JPH05145005A - Semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the breakdown of parts and devices being in contact with a semiconductor device, on account of an excessive current caused by abnormality of the semiconductor device generated at the time of burn-in or in the course of actual use. CONSTITUTION:A fuse 3 is provided between leads 2 for sending an electric signal to a semiconductor chip 1. Hence the fuse 3 inserted between the leads 2 is fused when an excessive current flows on account of abnormality of the semiconductor chip 1. Thereby the excessive current is blocked.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device.

[0002]

2. Description of the Related Art During the burn-in of a semiconductor device, depending on the burn-in conditions, the circuit configuration of the semiconductor device, the manufacturing process, the performance, etc., a short circuit or latch-up may be induced in the semiconductor device, causing an excessive current to flow. .

This excessive current is a problem because it may cause not only destruction of the semiconductor device, discoloration and melting of the semiconductor device lead plating, but also burnout of the IC socket of the burn-in board and interruption of power supply from the burn-in device.

In order to deal with these problems, in the prior art, as shown in FIG. 3, a resistor 10 is inserted between the signal wiring 11 connected to the IC socket 8 of the burn-in board 9. The resistor 10 suppresses an excessive current due to a short-circuit or latch-up of the semiconductor device at the time of burn-in.

[0005]

In this prior art, since the electric signal is applied to the semiconductor device via the resistor, the electric signal actually applied to the semiconductor device is the resistance component. However, if the signal is a rectangular wave, the waveform may be rounded, which makes accurate burn-in difficult.

If the resistors are not firmly connected, the resistors will be removed by heating with a large current, and no electrical signal will be applied to the semiconductor device, which means that the semiconductor device is not burned in. Inspections and repairs were also time-consuming and complicated.

Furthermore, when the semiconductor device mounted on the device substrate fails during actual use and an excessive current flows, the connection of the semiconductor device or the parts in contact or the device itself is adversely affected. There is also.

[0008]

The semiconductor device of the present invention comprises:
A part of the lead electrically connected to the semiconductor chip is a fuse.

[0009]

The present invention will be described below with reference to the drawings. 1A and 1B show a first embodiment of the present invention, FIG. 1A is a plan view, and FIG. 1B is a sectional view taken along the line AA of FIG. 1A. .

As shown in FIGS. 1A and 1B, a fuse 3 is provided between leads 2 for transmitting an electric signal to a semiconductor chip.
Have. When an excessive current flows into the semiconductor chip 1, the fuse 3 is blown and the current flowing through the lead 2 to the semiconductor chip 1 can be cut off.

FIG. 2 is a sectional view of the essential parts showing a second embodiment of the present invention. As shown in FIG. 2, a fuse 6 is used to connect the pad electrode 5 of the semiconductor chip and the lead 7 for transmitting an electric signal. When an excessive current flows in the semiconductor chip 1, the fuse 6 is blown and the current flowing in the semiconductor chip 1 through the lead 2 can be cut off.

[0012]

As described above, according to the present invention, since a part of the lead electrically connected to the semiconductor chip is a fuse, the fuse is blown in the case of an abnormality such as an excessive current flowing through the semiconductor chip. However, since the excessive current flowing through the semiconductor chip is cut off, it does not adversely affect the parts or devices connected to or in contact with the semiconductor device.

Further, since the semiconductor device itself is defective due to the blow of the fuse, such an abnormal semiconductor device can be removed by a simple electrical characteristic check.

[Brief description of drawings]

FIG. 1 is a plan view (a) of the first embodiment of the present invention and a sectional view (b) taken along the line AA in the plan view (a).

FIG. 2 is a cross-sectional view of essential parts of a second embodiment of the present invention.

FIG. 3 is a plan view of a main part of a conventional semiconductor device.

[Explanation of symbols]

 1,4 Semiconductor chip 2,7 Lead 3,6 Fuse 5 Pad electrode 8 IC socket 9 Burn-in board 10 Resistance 11 Signal wiring

Claims (1)

[Claims] 1. A semiconductor device, wherein a part of a lead electrically connected to a semiconductor chip is a fuse.