JPH05144495A - Connector for electrical connection - Google Patents

Abstract

PURPOSE:To easily and certainly make locational coordination with high precision relative to an electrode to be connected. CONSTITUTION:A plurality of through holes 41 are formed in a clear resin film 41, and a spherical contact 23 prepared by forming a electroconductive film 25 over the surface of a deformable sphere 24 is provided at each of these through holes 42. They 23 are held by the resin film 41 by an insulative resin layer 26, and the resin film 41 is provided with ID marks 43a, 43b in a specified positional relationship relative to the spherical contacts 23. The ID mark formed on the mating side to be connected is perceived through the resin film 41, and its locational coordination with the 10 mark 43a or 43b is established.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector for electrical connection used for connecting a land grid array, an IC chip, a flexible printed wiring board or the like to a wiring board, a subcarrier or the like.

[0002]

2. Description of the Related Art As a conventional connector of this type, for example, Japanese Patent Laid-Open No. 2-239578 proposes an anisotropic conductive sheet in which superelastic metal balls are arranged in an island shape. As shown in FIG. 5, the anisotropic conductive sheet 11 is made of, for example, Ni-T.
The superelastic metal spheres 12 made of a material such as i are embedded in an island shape by molding the polyimide resin 13, and the superelastic metal spheres 12 are formed on the front and back of the anisotropic conductive sheet 11.
Part of each is exposed.

Between the wiring board 14 and the IC chip 15,
The anisotropic conductive sheet 11 is inserted, and the pads 16 on the wiring board 14, the pads 17 of the IC chip 15 and the super-elastic metal balls 1
After the two are aligned with each other, a pressure is applied by the resin 18 having a large shrinkage factor at the time of curing, and the superelastic metal sphere 12
Are compressed and deformed, and electrical connection is made. When using the anisotropic conductive sheet 11 to connect a plurality of electrodes arranged in a plane, a large pressure is required to elastically deform the plurality of superelastic metal balls 12. therefore,
It is not easy to obtain such a large pressure including the method of obtaining the pressure by contracting the resin 18, and there is a possibility that connection failure may occur.

In order to solve this problem, the present applicant has disclosed in Japanese Patent Application No. 3-232849 that a plurality of electrodes can be connected reliably with a relatively small pressure and a narrow pitch is formed. We proposed a connector for electrical connection that enables connection of electrodes. This has a structure as shown in FIG. That is, a plurality of through holes 22 are formed in the resin film 21,
One spherical contact 23 is arranged in each through hole 22, and they protrude from both sides of the resin film 21 to form a joint surface. The spherical contact point 23 is formed by forming a conductive film 25 on the surface of a deformable sphere 24, and the material of the sphere 24 is, for example, a styrene-divinylbenzene-based or acryl-based resin. The conductive film 25 is formed by a so-called thin film forming technique such as plating, vapor deposition or sputtering, and the material thereof is Ni-Au, Ni-Sn, Ni-Cu or the like.

An insulating resin layer 26 made of a material whose volume decreases when pressure is applied between each through hole 22 and the spherical contact point 23.
Are filled, and each spherical contact 23 is held by the resin film 21 by the insulating resin layer 26. The insulating resin layer 26 is made of, for example, silicone resin. In this electrical connection connector 27, the spherical contact 23 is positioned between both electrodes to be connected, and the spherical contact 23 is sandwiched and pressed by these electrodes, whereby the spherical contact 2
3 is deformed and comes into pressure contact with both electrodes, and the conductive film 25 formed on the surface of the spherical contact 23 electrically connects both electrodes. At this time, since the spherical body 24 is made of a resin material, it can be deformed and pressed against each other with a relatively small pressing force, and can also be greatly deformed. Spherical contact 23
When the electrode is largely deformed and used, even if the flatness of the electrode forming surface is poor and the positional accuracy of the plurality of electrodes to be connected is poor, they can be connected well.

By the way, conventionally, the work of aligning the contact of the connector of this type with the electrode to be connected has been performed by the method described below. A method of connecting the wiring board 28 and the land grid array 29 using the anisotropic conductive sheet 11 shown in FIG. 5 will be described with reference to FIG. 7. FIG. 7A shows a method of aligning the wiring board 28 and the anisotropic conductive sheet 11.
The CCD camera 30 projects the recognition mark 31 formed on the surface of the wiring board 28 to obtain the distance (x ₁ , y ₁ ) of the recognition mark 31 from the mechanical origin. On the other hand, C
The recognition mark 33 formed on the surface of the anisotropic conductive sheet 11 is projected by the CD camera 32, and similarly, the distance (x ₂ , y ₂ ) of the recognition mark 33 from the mechanical origin is obtained. The CCD cameras 30 and 32 are indicated by arrows 34,
As shown by 35, the observation directions are opposite to each other, and the mechanical origin and the length measurement direction (X, Y) are the same.

Based on the difference in the distance between the recognition marks 31 and 33 on the wiring board 28 and the anisotropic conductive sheet 11, the CCD cameras 30 and 32 are determined to have the same measuring direction (X, Y) and the same moving direction. The wiring board 2 is moved by moving a stage (not shown) to which the anisotropic conductive sheet 11 is attached in the direction of arrow 36.
8 and the anisotropic conductive sheet 11 are opposed to each other, and the positions of both recognition marks 31 and 33 are aligned with each other.
8 and the anisotropic conductive sheet 11 are aligned.
That is, the superelastic metal spheres 12 of the anisotropic conductive sheet 11 are brought into contact with the respective pads 37 on the wiring board 28.

The anisotropic conductive sheet 11 that is positioned and temporarily fixed to the wiring board 28 and the land grid array 29 are aligned in the same manner as shown in FIG. 7B. In order to perform such alignment work, the wiring board 28 and the land grid array 29 are used.
When the anisotropic conductive sheet 11 and the anisotropic conductive sheet 11 are respectively installed in the alignment apparatus, the arrangement directions of the pads 37, 38 and the superelastic metal balls 12 need to be aligned with each other.

[0009]

As described above, in the conventional alignment method, the mechanical origin (measurement origin) and the measuring direction of the two CCD cameras are made to coincide with each other, and the measuring direction and the stage It was necessary to match the moving direction. Therefore, the alignment device including these two CCD cameras and the stage has a complicated structure and requires high assembly precision, that is, it is expensive.

The alignment accuracy is the measurement accuracy of each of the two CCD cameras, the movement accuracy of the stage, and the wiring board 28.
Pad 37, pad 3 of land grid array 29
8. It is difficult to obtain high accuracy because it is determined by accumulating the respective accuracies of mounting the superelastic metal balls 12 of the anisotropic conductive sheet 11 on the alignment devices when the respective array directions of the superelastic metal balls 12 are made to coincide with each other. Was becoming. Furthermore, when the stage is moved and the positions of both recognition marks are aligned, it is not possible to observe with a CCD camera whether the positions are proper,
It was impossible to detect it even if the alignment was wrong.

The object of the present invention is to eliminate the above-mentioned problems in the alignment of the previously proposed electrical connection connector, and to perform the alignment with high accuracy easily and surely, and to simplify the alignment device. An object of the present invention is to provide a connector for electrical connection that can be used.

[0012]

According to a first aspect of the electrical connecting connector of the present invention, a transparent resin film having a plurality of through holes is formed, and a conductive film is formed on the surface of a deformable sphere. A plurality of spherical contacts, each of which is provided in each of the above-mentioned through-holes and forms a joint surface by projecting from both sides of the resin film respectively, and made of a material whose volume decreases when pressed. An insulating resin layer filled between the contacts and holding the contacts on a resin film, and an identification mark formed on the resin film in a predetermined positional relationship with the spherical contacts.

In the second structure, a transparent resin film having a plurality of through-holes formed therein and a conductive film formed on the surface of a deformable sphere, and one conductive film is formed in each of the through-holes. A plurality of spherical contacts, each of which protrudes from both sides to form a joint surface, and a material that decreases in volume when pressed, is filled between each through hole and the spherical contact, and holds the contacts in a resin film. And a transparent insulating resin layer.

[0014]

According to the present invention constructed as described above, the recognition mark formed on the other side wiring board or land grid array to be connected through the resin film can be recognized, and the recognition mark and the resin film can be recognized. It is possible to perform alignment with the recognition marks formed on the substrate while observing them.

Further, when the resin film and the insulating resin layer are transparent, the electrodes formed on the wiring board or the land grid array can be recognized through them, and the recognition mark is not used directly. The spherical contact and the electrode can be aligned.

[0016]

FIG. 1 shows an embodiment of the present invention. The same parts as those of the previously proposed electrical connection connector 27 shown in FIG. 6 are designated by the same reference numerals and the description thereof will be omitted. A plurality of through holes 42 are formed in a transparent resin film 41 made of polyester or acetate. These through holes 42 are formed by punching or laser processing, and in this embodiment, they are arranged in a grid pattern. Each of the through holes 42 is provided with one spherical contact 23 having a uniform particle diameter, and each of the spherical contacts 23 projects from both sides of the resin film 41 to form a joint surface. An insulating resin layer 26 is filled between the through holes 42 and the spherical contacts 23, and the insulating resin layer 26 holds the spherical contacts 23 on the resin film 41.

Two types of recognition marks 43a and 43b having a predetermined relative positional relationship with the spherical contact point 23 are formed at two locations on the resin film 41, respectively. The recognition marks 43a and 43b are optically recognizable, and are through holes in this embodiment. By forming the recognition marks 43a and 43b, which are formed as the through holes, at the same time as the through holes 42 in which the spherical contacts 23 are arranged by punching or laser processing, it is possible to bring them into a predetermined accurate positional relationship. ..

As described above, the electrical connection connector 44 according to the present invention is the electrical connection connector 2 previously proposed.
The resin film 21 of No. 7 is transparent, and the recognition mark is formed on it. FIG. 2 shows a case where the wiring board 45 and the land grid array 46 are connected using the electrical connection connector 44. Wiring board 45
Is a glass substrate, a ceramic substrate, an alumina substrate, a glass epoxy substrate, or the like, and a pad 47 is formed on the substrate. The land grid array 46 is formed by forming a plurality of pads 48 on one surface of an electronic component (device) so as to be insulated from each other in a grid shape. Pad 47 and pad 48
Are arranged in a grid pattern at the same pitch. Further, the wiring board 45 has recognition marks 49 formed at two positions on its surface, and the land grid array 46 also has recognition marks 51 similarly formed.

The electrical connector 44 has spherical contacts 23 arranged in a grid pattern at the same pitch as the pads 48, and has a wiring board 45 and a land grid array 46.
Recognition marks 4 formed on them when they are connected to
It has recognition marks 43a and 43b formed at positions facing 9 and 51, respectively. First, as shown in FIG. 2A, the electrical connection connector 44 and the wiring board 45 are arranged so as to face each other, and they are observed from the direction of arrow 53 by a recognition device 52 such as a CCD camera arranged outside the electrical connection connector 44. The recognition mark 43a and the recognition mark 4
The position of the electrical connection connector 44 and the wiring board 45 are temporarily fixed by performing alignment with the two positions at the same time. The alignment is performed by attaching either one of the electrical connection connector 44 and the wiring board 45 to a movable stage and moving the stage.

Next, the temporarily fixed electrical connection connector 44 and the wiring board 45 are reversed so that the wiring board 45 is on the recognition device 52 side, and the land grid array 46 is electrically connected as shown in FIG. 2B. It is arranged so as to face the connector 44 for use. The wiring board 45 is formed with recognition holes 54 at positions facing the two recognition marks 43b of the electrical connection connector 44, the recognition holes 54 having a size sufficient to observe the recognition marks 43b. The mark 43b and the recognition mark 51 are observed by the recognition device 52, and the two positions are aligned.

In the thus aligned state,
For example, the land grid array 46 is pressed to press the land grid array 46 against the wiring board 45 via the electrical connection connector 44. A wiring board 45 and a land grid array 46 are provided on both surfaces of the electrical connection connector 44 as shown in FIG.
Pads 47 and 4 that are in contact with each other and face each other as shown in FIG.
In the state where the spherical contact point 23 is sandwiched by 8 and pressed,
For example, the wiring board 45 and the land grid array 46 are mechanically fixed to each other via the electrical connection connector 44 by a screwing method or a throttle method, and the corresponding pads 47 and 48 are electrically connected through the spherical contacts 23. Connected to.

In this embodiment, the recognition marks 43a,
Although 43b is used as a through hole, the film-like body is made of resin film 4
It may be formed as 1. Further, by inverting the temporarily fixed electrical connection connector 44 and the wiring board 45, the electrical connection connector 44, the wiring board 45, and the land grid array can be used by using only one recognition device 52 such as a CCD camera. Although the position of the recognition device 52 can be aligned with that of the electric connection connector 46, the structure may be such that the recognition device 52 is reversed and moved without inverting the electrical connection connector 44 and the wiring board 45.

By the way, a wiring board 45 connected to the land grid array 46 via the electrical connection connector 44.
Is a transparent glass substrate, and its pad 47 is formed of a transparent electrode film such as an indium tin oxide film (ITO film), this wiring substrate 45.
Through this, the recognition mark 43b of the electrical connection connector 44 and the recognition mark 51 of the land grid array 46 can be observed, and their alignment can be performed. Therefore, in this case, the recognition hole 54 of the wiring board 45 which is necessary for the alignment shown in FIG. 2B is unnecessary.

Further, as shown in FIG. 3, the identification mark 51 of the land grid array 46 is provided with the electrical connection connector 4
4 is formed at a position facing the recognition mark 43a, the wiring board 45, the temporarily fixed electrical connection connector 44, and the land grid array 46 are connected by the positioning of the recognition mark 49 and the recognition mark 51. It is possible,
That is, it is necessary to form only one kind of recognition mark 43a on the resin film 41 of the electrical connection connector 44.

In aligning the recognition marks with each other,
Whether the insulating resin layer 26 holding the spherical contacts 23 on the resin film 41 is transparent or opaque, it does not affect the alignment work. However, if the insulating resin layer 26 is formed of, for example, a transparent silicone resin, the insulating resin layer 26 shown in FIG.
In the alignment work of the electrical connection connector 44 and the wiring board 45 shown in A, the pad 47 of the wiring board 45 can be observed through the insulating resin layer 26, and the alignment of the recognition mark 43a and the recognition mark 49 can be performed. It can be surely confirmed that each spherical contact 23 is positioned on the pad 47.

In FIG. 4, a transparent insulating resin layer 55 is filled between each through hole 42 and the spherical contact 23, and the resin film 4 is formed.
1 shows a modified example of the electrical connection connector according to the present invention having a structure without the recognition marks 43a and 43b. This electrical connection connector 56 is used when one side to be connected is transparent, for example, when the wiring substrate 45 is a glass substrate and the pad 47 is formed of an ITO film, as described above, and the spherical contact 23 is used. It is possible to observe the pads to be connected and directly align them.

When the transparent wiring board 45 and the land grid array 46 are connected by using the electrical connection connector 56, first, the electrical connection connector 56 and the wiring board 45 are arranged to face each other and are transparent. The pad 47 is observed through the different insulating resin layer 55 to align with the spherical contact 23. Next, the transparent wiring board 45 and the insulating resin layer 55
The pad 48 of the land grid array 46 is observed through and the alignment with the spherical contact 23 is performed. in this way,
According to this electrical connection connector 56, the spherical contact point 23 and the pad 47 or 48 can be directly connected without using a recognition mark.
Can be recognized and their alignment can be performed.

[0028]

As described above, according to the present invention, by making the resin film transparent, the recognition mark formed on the wiring board or the like connected to this electrical connection connector can be recognized through the resin film. Therefore, the recognition mark and the recognition mark formed on the resin film can be aligned while observing them.

Therefore, high-accuracy alignment can be easily performed, and since the recognition mark can always be observed, the alignment can be reliably performed without error. Also,
Since the alignment can be performed by using one recognition device such as a CCD camera, the alignment device can be simplified. Furthermore, by making the insulating resin layer that holds the spherical contacts on the resin film transparent, the electrodes to be connected to the spherical contacts can be recognized, so that the spherical contacts and electrodes can be directly positioned without using the recognition mark. It can also be combined.

[Brief description of drawings]

FIG. 1 is a sectional perspective view showing an embodiment of an electrical connector according to the present invention.

FIG. 2 is a cross-sectional view showing a positioning method of an embodiment of an electrical connection connector according to the present invention. A shows alignment with the wiring board, B shows alignment with the land grid array, and C shows alignment and connection.

FIG. 3 is a sectional view showing alignment of another embodiment of the electrical connecting connector according to the present invention.

FIG. 4 is a sectional perspective view showing a modified example of the electrical connection connector according to the present invention.

FIG. 5 is a sectional view showing a connection using a conventionally proposed anisotropic conductive sheet.

FIG. 6 is a sectional perspective view showing a conventionally proposed electrical connection connector.

FIG. 7 is a sectional view showing a conventional alignment method. A shows the alignment between the wiring board and the anisotropic conductive sheet, and B shows the alignment between the land grid array and the anisotropic conductive sheet.

[Explanation of symbols]

 23 Spherical contact 24 Sphere 25 Conductive film 26 Insulating resin layer 41 Transparent resin film 42 Through holes 43a, 43b Recognition mark 44 Electrical connection connector 55 Transparent insulating resin layer 56 Electrical connection connector

Claims (2)

[Claims] 1. A transparent resin film having a plurality of through holes formed therein, and a conductive film formed on the surface of a deformable sphere, and one conductive film is formed in each of the through holes. A plurality of spherical contacts that protrude to form a joint surface, and are made of a material that decreases in volume when pressed, are filled between the through holes and the spherical contacts, and hold the contacts in the resin film. An electrical connection connector comprising: an insulating resin layer; and a recognition mark formed on the resin film in a predetermined positional relationship with the spherical contact. 2. A transparent resin film having a plurality of through-holes formed therein, and a conductive film formed on the surface of a deformable sphere, one conductive film being formed in each of the through-holes. A plurality of spherical contacts that protrude to form a joint surface, and are made of a material that decreases in volume when pressed, are filled between the through holes and the spherical contacts, and hold the contacts in the resin film. An electrical connector comprising a transparent insulating resin layer.