JPH0515979B2 - - Google Patents
Info
- Publication number
- JPH0515979B2 JPH0515979B2 JP62268974A JP26897487A JPH0515979B2 JP H0515979 B2 JPH0515979 B2 JP H0515979B2 JP 62268974 A JP62268974 A JP 62268974A JP 26897487 A JP26897487 A JP 26897487A JP H0515979 B2 JPH0515979 B2 JP H0515979B2
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- refrigerator
- cryogenic
- sample
- control body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012360 testing method Methods 0.000 claims description 23
- 230000008018 melting Effects 0.000 claims description 20
- 238000002844 melting Methods 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 16
- 229910000634 wood's metal Inorganic materials 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 239000002470 thermal conductor Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 11
- 238000007710 freezing Methods 0.000 description 5
- 230000008014 freezing Effects 0.000 description 5
- 230000005856 abnormality Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 241000951490 Hylocharis chrysura Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Description
【発明の詳細な説明】
≪産業上の利用分野≫
本発明は、極低温冷凍機を用いた温度試験装置
に関し、特に、試料を極低温状態から高温状態ま
での温度領域に置いて試験を行なえるようにした
極低温試験装置に関する。[Detailed Description of the Invention] <<Industrial Application Field>> The present invention relates to a temperature testing device using a cryogenic refrigerator, and in particular, to a temperature testing device that uses a cryogenic refrigerator to conduct a test by placing a sample in a temperature range from a cryogenic state to a high temperature state. The present invention relates to a cryogenic testing device designed to
≪従来技術≫
極低温冷凍機を用いた従来の極低温試験装置
は、真空槽内に極低温冷凍機の出力部と試料支持
部とを配置し、冷凍機の出力部と試料支持部に支
持された試料とを可撓性の熱伝導材で連結するこ
とにより、試料を室温(300K)から極低温
(10K)の範囲で冷却可能にし、試料の温度を一
定に保持するために試料部にヒータを配置し、所
定の温度範囲内で試料を一定温に保持して試験を
行うように構成してあつた。<<Prior Art>> A conventional cryogenic testing device using a cryogenic refrigerator places the output part of the cryogenic refrigerator and the sample supporting part in a vacuum chamber, and the output part of the cryogenic refrigerator and the sample supporting part are supported by the cryogenic refrigerator. By connecting the sample with a flexible thermally conductive material, the sample can be cooled from room temperature (300K) to extremely low temperature (10K). A heater was arranged to maintain the sample at a constant temperature within a predetermined temperature range and conduct the test.
この場合、冷凍機の構成部品の材質や構造は低
温時を基準に選定されることから、極低温冷凍機
の場合には、略340Kになると構成材料の耐熱性
の問題や熱膨脹の影響が現われるため運転不能と
なつたり、冷凍機が損傷したりすることがある。 In this case, the materials and structure of the components of the refrigerator are selected based on the low temperature, so in the case of cryogenic refrigerators, problems with the heat resistance of the component materials and the effects of thermal expansion appear when the temperature reaches approximately 340K. This may cause the refrigerator to become inoperable or cause damage to the refrigerator.
そこで従来、誤操作等により試料側から冷凍機
側に熱が伝達されて冷凍機が温度上昇するのを防
止するために、熱伝達量の微少な熱伝達材(例え
ば0.5mmφの銅線束)で試料部と冷凍機の出力部
とを連結するようにしていた。 Conventionally, in order to prevent heat from being transferred from the sample side to the refrigerator side due to incorrect operation, etc. and causing the temperature of the refrigerator to rise, a heat transfer material with a small amount of heat transfer (for example, a 0.5 mm diameter copper wire bundle) was used to The section was connected to the output section of the refrigerator.
≪解決しようとする問題点≫
ところが、熱伝達量の小さな熱伝達材を使用し
て冷凍機の出力部と試料とを連結した場合には、
冷却時での熱伝達の効率が悪く、目標温度を得る
ために長時間を必要とするだけでなく、冷凍機の
冷凍能力を有効に使えないという問題があつた。≪Problem to be solved≫ However, when the output part of the refrigerator and the sample are connected using a heat transfer material with a small amount of heat transfer,
There was a problem in that the heat transfer efficiency during cooling was poor, not only did it take a long time to obtain the target temperature, but also the freezing capacity of the refrigerator could not be used effectively.
また、熱伝達量を多くした場合には、試料側か
らの高熱が冷凍機に伝達された場合に、冷凍機が
急速に温度上昇して損傷するという問題がある。 Furthermore, when the amount of heat transfer is increased, there is a problem that when high heat from the sample side is transferred to the refrigerator, the temperature of the refrigerator rapidly rises and is damaged.
≪問題点を解決するための手段≫
本発明は、冷凍機の冷凍能力を有効に利用でき
るものでありながら、試料側からの高熱が冷凍機
に伝わらないようにしたもので、そのために、冷
凍機の出力部と試料とを連結する伝熱系路の途中
に、低温時には熱伝導率が高くなり、高温時には
熱伝導率が低くなる素材(例えばサフアイヤ材)
からなる伝熱制御体を配置し、この伝熱制御体と
冷凍機出力部との間にウツドメタル等の低融点金
属を介装したことを特徴とするものである。≪Means for Solving the Problems≫ The present invention makes it possible to effectively utilize the freezing capacity of the refrigerator while preventing high heat from the sample side from being transmitted to the refrigerator. In the middle of the heat transfer path that connects the output part of the machine and the sample, use a material that has high thermal conductivity at low temperatures and low thermal conductivity at high temperatures (e.g. sapphire material).
A heat transfer control body consisting of the above is disposed, and a low melting point metal such as wood metal is interposed between the heat transfer control body and the output section of the refrigerator.
≪作用≫
本発明では、冷凍機の出力部と試料とを連結す
る伝熱系路の途中に、低温時には熱伝導率が高く
なり、高温時には熱伝導率が低くなる素材(例え
ばサフアイヤ材)からなる伝熱制御体を配置し、
この伝熱制御体と冷凍機出力部との間にウツドメ
タル等の低融点金属を介装しているので、冷凍機
による吸熱量がヒーターからの入熱量よりも大き
い試料冷却時には熱移動が効率良く行なえるもの
でありながら、冷凍機の運転停止時や装置に異常
が発生して試料側からの高熱が冷凍機側に流れよ
うとした場合に伝熱制御体で熱移動が制限される
ことから、冷凍機が温度上昇することがなくな
る。また、試料側から冷凍機側に流れる熱が一定
温以上になると、低融点金属が溶融して冷凍機へ
熱流入を阻止するから、冷凍機の高熱による損傷
を防止する。<<Operation>> In the present invention, a material (such as sapphire material) that has high thermal conductivity at low temperatures and low thermal conductivity at high temperatures is used in the heat transfer path connecting the output part of the refrigerator and the sample. A heat transfer control body is arranged,
Since a low melting point metal such as wood metal is interposed between this heat transfer control body and the output part of the refrigerator, heat transfer is efficient when cooling the sample where the amount of heat absorbed by the refrigerator is greater than the amount of heat input from the heater. However, if the refrigerator stops operating or an abnormality occurs in the equipment and high heat from the sample side attempts to flow to the refrigerator, the heat transfer control body will restrict heat transfer. , the temperature of the refrigerator will not rise. Furthermore, when the heat flowing from the sample side to the refrigerator side reaches a certain temperature or higher, the low melting point metal melts and blocks the heat from flowing into the refrigerator, thereby preventing damage to the refrigerator due to high heat.
≪実施例≫
図面は本発明の実施例を示し、第1図は極低温
試験装置の概略構成図、第2図は第1図A部拡大
図、第3図は第1図B部拡大図である。≪Example≫ The drawings show examples of the present invention, in which Fig. 1 is a schematic diagram of the cryogenic test equipment, Fig. 2 is an enlarged view of part A in Fig. 1, and Fig. 3 is an enlarged view of part B in Fig. 1. It is.
図において、1は極低温冷凍機、2は温度試験
装置であり、極低温冷凍機1の出力部3と温度試
験装置2の下部に保持された試料4とは真空室5
内で熱伝導材6で連結されている。 In the figure, 1 is a cryogenic refrigerator, 2 is a temperature testing device, and the output section 3 of the cryogenic refrigerator 1 and the sample 4 held at the bottom of the temperature testing device 2 are connected to a vacuum chamber 5.
They are connected by a heat conductive material 6 inside.
熱伝導材6は可撓性を有する熱良導体(例え
ば、銅、アルミニユーム)で構成されており、そ
の途中に伝熱規制具7が設けてある。 The thermally conductive material 6 is made of a flexible thermally conductive material (for example, copper or aluminum), and a heat transfer restrictor 7 is provided in the middle thereof.
この伝熱規制具7は、サフアイヤ材等の高温時
には熱伝導率が低いが低温時には熱伝導率が高く
なる特性を有する素材で構成された伝熱制御体8
と、ウツドメタル等の低融点金属9とを具備して
なり、冷凍機1の出力部3から導出した熱伝導材
6aの先端部を埋没させている低融点金属9をケ
ーシング10に固着するとともに、棒状に形成し
た伝熱制御体8を熱良導体で形成したケーシング
10に固定ネジ11で圧着固定することにより、
冷凍機側熱伝導材6aと伝熱制御体8とを低融点
金属9及びケーシング10を介して熱伝導可能に
連結してある。そして、伝熱規制具7のケーシン
グ10における低融点金属保持部の底部には溶融
金属流出孔12が開口形成してある。 The heat transfer regulator 7 is a heat transfer controller 8 made of a material such as sapphire material that has low thermal conductivity at high temperatures but high thermal conductivity at low temperatures.
and a low melting point metal 9 such as wood metal, and the low melting point metal 9 in which the tip of the thermally conductive material 6a led out from the output section 3 of the refrigerator 1 is embedded is fixed to the casing 10, By crimping and fixing the rod-shaped heat transfer control body 8 to the casing 10 made of a good thermal conductor with fixing screws 11,
The refrigerator side heat conductive material 6a and the heat transfer control body 8 are connected via a low melting point metal 9 and a casing 10 so as to be heat conductive. A molten metal outflow hole 12 is formed at the bottom of the low melting point metal holding portion in the casing 10 of the heat transfer regulator 7.
伝熱制御体8と試料4とは試料側熱伝導材6b
で連結されている。また、温度試験装置2の試料
保持部には試料温度制御用ヒータ13が配置して
あり、試料保持部に保持されて温度試験装置2内
に内封されている試料4を加温できるように構成
してある。 The heat transfer control body 8 and the sample 4 are the sample side heat conductive material 6b.
are connected. In addition, a sample temperature control heater 13 is arranged in the sample holding section of the temperature test device 2, so that the sample 4 held in the sample holding section and sealed inside the temperature test device 2 can be heated. It is configured.
また、冷凍機1の出力部3における熱伝導材6
との連結は、第3図に示すように、冷凍機側熱伝
導材6aの冷凍機側端部をインジユーム板14と
低融点金属板15で挟持した状態で取付ボルト1
6により出力部3に固定されている。 In addition, the heat conductive material 6 in the output section 3 of the refrigerator 1
As shown in FIG. 3, the connection is made with the mounting bolts 1 while the refrigerator side end of the refrigerator side heat conductive material 6a is sandwiched between the indium plate 14 and the low melting point metal plate 15.
6 is fixed to the output section 3.
なお、この冷凍機1の出力部3と熱伝導材6の
連結部においても、熱伝導材6の端部を低融点金
属内に埋没させるようにしてもよい。 In addition, also in the connection part of the output part 3 of this refrigerator 1 and the thermal conductive material 6, the end part of the thermal conductive material 6 may be made to be buried in a low melting point metal.
以上の構成からなる極低温試験装置では、冷凍
機1の出力部3と試料4とを連結する伝熱系路の
途中に、高温時には熱抵抗体となり低温時には熱
良導体となる伝熱制御体8及び低融点金属9が介
在させてあるので、極低温冷凍機1を運転して、
試料4を冷却する際には極低温冷凍機1の冷凍能
力を有効に利用して強力かつ迅速に試料4を冷却
することができるものでありながら、極低温冷凍
機1の運転停止時あるいは装置異常発生時、又は
高温試験時に試料4が高温になることにあつて
も、伝熱制御体8が熱抵抗体として使用すること
からその高温が極低温冷凍機1側に伝達されるこ
となく、また、伝熱規制部での温度が低融点金属
の融点(例えば343K)になると低融点金属が溶
け落ちてしまい試料4と冷凍機1との熱伝達系路
が遮断してしまうので極低温冷凍機1が高温に曝
らされることがなくなり、熱により損傷すること
を阻止することができる。そして、試料4が高温
になつてもその熱が極低温冷凍機1に伝達される
ことがないから、冷凍機1の運転状態のいかんに
かかわらず試料4を温度制御用ヒータ13で昇温
させることができ、温度試験を10K〜600Kの温
度範囲で行うことができる。 In the cryogenic test apparatus having the above configuration, a heat transfer control body 8 is provided in the middle of the heat transfer path connecting the output section 3 of the refrigerator 1 and the sample 4, which becomes a thermal resistor at high temperatures and a good thermal conductor at low temperatures. Since the low melting point metal 9 is interposed, the cryogenic refrigerator 1 is operated,
When cooling the sample 4, the freezing capacity of the cryogenic refrigerator 1 can be effectively used to cool the sample 4 powerfully and quickly. Even if the sample 4 reaches a high temperature when an abnormality occurs or during a high-temperature test, the heat transfer control body 8 is used as a heat resistor, so the high temperature will not be transmitted to the cryogenic refrigerator 1 side. In addition, if the temperature in the heat transfer regulating part reaches the melting point of the low melting point metal (for example 343K), the low melting point metal will melt down and the heat transfer path between the sample 4 and the refrigerator 1 will be cut off, so cryogenic freezing The machine 1 is no longer exposed to high temperatures and can be prevented from being damaged by heat. Even if the sample 4 becomes high temperature, the heat is not transferred to the cryogenic refrigerator 1, so the temperature of the sample 4 is raised by the temperature control heater 13 regardless of the operating state of the refrigerator 1. and temperature tests can be performed in the temperature range of 10K to 600K.
≪効果≫
本発明では、冷凍機の出力部と試料とを連結す
る伝熱系路の途中に、低温時には熱伝導率が高く
なり、高温時には熱伝導率が低くなる素材からな
る伝熱制御体を配置し、この伝熱制御体と冷凍機
出力部との間に低融点金属を介装しているので、
冷凍機による吸熱量がヒーターからの入熱量より
も大きい試料冷却時には熱移動が効率良く行なえ
るものでありながら、冷凍機の運転停止時や装置
に異常が発生して試料側からの高熱が冷凍機側に
流れようとした場合に伝熱制御体で熱移動が制限
されて、冷凍機が温度上昇することはない。<<Effects>> In the present invention, a heat transfer control body made of a material that has high thermal conductivity at low temperatures and low thermal conductivity at high temperatures is installed in the middle of the heat transfer path connecting the output part of the refrigerator and the sample. , and a low melting point metal is interposed between this heat transfer control body and the refrigerator output section.
Although heat transfer can be performed efficiently when cooling the sample where the amount of heat absorbed by the refrigerator is greater than the amount of heat input from the heater, the high heat from the sample side can be frozen when the refrigerator stops operating or an abnormality occurs in the equipment. When the heat tries to flow toward the machine, the heat transfer control body restricts the heat transfer, and the temperature of the refrigerator does not rise.
また、試料側から冷凍機側に流れる熱が一定温
以上になると、低融点金属が溶融して冷凍機への
熱流入を阻止する。 Furthermore, when the heat flowing from the sample side to the refrigerator side reaches a certain temperature or higher, the low melting point metal melts and prevents heat from flowing into the refrigerator.
これにより、本発明では、冷凍機の冷凍能力を
有効に使用できるものでありながら、高温試験時
又は異常発生時等に試料が高温化することがあつ
ても冷凍機を高温で損傷させることのない極低温
試験装置を得ることができる。 As a result, in the present invention, the freezing capacity of the refrigerator can be used effectively, but even if the sample becomes hot during a high temperature test or when an abnormality occurs, it is possible to prevent the refrigerator from being damaged by high temperatures. No cryogenic testing equipment can be obtained.
図面は本発明の実施例を示し、第1図は極低温
試験装置の概略構成図、第2図は第1図A部拡大
図、第3図は第1図B部拡大図である。
1……極低温冷凍機、3……1の出力部、4…
…試料、6……熱伝達材、8……伝熱制御体、9
……低融点金属。
The drawings show an embodiment of the present invention, and FIG. 1 is a schematic configuration diagram of a cryogenic testing apparatus, FIG. 2 is an enlarged view of section A in FIG. 1, and FIG. 3 is an enlarged view of section B in FIG. 1. 1... Cryogenic refrigerator, 3... Output section of 1, 4...
...Sample, 6...Heat transfer material, 8...Heat transfer control body, 9
...Low melting point metal.
Claims (1)
良導体からなる熱伝達材で連結してなる極低温試
験装置において、 低温時には熱伝導率が高くなり、高温時には熱
伝導率が低くなる素材からなる伝熱制御体を伝熱
系路中に配置し、この伝熱制御体と冷凍機出力部
との間に低融点金属を介装したことを特徴とする
極低温試験装置。 2 伝熱制御体がサフアイヤ材で構成されている
特許請求の範囲第1項に記載の極低温試験装置。 3 低融点金属がウツドメタルである特許請求の
範囲第1項又は第2項に記載の極低温試験装置。 4 低融点金属を冷凍機の出力部と伝熱制御体と
を連結する熱伝達材と伝熱制御体との接続部に配
置した特許請求の範囲第1項〜第3項のうちのい
ずれか一項に記載した極低温試験装置。 5 低融点金属を冷凍機の出力部と伝熱制御体と
の接続部に配置した特許請求の範囲第1項〜第4
項のうちのいずれか一項に記載した極低温試験装
置。[Claims] 1. In a cryogenic test device in which the output part of a cryogenic refrigerator and a sample are connected by a heat transfer material made of a flexible thermal conductor, the thermal conductivity increases at low temperatures; It is characterized in that a heat transfer control body made of a material that sometimes has low thermal conductivity is placed in the heat transfer path, and a low melting point metal is interposed between the heat transfer control body and the output section of the refrigerator. Cryogenic testing equipment. 2. The cryogenic testing device according to claim 1, wherein the heat transfer control body is made of sapphire material. 3. The cryogenic testing device according to claim 1 or 2, wherein the low melting point metal is wood metal. 4. Any one of claims 1 to 3, in which the low melting point metal is disposed at the connection part between the heat transfer material and the heat transfer control body that connects the output part of the refrigerator and the heat transfer control body. Cryogenic test equipment described in paragraph 1. 5 Claims 1 to 4 in which the low melting point metal is arranged at the connection part between the output part of the refrigerator and the heat transfer control body
Cryogenic test equipment as described in any one of the following paragraphs.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26897487A JPH01110245A (en) | 1987-10-23 | 1987-10-23 | Cryogenic temperature tester |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26897487A JPH01110245A (en) | 1987-10-23 | 1987-10-23 | Cryogenic temperature tester |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01110245A JPH01110245A (en) | 1989-04-26 |
JPH0515979B2 true JPH0515979B2 (en) | 1993-03-03 |
Family
ID=17465892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26897487A Granted JPH01110245A (en) | 1987-10-23 | 1987-10-23 | Cryogenic temperature tester |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01110245A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2904103B1 (en) * | 2006-07-18 | 2015-05-15 | Airbus France | HEAT FLOW DEVICE |
FR2904102B1 (en) * | 2006-07-18 | 2015-03-27 | Airbus France | HEAT FLOW DEVICE |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58199047A (en) * | 1982-05-14 | 1983-11-19 | Toshiba Ceramics Co Ltd | Vacuum heating device |
JPS5939348A (en) * | 1982-08-27 | 1984-03-03 | Toshiba Corp | Apparatus for heating specimen in vacuum |
JPS6168547A (en) * | 1984-09-12 | 1986-04-08 | Hitachi Ltd | Cryogenic tester |
-
1987
- 1987-10-23 JP JP26897487A patent/JPH01110245A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58199047A (en) * | 1982-05-14 | 1983-11-19 | Toshiba Ceramics Co Ltd | Vacuum heating device |
JPS5939348A (en) * | 1982-08-27 | 1984-03-03 | Toshiba Corp | Apparatus for heating specimen in vacuum |
JPS6168547A (en) * | 1984-09-12 | 1986-04-08 | Hitachi Ltd | Cryogenic tester |
Also Published As
Publication number | Publication date |
---|---|
JPH01110245A (en) | 1989-04-26 |
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