invention includes electrically connecting the ends of the coil wires of the inner layer coil and the outer layer coil at the end face of the coil. In the method of manufacturing a coreless armature coil that is connected to each other, a step of forming a conductive layer 6 over the entire end face of the coil across the inner and outer layer coils 1 and 2, and a step of forming a conductive layer 6 on the surface of the conductive layer 6 The surface of the resist film 7 is scanned with a spot beam according to the arrangement state of the coil wires 3 to partially expose the required resist film 7, and then developed to expose the coil wires 3 adjacent to each other in the circumferential direction. A step of removing the exposed resist film 7 leaving only the connecting wire 4 between the inner and outer coil wires 3 facing each other, and removing the conductive layer 6 from which the resist film 7 has been removed by etching. It consists of a process.

[Function] Thus, the conductor layer 6 is formed over the entire coil end face of the inner and outer layer coils 1 and 2, and the surface of the resist film 7 formed on the surface of the conductor layer 6 is exposed to the coil wire 3 with a spot beam. The required resist film 7 is partially exposed to light by scanning according to the arrangement state of the resist film 7, and then developed to expose the areas between the coil wires 3 that face each other inside and outside among the coil wires 3 adjacent in the circumferential direction. The exposed resist film 7 is removed leaving only the connecting wire 4, and the conductor layer 6 from which the resist film 7 has been removed is removed by etching to form the coil wires 3 of the inner and outer coils 1 and 2. A connecting line 4 having a desired shape is formed in between.

[Examples] Hereinafter, the present invention will be described in detail based on illustrated examples.

First, manufacturing of the inner and outer layer coils 1 and 2 will be explained. First, as shown in Fig. 3, the coil wire 3, which has been pre-curved and cut into a C-shape, is wound around the core bar 8, and then the shape of the coil wire 3 when the coil is formed is determined. The coil wire 3 is pressed using matched upper and lower coil forming punches 9 and 10 while being guided by an outer diameter guide 11 to form a coil wire 3 having a shape as shown in FIG. Here, FIGS. 5 and 6 show an example of press-forming a plurality of coil wires 3 at the same time. In either case, a rectangular wire is used as the coil wire 3, and a rectangular wire is used as the coil wire 3. For example, an epoxy adhesive coating is provided. Next, one or more coil wires 3 as shown in FIG. 4 or 6 are combined, as shown in FIG. 7,
Alcohol is applied while applying pressure from above and below using upper and lower coil forming punches 9 and 10 having the same shape as in FIG. 3 or 5, and these are bonded by a fusion film,
Furthermore, by sequentially combining one or more coil wires 3 as shown in FIG. 4 or FIG. 6 to this, two half-coil bodies 1 as shown in FIG.
2, 12 are formed. After joining these semi-coiled bodies 12, 12, the joining surfaces are glued, and the inner diameter is approximately equal to the outer diameter of the inner layer coil 1 as shown in FIG. 9 and the inner layer coil 1 as shown in FIG. 10. These inner and outer layer coils 1 and 2 are combined to form a coil C as shown in FIG. 11. Note that in the present invention, the coil may be formed by a method other than the above-described coil C forming method, for example, by spiral winding, but in the case of the above method, the coil wire 3 does not sag;
It is possible to form a coil with uniform phase.

Next, an embodiment of the method of connecting the coil wire 3 at the end face of the coil C according to the present invention will be described.

First, a metal material such as copper or aluminum is plated or spun over the entire circumference of the end face of the coil C where the end face of the bare coil wire 3 is exposed, covering both the inner and outer layer coils 1 and 2. Coating is performed by a method such as ivy coating or vapor deposition to form a ring-shaped conductive layer 6 as shown in FIG. 2a. At this time, instead of the above-mentioned coating method, a thin metal ring is placed on the end face of the coil C and bonded to the end face of the coil C by a method such as full surface soldering or ultrasonic pressure welding.
A conductor layer 6 as shown in Figure a may be formed. Next, a suitable resist film 7 is coated on the surface of this conductor layer 6, and the surface of this resist film 7 is scanned with a pot beam of laser light or the like according to the arrangement state of the coil wires 3. expose to light. Subsequently, this is developed and the resist film 7 in the exposed area is removed as shown in FIG. The resist film 7 is removed, leaving only the resist film 7 at the required connection line 4 portion. In other words, among the coil wires 3 adjacent in the circumferential direction, the exposed portion (corresponding to the joint portion of the coil wires 3 adjacent in the circumferential direction) leaving 4 portions of the connecting wires between the coil wires 3 facing each other inside and outside. The resist film 7 in the exposed portion) is removed. Therefore, as shown in FIG.
The surface of the conductive layer 6 where the resist film 7 is left is etched by chemical etching, sputter etching, etc., and the portion of the conductive layer 6 where the resist film 7 has been removed is removed as shown in FIG. As shown in FIG. here,
The resist film 7 in the above etching process can be left as it is without causing any functional problems.

In addition, if it is desired to add an encoder function or the like in the present invention, the conductive layer 6 is formed to extend to the inner surface of the coil C, and scanning exposure of this extended portion is performed at equal pitches in the circumferential direction. As a result, a highly accurate encoder slit portion E can be easily formed as shown in FIG. 2d. In addition, after first applying a resist film to the end face of the coil, the necessary portions are subjected to beam scan exposure, and after this is developed, a conductive metal film is coated with plating or the like to obtain the required connection wire 4. It is also possible to do so.

[Effects of the Invention] As described above, the present invention includes a step of forming a conductor layer over the entire end face of the coil, including the inner and outer layers of the coil, and applying a spot beam to the surface of the resist film formed on the surface of the conductor layer. The required resist film is partially exposed to light by scanning according to the arrangement state of the wires, and then developed to form a connection line between the coil wires that face each other on the inside and outside among the coil wires adjacent in the circumferential direction. This process includes the step of removing the resist film in the exposed area leaving only the exposed part, and the step of etching the conductor layer part from which this resist film has been removed.In other words, the inner layer coil and the outer layer coil To form the connection wire portion that connects the wires, first, a conductor layer is formed over the entire end face of the coil, covering both the inner and outer layers of the coil, and the conductor layer is scanned with a spot beam according to the arrangement of the coil wires. In a coreless armature coil formed by connecting the coil wires of the inner and outer layer coils, in order to partially expose the resist film formed on the surface to form the connecting wire part, Even if the arrangement or pitch of the coil wires is not uniform, it is possible to reliably form the connecting wire portion without shorting adjacent coil wires by scanning with the spot beam. Even if the arrangement precision of the coil wires in the circumferential direction is poor and a phase shift occurs, as long as the phase shift does not exceed the width of one coil wire, the coil wires are always aligned. It is possible to connect between wires, and has the effect of improving the reliability of coil wire connections.
In addition, since the connection of the coil wires of the inner and outer layer coils can be performed for all the coil wires at the same time, the connection process can be sped up.Furthermore, the resist film in the exposed part can be removed to form the connection wire part. It is possible to connect the inner layer coil and the outer layer coil, and the mechanical connection is completed by the conductor layer by etching and forming the connection line part, which improves productivity. This has an effect that can be improved, and furthermore, it has an effect that it is possible to add an encoder function etc. very easily.

[Brief explanation of the drawing]

Fig. 1a is a perspective view of a conventional coil, Fig. 1b is an enlarged perspective view of important parts of the end face of the same coil, Fig. 1c is an enlarged top view of important parts of the end face of the same coil, Fig. 2a
1 is an enlarged perspective view of a main part during the formation of a conductor layer according to an embodiment of the present invention, FIG. Cross-sectional view, Figure d is an enlarged cross-sectional view of the main part when etching is completed, Figure e is an enlarged perspective view of the main part when the connection line is completed (etching is completed), Figure f is
3 is a scaled-down perspective view of the same coil wire forming process as above, and FIG. 4 is a scaled-down perspective view of the coil wire after forming the same as above. , Fig. 5 and Fig. 6 are a reduced perspective view of the coil strand forming process when a plurality of coil strands are simultaneously formed as above, and a reduced perspective view of the coil strand after forming, and Fig. 7 is a reduced perspective view of the coil strand formed as above. Figure 8 is a scaled-down perspective view of the two completed half-coil bodies of the same as above, Figure 9 is a scaled-down perspective view of the outer layer coil of the same, and Figure 10 is a scaled-down perspective view of the same as the above outer layer coil. FIG. 11 is a reduced perspective view of the coil, in which 1 is an inner layer coil, 2 is a reduced perspective view of the coil;
is the outer layer coil, 3 is the coil wire, 4 is the connection wire, 6
7 is a conductor layer, 7 is a resist film, and C is a coil.

Claims (1)

[Claims] 1. In a method for manufacturing a coreless armature coil in which the coil wire ends of an inner layer coil and an outer layer coil are electrically connected at the coil end surface, a conductor is formed over the entire coil end surface across the inner and outer layer coils. The process involves forming a layer, scanning the surface of the resist film formed on the surface of this conductor layer with a spot beam according to the arrangement state of the coil wires, exposing the desired resist film partially to light, and then developing it. a step of removing the resist film from the exposed portions of the coil wires that are adjacent to each other in the circumferential direction, leaving the connection line portion between the inner and outer coil wires facing each other; and the conductor layer portion from which this resist film has been removed. 1. A method for manufacturing a coreless armature coil, comprising the step of removing by etching.