JP2000277814A - Optical communication module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an optical communication module, the function of which can be improved. SOLUTION: An optical communication module 1 is provided with a flexible printed board 2 carrying a first conductive layer, semiconductor electronic devices 4 and 6, and a semiconductor optical device 8. The optical device 8 is mounted on the printed board 2 and emits or receives light having a prescribed wavelength. The electronic devices 4 and 6 are mounted on the printed board 2 and electrically connected to the optical device 8 via the first conductive layer formed on the printed board 2. The optical device 8 and electronic devices 4 and 6 are sealed with sealing resins 10 and 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an optical communication module, and more particularly, to an optical communication module including a semiconductor optical device and a semiconductor electronic device mounted on a flexible printed circuit board.

[0002]

2. Description of the Related Art Conventional optical links include the following.

[0003] Japanese Patent Application Laid-Open No. 10-123376 describes a technique related to a lead frame used for an optical link. The lead frame has an optical element mounting part, an electronic element mounting part, and a connecting part for electrically connecting the two parts and maintaining a predetermined shape. The optical element is mounted on the optical element mounting portion of the lead frame, and the electronic element is mounted on the electronic element mounting portion. Wiring leads are formed in the electronic element mounting section and the optical element mounting section to electrically connect the optical element and the electronic element, and these sections are individually resin-sealed. In this optical link, the direction of the optical axis of the optical element is directed to the optical fiber by bending the connection portion into a hook shape.

[0004]

In this lead frame, the wiring leads also serve as external lead pins. For this reason, in terms of mechanical strength, there is a limit in reducing the thickness of the lead frame metal plate in order to form fine wiring. If the strength of the wiring lead is insufficient, the wiring lead may be deformed during resin molding.

Further, since the lead frame is formed from a thin metal plate by etching, there is a limit to miniaturization due to the manufacturing method.

[0006] The lead frame has wiring leads and die pads of desired shapes. However, since the lead frame is formed from a single metal plate, a multilayer conductive layer cannot be used to connect elements mounted on the lead frame.

On the other hand, in order to enhance the functions of the optical link, a structure capable of forming a more complicated and fine wiring pattern is required.

[0008] Therefore, an object of the present invention is to provide an optical communication module capable of achieving high functionality.

[0009]

Means for Solving the Problems The inventor has repeatedly studied an optical communication module which can solve the above-mentioned problems and can cope with a future increase in the speed of optical communication.

For high-speed optical communication, it is important to improve noise characteristics. For this, GND
Wiring needs to be strengthened. However, in the lead frame, there is a limit in enhancing the GND potential.

It is also necessary to seal the optical device and the semiconductor electronic device with a resin as in the conventional case.

As a result of studying the above, the present invention is as follows.

An optical communication module according to the present invention includes a flexible printed board, a semiconductor optical device, and a semiconductor electronic device. The semiconductor optical device is mounted on a flexible printed circuit board and emits or receives light of a predetermined wavelength. Semiconductor electronic devices are mounted on flexible printed circuit boards. The semiconductor optical device is molded and sealed. Further, the semiconductor electronic device is also molded and sealed. The semiconductor optical device is electrically connected to the semiconductor electronic device on the flexible printed board.

The flexible printed board has a first conductive layer and an insulating base. Since the first conductive layer of the flexible printed circuit board is supported by the base, the mechanical strength of the conductive layer is reinforced by the base. Therefore, fine wiring can be formed on the flexible printed circuit board without considering the mechanical strength of the wiring lead as in a lead frame.

In such an optical communication module, a semiconductor electronic device and a semiconductor optical device can be mounted on the same surface of a flexible printed circuit board.

In the optical communication module according to the present invention, the insulating base of the flexible printed circuit board has a first surface provided with the first conductive layer, and a second surface facing the first surface. The second side can have a second conductive layer. Further, the flexible printed circuit board can include a third conductive layer having conductivity between the first surface and the second surface. The third conductive layer is a conductive layer different from the first conductive layer and the second conductive layer. For this reason, in the flexible printed circuit board, a multi-layered conductive layer can be used. A complicated and fine wiring pattern can be realized.

The first conductive layer, the second conductive layer, and the third conductive layer are insulated by the base except when they are intentionally connected by, for example, connection vias.

The optical communication module of the present invention can have a resin body for molding and sealing a semiconductor optical device and a resin body for molding and sealing a semiconductor semiconductor electronic device. The semiconductor optical device can be sealed with a resin body formed of a sealing resin transparent to light of a predetermined wavelength. Such a resin body can be formed by a transfer molding method. A lens that can be optically coupled to a semiconductor optical device can be provided by utilizing the shape of the resin body. With this lens,
When the semiconductor optical device is a light receiving device, light can be condensed on the light receiving surface. Can be collected.

In the optical communication module of the present invention, it is preferable that the element forming surface of the semiconductor electronic device faces the flexible printed circuit board. In such an optical communication module, the light received or emitted by the semiconductor optical device does not directly reach the element formed on the element forming surface as noise light. Therefore, it is possible to prevent noise light from affecting the operation of the semiconductor electronic device.

In the optical communication module according to the present invention, the flexible printed circuit board may have a positioning means for enabling the semiconductor optical device to be sealed. The positioning means enables the semiconductor optical device and the flexible printed circuit board to be reliably positioned. As such a positioning means, for example, a through hole formed in a flexible substrate can be applied.

[0021] The optical communication module of the present invention can include a second semiconductor electronic device electrically connected to at least one of the first semiconductor electronic device and the semiconductor optical device. The semiconductor optical device, the first semiconductor electronic device, and the second semiconductor electronic device are mounted on one main surface of a flexible printed board. The flexible printed circuit board is formed by integrally molding the first semiconductor electronic device and the second semiconductor semiconductor electronic device in a state where the flexible semiconductor substrate is bent so as to face one of the main surface and the back surface facing the main surface. Can be sealed.

Since a plurality of semiconductor electronic devices are mounted on a flexible printed circuit board and sealed with an integrated resin body, the function of the optical communication module can be enhanced while the mounting portion of the semiconductor electronic devices is reduced in size. . Also,
Since a flexible printed board is used, the board can be easily bent even when an integrated resin body is formed. The portion of the flexible printed board on which the resin body is not formed remains flexible. Therefore, the flexible printed board is easily bent when the flexible printed board is arranged in the mold sealing mold. For this reason, the manufacturing process can be simplified as compared with a case where a lead frame that requires a process of bending in advance to match the mold is used.

An optical communication module according to the present invention has a first region provided with a first resin member for sealing a semiconductor electronic device, and a second region provided with a second resin member for sealing a semiconductor optical device. , A flexible first neck region provided between the first region and the second region, and at least one or more conductive layers connecting the semiconductor electronic device and the semiconductor optical device. A substrate. Such a flexible printed circuit board is provided with a second side having flexibility provided between the terminal side on which the lead terminal is provided, and one of the first resin body and the second resin body and the terminal side. It can have a neck region. Thereby, even after the completion of the optical communication module, the neck region can be repeatedly bent. It is preferable that the first region of the flexible printed board is provided between the lead side and the second region.

[0024]

Embodiments of the present invention will be described with reference to the drawings. When possible, the same and similar parts are denoted by the same reference numerals, and redundant description will be omitted.

FIG. 1 is a perspective view of an optical communication module according to the present invention. FIG. 1 is a partially cutaway view so that the inside of the optical communication module becomes clear. Referring to FIG. 1, an optical communication module 1 includes a flexible printed circuit board 2, semiconductor electronic devices 4 and 6, a semiconductor optical device 8, and a first molded resin body 10 that seals the semiconductor electronic devices 4 and 6. Second sealing the semiconductor optical device 8
And a molded resin body 12. The semiconductor electronic devices 4 and 6 and the semiconductor optical device 8
On the surface 22a.

The flexible printed circuit board 2 includes a base 2
2, a lead terminal 24, a first conductive layer 26, a second conductive layer 28, and a third conductive layer 30. A plurality of lead terminals 24 are provided on one side of the base 22. The lead terminals 24 are connected to a mounting board (not shown) to enable transmission of electrical signals. The base 22 electrically insulates the first conductive layer 26, the second conductive layer 28, and the third conductive layer 30, respectively. The base 22 is a rectangular film and has flexibility. The base 22 is made of the lead terminal 2
4, the first conductive layer 26, the second conductive layer 28, and the third
It is also a supporting member having mechanical strength capable of supporting the conductive layer 30 of FIG. This support member has electrical insulation. When such a supporting member is used, each wiring layer 2
6, 28 and 30 enable miniaturization to a minimum width of about 0.1 mm.

The base 22 includes a first area 2a, a second area 2b, and a third area 2c along a predetermined axis 20 direction.
Having. The first area 2a has lead terminals 24 provided on one side of the flexible printed circuit board. Second
In the region 2b, a resin body 10 for sealing the semiconductor electronic devices 4 and 6 is provided. The third region 2c has a resin body 12 for sealing the semiconductor optical device 8.
The resin body 1 is located between the second region 2b and the third region 2c.
A first neck region having flexibility is formed such that the angle between the surface of the flexible printed circuit board 2 on which the “0” is mounted and the surface of the flexible printed circuit board 2 on which the resin body 12 is mounted can be changed. Is done. First area 2a
And the second region 2b have such flexibility that the angle between the surface including the plurality of lead terminals 24 and the surface of the flexible printed circuit board 2 on which the resin body 10 is mounted can be changed. A second neck region is formed. Such first and second neck regions serve to diversify the connection form when the optical communication module 1 is coupled to an optical connector (not shown) after being mounted on the mounting board. The resin bodies 10 and 12 also reinforce the mechanical strength of the base 22.

FIG. 2 is a sectional view of the optical communication module 1 taken along the line II of FIG. Referring to FIGS. 1 and 2, first conductive layer 26, second conductive layer 28, and third conductive layer
The conductive layer 30 will be described. The first conductive layer 26
It is formed on the first surface 22 a of the base 22. The second conductive layer 28 is formed on the second surface 22b of the base 22. The third conductive layer 30 is formed on the first surface 22 of the base 22.
a and the second surface 22b. First conductive layer 26, second conductive layer 28, and third conductive layer 30
Are the lead terminals 24, the semiconductor electronic device 4,
6, and a metal thin film formed in a predetermined pattern to electrically connect the semiconductor optical devices 8 to each other.
The first conductive layer 26, the second conductive layer 28, and the third conductive layer 30 can be electrically connected to each other via via holes 22d provided in the insulating member 22c.

In a preferred embodiment, the first conductive layer 26 and the third conductive layer 30 are used as wiring for connecting the semiconductor electronic devices 4 and 6 and the semiconductor optical device 8 to each other. It is preferable to use the second conductive layer 28 to enhance the reference potential (ground, GND) of the optical communication module 1. In this way, a plurality of wiring layers can be used to achieve a higher function of the optical communication module 1, and in addition, the reference potential is enhanced to improve the noise characteristics, that is, the impedance is matched. You can also achieve To enhance the reference potential, for example, the GND plane can be formed wide and thick. As the thin films of the first conductive layer 26, the second conductive layer 28, and the third conductive layer 30, a copper (Cu) thin film can be used. It is possible to provide a plurality of conductive layers between the first conductive layer 26 and the second conductive layer 28 to such an extent that the flexibility of the flexible printed circuit board is not sacrificed.

Referring again to FIG. 1, the semiconductor electronic devices 4, 6 can process the electrical signals received from the semiconductor optical device 8. The processed signal is output from the optical communication module 1 via the lead terminal 24. Further, the semiconductor electronic devices 4 and 6 are connected to the lead terminals 2.
An electric signal received from outside the optical communication module 1 via the optical communication module 4 can be processed, and the semiconductor optical device 8 can be driven via the wiring layer on the base 22. Semiconductor electronic device 4,
6, a signal processing device that performs predetermined processing on a received signal and outputs the processed signal, for example, a device that can perform analog signal processing;
It can be a device capable of digital signal processing, a preamplifier, etc. Electronic devices mounted on the flexible printed circuit board 2 include not only semiconductor active devices having transistors but also passive devices such as chip resistors, chip capacitors, and semi-fixed resistors. As described above, when the passive device is mounted, for example, an electronic device such as a power supply bypass capacitor is connected together at a position close to the power supply line of the semiconductor optical device 8 and the connection distance between the devices is shortened to thereby reduce noise characteristics. Improvement can be achieved.

Referring again to FIG. 2, the element forming surface 6a of the semiconductor electronic device 6 faces the first surface (device mounting surface) 22a of the flexible printed circuit board 2. That is, the semiconductor electronic device 6 is flip-chip mounted. For this purpose, a connection member 14 for a bump is formed in a pad portion on the element forming surface 6a of the semiconductor electronic device 6, and this is electrically connected to the first wiring layer 26. When an LCC (Leadless Chip Charier) form is adopted, the element forming surface 6 a of the semiconductor electronic device 6 faces the surface 22 a of the base 22. Therefore, light emitted from or received by the semiconductor optical device 8 does not directly reach the element forming surface 6a of the semiconductor electronic device 6.
Therefore, the noise light does not affect the operation of the semiconductor electronic device 6. On the other hand, the semiconductor electronic device 4 is mounted so that the surface facing the element forming surface faces the device mounting surface 22a of the flexible printed circuit board 2. After being mounted at a predetermined position on the flexible printed board 2, the semiconductor electronic device 4 is electrically connected to the flexible printed board 2 using wiring and bonding wires.

The semiconductor optical device 8 is at least one of a light emitting element and a light receiving element. Examples of the light emitting element include a semiconductor laser and a light emitting diode. Examples of the light receiving element include a pin photodiode and an avalanche photodiode. The semiconductor optical device 8 is electrically connected to a wiring layer on the flexible printed circuit board 2 by a bonding wire. Semiconductor optical device 8
Can be mounted on the flexible printed circuit board 2 in a state of being mounted on a chip carrier or the like as necessary. The optical communication module 1 can include a separate semiconductor optical device in addition to the semiconductor optical device 8.

The semiconductor electronic devices 4 and 6 are molded and sealed by the second resin body 10. The semiconductor optical device 8 is molded and sealed with the first resin body 12. As the second resin body 10, an opaque resin is used for light of a predetermined wavelength that the semiconductor optical device 8 emits or receives. On the other hand, as the first resin body 12, a resin transparent to light of a predetermined wavelength that the semiconductor optical device 8 emits or receives is used. For this reason, the second resin body 10 has a light transmittance with respect to light of a predetermined wavelength,
Smaller than. Such resin bodies 10 and 12 are formed using, for example, a transfer molding method.

The first resin body 12 is formed of the semiconductor optical device 8
Condensing means 12 for condensing light emitted or received by
a. As the light condensing means 12a, there is a lens formed using the external shape of the resin body. The optical axis 12b of the lens 12a needs to intersect the light emitting surface or the light receiving surface of the semiconductor optical device 8 in order for the lens 12a to exhibit a sufficient light collecting function. For this reason, the position of the semiconductor optical device 8 needs to be relatively aligned with the position of the first resin body 12.

In order to surely perform this, the flexible printed board 2 has a positioning means 34. The positioning means 34 enables the semiconductor optical device 8 to be sealed with a sealing resin under a state where the semiconductor optical device 8 and the flexible printed board 2 are aligned. Such a positioning means 34 is provided. In the embodiment shown in FIG.
Is a positioning hole 34 penetrating from the first surface 22a to the second surface 22b.

FIG. 3 partially shows the flexible printed circuit board 2 on which the semiconductor optical device 8 is mounted, and the transfer mold 35. The mold 35 has positioning means 36. The positioning means 36 is combined with the positioning means 34 of the flexible printed circuit board 2 to enable the flexible printed circuit board 2 to be positioned on the mold 35. In the embodiment shown in FIG. 3, the positioning means 34 is a plurality of protrusions (pins) 36 provided on the substrate mounting surface 37. The plurality of protrusions 36 are inserted into the corresponding alignment holes 34 of the flexible printed circuit board 2 and define the relative positions of the semiconductor optical device 8 and the resin body 12. Such a protrusion 3
6 can also be used to define the relative position between the semiconductor electronic devices 4 and 6 and the resin body 10.

The flexible printed board 2 is made of a resin body 1
Holes 38 can be provided in the formation areas of 0 and 12. When a resin body is formed in a region including the hole 38, the resin bodies 10 and 12 are provided in the hole 38. For this reason, the resin body 1
0 and 12 are sufficiently fixed to the flexible printed circuit board 2. This fixation allows the flexible printed circuit board 2
Mechanical strength is increased.

FIG. 4 is a perspective view showing an optical communication module sealed with resin. In order to seal the optical communication module 1 with a resin, for example, the following procedure is performed.

By molding the second area 2b of the flexible printed circuit board 2 with a sealing resin using a predetermined mold (not shown), the semiconductor electronic device 6 and the passive element existing in the area are molded. , And a bonding wire and the like are sealed with resin. Since the sealing resin for this purpose does not have light transmittance with respect to the wavelength of the light relating to the semiconductor optical device 8, the sealing element shields the sealed element from external light.

Using another mold (35 in FIG. 3), the third region 2c of the flexible printed circuit board 2 is molded with a sealing resin so that the semiconductor optical device 8 and the passive The element, the bonding wire and the like are sealed with resin. The sealing resin for this purpose has light transmittance with respect to the wavelength of light related to the semiconductor optical device 8. As described above, when molding is performed with this mold, the condenser lens 12a is integrally molded with resin so as to correspond to the main surface of the semiconductor optical device 8.

Although the case where the formation of the molding resin in the first region 2a and the formation of the molding resin in the second region 2b are performed separately has been described, since the molding can be performed using a single mold, these methods are used. Can be simultaneously and collectively performed. The sealing resin used at this time has light transmittance with respect to the wavelength of light related to the semiconductor optical device. For this reason, it is desirable to provide a means for shielding light at the portions of the semiconductor electronic devices 4 and 6, for example, a housing having a light shielding property.

As described above, in the present invention, since the flexible printed circuit board 2 is used, a lead forming step after resin formation necessary when a lead frame is used becomes unnecessary. In addition, in order to arrange the resin body 10 and the resin body 12 in a predetermined positional relationship, conventionally, a step of bending a connection portion of a lead frame was required. However,
Such steps are not required in the optical communication module of the present invention.

FIG. 5 is a sectional view of an optical communication module according to another embodiment. FIG. 5 shows a cross section corresponding to the II cross section in FIG. 1 and shows a state where the cross section is bent at the neck regions 2d and 2e. The broken line shows a state before the third region 2c is bent. Referring to FIG. 5, in optical communication module 41, the shape of resin body 42 molded in third region 2c is different from the shape of resin body 12 formed in optical communication module 1 shown in FIG. . Resin body 4
2 includes a condenser lens 42a and a coupling part 42c.
In FIG. 5, the shapes of the condenser lens 42a and the coupling portion 42c are rotationally symmetric about the axis 42b.

The condensing lens 42a is provided so that its optical axis 42b intersects the light emitting end (light emitting surface) or light receiving end (light receiving surface) of the semiconductor optical device 8. Coupling part 4
2c includes a concave portion 42d having a conical inner wall. The concave portion 42d has an axis 4 as it moves toward the condenser lens 42a.
The inner diameter centering on 2b gradually decreases. Coupling part 42
A sleeve (40 in FIGS. 6A and 6B) to be described later can be fitted into the concave portion 42d.

FIG. 6A is a perspective view of the sleeve.
FIG. 6B is a cross-sectional view taken along the line II-II in FIG. The sleeve 42 is a cylindrical component molded from a resin such as metal or plastic. The distal end portion 40 a of the sleeve 40 is formed in a shape to be fitted to the inner wall of the concave portion 42 d of the connecting portion 42. For this reason, the sleeve 42 is formed in the shape of a truncated cone whose outer shape gradually decreases as it approaches the tip. The sleeve 40 extends along a predetermined axis 42e, and has a center hole 40b at the center thereof. A lens 40c is provided in a center hole 40b provided in the distal end portion 40a. An insertion hole 40b extending a predetermined length along a predetermined axis is provided at the other end facing the tip portion 40a. Insertion hole 4
The other end of Ob is provided with a stepped portion 40d for positioning the ferrule by bringing the end of the ferrule into which the insertion hole 40b is inserted into contact.

FIG. 7 is a sectional view showing a state in which the distal end portion 40a of the sleeve 40 is inserted into the concave portion 42d of the coupling portion 42 of the optical communication module 41. The optical communication module 4
1 is a cross-sectional view taken along a line II in FIG. 1, and the sleeve 40 is a cross-sectional view taken along a line II-II in FIG. 6B. Referring to FIG. 7, when the inner wall of the concave portion 42d and the outer wall of the distal end portion 40a are fitted, the sleeve 40 becomes
It is positioned with respect to the optical communication module 41. Thereby, the shaft 42b of the lens 42a and the shaft 4
0e matches. Ferrule 4 holding optical fiber
4 is inserted into the center hole 40b from the rear end of the sleeve 40, the axis 44a indicating the direction in which the light of the optical fiber propagates becomes
The axis coincides with the axis 42b of the lens 42a and the axis 40e of the sleeve 40.

The optical communication module 4 using the sleeve 40
The case where one semiconductor optical device 8 is optically coupled to the optical fiber has been described. However, it is also possible to couple the optical communication modules 1 and 41 to the optical connector using an optical connector having a separate configuration.

Referring to FIGS. 8 and 9, optical communication modules 51 and 61 according to another embodiment of the present invention will be described. FIG. 8 is a cross-sectional view of the optical communication module 51. FIG. 9 is a cross-sectional view of the optical communication module 61. 8 and 9 show cross sections corresponding to the II cross section in FIG.

Referring to FIGS. 8 and 9, semiconductor electronic devices 6a and 6b and semiconductor optical device 8 are provided on one principal surface (surface 22a of base 22) of flexible printed circuit board 2. As described above, the flexible printed board 2 includes the first region 2a where the lead terminals 24 are provided, and the third region 2c where the resin body 42 for molding and sealing the semiconductor optical device 8 is provided. . The flexible printed board 2 further includes a fourth region 2f, a fifth region 2g, and a sixth region 2h between the first region 2a and the third region 2c. 6th area 2h
Is provided between the fourth region 2f and the fifth region 2g. Semiconductor electronic devices 6a and 6b are mounted on the fourth region 2f and the fifth region 2g, respectively. The semiconductor electronic devices 6a and 6b are flip-chip mounted such that the element forming surface faces the first surface (the surface 22a of the base 22) of the flexible printed circuit board 2.

Referring to FIG. 8, flexible printed circuit board 2 is bent in sixth region 2h such that the main surface faces fourth region 5f and fifth region 2g. The optical communication module 51 includes the resin body 10a formed in the fourth region 2f and the fifth region 2g in this bent state. The resin body 10a integrally mold seals the semiconductor electronic devices 6a and 6b. It is preferable that the resin body 10a has a characteristic that does not transmit light emitted or received by the semiconductor optical element 8. So that the surfaces on which the semiconductor electronic devices 6a and 6b are mounted face each other,
When the flexible printed board 2 is bent, the semiconductor electronic devices 6a and 6b are sandwiched together by the flexible printed board 2. For this reason, it is difficult for so-called noise light to reach the semiconductor electronic devices 6a and 6b.

Referring to FIG. 9, flexible printed circuit board 2 is bent at sixth region 2h such that the surface facing the main surface faces fourth region 5f and fifth region 2g. . Optical communication module 6
1 includes a resin body 10b formed in the fourth region 2f and the fifth region 2g in this bent state. Resin body 10
“b” integrally mold-seals the semiconductor electronic devices 6a and 6b. It is preferable that the resin body 10b has a characteristic that does not transmit light emitted or received by the semiconductor optical element 8. When the flexible printed board 2 is bent such that the surfaces on which the semiconductor electronic devices 6a and 6b are mounted face each other, the semiconductor electronic devices 6a and 6b are arranged so as to sandwich the flexible printed board 2 together. For this reason,
Noise between the semiconductor electronic devices 6a and 6b can be shielded by the conductive layer formed on the flexible printed circuit board 2.

In the optical communication modules 51 and 61, the plurality of semiconductor electronic devices 6a and 6b are integrated with the resin bodies 10a and 10b while the flexible printed circuit board 2 is bent.
Mold sealing. Therefore, the number of mounted electronic components can be increased, and the optical communication modules 51, 61
Increases the area occupied on the mounting substrate.

Since the neck region 2e is provided between the resin body 10a and the resin body 42 or between the resin body 10b and the resin body 42, the semiconductor optical device 8 can be connected to an optical device such as an optical waveguide. Easy going.

The method of manufacturing such optical communication modules 51 and 61 is characterized by the following order.

The semiconductor electronic devices 6 a and 6 b are mounted on the main surface of the flexible printed circuit board 2. The flexible printed circuit board 2 is bent so as to face either the main surface of the flexible printed circuit board 2 or the back surface opposite to the main surface. The semiconductor electronic devices 6a and 6b are collectively molded and sealed. Transfer molding can be used for mold sealing. The bending of the flexible printed circuit board 2 is easily maintained throughout the mold sealing by being placed on a transfer mold (not shown).

[0056]

As described in detail above, the optical communication module of the present invention includes a flexible printed circuit board having a first conductive layer, a semiconductor optical device, and a semiconductor electronic device. The semiconductor optical device and the semiconductor electronic device are sealed using a sealing resin. The flexible printed circuit board has a first conductive layer and a base supporting the first conductive layer. For this reason, the first conductive layer can be formed without considering a decrease in mechanical strength of a member on which the semiconductor optical device and the semiconductor electronic device are mounted. Therefore, fine wiring can be formed on the flexible printed circuit board.

Therefore, it is possible to provide an optical communication module capable of achieving high functionality.

[Brief description of the drawings]

FIG. 1 is a perspective view of an optical communication module according to the present invention. FIG. 1 is a partially cutaway view so as to clarify the inside of the optical communication module.

FIG. 2 is a cross-sectional view of the optical communication module 1 taken along a line II in FIG.

FIG. 3 is a perspective view partially showing a flexible printed circuit board on which a semiconductor optical device is mounted, and a transfer mold.

FIG. 4 is a perspective view showing a resin-sealed optical communication module.

FIG. 5 is a cross-sectional view of an optical communication module according to another embodiment, and FIG. 5 illustrates a cross section corresponding to the II cross section in FIG.

FIG. 6 (a) is a perspective view of a sleeve. FIG.
FIG. 6B is a cross-sectional view taken along the line II-II in FIG.

FIG. 7 is a cross-sectional view showing a state where the sleeve is inserted into the optical communication module.

FIG. 8 is a cross-sectional view of an optical communication module showing another embodiment, and shows a cross section corresponding to the II cross section in FIG.

FIG. 9 is a cross-sectional view of an optical communication module showing another embodiment, and shows a cross section corresponding to the II cross section in FIG.

[Explanation of symbols]

1, 41, 51, 61: Optical communication module, 2: Flexible printed circuit board, 4, 6, 6a, 6b: Semiconductor electronic device, 8: Semiconductor optical device, 10, 12,
10a, 10b ... resin body, 22 ... base, 24 ... lead terminal, 26, 28, 30 ... conductive layer, 34 ... alignment hole,
36 ... positioning pin, 40 ... sleeve, 42 ... connecting part,
44… Ferrule

Claims (10)

[Claims] 1. A flexible printed circuit board having a first conductive layer and an insulating substrate supporting the first conductive layer, mounted on the flexible printed circuit board and electrically connected to the first conductive layer. A semiconductor optical device that emits or receives light of a predetermined wavelength; and a first semiconductor electronic device mounted on the flexible printed circuit board and electrically connected to the first conductive layer and the semiconductor optical device. An optical communication module, comprising: the semiconductor optical device is molded and the first semiconductor electronic device is molded. 2. The flexible printed circuit board according to claim 2, wherein the insulating substrate has a first surface on which the first conductive layer is provided, and a second surface facing the first surface. The optical communication module according to claim 1, wherein the surface has a second conductive layer. 3. The optical communication according to claim 2, wherein the flexible printed board has a third conductive layer provided between the first surface and the second surface. module. 4. The semiconductor optical device according to claim 1, wherein the semiconductor optical device is molded using a sealing resin through which the light having the predetermined wavelength is transmitted. Optical communication module. 5. The semiconductor device according to claim 4, further comprising a lens formed using a resin body for molding and being optically coupled to the semiconductor optical device.
An optical communication module according to item 1. 6. The device according to claim 1, wherein the first semiconductor electronic device has an element forming surface on which elements are formed, and the element forming surface faces the flexible printed circuit board. Item 6. The optical communication module according to any one of Items 5. 7. The flexible printed circuit board has alignment means for enabling the semiconductor optical device to be molded and sealed in a state where the semiconductor optical device and the flexible printed circuit board are aligned. The optical communication module according to any one of claims 4 to 6, wherein: 8. A semiconductor optical device, comprising: a second semiconductor electronic device electrically connected to at least one of the first semiconductor electronic device and the semiconductor optical device; and the semiconductor optical device and the first semiconductor electronic device. And the second semiconductor semiconductor electronic device is mounted on one main surface of the flexible printed circuit board, and the flexible printed circuit board faces either the main surface or the back surface facing the main surface. The semiconductor device according to any one of claims 1 to 7, wherein the first semiconductor electronic device and the second semiconductor electronic device are integrally molded and sealed. Optical communication module. 9. A first region provided with a first resin member for sealing a semiconductor electronic device, a second region provided with a second resin member for sealing a semiconductor optical device, and the first region. And a first neck region having flexibility provided between the first region and the second region, and a flexible printed circuit board having at least one or more conductive layers connecting the semiconductor electronic device and the semiconductor optical device. Optical communication module. 10. The flexible printed circuit board has flexibility provided between a terminal side on which a lead terminal is provided and any one of a first resin body and a second resin body and the terminal side. The optical communication module according to claim 9, wherein the optical communication module has a second neck region.