JPH05145298A - Monitoring method for taping of electronic component - Google Patents

Abstract

PURPOSE:To automatically monitor an order, polarity, etc., of a taped electronic component. CONSTITUTION:A reflection type illuminator 12b and a color CCD camera 13 for imaging a color band attached to a surface of an electronic component are mounted at an upper side of a taped electronic component 11. A picture processor 14 for monitoring a color distribution of the surface of the component by processing a color picture and a CRT display 15 are connected to the camera 13. The component is irradiated with a light from the illuminator 12b, the color band of the component is imaged by the reflected light, the color picture is processed to detect the color distribution of the band. If the distribution is different from a designated one, an alarm is output externally from an alarm unit 21 of an output unit 17, and an alarm lamp 22.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component taping monitoring method for monitoring the quality of a taping electronic component by checking the color band attached to the electronic component.

[0002]

2. Description of the Related Art Conventionally, a taping machine (trade name: coaxial sequencer) is used to tap a lead wire of a large number of coaxial electronic parts in order at a constant pitch between adhesive tapes. Before supplying the lead wire to the machine for forming and inserting the lead wire into the substrate), it is monitored by visual inspection whether the taping state of the electronic component is abnormal.

That is, due to a malfunction of the taping machine, for example, the arrangement order of taped electronic components (resistors, diodes, etc.), constants (resistance value, etc.), polarities (+, −, etc. of diodes, etc.) are normal. If it is not, the electronic component is mounted on the board by the inserter, the insertion is erroneous, and a correct circuit cannot be manufactured. Therefore, the monitoring is performed.

[0004]

The arrangement order, polarity, etc. of electronic components having similar shapes are identified by the color bands attached to the component body. It is extremely difficult to visually monitor such color bands. Difficult, heavy burden on the person watching, and unreliable.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a monitoring method capable of automatically monitoring the arrangement order, constants, polarities and the like of taped electronic components. ..

[0006]

SUMMARY OF THE INVENTION The present invention is an electronic component taping monitor for monitoring the taping state of a taping electronic component in which lead wires of a large number of electronic components arranged in parallel are held between bonded tapes. A method of irradiating the electronic component with light for obtaining reflected light, photographing the color band provided on the surface of the electronic component by the light reflected on the surface of the electronic component, and obtaining the color obtained by the photographing. It is an electronic component taping monitoring method of processing an image to detect a color distribution on the surface of the electronic component and outputting an abnormality in the color distribution to the outside.

[0007]

According to the present invention, the surface of an electronic component is irradiated with light to photograph a color band, the color image obtained by the photographing is subjected to image processing to detect the color distribution of the color band, and the color distribution is designated. If it is different from the above, an abnormality is output to the outside.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the embodiments shown in the drawings.

FIG. 1 shows an example of a monitoring device used in the electronic component taping monitoring method according to the present invention. This monitoring device uses a taping machine (product name / coaxial sequencer) that taps coaxial electronic components in order in the previous process and an inserter that forms the lead wires of the coaxial electronic components and inserts them into the board in the subsequent process. It is provided for the taping electronic component 11 that is conveyed intermittently or intermittently.

That is, below the taping electronic component 11, an illuminating device 12a for irradiating light for obtaining transmitted light for negative image of this component is arranged, and above the taping electronic component 11, An illuminating device 12b for irradiating the electronic component with light for obtaining reflected light for a color image is arranged.
Further, a charge-coupled device camera (color CCD) as a photographing device for photographing a negative image of the taping electronic component 11 and photographing the color band provided on the electronic component surface from the reflected light on the electronic component surface. Cameras 13) are installed opposite to each other, and the color CCD camera 13 is connected to an image processing device 14 for processing the negative image and the color image obtained by the photographing to monitor the outer shape of the electronic component and the color distribution on the surface of the electronic component. Has been done. This image processing device 14 has a cathode ray tube display (hereinafter referred to as CRT15).
Are connected.

Further, the image processing device 14 is connected to an output device 17 having an operation panel 16 and outputting to the outside an abnormality of the external shape mismatch and the color distribution mismatch of the electronic components detected by the image processing. As a means for the output device 17 to output a taping abnormality to the outside, an alarm device 21 and a warning light 22 are provided, and an output circuit 23 for stopping an external device such as the inserter is pulled out from the output device 17. There is.

FIG. 2 shows the taping electronic component 11 in which electronic components (resistors, diodes, etc.) are arranged in parallel.
The left and right lead wires 11b protruding from both sides of the component body 11a of 2 are attached to each other to form two adhesive tapes (paper tapes) 1
It is held between 1c.

In such a structure, when the monitoring operation is started by the switch of the operation panel 16, the illuminating device 12 is applied to the taping electronic component 11 which is moving or stopped.
Due to the transmitted light emitted from a, the negative image of the electronic component is CC
The color image (color band) provided on the surface of the electronic component is captured by the illumination light emitted from the illumination device 12b and reflected on the surface of the electronic component while being captured by the D camera 13.
These images are sent to the image processing device 14, and the image processing device 14 and the CRT 15 image-process the obtained negative image and color image to specify the outer shape and color distribution of the electronic component surface for each electronic component. It is monitored whether or not there is a match with the one that has been performed, and it is determined for each electronic component or collectively for a plurality of electronic components. If the electronic parts are different from those specified, or if the direction of each component body (diode polarity, etc.) is different from the specified ones, the status is displayed on the CRT 15 and an alarm is issued.
The abnormality is notified to the outside by 21 and the inserter and the like are stopped.

Next, a method of monitoring the outer shape and color distribution of an electronic component by image processing will be specifically described with reference to the flowcharts in FIG. 3 and subsequent drawings and the explanatory diagrams accompanying each chart. The circled numbers attached to the flowcharts indicate step numbers.

FIG. 3A is a flow chart showing the entire electronic component taping monitoring method.
The negative image of the electronic component 11 captured by is input to the image processing device 14 (step 1), and the color image of the electronic component 11 is input to the image processing device 14 (step 2). The negative image is the image obtained from the light emitted from the illumination device 12a and transmitted through the electronic component, and the color image is the image obtained from the illumination light emitted from the illumination device 12b and reflected on the surface of the electronic component body. is there.

Next, while observing the CRT 15 of the image processing device 14, the lead wire 11b relating to each electronic component is displayed by the window described later set for the actually obtained negative image.
The component arrangement direction coordinate (hereinafter, referred to as Y-axis coordinate) is detected (step 3), and a jumper wire (one electric wire) may be mixed in the electronic component. If the jumper line is checked from the Y-axis coordinate shadow image where 11b is located (step 4), if it is a jumper line, the external shape and color distribution of electronic parts are not monitored (Yes in step 5), and if it is not a jumper line If (coaxial electronic component is confirmed) (No in step 5), the following monitoring regarding the outer shape and color distribution of the electronic component is performed for each individual electronic component (steps 6 to 11).

The lead wire 11b is removed from the negative image (referred to as the input image) of each electronic component input from the CCD camera 13 (step 6), and the barycentric coordinates (area center coordinates) of the input image of only the component body 11a of the electronic component are removed. X _G , Y _G ) is detected (step 7), and the barycentric coordinates of this input image are detected.
The input image is compared with the reference image by moving to the barycentric coordinates of the reference image set in 14 and superimposing the two images (step 8). It is determined (step 9), and if they do not match, it is determined that the electronic component is different from the designated one, and NG shown in FIG. 3B is executed.

Further, a color band (color code) attached to the surface of the component body from the light reflected by the surface of the component body 11a.
The color image of the electronic component is monitored, and its color distribution is compared with the color distribution designated for each electronic component (step 10). If the color distribution of the electronic component does not match the designated one, the order of the component arrangement or The NG is executed because it is determined that the color distribution of the color band attached to the component body is abnormal due to the deviation of the orientation (at step 11).
Yes). When the color distribution is abnormal, it is displayed as K / NG.

FIG. 3B is an example of outputting the NG, and an alarm sound is output from the alarm device 21 (step 1).
2). Similarly, the warning light is made to blink and a stop signal is output from the circuit 23 to the inserter. The same applies to the case of outputting K / NG of the color distribution mismatch abnormality.

In the above flow chart, the negative image is processed in steps 3 to 9, and the color image is processed in steps 10 and 11. In the color distribution comparison in step 10,
As shown in (C), the color code (first color band K ₁ , second color band K ₂ , third color band K ₃ , the third color band K ₁ attached to the component body 11a of the electronic component (resistor, diode, etc.) 4 color band K ₄ ,
The X-axis coordinates of the color components (red component, green component, blue component, luminance) and the color band in the fifth color band K ₅ and the background color K _B ) are compared.

FIG. 4 is a flow chart showing the Y-axis coordinate detection processing of the electronic component in the step 3 and CR at that time.
A T screen is displayed, and Y-axis coordinate detection windows WD1 are set on the left and right sides over the lead wires 11b of a plurality of electronic components (step 13), and the Y-axis coordinates Y _L of the lead wires 11b relating to individual electronic components are set by this window WD1. , Y _R are detected (step 14). And, as explained below,
With reference to the Y-axis coordinates Y _L and Y _R of each electronic component, individual window setting corresponding to each electronic component is performed.

FIG. 5 shows a flow chart showing the jumper wire detection processing in steps 4 and 5 and a CRT screen at that time. The location where the component body 11a of the electronic component is expected to be located (each lead wire 11b is located). A jumper line detection window WD2 is set at the Y-axis coordinate and substantially the center coordinate in the X-axis direction (step 15), and the pixel number n _{J of the} image in the window WD2 is detected (step 16). An error between the number of pixels in the window n _J and the jumper line reference value (a value slightly larger than the number of pixels of the jumper line J) A is set as the jumper line determination value N _J (step 17), and the jumper line determination value N _J is positive or negative. If the jumper line judgment value N _J is positive, the number of pixels in the window n _J is larger than the jumper line reference value A. Therefore, there is the component body 11a in the window WD2. resistance It is determined to be a coaxial electronic component such as a container or a diode (step 19). If the jumper line determination value N _J is negative in step 18, the number of pixels in the window n _J is smaller than the jumper line reference value A, so that the window line WD2 is jumper line J.
Is determined (step 20).

FIG. 6 is a flow chart showing the lead wire removing process of the step 6 and its CRT screen,
This lead wire removal processing is a prerequisite for the next step 7 (component main body weight center coordinate detection processing). First, (B)
The lead lines are removed by subjecting the image of the electronic component to the image shrinkage process as a whole (step 21), and then the lead lines are removed by the image expansion process as shown in (C). The component body 11a is restored to its original size (step 22).

FIG. 7 is a flow chart showing the process for detecting the main body weight / center coordinate of the step 7 and the CRT at that time.
A screen is displayed. First, a component body detection window WD3 is set on the component body 11a at the Y-axis coordinate where each electronic component is located (step 23), and the image in this window WD3 (lead lines at steps 21 and 22) is set. (Only the component body 11a with the removed)
From the X and Y coordinates of each pixel, the area center coordinates, that is, the accurate barycentric coordinates (X _G1 , Y _G1 ) of the component body 11a are detected (step 24).

FIG. 8A is a flow chart showing the outer shape comparing process of the step 8, and FIG. 8B is the CR at that time.
Representing the T window WD4, the barycentric coordinates (X _G1 , Y _G1 ) of the component body input image P ₁ actually detected in step 24.
And the reference image P of the component body set in the window WD4
Because there is a deviation between ₀ and center coordinates (X _G0, Y _G0),
As shown in (C), the barycentric coordinates (X _G1 , Y _G1 ) of the input image P ₁ are converted to the barycentric coordinates (X _G0 , Y) of the reference image P _0.
G0 ) (step 25), the difference between the input image P ₁ and the reference image P ₀ (the number of pixels in the non-matching portions of both images) ΔP ₁ is calculated (step 26), and the number of non-matching pixels ΔP ₁ is the image difference. It is determined whether or not it is larger than the reference value (number of pixels) ΔP ₀ (step 27), and the number of unmatched pixels ΔP ₁ is the image difference reference value Δ.
If smaller than P _0, it determines the outer shape of the component body input image P ₁ coincides with the outline of the reference image P ₀ (step 28). If the number of unmatched pixels ΔP ₁ is larger than the image difference reference value ΔP _{0 in} step 27, the input image P ₁ is horizontally inverted (step 29), and the difference between the inverted input image P ₂ and the reference image P ₀ is obtained. (The number of pixels in the non-matching portion of both images) ΔP ₂ is calculated (step 30), and it is determined whether or not the number of non-matching pixels ΔP ₂ is smaller than the image difference reference value (number of pixels) ΔP ₀ (step 31). ), The number of unmatched pixels ΔP ₂ is the image difference reference value Δ
If it is smaller than P ₀ , it is determined that the electronic components are left-right reversed but their outer shapes are the same. In the case of right-and-left reversal, there are some which have a problem of polarity like a diode and some which have no problem like a resistor. When the number of unmatched pixels ΔP ₂ is larger than the image difference reference value ΔP _{0 in} step 31, it is determined that the outer shape of the inverted input image P ₂ does not match the outer shape of the reference image P ₀ (step 32). In this case, the electronic component may be different from the designated one or may be in an abnormal state such as being tilted. Therefore, NG shown in step 9 of FIG. 3 is unconditionally output.

FIGS. 9 to 12 are flowcharts showing the color distribution comparison processing in steps 10 and 11 above.
By detecting the color distribution of the color band attached to 11a,
It is monitored whether or not the designated electronic component is taped at the designated Y-axis coordinate (FIG. 4) in the designated direction.

FIG. 9 is a flow chart for checking the presence or absence of the color band shown in FIG. 3 (C) and for roughly classifying the types of electronic parts. The light emitted from the illumination device 12b and reflected by the part body 11a is used. First, the background color K _B of the component body 11a is detected (step 33), then the first color band K ₁ is detected (step 34), and then the second color band K ₂ is detected (step 35). Then, the third color band K ₃ is detected (step 36), the fourth color band K ₄ is detected (step 37), and then the fifth color band K ₅ is detected (step 38).

Then, the presence / absence of the background color K _B is checked (step 39). If there is no background color, an abnormal color distribution is output (K / NG). If there is no abnormality in the background color, the first color is detected. The presence or absence of the band K ₁ is checked (step 40). If the first color band is not present, an abnormal color distribution is output (K / NG), and if the first color band is present, the presence or absence of the second color band K ₂ is detected. Is checked (step 41), and when the second color band is not present, it is determined that the electronic component is not a resistor (for example, a diode) (step 42).

When there is up to the second color band, the third color band K
The presence or absence of ₃ is checked (step 43). If this third color band is not present, an abnormal color distribution is output (K / NG). If there is up to the third color band, the presence or absence of the fourth color band K ₄ is checked. A check is made (step 44). If there is no fourth color band, an abnormal color distribution is output (K / NG). If there is up to the fourth color band, the presence or absence of a fifth color band K ₅ is checked (step 44). 45) If there is no fifth color band, an abnormal color distribution is output (K / NG), and if there are first to fifth color bands, it is determined that the electronic component is a resistor. (Step 46).

Next, FIG. 10A is a flow chart for checking the color component of each color band. First, it is judged whether or not the electronic component is a resistor (step 47), and if it is not a resistor (step 47). A diode) and compares the color component of the first color band K ₁ of the diode with the set one (step 48) to see if the color component of this first color band does not match the set one. Is determined (step 49), and if they do not match, a color distribution abnormality is output (K / NG).

Next, even if the color components of the first color band match in step 49, the diode has only the first color band.
It is unknown whether the diode is taped in the proper orientation. That is, it may be left-right reversed. Therefore, the X-axis coordinate X _K1 of the first color band K ₁ shown in FIG. 10B is compared with the set value (step 50),
It is determined whether or not the X-axis coordinate X _K1 of the first color band does not match the set value (step 51), and if they do not match, the left and right sides of the diode image are inverted (step 52), and the first color band is again set. The X-axis coordinate X _K1 of the color band K ₁ is compared with the set value (step 53), and it is determined whether the X-axis coordinate of the inverted first color band does not match the set value (step 54). ), If the parts do not match, the parts themselves are different and an abnormality is output (K / NG). When the X-axis coordinate X _K1 of the first color band matches the set value in step 54, it is determined that the diode is in the right-left reversed state and the polarities (+, −) do not match (step 55). ..

On the other hand, if it is determined in step 47 that the electronic component is a resistor, the ground color K is first determined.
Compare the _B color component with the specified one (step 56),
It is determined whether the color components do not match (step 5
7) If they do not match, an abnormal color distribution is output (K / N
G) When the color components of the background color match, the color component of the first color band K ₁ is compared with the designated one (step 58), and it is determined whether the color components do not match (step 59). ), If they do not match, proceed to step 68 shown in FIG. Next, when the color components of the first color band match, the color component of the second color band K ₂ is compared with the designated one (step 60), and it is determined whether or not the color components do not match ( (Step 61), and if they do not match, the process proceeds to Step 68 shown in FIG. When the color components of the second color band match, the color component of the third color band K ₃ is compared with the designated one (step 62), and it is determined whether the color components do not match (step 63). If they do not match, the process proceeds to step 68 shown in FIG. When the color components of the third color band match, the color component of the fourth color band K ₄ is compared with the designated one (step 64), and it is determined whether the color components do not match (step 65). If they do not match, the process proceeds to step 68 shown in FIG. When the color components of the fourth color band match, the color component of the fifth color band K ₅ is compared with the designated one (step 66), and it is determined whether the color components do not match (step 67). , If they do not match,
Proceed to step 68 shown in 1. When the ground color of this resistor and all the color components of the first to fifth color bands match, the routine proceeds to step 80 in FIG.

FIG. 11 shows first to fifth resistors attached to resistors.
If each color component of the color band does not match the specified one,
It is a flow chart which checks whether the resistor is left-right reversed. That is, the image of the resistor is horizontally inverted (step 68), and the color component of the first color band K ₁ is compared with the designated one (step 69) as before the inversion, and the color components do not match. It is determined whether or not (step 70), if they do not match, an abnormality is output, and if the color components of the first color band match, the color component of the second color band K ₂ is compared with the designated one ( (Step 71), it is determined whether or not the color components do not match (Step 72). If they do not match, an abnormality is output. If the color components of the second color band match, the color of the third color band K ₃ The component is compared with the designated one (step 73), and it is determined whether or not the color components do not match (step 74). If they do not match, an error is output and the color components of the third color band match. time compared to that specify the color component of the fourth color bands K ₄ (step 75), the color components do not match Determines whether (step 76), if they do not match outputs an abnormality, when the color components of the fourth color bands are matched compared to those specified color component of the fifth color bands K ₅ (step 77), it is determined whether or not the color components do not match (step 78). If they do not match, an error is output. If all the color components of the first to fifth color bands match, the directions do not match. It is determined that there is (step 79). In this case, the component to be inspected is the designated resistor, but is taped left-right.

FIG. 12 is a flow chart for judging whether the color distributions match or do not match from the polarities or directions of the electronic parts.
First, it is determined whether the component to be inspected is a resistor (step 80), and if it is not a resistor (diode, electrolytic capacitor, etc.), it is determined whether the polarity (+, −) of the electrode is determined. If it is selected (step 81) and the polarity is not judged intentionally due to special circumstances, it is processed as color distribution coincidence (normal taping) (step 82). When the polarity is determined in step 81 (normal), it is determined whether the polarities do not match (step 83). If the polarities do not match as obtained in step 55, it is determined that the color distributions do not match. Yes (step 84). If the polarities match in step 83, it is determined that the color distributions match (taping is normal) (step 82).

In the step 80, if the component to be inspected is a resistor, it is selected whether or not to determine the direction (step 85). When the case where the direction is not determined is selected, it is processed as a color distribution coincidence (normal taping) (step 86). When the direction is determined in step 85, it is determined whether or not the directions do not match (step 87),
If the directions do not match as obtained in step 79, it is determined that the color distributions do not match (step 88). If the directions match in step 87, it is determined that the color distributions match (normal taping) (step 86). If it is determined that the color distributions do not match, it is processed as an abnormal taping (step 8).
9).

[0036]

According to the present invention, the color band provided on the surface of the electronic component is photographed, the color image is image-processed, and when the color distribution is different from the designated one, an abnormality is output to the outside. Therefore, it is possible to automatically monitor whether or not the designated electronic component is taped in the designated direction (polarity or direction) from the color distribution of the color band.

[Brief description of drawings]

FIG. 1 is a schematic view showing an example of a monitoring device used in an electronic component taping monitoring method of the present invention.

FIG. 2 is a plan view of a taping electronic component to be monitored by the above monitoring method.

FIG. 3A is a flowchart showing an example of the electronic component taping monitoring method of the present invention. (B) is a flowchart showing an alarm output at the time of abnormality. (C) is an explanatory view showing a color band attached to the component body of the resistor and the diode.

FIG. 4A is a flowchart showing a component Y-axis coordinate detection process in the above monitoring method. (B) is a diagram showing a CRT screen at that time.

FIG. 5A is a flowchart showing a jumper wire detection process in the above monitoring method. (B) is C at that time
It is a figure which shows RT screen.

FIG. 6A is a flowchart showing a lead wire removal process in the monitoring method of the above. (B) is a diagram showing a CRT screen when the image is degenerated. (C) is a diagram showing a CRT screen when the image is expanded.

FIG. 7A is a flowchart showing a component main body weight / center detection process in the above monitoring method. (B) is a diagram showing a CRT screen at that time.

FIG. 8A is a flowchart showing a process of comparing the outer shapes of component bodies in the monitoring method of the same. (B) is a diagram showing a CRT screen of a reference image and an input image of the component body. (C) is a diagram showing a CRT screen when the two images are overlapped.

FIG. 9 is a flowchart showing a color distribution comparison process in the above monitoring method.

FIG. 10A is a flowchart showing a color distribution comparison process in the above monitoring method. (B) is a CRT screen view showing the X-axis coordinates of the first color band of the diode.

FIG. 11 is a flowchart showing a color distribution comparison process in the above monitoring method.

FIG. 12 is a flowchart showing a color distribution comparison process in the above monitoring method.

[Explanation of symbols]

 11 Taping electronic parts K1 to K5 color band

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Junichi Katsuse 1-1943 Higashi Oizumi 1-43, Higashioizumi, Nerima-ku, Tokyo Inside Tamura Corporation

Claims (1)

[Claims] 1. An electronic component taping monitoring method for monitoring a taping state of a taping electronic component, which comprises holding lead wires of a large number of electronic components arranged in parallel between bonded tapes. The electronic component is processed by irradiating the light for obtaining the reflected light, photographing the color band provided on the surface of the electronic component by the light reflected on the surface of the electronic component, and processing the color image obtained by the photographing. A method for monitoring taping of electronic parts, characterized by detecting a color distribution on a surface and outputting an abnormality in the color distribution to the outside.