JPH01308006A - Method of connecting coil to circuit board - Google Patents
Method of connecting coil to circuit boardInfo
- Publication number
- JPH01308006A JPH01308006A JP14011388A JP14011388A JPH01308006A JP H01308006 A JPH01308006 A JP H01308006A JP 14011388 A JP14011388 A JP 14011388A JP 14011388 A JP14011388 A JP 14011388A JP H01308006 A JPH01308006 A JP H01308006A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- terminal
- winding
- terminals
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 7
- 238000004804 winding Methods 0.000 claims abstract description 11
- 235000007164 Oryza sativa Nutrition 0.000 claims description 3
- 235000009566 rice Nutrition 0.000 claims description 3
- 240000007594 Oryza sativa Species 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000010030 laminating Methods 0.000 abstract description 4
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 230000002950 deficient Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 241000209094 Oryza Species 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Landscapes
- Insulation, Fastening Of Motor, Generator Windings (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
モータ等の駆動回路の回路基板、特にモータ等のコイル
を回路基板上に接続する技術に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a circuit board for a drive circuit such as a motor, and particularly to a technique for connecting a coil of a motor or the like onto the circuit board.
モータ例えばVTR用等に多用されているローターとス
テーターの平面対向型(フラット型)モータのコイルの
技術として、
】 銅線をおむすび型に巻回したおむすび型コイii
モータの平偏化を図ったフレキシブルプリントを利用
したシート状のコイル
iii 特に近年ここ数年の間に開発されたラミネー
ト型コイルがある。Coil technology for flat-type rotor and stator motors, which are often used in VTRs, is the following: ] Rice-ball-shaped coil coils made of copper wire wound in a rice-ball shape.
Sheet-shaped coils using flexible printing to flatten the motor III In particular, there are laminate-type coils that have been developed over the past few years.
上記各コイルはそれぞれ一長一短あり、その中で上記ラ
ミネート型コイルは占積率が高(高トルクが得られ、シ
ートコイル等に比較して単価Co5tが安い等の多くの
メリットがある。Each of the above-mentioned coils has its own advantages and disadvantages, and among them, the above-mentioned laminated coil has many advantages such as a high space factor (high torque can be obtained) and a lower unit price of Co5t than sheet coils.
〔発明が解決しようとしている問題点〕しかしながら音
響機器・映像機器を用途した場合のラミネートコイルの
コイル膜厚はlO〜100μ程度であり、巻回積層によ
る占積率の向上の反面、膜厚が極く薄いため回路基板へ
の端末接続に解決すべき問題を有していた。[Problem to be solved by the invention] However, the coil thickness of a laminated coil when used in audio equipment and video equipment is about 10 to 100μ, and while the space factor is improved by laminating the windings, the film thickness is Because it was extremely thin, there were problems that needed to be solved in connecting the terminal to the circuit board.
ラミネート型コイルの端末接続を開示した資料として特
開昭63−13305号がある。JP-A-63-13305 is a document that discloses terminal connections of laminated coils.
上記公報に係る技術はコイルの外周面及び又は内周面に
コイルの厚み方向に延在される棒状端子部を一体的に配
設するようにしたものである。上記公報に示された端末
接続に依ればコイルの巻回開始と終端を棒状端子部とし
ており、コイル表面と棒状端子部との接触面積が小さく
なったり、更に又は導通不良を生じる可能性がある。こ
れを防ぐために導電性接着剤を用いる必要が生じる0又
、導電性接着剤の補強としてさらにその上に接着剤を用
いる必要がある。The technique according to the above-mentioned publication is such that a rod-shaped terminal portion extending in the thickness direction of the coil is integrally disposed on the outer circumferential surface and/or the inner circumferential surface of the coil. According to the terminal connection shown in the above publication, the start and end of the winding of the coil are made into rod-shaped terminals, and there is a possibility that the contact area between the coil surface and the rod-shaped terminals becomes small, or that poor continuity occurs. be. In order to prevent this, it is necessary to use a conductive adhesive, and it is also necessary to use an adhesive on top of the conductive adhesive to reinforce it.
また、棒状端子部を設ける際、コイルに直接熱等の外力
が加わることになり、短絡、変形等悪影響をおよぼすこ
とがあった。Further, when providing the rod-shaped terminal portion, an external force such as heat is directly applied to the coil, which may cause adverse effects such as short circuit and deformation.
〔問題点を解決するための手段(及び作用)〕本発明に
よれば、コイルの巻き始め端と巻き終り端を折曲して端
子部と成し、前記端子部を回路基板上に植設した回路端
子に接続するようにしたこにより接続時にコイルに直接
外力が加わることを防止したものである。[Means for solving the problem (and operation)] According to the present invention, the winding start end and winding end of the coil are bent to form a terminal part, and the terminal part is implanted on a circuit board. This prevents external force from being applied directly to the coil during connection by connecting it to the circuit terminal.
第1図は、本発明の特徴を最もよく表わす図面であり、
同図に於いてlは導電層と絶縁層を略おむすび型に巻回
積層し作成したコイル、2は前記コイルの巻き始め端を
折曲した端子部、3は前記コイルの巻き終わり端を折曲
した端子部、4は基板、5a。FIG. 1 is a drawing that best represents the features of the present invention,
In the figure, 1 is a coil made by winding and laminating a conductive layer and an insulating layer in a roughly rice ball shape, 2 is a terminal portion by bending the starting end of the coil, and 3 is a terminal portion by folding the ending end of the coil. The bent terminal part, 4 is the board, 5a.
5b、 5c、 5dは前記基板4上に設けたパターン
ランド部、6a、6b、6c、6dは基板側に設けた板
バネ状端子である。5b, 5c, and 5d are pattern land portions provided on the substrate 4, and 6a, 6b, 6c, and 6d are leaf spring-like terminals provided on the substrate side.
次に上記構成、作用を説明する。Next, the above configuration and operation will be explained.
絶縁機能を有した接着剤層がコートされている導電性の
良好な金属箔を所要の回数巻回積層したコイルlの巻き
始め端と巻き終わり端を所要の幅、厚さが得られるよう
数回折返し端子部2.3を成す。The starting and ending ends of the coil L are made by winding and laminating a metal foil with good conductivity coated with an adhesive layer with an insulating function the required number of times so as to obtain the required width and thickness. It forms the diffraction return terminal portion 2.3.
ここで、端子表面は導電層である。Here, the terminal surface is a conductive layer.
以上の工程で得られた全体番コイル部とする。This is the overall size coil section obtained through the above steps.
次に、基板4上に設けたパターンランド部5aに、第2
図に示すようなくの字形状の端子6aを半田付は固定す
る。Next, a second
As shown in the figure, the dogleg-shaped terminal 6a is fixed by soldering.
同様にしてパターンランド部5bに端子6bを固定する
。Similarly, the terminal 6b is fixed to the pattern land portion 5b.
上記端子6a、 6b間に、A<Bなる厚さの前記端子
部2を押し入ることにより、6a、6b屈曲部のバネ作
用が生じ、端子2を挟持する。By pushing the terminal portion 2 having a thickness such that A<B between the terminals 6a and 6b, a spring action of the bent portions 6a and 6b is generated to sandwich the terminal 2.
同様にパターンランド部5cに端子6Cを半田付は固定
し、またパターンランド部5dに端子6dを半田付は固
定することにより、前記端子6c、 6a間にコイル
部端子3を挟持することができる。Similarly, by soldering and fixing the terminal 6C to the pattern land 5c, and by soldering and fixing the terminal 6d to the pattern land 5d, the coil terminal 3 can be held between the terminals 6c and 6a. .
以上のように外部接続用端子2,3をコイルを製造する
ための金属箔を使って形成することにより、端子を形成
するための銅棒などの別部材及びその部材を銅箔に接続
するための半田付は等の工程が不要になり、かつ製造コ
ストがあまりかからない。By forming the external connection terminals 2 and 3 using metal foil for manufacturing the coil as described above, it is possible to connect another member such as a copper rod for forming the terminal and that member to the copper foil. This eliminates the need for soldering and other processes, and reduces manufacturing costs.
また基板への接続時にコイルl自体に力が加わらないた
め、変形等の心配がなく、信頼性が向上した。Furthermore, since no force is applied to the coil l itself when connected to the board, there is no need to worry about deformation, improving reliability.
また、板バネ状端子を使って基板に接続することにより
、押し込むという操作のみのため、半田付は等の工程を
ふまずにすみ、組立操作の行い易さ及び作業工数の低減
や部品点数の減少等にともない生産性が向上した。In addition, by connecting to the board using a leaf spring-like terminal, the operation of pushing it in is only required, eliminating the need for soldering and other steps, making assembly operations easier, reducing work man-hours, and reducing the number of parts. Productivity improved as a result of this reduction.
なお、上記実施例において、コイル形状を略おむすび型
としたが、上記形状に限られるものではなく、例えば丸
型・角型等でもよい。In the above embodiments, the coil shape is approximately rice ball shape, but the shape is not limited to the above shape, and may be, for example, round or square.
また、上記実施例において、コイル端子部には、数回折
り返す方法を用いたが、前記形状に限られるものではな
(、例えば丸形、異形に数回巻回してもよい。Further, in the above embodiments, the coil terminal portion is folded several times, but the shape is not limited to the above-mentioned shape (for example, the coil terminal portion may be wound several times in a round shape or an irregular shape).
さらに、上記実施例においては、基板にバネ性端子部を
設け、コイル端子部をさし込むという方式であるが、コ
イル端子部を半田付は等で直接端子部に接続してもよい
。Further, in the above embodiment, a spring terminal section is provided on the board and a coil terminal section is inserted into the substrate, but the coil terminal section may be directly connected to the terminal section by soldering or the like.
以上説明したようにコイルの巻き始め端と巻き終り端を
折曲して端子部と成し、前記端子部を回路基板上に植設
した回路端子に接続するようにしたことにより、半田付
は接着剤等の工程をふまず前記端子部を作成することが
でき、また接続も非常に簡単であり、製造コスト・生産
性が向上し、かつ回路基板に端子部を接続する際、コイ
ル自体にはほとんど外力が加わる心配がないため、コイ
ルの不良が低減するという効果がある。As explained above, by bending the winding start end and the winding end end of the coil to form a terminal part, and connecting the terminal part to the circuit terminal implanted on the circuit board, soldering is possible. The terminal section can be created without using adhesives or other processes, and connection is also very simple, improving manufacturing costs and productivity. Since there is almost no need to worry about external force being applied, this has the effect of reducing coil defects.
第1図は本発明を実施したコイルと回路基板の接続方法
を示した斜視図、
第2図は回路基板上に植設した回路端子の斜視図である
。
lはコイル、2,3は端子部、4は回路基板、5a。
5b、5c、5dはパターンランド部、6a、 6b
、 6c。
6dは回路端子。
出願人 キャノン株式会社 −FIG. 1 is a perspective view showing a method of connecting a coil and a circuit board according to the present invention, and FIG. 2 is a perspective view of a circuit terminal implanted on the circuit board. 1 is a coil, 2 and 3 are terminal parts, 4 is a circuit board, and 5a. 5b, 5c, 5d are pattern land parts, 6a, 6b
, 6c. 6d is a circuit terminal. Applicant Canon Co., Ltd. −
Claims (1)
イル形状と成し、前記コイルの巻き始め端と巻き終り端
を折曲して端子部と成し、前記端子部を回路基板上に植
設した回路端子に接続するようにしたことを特徴とする
コイルと回路基板の接続方法。(1) A conductive wire is wound and laminated in a substantially rice ball shape or a circular shape to form a coil shape, the winding start end and the winding end end of the coil are bent to form a terminal part, and the terminal part is connected to a circuit. A method for connecting a coil and a circuit board, characterized in that the coil is connected to a circuit terminal planted on the board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14011388A JPH01308006A (en) | 1988-06-07 | 1988-06-07 | Method of connecting coil to circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14011388A JPH01308006A (en) | 1988-06-07 | 1988-06-07 | Method of connecting coil to circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01308006A true JPH01308006A (en) | 1989-12-12 |
Family
ID=15261218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14011388A Pending JPH01308006A (en) | 1988-06-07 | 1988-06-07 | Method of connecting coil to circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01308006A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0662508U (en) * | 1992-09-10 | 1994-09-02 | 株式会社三協精機製作所 | Air core coil |
-
1988
- 1988-06-07 JP JP14011388A patent/JPH01308006A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0662508U (en) * | 1992-09-10 | 1994-09-02 | 株式会社三協精機製作所 | Air core coil |
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