JPH05101860A - Connector for ceramic board - Google Patents

Abstract

PURPOSE:To simplify the connecting structure of an external wiring with a ceramic board and accomplish a small and light construction by forming a board side connection part from a resilient contact part for external wiring to be inserted in the gap between the upper and lower walls, which are positioned opposed with a certain gap reserved in between, and the side edge part of the ceramic board clamping these walls. CONSTITUTION:In a gap I in the form of a long hole bounded by an upper and a lower wall 29a. 29b and a left and a right wall 30a, 30b, an external wiring connection part 19 is provided configured with a contact part 28 whose contact piece 31 is extended from a metal piece 25 of a board side connection part 18. The width and height of the gap I are set so that it admits insertion of the end of a band-shaped external wiring 32, and the contact piece 31 is extended in a single piece from the metal piece 25, and when the end of the wiring 32 is inserted int the gap I, the end is clamped resiliently by the contact piece 31 and the lower wall 29. Thereby electrical continuity between the contact part 28 and wiring 32 is ensured, and also mechanical bond of the wiring 32 with a connector 15 for ceramic board can be made certain.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic substrate connector.

[0002]

2. Description of the Related Art For example, a print head of a thermal printer which prints on a thermal recording paper is a ceramic substrate having a large number of print media arranged in a row on one surface of a base substrate and a drive circuit therefor. And a board for connection with an external circuit is attached to each of the other side portions.

FIG. 5 specifically shows a connection structure in a conventional thermal print head. On a base substrate 1 made of aluminum, a ceramic substrate 2 as a head substrate is mounted on one side thereof, and a connecting substrate 3 for connecting the ceramic substrate 2 to an external circuit is mounted on the other side thereof. ing. On the ceramic substrate 2, a large number of heating dots 4 arranged in a row in the substrate longitudinal direction are formed.
And fine wiring patterns (not shown) are integrally formed, and a plurality of driving ICs for driving a fixed number of heating dots 4 ... In accordance with print information input from an external circuit.
5 is installed. Further, a comb-teeth-shaped connection terminal portion 6 for making a connection with the connection substrate 3 is formed on the upper surface of one end edge (the right end edge in the drawing) of the ceramic substrate 2.

On the other hand, the connection board 3 has a flexible circuit board 7 formed by forming a circuit pattern on the front and back surfaces of a polyimide film and applying a protective coating thereto, and a glass epoxy for reinforcing the flexible circuit board 7. And a reinforcing plate 8 made of, for example. Further, the edge of the flexible circuit board 7 is extended from the edge of the reinforcing plate 7 so as to overlap with the upper surface of the end of the ceramic substrate 2, and has a comb-teeth shape formed on the rear surface of the extension. The connection terminal portion 9 is superposed on the connection terminal portion 6 of the ceramic substrate 2, and the flexible circuit board 7 and the ceramic circuit substrate 2 are electrically connected.

Further, on the flexible circuit board 7,
A pressing cover 10 is superposed and fixed to the heat sink 1 by a plurality of screws 11. In addition to the role of protecting the driving IC 5, the pressing cover 10 presses the connecting terminal portion 6 on the side of the ceramic substrate 2 and the connecting terminal portion 9 on the side of the flexible circuit board 7 to press the connecting terminal portions 5 and 9 together. It has a role to secure the connection, and the pressing rubber 12
The overlapping portions of both the connection terminal portions 5 and 9 are pressed via. Further, a male connector 13 is attached to a rear end portion of the connecting substrate 3 protruding from an edge of the base substrate 1, and a female connector 14 derived from a circuit on the printer device side is connected to the male connector 13. Then, the print head is operated.

[0006]

In the conventional connection structure of the ceramic substrate 2 described above, the ceramic substrate 2 and the flexible circuit substrate 7 of the connection substrate 3 are elastically pressed by using the pressing rubber and the pressing cover 10. The connection terminal portions 6 and 9 are electrically connected. However,
In order to provide the connecting board 3 and the pressing cover 10, a mounting space on the base board must be secured. Therefore, the size of the base substrate 1 in the width direction becomes large, and it is impossible to reduce the size and weight of the device.

Further, as shown in the figure, since the connecting substrate 3 is semi-fixedly connected to the ceramic substrate 2, in order to attach / detach the connecting substrate 3 to / from the ceramic substrate 2, A very troublesome work is required, for example, the pressing cover 10 and the connection substrate 3 have to be removed. For this reason, the flexibility of wiring was low. Moreover, in order to connect the external wiring to the connection board 3, the connectors 13 and 14 must be further provided on the other side of the connection board 3, which increases the number of parts and the manufacturing process.
It was a factor that pushed up the manufacturing cost.

Further, the connecting substrate 3 is attached to the pressing cover 1 described above.
Since it is configured to be pressed onto the ceramic substrate by means of 0 and the screw 11, the ceramic substrate 2 is liable to be bent and the print quality is deteriorated. Moreover, since the connection terminal portions 6 and 9 between the flexible substrate 7 and the ceramic substrate 2 are provided over the entire length of the side edge of the ceramic substrate 2, the positional relationship between the ceramic substrate 7 and the connection substrate 3 is also limited, and the flexibility is increased. It was difficult to form a simple wiring.

The present invention has been devised under the above circumstances, solves the above-mentioned conventional problems, and directly connects external wiring without using the connecting substrate 3 and the pressing cover 10. Since it can be connected to the connection terminal portion of the ceramic substrate 2, the flexibility of the connection structure and the pattern on the ceramic substrate can be significantly improved, the device can be made smaller and lighter, and the number of manufacturing steps and the manufacturing cost can be significantly increased. It is an object of the present invention to provide a ceramic substrate connector that can be reduced to

[0010]

In order to solve the above problems, the present invention takes the following technical means. That is, the invention described in claim 1 of the present application is a connector for a ceramic substrate including a substrate-side connecting portion connected to a plurality of connecting terminal portions formed on the surface of the ceramic substrate, wherein the substrate-side connecting portion is , Upper and lower walls facing each other through a predetermined gap, and a contact portion that can be elastically pressed against the connection terminal portion of the ceramic substrate inserted in the gap, and the side edge portion of the ceramic substrate is formed into the upper and lower walls. It is characterized in that it is configured to be connected to the ceramic substrate by being sandwiched by.

The invention described in claim 2 of the present application is
On the opposite side of the board-side connecting portion, an external wiring-side connecting portion including upper and lower walls facing each other through a predetermined gap and a contact portion connected to an external wiring inserted in the gap is provided. To do.

[0012]

In the ceramic substrate connector according to the present invention, the upper and lower walls facing each other through a predetermined gap and the contact which can be elastically pressed against the connection terminal portion of the ceramic substrate inserted into the gap. And a board-side connection portion including a portion. The connector is connected to the ceramic substrate such that the side edges of the ceramic substrate are sandwiched between the upper and lower walls.

That is, the ceramic substrate connector according to the present invention can be directly connected to the external wiring to the ceramic substrate without the need for a connecting substrate or a pressing cover. Therefore, the connection structure between the external wiring and the ceramic substrate is extremely simplified, the size and weight of the device can be reduced, and the manufacturing process and the number of parts can be significantly reduced, and the manufacturing cost can be reduced.

Moreover, the ceramic substrate connector is connected so that the side edges of the ceramic substrate are sandwiched between the upper and lower walls of the substrate-side connecting portion, and the contact portion is elastically pressed against the connecting terminal portion of the ceramic substrate. Is configured to be. Therefore, it is extremely easy to attach and detach the ceramic substrate connector to and from the ceramic substrate. As a result, not only the workability of the connection work is improved, but also the flexibility of the connection wiring is improved.

Further, the side edges of the ceramic substrate can be sandwiched between the upper and lower walls facing each other with a predetermined gap therebetween. Therefore, it can be configured to be connected at any part of the side edge portion of the ceramic substrate. Therefore, the degree of freedom of the wiring pattern on the ceramic substrate is significantly increased, and the ceramic substrate itself can be made smaller and lighter.

According to a second aspect of the present invention, the upper and lower walls facing each other with a predetermined gap on the side opposite to the board-side connecting portion of the connector, and the contact connected to the external wiring inserted in the gap. And an external wiring side connecting portion including a portion. By providing the external wiring side connecting portion, the ceramic substrate connector according to the present invention can reliably connect the ceramic substrate and the external wiring. Also, similar to the board-side connection portion,
By configuring the external wiring side connecting portion so that the external wiring can be detachably connected, the workability of the wiring work can be improved, and the flexibility of the external wiring can be significantly increased. Further, unlike the conventional case, it is not necessary to separately provide a connector for connecting the external wiring to the external wiring side connecting portion, and the size and weight of the device can be reduced.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a ceramic substrate connector according to the present invention will be specifically described below with reference to FIGS. 1 to 4. As shown in FIG. 1, a ceramic board connector 15 according to the present invention has a board-side connecting portion 18 connected to a ceramic board 17 on one side of a rectangular box-shaped main body 16.
And an external wiring side connecting portion 19 to which the external wiring 32 is connected on the other side. In addition, a pair of holding springs 2 is provided on both sides of the board-side connecting portion 18 in order to ensure mechanical joining between the main body 16 and the ceramic board 17.
0 and 20 are provided.

The board-side connecting portion 18 is shown in FIGS.
, The upper and lower walls 2 facing each other with a predetermined gap H in between.
1a and 21b, and a contact portion 23 that can be elastically pressed against the connection terminal portion 22 formed on the surface of the ceramic substrate 17 inserted into the gap H. The upper and lower walls 21
The gap H provided between a and 21b is set corresponding to the thickness of the ceramic substrate 17. As shown in FIG. 2, the gap H is formed so as to open on both right and left sides of the connector body 16, and as shown in FIG. It is connected to the ceramic substrate 17 so as to be sandwiched between the walls 21a and 21b.

The contact portion 23 is shown in FIGS.
As shown in FIG. 5, the contact metal fitting 25 is inserted and held in the contact metal fitting holding hole 24 provided in a penetrating shape in the width direction of the main body 16. The contact metal fitting 25 is formed with the base portion 26 held on the lower wall 21b side of the main body 16 integrally with the base portion 26, and is a connection terminal formed on the surface of the ceramic substrate 17 inserted into the gap H. A contact piece 27 that can elastically contact the portion 22 is provided, and conduction with the contact portion 28 of the external wiring side connection portion 19 described below is achieved.

The abutment piece 27 abuts the surface of the ceramic substrate 17 to connect the connection terminal portion 2 on the ceramic substrate 17.
2 has a function of holding the ceramic substrate 17 in the gap H by elastically pressing the ceramic substrate 17 inserted in the gap H with the lower wall 21b while electrically connecting the ceramic substrate 17 to the gap H. is doing. Therefore, by simply inserting the ceramic substrate 17 into the gap H, the connector 16
Will be connected to the ceramic substrate 17.

Further, in the present embodiment, both sides of the board-side connecting portion 18 are brought into contact with the surface of the ceramic board 17, and the ceramic board 17 is pinched with the lower wall portion 21b of the main body 16. A pair of holding springs 20 are provided to ensure the reliability of mechanical connection between the ceramic board 17 and the ceramic board connector 15.

The external wiring side connecting portion 19 according to this embodiment.
The upper and lower walls 29a, 29b and the left and right walls 30
The contact piece 28 is formed by extending the abutting piece 31 from the contact metal fitting 25 in the board-side connecting portion 18 into the slot-like gap I surrounded by a and 30b. In the present embodiment, the gap I is set to have a width and a height that allow the end of the strip-shaped external wiring 32 to be inserted therein, while the contact piece 31 of the contact portion 28 has the contact piece 31.
5 is integrally formed to extend. Then, when the end portion of the external wiring 32 is inserted into the gap I, the external wiring 32 is elastically pinched between the contact piece 31 and the lower wall 29, and the contact portion 28 and The electrical connection with the external wiring 32 is achieved, and the external wiring 32 and the ceramic substrate connector 15 are mechanically connected.

Unlike the conventional connecting structure, the connector 15 for a ceramic substrate according to the present invention does not require a connecting substrate and a pressing plate, so that the number of parts and the manufacturing process can be significantly reduced, and the manufacturing cost can be reduced. Can be significantly reduced. Further, since a pressing plate or the like is unnecessary, it is possible to reduce the size and weight of the device.

Further, as shown in FIG. 1, since the connection structure can be formed at any of the side edge portions of the ceramic substrate 17, the flexibility of the wiring pattern on the ceramic substrate 17 can be enhanced. At the same time, the size of the ceramic substrate itself can be reduced.

Moreover, in the embodiment, since the external wiring side connecting portion 19 to which the external wiring 32 can be directly connected is provided on the opposite side of the ceramic substrate side connecting portion 18, it is connected to the ceramic substrate 17 via the connector 15. External wiring 32
It becomes possible to directly connect and. Therefore, unlike the conventional case, a separate connection board for connecting the external wiring 32 is not required, and the number of parts and the manufacturing cost can be further reduced. In addition, since the external wiring 32 can be easily connected to and detached from the external wiring side connection portion 19, the mounting work can be facilitated and the assembly process can be reduced.

The present invention is not limited to the above-described embodiment. In the embodiment, the ceramic substrate connector 15 according to the present invention is connected to the ceramic substrate 17 used as the head substrate of the thermal printer. However, the present invention can also be applied to a connector connected to another ceramic substrate such as a head substrate used in an optical printer.

Further, the external wiring side connecting portion is not limited to the embodiment, and a plurality of cords can be connected in addition to the thin plate-like cord. Also,
It can also be configured to connect an external wiring side structure having a circular cross section. In addition, although the holding springs 7, 7 are provided on both sides of the board-side connecting portion in the embodiment, they may not be provided. Further, the structure of the contact portions 23 and 26 is not limited to the embodiment, and can be variously changed according to the shape of the end portions of the connecting terminal portion on the ceramic substrate side and the external wiring.

[Brief description of drawings]

FIG. 1 is a plan view showing a connected state of a ceramic substrate connector according to the present invention.

FIG. 2 is a side view showing a connected state of the ceramic substrate connector according to the present invention.

FIG. 3 is a sectional view taken along line III-III in FIG.

FIG. 4 is a view of the board-side connecting portion as seen from the front, and is a view in the direction of the arrow IV in FIG.

FIG. 5 is a cross-sectional view showing a conventional example.

[Explanation of symbols]

 15 ceramic board connector 17 ceramic board 18 board side connection section 19 external wiring side connection section 21a, 21b upper and lower walls 22 connection terminal section 23 contact section (board side connection section) 28 contact section (external wiring side connection section) 29a , 29b Upper and lower walls 30 Left and right walls 32 External wiring H Gap I Gap

Claims (2)

[Claims] 1. A ceramic substrate connector comprising a substrate-side connecting portion connected to a plurality of connecting terminal portions formed on the surface of the ceramic substrate, the substrate-side connecting portion being opposed to each other with a predetermined gap therebetween. Upper and lower walls and a contact portion that can be elastically pressed into contact with the connection terminal portion of the ceramic substrate inserted in the gap, and the side edge portion of the ceramic substrate is sandwiched between the upper and lower walls. A connector for a ceramic substrate, which is configured to be connected to each other. 2. An external wiring side connecting portion is provided on the side opposite to the substrate side connecting portion, the upper and lower walls facing each other through a predetermined gap, and the contact portion connected to the external wiring inserted into the gap. The connector for a ceramic substrate according to claim 1, wherein the connector is a ceramic substrate.