CN103907250A - Optical communication module - Google Patents
Optical communication module Download PDFInfo
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- CN103907250A CN103907250A CN201280053288.8A CN201280053288A CN103907250A CN 103907250 A CN103907250 A CN 103907250A CN 201280053288 A CN201280053288 A CN 201280053288A CN 103907250 A CN103907250 A CN 103907250A
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- resin
- conductive plate
- conversion element
- formed body
- communications module
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- 230000003287 optical effect Effects 0.000 title claims abstract description 108
- 238000004891 communication Methods 0.000 title claims abstract description 105
- 238000006243 chemical reaction Methods 0.000 claims abstract description 83
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 18
- 239000000057 synthetic resin Substances 0.000 claims abstract description 18
- 238000000465 moulding Methods 0.000 claims description 18
- 238000005452 bending Methods 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000004806 packaging method and process Methods 0.000 description 52
- 238000009740 moulding (composite fabrication) Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 5
- 239000013307 optical fiber Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
- G01J1/0411—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using focussing or collimating elements, i.e. lenses or mirrors; Aberration correction
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4262—Details of housings characterised by the shape of the housing
- G02B6/4263—Details of housings characterised by the shape of the housing of the transisitor outline [TO] can type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/0222—Gas-filled housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0231—Stems
Abstract
Provided is an optical communication module which enables simpler manufacturing and lower costs due to fewer parts, and in which a photoelectric conversion element provided with a light receiving part or a light emitting part is mounted on the upper surface of a main body. In an optical communication module (1), a housing body (2) is resin-molded with a bendable conductive plate (3) with part of the conductive plate (3) embedded therein, and a cover body (4) is resin-molded with another section of the conductive plate (3) embedded therein and with the cover body (4) separated from the housing body (2) by a predetermined distance. A photoelectric conversion element (5) is mounted to the conductive plate (3) inside the housing body (2), and a lens part (42) is provided on the cover body (4). The conductive plate (3) is bent between the housing body (2) and the cover body (4), and the housing body (2) and the cover body (4) are positioned and fixed such that a light emitting part or a light receiving part of the photoelectric conversion element (5) faces the lens part (42). The cover body (4) is molded using a translucent synthetic resin, and integrally molded with the lens part (42). The cover body (4) is also integrally molded with a cylindrical part (43), and the cylindrical part (43) is fitted and connected to an optical communication line.
Description
Technical field
The present invention relates to the optical communications module that the conversion element such as laser diode and/or the photodiode encapsulationization for carrying out optical communication is formed.
Background technology
In the past, utilized the optical communication of optical fiber etc. to be popularized widely.Optical communication is carried out as follows: the signal of telecommunication is converted to light signal by conversion elements such as laser diodes, and via optical fiber transceiving light signal, the conversion elements such as photodiode convert the light signal of receiving to the signal of telecommunication.Therefore, the conversion element such as laser diode and/or photodiode is widely used with the optical communications module forming as an encapsulation together with peripheral circuit element for making conversion element action according to different situations.This optical communications module is called as OSA (Optical Sub-Assembly, optical sub-assembly).In recent years, the various inventions relevant to optical communication apparatus and optical communications module were carried out.
For example, in patent documentation 1, propose a kind of light-electric modular converter, possess: photoelectric cell, sends or receiving optical signals; Pillar, for fixed light electric device; Cap, for covering photoelectric cell; And many lead-in wires, apply the signal of telecommunication or send the signal of telecommunication from photoelectric cell to photoelectric cell, one end at the predetermined lead-in wire that is positioned at the encapsulation being made up of pillar and cap arranges planar portions, arrange that one end is connected with photoelectric cell and circuit element that the other end is connected with lead-in wire in this planar portions, by such structure, can realize the light-electric modular converter of excellent in high-frequency characteristics and miniaturization.
Prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2005-167189 communique
Summary of the invention
The problem that invention will solve
Present inventor's invention has also been applied for the optical communications module (this optical communications module is called to existing optical communications module) of following structure.Fig. 7 is the schematic cross sectional views that the structure of existing optical communications module is shown.In the drawings, label 101 is existing optical communications module, and it is configured to photo-electric conversion element 105 and connected conductive plate 103 are accommodated in the packaging container 102 of light transmission.Packaging container 102 is that the synthetic resin (transparent resin) that utilizes light transmission carries out resin forming and forms, its form integratedly overlook be the cylinder portion 123 of roughly foursquare bottom 21, the perisporium 22 of being located at the upper surface of this bottom 21, the outstanding lower surface that is arranged at bottom 21 and be located at bottom the lens section 124 of substantial middle of 21 lower surface.At packaging container 102, formed the recess 25 of storage photo-electric conversion element 105 by bottom 21 and perisporium 22.
At the packaging container 102 of optical communications module 101, multiple conductive plates 103 are embedded in the upper surface (bottom surface of recess 25) of bottom 21 so that its upper surface is exposed to mode in recess 25, on a conductive plate 103, photo-electric conversion element 105 are installed.At conductive plate 103, be formed with opening 131 in the position corresponding with the lens section 124 of being located at bottom 21 lower surface, photo-electric conversion element 105 is configured on the opening 131 of conductive plate 103.
Photo-electric conversion element 105 has: rectangular-shaped main part 151, and overlook and be roughly square; Light accepting part or illuminating part (omit diagram), be located at the substantial middle of the lower surface of this main part 151; The first terminal 152, is located at the light accepting part of lower surface of main part 151 or illuminating part around; And second terminal 153, be located at the upper surface of main part 151.The first terminal 152 and the second terminal 153 for carry out the transmitting-receiving of the signal of telecommunication between photo-electric conversion element 105 and conductive plate 103, for example, are anode terminal and the cathode terminal etc. of photodiode or laser diode.The first terminal 152 of photo-electric conversion element 105 is connected with conductive plate 103 by soldering, and the second terminal 153 connects (wire bonds) via wire.In addition, be fixed with and be formed as roughly foursquare tabular lid 126 in the upper end of the perisporium 22 of packaging container 102, by interior recess 25 sealing.
The existing optical communications module 101 of this spline structure can be realized the low price and the facilitation of manufacture etc. that are obtained by the reduction of number of elements.But, in this existing optical communications module 101, as photo-electric conversion element 105, need to adopt the structure that is provided with light accepting part or illuminating part at the lower surface of main part 151 (be provided with and carry out the face with the terminal being connected of conductive plate 103).But photo-electric conversion element also has upper surface to be provided with the structure of light accepting part or illuminating part, existing optical communications module 101 cannot use such photo-electric conversion element.
The present invention is just in view of such situation completes, its object is to provide a kind of optical communications module, it is equipped with upper surface (being provided with the opposing face of the face of the splicing ear being connected with conductive plate) at main part and is provided with the photo-electric conversion element of light accepting part or illuminating part, can realize the low price and the facilitation of manufacture etc. that are obtained by the reduction of number of elements.
For solving the scheme of problem
Optical communications module of the present invention possesses the conversion element that carries out the conversion from light signal to the signal of telecommunication or from the signal of telecommunication to light signal, and described optical communications module is characterised in that to possess: conductive plate, and for described conversion element is installed, and can be bending; The first resin-formed body, to imbed the mode moulding of a part of described conductive plate; The second resin-formed body, with described the first resin-formed body spaced a predetermined distance from imbed the mode moulding of other parts of described conductive plate; And lens section, be located at described the second resin-formed body, described conversion element is arranged on a part for the described conductive plate that is embedded in described the first resin-formed body, described the first resin-formed body with described the second resin-formed body so that the bending described conductive plate of the described conversion element mode relative with described lens section fixing.
And optical communications module of the present invention is characterised in that, described the second resin-formed body is by the molding synthetic resin of light transmission, described lens section and described the second resin forming body by integral forming.
And, optical communications module of the present invention is characterised in that, described the first resin-formed body has bottom and surrounds the perisporium of described bottom, a part for described conductive plate is embedded in described the first resin-formed body so that part or all of surface is exposed to the mode of described bottom, and described the second resin-formed body is fixing on the complete cycle of the end of described perisporium.
And optical communications module of the present invention is characterised in that, described the first resin-formed body is by the molding synthetic resin of light transmission, and described conversion element is embedded in described the first resin-formed body.
And, optical communications module of the present invention is characterised in that to possess a portion, described cylinder portion and described the second resin forming body by integral forming, for chimeric optical communication wire, described conversion element is by described lens section and be embedded in the transmitting-receiving of carrying out light signal between the optical communication wire of described cylinder portion.
In the present invention, on conductive plate that can be bending, to imbed its a part of mode, the first resin-formed body is set, and in the mode of imbedding other parts of conductive plate spaced a predetermined distance from, the second resin-formed body is set.The conversion element that carries out the conversion of the signal of telecommunication and light signal is arranged on a part for the conductive plate that is embedded in the first resin-formed body.And, at the second resin-formed body, lens section is set.
Thus, the first resin-formed body and the state of the second resin-formed body in being connected via conductive plate, therefore fix conductive plate bending the first resin-formed body and the second resin-formed body.Now, so that the conversion element mode relative with the lens section of being located at the second resin-formed body of installing at the electric conductor that is embedded in the first resin-formed body carried out the location of the first resin-formed body and the second resin-formed body.
So, be different resin-formed bodies by the part that makes to arrange conversion element and the part that lens section is set, not only can in optical communications module, be mounted in lower surface the conversion element of light accepting part or illuminating part is set, and can in optical communications module, be mounted in upper surface and arrange the conversion element of light accepting part or illuminating part.And two resin-formed bodies connect via conductive plate, therefore can be by bending conductive plate and easily fix two resin-formed bodies with the method such as bonding or deposited.
And, in the present invention, make the molding synthetic resin of the second resin-formed body by light transmission, and make lens section and this second resin forming body by integral forming.Thus, the number of elements of optical communications module can be cut down, easy to manufactureization of optical communications module can be made.
And in the present invention, the first resin-formed body adopts the structure of perisporium that has bottom and surround this bottom, and so that the mode of part or all of surface bottom being exposed to imbedded a part for conductive plate.Thus, the recess that can be surrounded by bottom and perisporium in the first resin-formed body setting, can be received into conversion element in this recess.And the second resin-formed body is fixing on the complete cycle of the end of perisporium.Thus, by the recess sealing of storage conversion element.
And, in the present invention, make the molding synthetic resin of the first resin-formed body by light transmission, and conductive plate and the conversion element that is installed on this conductive plate are embedded in to the first resin-formed body.Thus, can easily carry out the sealing of conversion element, conversion element can carry out by the synthetic resin of light transmission the transmitting-receiving of light signal.
And, in the present invention, make a portion and the second resin forming body by integral forming, at optical communication wires such as the chimeric connection optical fiber of this.Conversion element is by being located at the lens section of the second resin-formed body and following the transmitting-receiving of carrying out light signal between the chimeric optical communication wire of cylinder portion.Thus, can make the location facilitation of optical communication wire with respect to optical communications module, and the number of elements that can cut down optical communications module.
Invention effect
In situation according to the present invention, the first resin-formed body is connected via conductive plate with the second resin-formed body.A part at the conductive plate that is embedded in the first resin-formed body is installed photo-electric conversion element, and so that is located at the bending conductive plate of mode that the lens section of the second resin-formed body is relative with photo-electric conversion element and the first resin-formed body and the second resin-formed body location are fixed.By this structure, can be mounted in upper surface and be provided with the conversion element of light accepting part or illuminating part, and can realize number of elements optical communications module few and easy to manufacture.
Brief description of the drawings
Fig. 1 is the schematic cross sectional views that the structure of optical communications module of the present invention is shown.
Fig. 2 is the schematic cross sectional views that the structure of optical communications module of the present invention is shown.
Fig. 3 A is the vertical view that the structure of photo-electric conversion element is shown.
Fig. 3 B is the vertical view that the structure of photo-electric conversion element is shown.
Fig. 4 is the schematic cross sectional views that the structure of the conductive plate of optical communications module is shown.
Fig. 5 is the schematic cross sectional views that the structure of the optical communications module of variation 1 is shown.
Fig. 6 is the schematic cross sectional views that the structure of the optical communications module of variation 2 is shown.
Fig. 7 is the schematic cross sectional views that the structure of existing optical communications module is shown.
Embodiment
Below, the accompanying drawing based on representing this execution mode specifically describes the present invention.Fig. 1 and Fig. 2 are the schematic cross sectional views that the structure of optical communications module of the present invention is shown.In the drawings, the optical communications module of label 1 for the photo-electric conversion element such as photodiode or laser diode 5 encapsulation are formed.Optical communications module 1 is for linking with the optical communication wire such as optical fiber (omitting diagram), by carrying out the transmitting-receiving of light signal between this optical communication wire and other optical communication apparatus, carrying out the element of the conversion between light signal and the signal of telecommunication.
Fig. 3 A and Fig. 3 B are the vertical views that the structure of photo-electric conversion element 5 is shown.In addition, the structure of the upper surface of photo-electric conversion element 5 is shown in Fig. 3 A, the structure of lower surface has been shown in Fig. 3 B.Photo-electric conversion element 5 has to overlook and is roughly foursquare flat rectangular-shaped main part 51.At the lower surface of main part 51, be respectively equipped with the first terminal 52 at Qi Sijiao.Four the first terminals 52 are brazed in conductive plate 3.And, at the upper surface of main part 51, be provided with illuminating part or light accepting part 54 in substantial middle, and be provided with second terminal 53.The second terminal 53 is connected with conductive plate 3 via wire 35 by wire bonds.The first terminal 52 is terminals of the transmitting-receiving for carrying out the signal of telecommunication relevant to opto-electronic conversion with the second terminal 53, for example, be anode terminal and the cathode terminal etc. of photodiode or laser diode.
And, the lid 4 of optical communications module 1 have overlook with bottom 21 roughly the same be roughly foursquare base portion 41.Substantial middle at the face of a side of base portion 41 (be the face of downside in Fig. 1, be the face of upside in Fig. 2, but hereinafter referred to as lower surface) is provided with lens section 42.And, at the face (hereinafter referred to as upper surface) of the opposition side of base portion 41, the outstanding cylinder cylindraceous portion 43 being provided with for linking optical communication wire upward.Lid 4 is to utilize the synthetic resin of light transmission that base portion 41, lens section 42 and cylinder portion 43 are made of one piece, carrying out imbedding multiple conductive plates 3 when one-body molded.
The conductive plate 3 of imbedding lid 4 is identical with the conductive plate 3 of imbedding packaging container 2.Specifically, conductive plate 3 is the plate bodys (aggregates of multiple plates) with the length more than twice of an edge lengths of packaging container 2 and lid 4, one end part of the length direction of conductive plate 3 is imbedded in packaging container 2, and, with packaging container 2 spaced a predetermined distance from the part midway of conductive plate 3 is imbedded to lid 4., packaging container 2 is connected via conductive plate 3 with lid 4.
Fig. 4 is the schematic plan that the structure of the conductive plate 3 of optical communications module 1 is shown, its in the shape of overlooking of conductive plate 3 with the overlapping profile that packaging container 2, lid 4 and lens section 42 are shown of single-point line.In illustrated example, optical communications module has three conductive plate 3a～3c.The first conductive plate 3a has and is located at the roughly foursquare part of one end and from the extended elongated roughly rectangular part of this part, is provided with and makes it bend to the part that U-shaped forms midway in rectangular part roughly.The second conductive plate 3b is elongated roughly rectangle, and it is provided with and makes it bend to the part that U-shaped forms midway.And, the 3rd conductive plate 3c has makes its one end with the part of surrounding the mode bending of roughly foursquare part of the first conductive plate 3a and forming with from the extended elongated roughly rectangular part of this part, is provided with and makes it bend to the part of U-shaped midway in rectangular part roughly.
Imbed the roughly foursquare part of the first conductive plate 3a and from the bending part of one end of one end part of the part of the extended roughly rectangular part of this part, the second conductive plate 3b, the 3rd conductive plate 3c and from the part of the extended roughly rectangular part of this part at the packaging container 2 of optical communications module 1.The roughly rectangular part of the first～three conductive plate 3a～3c is respectively since a side of packaging container 2 extends out and be exposed to outside, and between packaging container 2 and lid 4, the first～three conductive plate 3a～3c configures substantially in parallel.
And, imbed the part midway of the elongated roughly rectangular part of the part that bends to U-shaped that comprises the first～three conductive plate 3a～3c at the lid 4 of optical communications module 1.The part that bends to U-shaped of the first～three conductive plate 3a～3c is the roundabout circuity part 31 of the allocation position of lens section 42 excessively of mode not overlapping with the lens section 42 of being located at lid 4 with (in vertical view).Lid 4 extends the first～three conductive plate 3a～3c and is connected with packaging container 2 from a side, also extend substantially in parallel the other end of the first～three conductive plate 3a～3c from the side of its opposition side.
The first conductive plate 3a installs photo-electric conversion element 5 by roughly foursquare part soldering the first terminal 52 at one end.The second conductive plate 3a is connected with the second terminal 53 of the upper surface of being located at photo-electric conversion element 5 via wire 35 in one end part.The 3rd conductive plate 3c is for example connected with earthing potential, for optical communications module 1 is shielded.And the first～three conductive plate 3a～3c uses as the terminal for optical communications module 1 is connected with the circuit substrate of for example communicator from the extended part of opposing face of lid 4.
Conductive plate 3 (the first～three conductive plate 3a～3c) is for example thin metallic plate, can be bending.In the manufacturing process of optical communications module 1, one end of unbent conductive plate 3 is configured in the metal pattern for making packaging container 2 moulding, and by the partial configuration midway of conductive plate 3 in the metal pattern for making lid 4 moulding, by making the synthetic resin of light transmission flow into each metal pattern and solidify, carry out the moulding of packaging container 2 and lid 4.Under this state, as shown in Figure 2, packaging container 2 is spaced a predetermined distance from lid 4 and be connected via conductive plate 3.
Next, by conductive plate 3 bendings between packaging container 2 and lid 4, so that in photo-electric conversion element 5 mode relative with the lens section 42 of being located at lid 4 of the recess 25 interior installations of packaging container 2, make under the upper surface of perisporium 22 of packaging container 2 and the state of the lower surface butt of lid 4, by the method such as bonding or deposited such as by fixing to packaging container 2 and lid 4.Now, so that the illuminating part of photo-electric conversion element 5 or light accepting part 54 center and lens section 42 center roughly consistent mode carry out the location of packaging container 2 and lid 4.
After this, optical communications module 1 is using the end of extended side from lid 4 conductive plate 3 as splicing ear and be connected and fix with circuit substrate of optical communication apparatus etc.And, the optical communication wire such as 43 insertions of cylinder portion chimeric optical fiber on the outstanding lid 4 that is arranged at optical communications module 1.Thus, the photo-electric conversion element that is accommodated in packaging container 25 of optical communications module 1 can scioptics portion 42 and is embedded in the transmitting-receiving of carrying out light signal between the optical communication wire of a portion 43, and can and between the telecommunication circuit of the formations such as the circuit substrate of optical communication apparatus, carry out the transmitting-receiving of the signal of telecommunication via conductive plate 3.
The optical communications module 1 of above structure is configured to, on conductive plate 3 that can be bending, make packaging container 2 resin formings to imbed its a part of mode, and with packaging container 2 spaced a predetermined distance from imbed other parts of conductive plate 3 mode make lid 4 resin formings, and the conductive plate 3 in packaging container 2 is installed photo-electric conversion element 5, at lid 4, lens section 42 is set, by conductive plate 3 bendings between packaging container 2 and lid 4, so that the illuminating part of photo-electric conversion element 4 or light accepting part 54 mode relative with lens section 42 located packaging container 2 and lid 4 fix.So, by making the packaging container 2 that is provided with photo-electric conversion element 5 be formed as different resin-formed bodies from the lid 4 that is provided with lens section 42, can realize and use the optical communications module 1 that the photo-electric conversion element 5 of illuminating part or light accepting part 54 is set at upper surface (be provided with and carry out the opposing face with the face of the first terminal being connected 52 of conductive plate 3).And, in this structure, packaging container 2 as two resin-formed bodies is connected via conductive plate 3 with lid 4, therefore bending conductive plate 3 two resin-formed bodies being fixed by the method such as bonding or deposited, thus can easily carry out the manufacture of optical communications module.
And by making the molding synthetic resin of lid 4 by light transmission, and by integrated lens section 42 structure, the number of elements that can cut down optical communications module 1, can make easy to manufactureization of optical communications module 1.And, by 4 one-body molded portions of lid 43, and in the structure of the chimeric connection optical communication wire of cylinder portion 43, can make the location facilitation of optical communication wire with respect to optical communications module 1, and the number of elements that can cut down optical communications module 1.
And, the recess 25 surrounding by the bottom 21 by packaging container 2 and perisporium 22 is received photo-electric conversion element 5, at the conductive plate 3 that is exposed to bottom 21, photo-electric conversion element 5 is installed, and the structure of fixing lid 4 on the complete cycle of the upper surface of perisporium 22, can easily and reliably seal photo-electric conversion element 5.
In addition, shape and the structure etc. of illustrated packaging container 2, conductive plate 3, lid 4 and photo-electric conversion element 5 are examples in the present embodiment, are not limited thereto.And optical communications module 1 is for to make the structure of packaging container 2 by the molding synthetic resin of light transmission, but be not limited thereto, packaging container 2 also can be by the molding synthetic resin of non-light transmittance.And, be formed as the structure in 4 one-body molded portions of lid 43, but be not limited to this, also can independently manufacture a portion 43 and be fixed on lid 4 by the method such as bonding or deposited, can be also the structure that optical communications module 1 does not possess a portion 43.And optical communications module 1 has three conductive plate 3a～3c as conductive plate 3, but is not limited to this, it can be also below thering are two or the structure of four above conductive plates.And number and the configuration etc. of the first terminal 52 of photo-electric conversion element 5 are not limited to the situation shown in Fig. 3 B.Photo-electric conversion element 5 is formed as having the structure of second terminal 53, but is not limited to this, can be also the structure with plural the second terminal.And the configuration of the second terminal 53 is not limited to the situation shown in Fig. 3 A.
(variation 1)
Fig. 5 is the schematic cross sectional views that the structure of the optical communications module 201 of variation 1 is shown.The optical communications module 201 of variation 1 is to make packaging container 202 and lid 204 structure by the molding synthetic resin of non-light transmittance.Therefore, lens section 260 is manufactured with respect to lid 204 is independent, and by the manufacturing process of optical communications module 201, lens section 260 is installed on to lid 204.
So, the lens section 260 of optical communications module 201 also can with lid 204 splits, and can make the molding synthetic resin of lid 204 by non-light transmittance.
(variation 2)
Fig. 6 is the schematic cross sectional views that the structure of the optical communications module 301 of variation 2 is shown.In the optical communications module 301 of variation 2, the structure of lid 4 is identical with the structure shown in Fig. 1, but the structure of packaging container 302 is different from the packaging container 2 shown in Fig. 1.The packaging container 302 of the optical communications module 301 of variation 2 is imbedded the end of (resin sealing) conductive plate 3 and is installed on the photo-electric conversion element 5 of this end overlooking in the base portion 321 that is foursquare flat cuboid roughly.And, be provided with perisporium 322 at the upper surface of base portion 321, in the upper surface of perisporium 322 by the fixing lid 4 of method such as bonding or deposited.
In the manufacturing process of the optical communications module 301 of variation 2, carrying out after the installation of photo-electric conversion element 5 with respect to conductive plate 3, conductive plate 3 and photo-electric conversion element 5 are accommodated in to the resin forming that carries out packaging container 302 and lid 4 in metal pattern.Then, by conductive plate 3 bendings between packaging container 302 and lid 4, so that the mode relative with the lens section 42 of being located at lid 4 of the photo-electric conversion element 5 in packaging container 302, make under the upper surface of perisporium 322 of packaging container 302 and the state of the lower surface butt of lid 4, by the method such as bonding or deposited such as by fixing to packaging container 302 and lid 4.Photo-electric conversion element 5 can and be embedded in the transmitting-receiving of carrying out light signal between the optical communication wire of a portion 43 by the base portion of light transmission 321 and lens section 42.
So, can be configured in the time of the resin forming of packaging container 302 photo-electric conversion element of optical communications module 301 5 is sealed.
Label declaration
1: optical communications module;
2: packaging container (the first resin-formed body);
3,3a, 3b, 3c: conductive plate;
4: lid (the second resin-formed body);
5: photo-electric conversion element (conversion element);
21: bottom;
22: perisporium;
25: recess;
35: wire;
41: base portion;
42: lens section;
43: cylinder portion;
51: main part;
52: the first terminal;
53: the second terminals;
54: illuminating part or light accepting part;
201: optical communications module;
202: packaging container;
204: lid;
242: through hole
260: lens section;
301: optical communications module;
302: packaging container;
321: base portion;
322: perisporium.
Claims (5)
1. an optical communications module, possesses the conversion element that carries out the conversion from light signal to the signal of telecommunication or from the signal of telecommunication to light signal, and described optical communications module is characterised in that,
Possess: conductive plate, for described conversion element is installed, and can be bending;
The first resin-formed body, to imbed the mode moulding of a part of described conductive plate;
The second resin-formed body, with described the first resin-formed body spaced a predetermined distance from imbed the mode moulding of other parts of described conductive plate; And
Lens section, is located at described the second resin-formed body,
Described conversion element is arranged on a part for the described conductive plate that is embedded in described the first resin-formed body,
Described the first resin-formed body with described the second resin-formed body so that the bending described conductive plate of the described conversion element mode relative with described lens section fixing.
2. optical communications module according to claim 1, is characterized in that,
Described the second resin-formed body is by the molding synthetic resin of light transmission,
Described lens section and described the second resin forming body by integral forming.
3. optical communications module according to claim 1 and 2, is characterized in that,
Described the first resin-formed body has bottom and surrounds the perisporium of described bottom,
A part for described conductive plate is embedded in described the first resin-formed body so that part or all of surface is exposed to the mode of described bottom,
Described the second resin-formed body is fixing on the complete cycle of the end of described perisporium.
4. optical communications module according to claim 1 and 2, is characterized in that,
Described the first resin-formed body is by the molding synthetic resin of light transmission,
Described conversion element is embedded in described the first resin-formed body.
5. according to the optical communications module described in any one of claim 1 to 4, it is characterized in that,
Possess a portion, described cylinder portion and described the second resin forming body by integral forming, for chimeric optical communication wire,
Described conversion element is by described lens section and be embedded in the transmitting-receiving of carrying out light signal between the optical communication wire of described cylinder portion.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-241622 | 2011-11-02 | ||
| JP2011241622A JP2013098431A (en) | 2011-11-02 | 2011-11-02 | Optical communication module |
| PCT/JP2012/078293 WO2013065774A1 (en) | 2011-11-02 | 2012-11-01 | Optical communication module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103907250A true CN103907250A (en) | 2014-07-02 |
Family
ID=48192112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280053288.8A Pending CN103907250A (en) | 2011-11-02 | 2012-11-01 | Optical communication module |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20140291494A1 (en) |
| JP (1) | JP2013098431A (en) |
| CN (1) | CN103907250A (en) |
| WO (1) | WO2013065774A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI706179B (en) * | 2018-10-01 | 2020-10-01 | 創威光電股份有限公司 | Optical sub-assembly module and cap of optical sub-assembly module |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10587090B1 (en) * | 2015-12-31 | 2020-03-10 | Soraa Laser Diode, Inc. | Safe laser light |
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| JPH06198957A (en) * | 1992-12-29 | 1994-07-19 | Kyocera Corp | Imaging device |
| JP2000277814A (en) * | 1999-03-29 | 2000-10-06 | Sumitomo Electric Ind Ltd | Optical communication module |
| CN2613771Y (en) * | 2003-01-20 | 2004-04-28 | 一品光学工业股份有限公司 | Optical sub-module improved structure for optical receiver-transmitter |
| CN101102161A (en) * | 2007-07-26 | 2008-01-09 | 智科光光电（深圳）有限公司 | Optical transmission secondary module for optical fiber communication |
| US20100247043A1 (en) * | 2009-03-24 | 2010-09-30 | Hitachi, Ltd. | Optical module and wavelength division multiplexing optical module |
| CN101975980A (en) * | 2009-06-16 | 2011-02-16 | 瑞萨电子株式会社 | Optical communication module and method for manufacturing the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4218174B2 (en) * | 2000-03-17 | 2009-02-04 | パナソニック株式会社 | Optical pickup |
| JP2008130773A (en) * | 2006-11-20 | 2008-06-05 | Sharp Corp | Integrated optical device, integrated optical device mounting method, and optical element manufacturing method |
-
2011
- 2011-11-02 JP JP2011241622A patent/JP2013098431A/en not_active Ceased
-
2012
- 2012-11-01 WO PCT/JP2012/078293 patent/WO2013065774A1/en active Application Filing
- 2012-11-01 CN CN201280053288.8A patent/CN103907250A/en active Pending
- 2012-12-01 US US14/355,749 patent/US20140291494A1/en not_active Abandoned
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06198957A (en) * | 1992-12-29 | 1994-07-19 | Kyocera Corp | Imaging device |
| JP2000277814A (en) * | 1999-03-29 | 2000-10-06 | Sumitomo Electric Ind Ltd | Optical communication module |
| CN2613771Y (en) * | 2003-01-20 | 2004-04-28 | 一品光学工业股份有限公司 | Optical sub-module improved structure for optical receiver-transmitter |
| CN101102161A (en) * | 2007-07-26 | 2008-01-09 | 智科光光电（深圳）有限公司 | Optical transmission secondary module for optical fiber communication |
| US20100247043A1 (en) * | 2009-03-24 | 2010-09-30 | Hitachi, Ltd. | Optical module and wavelength division multiplexing optical module |
| CN101975980A (en) * | 2009-06-16 | 2011-02-16 | 瑞萨电子株式会社 | Optical communication module and method for manufacturing the same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI706179B (en) * | 2018-10-01 | 2020-10-01 | 創威光電股份有限公司 | Optical sub-assembly module and cap of optical sub-assembly module |
| US10895700B2 (en) | 2018-10-01 | 2021-01-19 | Axcen Photonics Corp. | Optical sub-assembly module and cap thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013098431A (en) | 2013-05-20 |
| US20140291494A1 (en) | 2014-10-02 |
| WO2013065774A1 (en) | 2013-05-10 |
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Application publication date: 20140702 |