JPH0514950U - Contact for measuring semiconductor device characteristics - Google Patents

Abstract

(57) [Abstract] [Purpose] To prevent damage to the plating film due to friction between the tips of the contacts of the IC socket and the leads, and to prevent short-circuiting and lowering of the withstand voltage due to the deposition of plating debris. [Structure] A vertical connector etc. that connects the contactor (8) fixed to the IC socket (3) to the pressure contact (10A) to the lead (4) and the base end (10B) of the contactor body (10). Dividing line (9)
Is formed from a horizontally long closed loop spring material that is installed symmetrically with respect to the axis of symmetry. On the upper surface of the contactor (8), a pressure contact (10A) to the lead (4) consisting of an upward protrusion is formed concentrically with the axis of symmetry (9). When a load P is applied during the measurement of electrical characteristics, the contactor body (10) will
It elastically deforms symmetrically while maintaining the closed loop shape, and creates a state in which the pressure contact (10A) does not move laterally along the back surface of the lead (4).

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a contact for measuring characteristics of a semiconductor device.

[0002]

[Prior Art]

 As shown in FIG. 2 (A), the surface mount type semiconductor device (1) uses a positioning jig (5) to mount a contact ( 2) is supplied to the IC socket (3), and the tip of the contact (2) is pressed against the lead (4) to measure the conduction state of the lead (4) and the contact (2). Defective products are identified.

[0003]

[Problems to be solved by the device]

The surface of the lead (4) of the semiconductor device (1) is plated with solder, and the tip of the contact (2) made of a spring material is elastically pressed against the plated surface. Continuity is being measured. FIG. 2B is an enlarged view of the pressure contact state between the lead (4) and the contactor (2) at the time of measuring the characteristic. The contactor when the load P acts from above the lead (4). (2) is elastically deformed asymmetrically left and right as indicated by a chain double-dashed line and symbols L ₁ and L ₂ , and the tip (2A) of the contact (2) slides along the back surface of the lead (4). The tip (2A) of the contactor (2) rubs the solder-plated surface of the lead (4), which damages the plated film and reduces the reliability of the product. In addition, the accumulated debris adheres to the product, which causes problems such as a short circuit and a decrease in withstand voltage when the semiconductor device (1) is mounted.

[0004]

[Means for Solving the Problems]

 As a means for solving the above problems, the present invention provides an IC socket in which a characteristic measuring contact made of a conductive spring material is fixed to an upper surface of a measuring block in an upright state, and a tip of the IC socket is pressed against a lead of the semiconductor device. The contactor for measuring the electrical characteristics of is composed of a horizontally long closed-loop spring material that is installed symmetrically to the left and right with the vertical bisector connecting the pressure contact to the lead and the base end of the contactor body as the axis of symmetry. Provided is a contact for measuring characteristics of a semiconductor device, which is characterized in that a pressure contact to a lead of the semiconductor device is formed on the upper surface of the contact body in a concentric arrangement with the axis of symmetry. ..

[0005]

[Action]

 The contactor fixed to the IC socket is formed of a horizontally long closed loop-shaped bar material that is symmetrically installed with the vertical bisector connecting the pressure contact to the lead and the base end of the contactor body as the axis of symmetry. Then, pressure contacts to the leads of the semiconductor device are formed on the upper surface of the contact in a concentric arrangement with the axis of symmetry. When the lead of the semiconductor device is pressed against the tip of the contactor body, the contactor body is elastically deformed symmetrically while maintaining the closed loop shape due to the applied load, and the pressure contact to the lead is laterally moved. Create a state that does not move. As a result, damage to the lead plating film and generation of plating scraps due to the lateral change of the press contact position are avoided.

[0006]

【Example】

 FIG. 1A shows a vertical bisector (9) connecting the pressure contact (10A) to the lead (4) and the base end (10B) of the contact body (10) on the IC socket (3). 2) shows a characteristic measurement contactor (8) of a semiconductor device (1) formed by erection of a closed-loop panel material having an oval crosswise symmetrically with respect to left and right as a symmetry axis. On the upper surface of the contact body (10), a pressure contact (10A) is formed on the lower surface of the lead (4) of the semiconductor device (1) in a concentric arrangement with the axis of symmetry composed of the above-mentioned perpendicular bisectors (9). Has been done. The contactor body (10) is manufactured from a thin conductive spring material by using a molding means such as etching. The pressure contact (10A) is formed by projecting an upward tip projection with a comparatively small radius of curvature in the central portion of the upper surface of the contact body (10) made of a closed loop spring material.

When the lead (4) of the semiconductor device (1) is pressed against the pressure contact (10A) provided at the tip of the contactor body (10), the contactor body (10) becomes horizontally long due to the addition of the load P. The oval closed loop part is elastically deformed symmetrically so that the pressure contact (10A) to the lead (4) moves only in the vertical direction and does not move in the lateral direction as shown by the chain double-dashed line. produce. As a result, damage to the plating surface of the lead (4) and generation of plating scraps due to the lateral change of the pressure contact position and rubbing against each other are substantially completely avoided.

FIG. 1B shows a second specific example of the present invention, in which the contactor body (10) is made of a horizontally long rectangular closed loop-shaped spring material. FIG. 1C shows a third embodiment of the present invention, in which the contact body (10) is formed by a horizontally long rectangular closed loop spring material having a recess at the center of the upper surface. There is. The deformed state of the contact body (10) and the vertically displaced state of the pressure contact (10A) when the load P acts in the second and third examples are the same as those shown in FIG. 1 (A). Therefore, the description of the overlapping matters will be omitted.

[0009]

[Effect of the device]

 When the lead is pressed against the central tip of the contactor body, the contactor body, which is erected at one end in the IC socket and stands upright, elastically deforms symmetrically around the pressure contact. A state in which relative displacement in the lateral direction does not occur between the pressure contact is created. As a result, the damage of the plating film and the generation of plating scraps due to the friction between the leads and the pressure contacts of the contactor body are almost completely prevented. Therefore, the reliability of the product is improved, and problems such as short circuit due to adhesion of plating scraps and reduction in withstand voltage are solved.

[Brief description of drawings]

FIG. 1 is a front view of a lead and a contactor body showing first to third embodiments of the present invention.

FIG. 2A is a perspective view of an IC socket and a conventional contactor. FIG. 2B is a front view of the conventional contactor in an elastically deformed state.

[Explanation of symbols]

 3 IC socket 4 Lead 8 Contact 9 Vertical bisector (symmetry axis) 10 Contact body 10A Pressure contact 10B Base end of contact body P Load

Claims (1)

[Scope of utility model registration request] 1. In an IC socket in which a contact for characteristic measurement made of a conductive spring material is fixed in an upright state on the upper surface of a measurement block, the tip of the IC socket is pressed against a lead of the semiconductor device to check the electrical characteristics of the semiconductor device. The contactor to be measured is formed of a horizontally long closed loop spring material symmetrically installed with a vertical bisector connecting the pressure contact to the lead and the base end of the contactor body as a symmetry axis. A contact for measuring characteristics of a semiconductor device, characterized in that a pressure contact to a lead of the semiconductor device is formed on an upper surface of the semiconductor device in a concentric arrangement with the axis of symmetry.