JPH06198957A - Imaging device - Google Patents
Imaging deviceInfo
- Publication number
- JPH06198957A JPH06198957A JP36064492A JP36064492A JPH06198957A JP H06198957 A JPH06198957 A JP H06198957A JP 36064492 A JP36064492 A JP 36064492A JP 36064492 A JP36064492 A JP 36064492A JP H06198957 A JPH06198957 A JP H06198957A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- board
- housing
- image array
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
- B41J2/451—Special optical means therefor, e.g. lenses, mirrors, focusing means
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Facsimile Heads (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Abstract
Description
【０００１】[0001]
【発明の利用分野】この発明は、ＬＥＤヘッドや密着型
イメージセンサ、液晶シャッタアレイヘッド等の画像装
置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image device such as an LED head, a contact type image sensor, a liquid crystal shutter array head and the like.
【０００２】[0002]
【従来技術】ＬＥＤヘッドや液晶シャッタアレイヘッ
ド、密着型イメージセンサ等の画像装置では、ＬＥＤア
レイ等の画像アレイとレンズアレイとを用いる。そして
ハウジングに対し、画像アレイを搭載した基板とレンズ
アレイとを位置決めし、間接的に画像アレイをレンズア
レイに対し位置決めする。画像アレイの位置決めでは、
画像アレイを搭載した基板の主面をハウジングに設けた
基準面に当接させることが知られている（例えば発明者
らの特開平４−８５０６２号公報参照）。しかしながら
この技術では、画像アレイを搭載した基板を接着剤等に
よりハウジングの基準面に固定するので、接着剤層の厚
さの変動により位置決め精度が低下する。2. Description of the Related Art Image devices such as LED heads, liquid crystal shutter array heads, and contact image sensors use an image array such as an LED array and a lens array. Then, the substrate on which the image array is mounted and the lens array are positioned with respect to the housing, and the image array is indirectly positioned with respect to the lens array. For image array positioning,
It is known to bring a main surface of a substrate on which an image array is mounted into contact with a reference surface provided on a housing (see, for example, Japanese Patent Laid-Open No. 4-85062 by the inventors). However, in this technique, since the substrate on which the image array is mounted is fixed to the reference surface of the housing with an adhesive or the like, the positioning accuracy is lowered due to the variation in the thickness of the adhesive layer.
【０００３】ところで画像装置では、画像アレイを搭載
した基板の他に、その駆動回路を搭載した基板を用いる
のが普通である。そしてこれらの基板の接続には主とし
てフレキシブルプリント基板が用いられるが、フレキシ
ブルプリント基板は高価である。さらに画像アレイを搭
載した基板は、ハウジングに設けた平滑なベースプレー
トに接着剤等で固定するが、ベースプレートの表面を精
密に加工する必要が有り、ハウジングの加工コストが増
加する。また画像アレイの基板をベースプレートに接着
剤で固定すると、その厚さの変動等により画像アレイの
位置決め精度が低下する。By the way, in an image device, in addition to a substrate on which an image array is mounted, it is usual to use a substrate on which a drive circuit for the image array is mounted. A flexible printed board is mainly used for connecting these boards, but the flexible printed board is expensive. Further, the substrate on which the image array is mounted is fixed to a smooth base plate provided in the housing with an adhesive or the like, but the surface of the base plate needs to be precisely processed, which increases the processing cost of the housing. Further, when the substrate of the image array is fixed to the base plate with an adhesive, the positioning accuracy of the image array is deteriorated due to variations in the thickness of the substrate.
【０００４】[0004]
【発明の課題】この発明の課題は、フレキシブルプリン
ト基板や接着剤無しに、画像アレイの基板と駆動回路の
基板とを電気的に接続すると共に、機械的にも固定し、
ハウジングのベースプレートを不要にすると共に、画像
装置のカバーを用いて、画像アレイを搭載した基板をハ
ウジングの基準面に当接させることにある。SUMMARY OF THE INVENTION An object of the present invention is to electrically connect a substrate of an image array and a substrate of a driving circuit without using a flexible printed circuit board or an adhesive, and also mechanically fix the same.
Another object is to eliminate the need for the base plate of the housing and use the cover of the image device to bring the substrate on which the image array is mounted into contact with the reference surface of the housing.
【０００５】[0005]
【発明の構成】この発明の画像装置は、画像アレイを搭
載した基板の裏面と、その駆動回路を搭載した基板の裏
面とを密着させて、クリップ端子により前記の２つの基
板を電気的に接続するとともに固定し、これらの基板を
画像装置のハウジングに装着するとともに、該ハウジン
グには前記画像アレイ基板の主面に当接させるための基
準面を設け、かつ画像装置のカバーを設けて、該カバー
により前記駆動回路基板の主面を押圧して、前記画像ア
レイ基板の主面を前記基準面に当接させるようにしたこ
とを特徴とする。画像アレイには例えばＬＥＤヘッドの
ＬＥＤアレイや、密着型イメージセンサのＣＣＤアレイ
や光電池アレイ，あるいは液晶シャッタアレイヘッドの
液晶シャッタアレイ等を用いる。クリップ端子は好まし
くは、２枚の基板の長手方向の両端部に設け、両側から
基板を固定するようにする。カバーは好ましくは金属製
とし、画像アレイ基板をハウジングの基準面に当接させ
るだけでなく、画像装置の静電シールドとしての役割も
兼ねさせるようにする。好ましくはカバーの駆動回路基
板への押圧部の表面を絶縁処理し、金属カバーと駆動回
路基板とが短絡しないようにする。またカバーには好ま
しくは、バネ部を設けてこの部分を駆動回路基板に当接
させ、ここで駆動回路基板を押圧するようにする。According to the image device of the present invention, the back surface of the board on which the image array is mounted and the back surface of the board on which the drive circuit is mounted are brought into close contact with each other, and the two boards are electrically connected by the clip terminal. And fixing them, and mounting these substrates in the housing of the image device, providing a reference surface for contacting the main surface of the image array substrate in the housing, and providing a cover of the image device, The main surface of the drive circuit board is pressed by the cover to bring the main surface of the image array board into contact with the reference surface. As the image array, for example, an LED array of an LED head, a CCD array of a contact image sensor, a photocell array, or a liquid crystal shutter array of a liquid crystal shutter array head is used. The clip terminals are preferably provided at both ends of the two substrates in the longitudinal direction so that the substrates are fixed from both sides. The cover is preferably made of metal so that not only is the image array substrate brought into contact with the reference surface of the housing, but it also serves as an electrostatic shield for the image device. Preferably, the surface of the pressing portion of the cover against the drive circuit board is subjected to insulation treatment so that the metal cover and the drive circuit board do not short-circuit. Further, the cover is preferably provided with a spring portion, and this portion is brought into contact with the drive circuit board, and the drive circuit board is pressed here.
【０００６】[0006]
【発明の作用】この発明では、画像アレイの基板と駆動
回路の基板とをクリップ端子により接続固定するので、
両者をクリップ端子で電気的に接続すると共に固定する
ことができる。この結果フレキシブルプリント基板やベ
ースプレートが不要となる。次にこの発明では、カバー
で駆動回路基板を押圧し、この圧力で画像アレイ基板の
主面をハウジングに設けた基準面に位置決めする。この
ためカバーは、通常の静電シールドや汚れ防止だけでな
く、画像アレイ基板の位置決めとしての役割をも持つこ
とになる。そしてカバーから駆動回路基板への圧力によ
り、画像アレイ基板がハウジングの基準面に当接し、画
像アレイ基板を位置決めする。According to the present invention, since the board of the image array and the board of the drive circuit are connected and fixed by the clip terminals,
Both can be electrically connected and fixed by a clip terminal. As a result, the flexible printed circuit board and the base plate are unnecessary. Next, in the present invention, the cover presses the drive circuit board, and this pressure positions the main surface of the image array board to the reference surface provided on the housing. Therefore, the cover not only has a function of positioning the image array substrate, in addition to the usual electrostatic shield and dirt prevention. The pressure applied from the cover to the drive circuit board brings the image array board into contact with the reference surface of the housing, and positions the image array board.
【０００７】[0007]
【実施例】ＬＥＤヘッドを例に実施例を示す。図１，図
２において、２はハウジングで、安価で剛性と耐熱性が
高く加工精度が得られるポリフェニレンサルファイド、
ポリカーボネート等のエンジニアリングプラスチックを
用いる。４は画像アレイで、ここではＬＥＤアレイと
し、例えば４０個程度の画像アレイ４を直線状に配置す
る。６は画像アレイ基板で、ガラス基板や表面をガラス
グレーズしたセラミック基板を用い、平坦で表面の平滑
性が高い基板を用いる。８は画像アレイ４の駆動回路
で、駆動ＩＣやコンデンサ等からなり、プラスチック等
の安価なプリント基板を用いた駆動回路基板１０上に搭
載する。１２は、セルフフォーカシングレンズアレイ等
のレンズアレイである。１４は金属カバーで、ハウジン
グ２の開口部を覆い、画像アレイ４や駆動回路８等を静
電シールドすると共に、トナーや紙粉の侵入を防止す
る。実施例では金属カバー１４でハウジング２の一方の
側面を覆い、使用時の帯電器からの静電ノイズをシール
ドするようにしたが、金属カバー１４はハウジング２の
底面のみを覆うものでも良い。EXAMPLE An example will be shown with an LED head as an example. In FIGS. 1 and 2, reference numeral 2 denotes a housing, which is inexpensive and has high rigidity and heat resistance, and polyphenylene sulfide that can obtain processing accuracy,
Use engineering plastics such as polycarbonate. An image array 4 is an LED array here, and for example, about 40 image arrays 4 are linearly arranged. An image array substrate 6 is a glass substrate or a ceramic substrate whose surface is glass glaze, and is a flat substrate having a high surface smoothness. A drive circuit 8 for the image array 4 is composed of a drive IC, a capacitor, and the like, and is mounted on the drive circuit board 10 using an inexpensive printed board such as plastic. Reference numeral 12 is a lens array such as a self-focusing lens array. Reference numeral 14 denotes a metal cover that covers the opening of the housing 2 to electrostatically shield the image array 4 and the drive circuit 8 and prevent the ingress of toner and paper dust. In the embodiment, one side surface of the housing 2 is covered with the metal cover 14 so as to shield electrostatic noise from the charger during use, but the metal cover 14 may cover only the bottom surface of the housing 2.
【０００８】１６，１８は各々クリップ端子で、基板
６，１０の長手方向の両端面に沿って各々多数設ける。
クリップ端子１６，１８はその弾性によって基板６，１
０を押圧しこれらを密着させると共に、半田付け等で基
板６，１０に固着し、これらを電気的にも接続する。実
施例では図２の右側のクリップ端子１６を基板の結合と
電気的接続との双方に用い、左側のクリップ端子１８は
基板６，１０の密着にのみ用いた。このため左側のクリ
ップ端子１８を、基板固定クリップ端子と呼ぶ。Clip terminals 16 and 18 are provided along the longitudinal end faces of the substrates 6 and 10, respectively.
The elasticity of the clip terminals 16 and 18 causes the substrates 6 and 1 to move.
While pressing 0 to bring them into close contact, they are fixed to the substrates 6 and 10 by soldering or the like, and these are also electrically connected. In the embodiment, the clip terminal 16 on the right side of FIG. 2 is used for both board connection and electrical connection, and the clip terminal 18 on the left side is used only for adhesion of the boards 6 and 10. Therefore, the clip terminal 18 on the left side is called a board fixing clip terminal.
【０００９】２０はハウジング２に設けた突起で、その
先端を面出しして基準面とし、基板６の主面に当接させ
て位置決めする。突起２０は、基板６の長手方向に沿っ
て、両側に各々４個〜１０個程度を設ける。２２は、金
属カバー１４を切り起こしたバネ片で、基板１０を押圧
して、基板６の主面を突起２０の基準面に当接させる。
金属カバー１４は基板１０との短絡を防止するため、表
面に絶縁処理を施しておくことが好ましい。２４はハウ
ジング２に設けた係合突起で、これに対応する部分で金
属カバー１４を切り欠き、カバー１４をハウジング２に
係合する。そして係合突起２４には弾性を持たせて、金
属カバー１４を挟み込んで固定するようにする。図２の
２６は調整ピンで、ネジやキー等でも良く、レンズアレ
イ１２の高さ方向に垂直な平面（ｘｙ平面）に付いて、
基板１０を位置決めする。Reference numeral 20 is a protrusion provided on the housing 2, and the tip of the protrusion is made to be a reference surface and is brought into contact with the main surface of the substrate 6 for positioning. About 4 to 10 protrusions 20 are provided on each side of the substrate 6 in the longitudinal direction. A spring piece 22 is formed by cutting and raising the metal cover 14, and presses the substrate 10 to bring the main surface of the substrate 6 into contact with the reference surface of the protrusion 20.
In order to prevent a short circuit with the substrate 10, the metal cover 14 is preferably surface-insulated. Reference numeral 24 denotes an engagement protrusion provided on the housing 2, and the metal cover 14 is cut out at a portion corresponding to the engagement protrusion to engage the cover 14 with the housing 2. The engaging projection 24 is made to have elasticity so that the metal cover 14 is sandwiched and fixed. Reference numeral 26 in FIG. 2 is an adjustment pin, which may be a screw, a key, or the like, and is attached to a plane (xy plane) perpendicular to the height direction of the lens array 12,
The substrate 10 is positioned.
【００１０】図３に、金属カバー１４の底面を示す。図
において、２８，３０は金属カバー１４に設けた切り欠
き部で、この部分で係合突起２４により、金属カバー１
４をハウジング２に係合する。またバネ片２２はハウジ
ング２の内側に向かって切り起こし、この部分で基板１
０を押圧する。FIG. 3 shows the bottom surface of the metal cover 14. In the figure, reference numerals 28 and 30 denote notches provided in the metal cover 14, and the engaging projections 24 are provided in the notches at these portions.
4. Engage housing 4 with housing 2. Further, the spring piece 22 is cut and raised toward the inside of the housing 2, and the substrate 1 is cut off at this portion.
Press 0.
【００１１】ガラス等の基板６とプリント基板１０とを
クリップ端子１６，１８で密着させると、クリップ端子
１６，１８のバネ性が強すぎる場合、基板６に反りが生
じる。また形状精度が低く反りが大きなプリント基板１
０にガラス等の基板６を密着させると、プリント基板１
０の影響を受け、ガラス等の基板６が反ることがある。
これに対して実施例では、ガラス等の基板６の主面が、
突起２０の底部に設けた基準面に当接している。そして
バネ部２２により基板６は基準面に向かって加圧され、
基板６の主面の反りや変形が突起２０に設けた基準面に
よって矯正される。また基板６，１０はクリップ端子１
６，１８で結合するので、接着剤が不要になる。このた
め接着剤の硬化を待つ必要がなく、かつ接着剤の厚さば
らつきによる焦点性能の低下が無い。When the substrate 6 made of glass or the like and the printed circuit board 10 are brought into close contact with each other by the clip terminals 16 and 18, when the clip terminals 16 and 18 have too strong spring properties, the substrate 6 is warped. A printed circuit board 1 with low shape accuracy and large warpage
When the substrate 6 made of glass or the like is closely attached to the printed circuit board 0,
The substrate 6 such as glass may be warped under the influence of 0.
On the other hand, in the embodiment, the main surface of the substrate 6 such as glass is
It is in contact with a reference surface provided on the bottom of the protrusion 20. Then, the substrate 6 is pressed toward the reference surface by the spring portion 22,
The warp or deformation of the main surface of the substrate 6 is corrected by the reference surface provided on the protrusion 20. The substrates 6 and 10 are clip terminals 1
Since they are joined at 6, 18, no adhesive is required. For this reason, it is not necessary to wait for the adhesive to harden, and there is no reduction in focus performance due to variations in the thickness of the adhesive.
【００１２】レンズアレイ１２に対する画像アレイ４の
横方向の平面、（光軸な垂直な平面で、実施例ではｘｙ
平面と呼ぶ。）、の位置決めを説明する。後に示すよう
に、基板６は基板１０に対して、ｘｙ平面で位置決めさ
れている。基板１０には正確に位置決めした穴が有り、
ここにピン２６を通し、ハウジング２に位置決めする。
この結果、基板６はハウジング２に対してｘｙ平面で正
確に位置決めされ、しかも位置決めは極めて容易であ
る。A horizontal plane of the image array 4 with respect to the lens array 12 (a plane perpendicular to the optical axis, which is xy in the embodiment).
Call it the plane. ), And positioning will be described. As will be shown later, the substrate 6 is positioned with respect to the substrate 10 in the xy plane. The board 10 has holes that are accurately positioned,
The pin 26 is passed through here, and the housing 2 is positioned.
As a result, the substrate 6 is accurately positioned with respect to the housing 2 in the xy plane, and the positioning is extremely easy.
【００１３】画像装置の組立を説明する。図４〜図６に
示すように、基板６，１０を背中合わせに重ね合わせ、
クリップ端子１６，１８を半田付けする。半田付けには
例えばクリーム半田を用い、熱風ヒータなどで非接触で
半田付けする。非接触であるので、ガラス等の基板６の
表面の電極に力が加わらず、電極の剥離や損傷をもたら
すことがない。また熱風ヒータでは局所的な加熱がで
き、かつ加熱時間も数秒程度と短く、画像アレイ４や駆
動回路８の損傷が無い。図４〜図６において、４０は基
板１０に設けた穴で、ピン２６を通すためのものであ
る。また４２は長手方向マーク，４４は中心線マーク
で、共に基板１０に設け、基板６の位置決めに用いる。The assembly of the image device will be described. As shown in FIGS. 4 to 6, the substrates 6 and 10 are stacked back to back,
The clip terminals 16 and 18 are soldered. For soldering, for example, cream solder is used, and is soldered in a non-contact manner with a hot air heater or the like. Since it is non-contact, no force is applied to the electrode on the surface of the substrate 6 such as glass, and the electrode is not peeled or damaged. Further, the hot air heater can locally heat and the heating time is as short as several seconds, so that the image array 4 and the drive circuit 8 are not damaged. 4 to 6, reference numeral 40 denotes a hole provided in the substrate 10 for inserting the pin 26. Further, 42 is a longitudinal mark and 44 is a center line mark, both of which are provided on the substrate 10 and used for positioning the substrate 6.
【００１４】図７に、基板６の基板１０に対する位置決
めを示す。図において、５０はＴＶカメラ、５２はモニ
ターで、穴４０の付近を観察する。モニター５２には、
Ｘ方向中心線５４とＹ方向中心線５６とをカーソルとし
て表示し、これらの交点が穴４０の中心に現れるように
位置決めする。基板６の長手方向（Ｘ方向）の両端を、
長手方向マーク４２のエッジで位置決めする。この結
果、基板１０のＸ方向に対し、基板６が位置決めされ
る。次に穴４０の中心を通るようにしたＸ方向中心線５
４が、中心線マーク４４，４４の間の中央を通り、かつ
基板６の画像アレイ４の中央を通るようにする。このた
めにはマニピュレータ等で基板６を移動させながら、固
定位置を確認すれば良い。このようにすると、基板６の
中心線が穴４０を利用して位置決めされ、図７のモニタ
ー５２での上下のずれが防止される。またモニター５２
上での基板６の左右の位置は、長手方向マーク４２で位
置決めされる。FIG. 7 shows the positioning of the substrate 6 with respect to the substrate 10. In the figure, 50 is a TV camera and 52 is a monitor for observing the vicinity of the hole 40. On the monitor 52,
The X-direction center line 54 and the Y-direction center line 56 are displayed as cursors and positioned so that their intersections appear at the center of the hole 40. Both ends in the longitudinal direction (X direction) of the substrate 6,
Position at the edge of the longitudinal mark 42. As a result, the substrate 6 is positioned in the X direction of the substrate 10. Next, the center line 5 in the X direction that passes through the center of the hole 40
4 through the center between the centerline marks 44, 44 and through the center of the image array 4 on the substrate 6. For this purpose, the fixed position may be confirmed while moving the substrate 6 with a manipulator or the like. By doing so, the center line of the substrate 6 is positioned by using the hole 40, and the vertical shift of the monitor 52 in FIG. 7 is prevented. Also monitor 52
The left and right positions of the substrate 6 above are positioned by the longitudinal marks 42.
【００１５】基板６，１０間の位置決めが終了すると、
前記のようにクリップ端子１６，１８で半田付けする。
この後、基板６，１０をハウジング２にセットし、ピン
２６により固定した後に、金属カバー１４を取り付け
て、バネ片２２の弾性により、基板６の主面に位置決め
する。この結果極く容易に、基板６をｘｙ平面でも、こ
れに垂直なｚ軸でも、レンズアレイ１２に対して位置決
めすることができる。When the positioning between the substrates 6 and 10 is completed,
Solder with the clip terminals 16 and 18 as described above.
After that, the substrates 6 and 10 are set in the housing 2 and fixed by the pins 26, and then the metal cover 14 is attached and positioned on the main surface of the substrate 6 by the elasticity of the spring pieces 22. As a result, the substrate 6 can be very easily positioned with respect to the lens array 12 in the xy plane or in the z axis perpendicular to the xy plane.
【００１６】[0016]
【変形例】図８に、変形例の金属カバー８０を示す。こ
のカバー８０はハウジング２の底面のみを覆うようにし
たもので、カバー８０の中央部全長に渡ってバネ部８２
を設け、この部分で基板１０を押圧する。バネ部８２の
表面には絶縁処理を施し、基板１０との短絡を防止す
る。[Modification] FIG. 8 shows a metal cover 80 of a modification. This cover 80 covers only the bottom surface of the housing 2, and the spring portion 82 is provided over the entire length of the central portion of the cover 80.
Is provided, and the substrate 10 is pressed at this portion. The surface of the spring portion 82 is subjected to an insulation treatment to prevent a short circuit with the substrate 10.
【００１７】図９に、第２の変形例の金属カバー９０を
示す。９２，９４は金属カバー９０に設けた挿入片で、
例えば幅１０ｍｍ程度のものを各２箇所程度に設ける。
９６は新たなハウジングで、９８は挿入片９２，９４を
受け入れるための挿入穴である。そしてこの変形例で
は、挿入片９２，９４を挿入穴９８，９８に差し込ん
で、金属カバー９０をハウジング９６に固定する。FIG. 9 shows a second modification of the metal cover 90. Reference numerals 92 and 94 denote insertion pieces provided on the metal cover 90.
For example, a width of about 10 mm is provided at each of two places.
96 is a new housing, and 98 is an insertion hole for receiving the insertion pieces 92, 94. In this modification, the insert pieces 92 and 94 are inserted into the insert holes 98 and 98 to fix the metal cover 90 to the housing 96.
【００１８】[0018]
【実施例２】図１０に、第２の実施例を示す。なお以下
の実施例において、特に断ったもの以外は、図１〜図７
の実施例と同様に構成する。図において、１００は新た
な金属カバーで、１０２は固定片であり、画像装置の底
部２〜３箇所に金属カバー１００を延長して設ける。１
０４は固定片１０２を折り返して設けたバネ部で、１０
６は新たなハウジング、１０８はバネ部１０４を受け入
れるための溝である。そしてこの実施例ではバネ部１０
４を溝１０８に固定し、バネ部１０４からの力で固定片
１０２により基板１０を押圧する。Second Embodiment FIG. 10 shows a second embodiment. In addition, in the following examples, unless otherwise specified, FIGS.
The configuration is similar to that of the above-mentioned embodiment. In the figure, 100 is a new metal cover, and 102 is a fixing piece, and the metal cover 100 is extended and provided at the bottom 2 to 3 places of the image device. 1
Reference numeral 04 is a spring portion provided by folding back the fixing piece 102.
6 is a new housing, and 108 is a groove for receiving the spring portion 104. And in this embodiment, the spring portion 10
4 is fixed in the groove 108, and the substrate 10 is pressed by the fixing piece 102 by the force from the spring portion 104.
【００１９】[0019]
【実施例３】図１１に、第３の実施例を示す。図におい
て、１１０は新たな金属カバーで、１１２は固定片、１
１４，１１４は固定片１１２に設けたバネ部である。ま
た１１６は新たなハウジングで、１１８，１１８はバネ
部１１４を受け入れるための溝である。この実施例で
も、固定片１１２を画像装置の底部の２〜３箇所に設
け、溝１１８でバネ部１１４を固定し、バネ部１１４か
らの力で固定片１１２を介して基板１０を押圧する。な
お図１０，図１１の画像装置では、基板１０のｘｙ方向
の位置決めを金属カバー１００，１１０で行うことがで
きる。例えば図１１の実施例の場合、プリント基板１０
に固定片１１２に対応した溝を設け、金属カバー１１０
を溝１１８で位置決めし、基板１０を固定片１１２に対
して記前の溝で位置決めすれば良い。Third Embodiment FIG. 11 shows a third embodiment. In the figure, 110 is a new metal cover, 112 is a fixing piece, 1
Reference numerals 14 and 114 denote spring portions provided on the fixed piece 112. Further, 116 is a new housing, and 118, 118 are grooves for receiving the spring portion 114. Also in this embodiment, fixing pieces 112 are provided at a few places on the bottom of the image device, the spring portion 114 is fixed by the groove 118, and the substrate 10 is pressed by the force from the spring portion 114 via the fixing piece 112. In the image devices of FIGS. 10 and 11, the substrate 10 can be positioned in the xy directions by the metal covers 100 and 110. For example, in the case of the embodiment shown in FIG.
A groove corresponding to the fixing piece 112 is provided on the metal cover 110.
Is positioned by the groove 118, and the substrate 10 is positioned by the groove described above with respect to the fixed piece 112.
【００２０】[0020]
【発明の効果】この発明では、フレキシブルプリント基
板やベースプレート、接着剤無しで、画像アレイ基板と
その駆動回路基板とを電気的に接続すると共に固定する
ことができる。この結果高価なフレキシブルプリント基
板が不要となり、かつベースプレートを設けてその表面
を面出しする必要もない。また接着剤の硬化を待つ間工
程を中断する必要もなく、接着剤の厚さのばらつきによ
り画像アレイ基板の位置決めが狂うこともない。この発
明では、金属カバーにより、駆動回路基板を介して画像
アレイ基板を押圧し、ハウジングに設けた基準面に当接
させる。この結果カバーは、単に画像装置の開口部を覆
うだけでなく、画像アレイ基板の位置決めにも用いるこ
とができる。According to the present invention, the image array substrate and its drive circuit board can be electrically connected and fixed without using a flexible printed board, a base plate, or an adhesive. As a result, an expensive flexible printed circuit board is not necessary, and it is not necessary to provide a base plate to surface the surface. Further, it is not necessary to interrupt the process while waiting for the adhesive to cure, and the positioning of the image array substrate is not disturbed due to the variation in the thickness of the adhesive. In the present invention, the metal cover presses the image array substrate via the drive circuit substrate to bring it into contact with the reference surface provided on the housing. As a result, the cover can be used not only to cover the opening of the image device but also to position the image array substrate.
【図１】 実施例の画像装置の一部切り欠き部付き断
面図FIG. 1 is a cross-sectional view with a partially cutaway portion of an image device according to an embodiment.
【図２】 実施例の画像装置の長手方向断面図FIG. 2 is a longitudinal cross-sectional view of the image device according to the embodiment.
【図３】 実施例の画像装置の背面図FIG. 3 is a rear view of the image device according to the embodiment.
【図４】 画像アレイ基板と駆動回路基板を結合した
状態の平面図FIG. 4 is a plan view showing a state in which the image array substrate and the driving circuit substrate are combined.
【図５】 画像アレイ基板と駆動回路基板を結合した
状態の側面図FIG. 5 is a side view showing a state in which the image array substrate and the driving circuit substrate are combined.
【図６】 画像アレイ基板と駆動回路基板を結合した
状態の底面図FIG. 6 is a bottom view of the state in which the image array substrate and the driving circuit substrate are combined.
【図７】 駆動回路基板への画像アレイ基板の位置決
めを示す図FIG. 7 is a diagram showing positioning of an image array board on a drive circuit board.
【図８】 変形例で用いた金属カバーの斜視図FIG. 8 is a perspective view of a metal cover used in a modified example.
【図９】 第２の変形例で用いた金属カバーの要部断
面図FIG. 9 is a sectional view of an essential part of a metal cover used in a second modification.
【図１０】 第２の実施例の画像装置の断面図FIG. 10 is a sectional view of an image device according to a second embodiment.
【図１１】 第３の実施例の画像装置の断面図FIG. 11 is a sectional view of an image device according to a third embodiment.
２ ハウジング ４ 画像アレイ ６ 画像アレイ基板 ８ 駆動回路 １０ 駆動回路基板 １２ レンズアレイ １４ 金属カバー １６ クリップ端子 １８ 基板固定クリップ端子 ２０ 突起 ２２ バネ片 ２４ 係合突起 ２６ 調整ピン ３２ ネジ穴 ３４ スペーサ ３６ 押圧部 ４０ 穴 ４２ 長手方向マーク ４４ 中心線マーク ５０ ＴＶカメラ ５２ モニター ５４ Ｘ方向中心線 ５６ Ｙ方向中心線 ８０ 金属カバー ８２ バネ部 ９０ 金属カバー ９２，９４ 挿入片 ９６ ハウジング ９８ 挿入穴 １００ 金属カバー １０２ 固定片 １０４ バネ部 １０６ ハウジング １０８ 溝 １１０ 金属カバー １１２ 固定片 １１４ バネ部 １１６ ハウジング １１８ 溝 2 housing 4 image array 6 image array substrate 8 driving circuit 10 driving circuit substrate 12 lens array 14 metal cover 16 clip terminal 18 substrate fixing clip terminal 20 protrusion 22 spring piece 24 engaging protrusion 26 adjustment pin 32 screw hole 34 spacer 36 pressing portion 40 holes 42 longitudinal direction mark 44 center line mark 50 TV camera 52 monitor 54 X direction center line 56 Y direction center line 80 metal cover 82 spring part 90 metal cover 92, 94 insertion piece 96 housing 98 insertion hole 100 metal cover 102 fixing piece 104 Spring Part 106 Housing 108 Groove 110 Metal Cover 112 Fixing Piece 114 Spring Part 116 Housing 118 Groove
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０４Ｎ 1/028 Ｚ 8721−5Ｃ 1/036 Ａ 8721−5Ｃ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical indication H04N 1/028 Z 8721-5C 1/036 A 8721-5C
Claims (1)
の駆動回路を搭載した基板の裏面とを密着させて、クリ
ップ端子により前記の２つの基板を電気的に接続すると
ともに固定し、 これらの基板を画像装置のハウジングに装着するととも
に、該ハウジングには前記画像アレイ基板の主面に当接
させるための基準面を設け、 かつ画像装置のカバーを設けて、該カバーにより前記駆
動回路基板の主面を押圧して、前記画像アレイ基板の主
面を前記基準面に当接させるようにしたことを特徴とす
る、画像装置。1. A back surface of a substrate on which an image array is mounted and a back surface of a substrate on which a driving circuit thereof is mounted are brought into close contact with each other, and the two substrates are electrically connected and fixed by a clip terminal. The board is attached to the housing of the image device, and the housing is provided with a reference surface for abutting against the main surface of the image array substrate, and a cover of the image device is provided, and the cover is provided for the drive circuit board. An image device, wherein a main surface is pressed so that the main surface of the image array substrate is brought into contact with the reference surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36064492A JP2849639B2 (en) | 1992-12-29 | 1992-12-29 | Imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36064492A JP2849639B2 (en) | 1992-12-29 | 1992-12-29 | Imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06198957A true JPH06198957A (en) | 1994-07-19 |
| JP2849639B2 JP2849639B2 (en) | 1999-01-20 |
Family
ID=18470301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36064492A Expired - Fee Related JP2849639B2 (en) | 1992-12-29 | 1992-12-29 | Imaging device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2849639B2 (en) |
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| US6515773B1 (en) | 1998-05-28 | 2003-02-04 | Brother Kogyo Kabushiki Kaisha | Image reading apparatus |
| JP2004207655A (en) * | 2002-12-26 | 2004-07-22 | Matsushita Electric Ind Co Ltd | Metallic base substrate and light-emitting unit |
| JP2006310653A (en) * | 2005-04-28 | 2006-11-09 | Toyoda Gosei Co Ltd | Led lamp and method of mounting substrate mounted component |
| JP2008055668A (en) * | 2006-08-30 | 2008-03-13 | Kyocera Corp | Optical printer head |
| JP2009290242A (en) * | 2002-11-11 | 2009-12-10 | Oki Data Corp | Semiconductor device, optical print head, and image forming apparatus |
| JP2009296003A (en) * | 2002-11-13 | 2009-12-17 | Oki Data Corp | Semiconductor composite device, optical print head and image forming apparatus |
| JP2009298155A (en) * | 2009-09-18 | 2009-12-24 | Oki Data Corp | Exposure device and image forming apparatus |
| US8305418B2 (en) | 2007-09-20 | 2012-11-06 | Oki Data Corporation | Exposure device and image forming apparatus having a forcing portion |
| WO2013065774A1 (en) * | 2011-11-02 | 2013-05-10 | 株式会社オートネットワーク技術研究所 | Optical communication module |
| JP6090519B1 (en) * | 2016-06-30 | 2017-03-08 | 富士ゼロックス株式会社 | Exposure device Image forming device |
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| US8305418B2 (en) | 2007-09-20 | 2012-11-06 | Oki Data Corporation | Exposure device and image forming apparatus having a forcing portion |
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| JP6094714B1 (en) * | 2016-06-30 | 2017-03-15 | 富士ゼロックス株式会社 | Exposure apparatus Image forming apparatus Exposure apparatus manufacturing method |
| JP6098748B1 (en) * | 2016-06-30 | 2017-03-22 | 富士ゼロックス株式会社 | Exposure device Image forming device |
| JP2018001567A (en) * | 2016-06-30 | 2018-01-11 | 富士ゼロックス株式会社 | Exposure device and image formation apparatus |
| JP2018001568A (en) * | 2016-06-30 | 2018-01-11 | 富士ゼロックス株式会社 | Exposure device, image formation apparatus and method of manufacturing exposure device |
| JP2018001569A (en) * | 2016-06-30 | 2018-01-11 | 富士ゼロックス株式会社 | Exposure device and image formation apparatus |
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