JPH05142560A - Anisotropic conductive film - Google Patents
Anisotropic conductive filmInfo
- Publication number
- JPH05142560A JPH05142560A JP30323091A JP30323091A JPH05142560A JP H05142560 A JPH05142560 A JP H05142560A JP 30323091 A JP30323091 A JP 30323091A JP 30323091 A JP30323091 A JP 30323091A JP H05142560 A JPH05142560 A JP H05142560A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- particles
- conductive film
- anisotropic conductive
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Liquid Crystal (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、液晶表示素子の基板に
形成した透明電極端子と外部回路の電極端子等の接続に
使用される異方性導電膜の改良に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to improvement of an anisotropic conductive film used for connecting a transparent electrode terminal formed on a substrate of a liquid crystal display element and an electrode terminal of an external circuit.
【０００２】[0002]
【従来の技術】従来、液晶表示素子における透明電極を
外部回路の配線パターンと接続するに際して異方性導電
膜が使用されている。その異方性導電膜の構造として、
絶縁性接着シートの中に金属粒子もしくは樹脂粒子表面
をＡｕメッキしたものを所定の濃度で分散された構成３
が用いられている。前記金属粒子としては、半田，Ｎｉ
等が使用されている。2. Description of the Related Art Conventionally, an anisotropic conductive film has been used to connect a transparent electrode in a liquid crystal display element to a wiring pattern of an external circuit. As the structure of the anisotropic conductive film,
Structure 3 in which metal particles or resin particles whose surfaces are plated with Au in an insulating adhesive sheet are dispersed at a predetermined concentration.
Is used. The metal particles include solder and Ni
Etc. are used.
【０００３】また、異方性導電膜の他の構造として、図
４に示すように、液晶表示素子のベースフイルム１上の
導電性インクで印刷された配線パターン２と外部回路の
配線パターンとを接続するため、前記ベースフイルム１
上に、前記金属粒子３を絶縁性接着剤４に混ぜた材料５
を印刷するタイプのものがある。いずれの異方性導電膜
も、二つの配線パターンの間に配置され、配線パターン
を支持したベースフイルム及び外部回路基板を加熱、加
圧することにより、金属粒子３が二つの配線パターン間
の導通をとり、絶縁性接着シート１又は絶縁性接着剤４
が溶けて二つの配線パターン間の接合を行っている。As another structure of the anisotropic conductive film, as shown in FIG. 4, a wiring pattern 2 printed with conductive ink on a base film 1 of a liquid crystal display element and a wiring pattern of an external circuit are provided. The base film 1 for connecting
On top of this, a material 5 in which the metal particles 3 are mixed with an insulating adhesive 4
There is a type of printing. Any of the anisotropic conductive films is disposed between the two wiring patterns, and the base film supporting the wiring pattern and the external circuit board are heated and pressed to allow the metal particles 3 to conduct electricity between the two wiring patterns. Insulating adhesive sheet 1 or insulating adhesive 4
Melts and joins the two wiring patterns.
【０００４】二つの配線パターンを接合した異方性導電
膜は、その後、金属粒子３の回りに位置する絶縁性接着
シート又は絶縁性接着剤４が硬化することによって、金
属粒子３の移動を阻止しているものの、温度の変化によ
って基板であるベースフイルム１が伸縮を生じ、この伸
縮により金属粒子３が配線パターン２の表面から浮き上
がり、このため、二つの配線パターンの導通を不安定な
ものとしている。The anisotropic conductive film in which the two wiring patterns are joined together is prevented from moving by the hardening of the insulating adhesive sheet or insulating adhesive 4 located around the metal particles 3. However, the base film 1, which is the substrate, expands and contracts due to a change in temperature, and the expansion and contraction causes the metal particles 3 to float up from the surface of the wiring pattern 2, thus making the conduction of the two wiring patterns unstable. There is.
【０００５】また、可撓性樹脂材料からなるベースフイ
ルム１上に形成されたＩＴＯ等の配線パターン２と金属
粒子３とが接触導通する際、ＩＴＯ等の配線パターン２
はベースフイルムに対する接着強度が弱いため、金属粒
子３が加熱加圧により配線パターン２に圧接させられる
ときに、配線パターン２に微小クラックが発生する可能
性がある。この微小クラックはその後の進行によって、
配線パターンの断線の一原因となることが判明してい
る。現在、このような微小クラックの進行を抑える適当
な手段は見当たらない。When the wiring pattern 2 made of ITO or the like formed on the base film 1 made of a flexible resin material and the metal particles 3 come into contact with each other, the wiring pattern 2 made of ITO or the like is formed.
Since the adhesive strength to the base film is weak, minute cracks may occur in the wiring pattern 2 when the metal particles 3 are pressed against the wiring pattern 2 by heating and pressing. This minute crack,
It has been found to be a cause of disconnection of the wiring pattern. At present, no suitable means for suppressing the progress of such minute cracks is found.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、従来技術に
おける問題に鑑み、二つの配線パターンを異方性導電膜
により接合するに際して、配線パターンに微小クラック
が発生することがなく、そして、仮に発生したとして
も、その微小クラックの進行を抑えることができる、接
続の信頼性の高い異方性導電膜を提供することを目的と
するものである。SUMMARY OF THE INVENTION In view of the problems in the prior art, the present invention is such that when two wiring patterns are joined by an anisotropic conductive film, fine cracks do not occur in the wiring patterns, and It is an object of the present invention to provide an anisotropic conductive film having a highly reliable connection that can suppress the progress of the minute cracks even if they occur.
【０００７】[0007]
【課題を解決するための手段】本発明は、前記目的を達
成するために、異方性導電膜が、絶縁性接着樹脂シート
の中に、導電性接着剤の粒子を分散させたことを特徴と
し、前記導電性接着剤の粒子は、絶縁性接着剤に導電物
質の粉末を混入したこと、又は絶縁性接着剤の粒子の表
面を金属皮膜で覆ったことを特徴とするものである。In order to achieve the above object, the present invention is characterized in that an anisotropic conductive film has particles of a conductive adhesive dispersed in an insulating adhesive resin sheet. The particles of the conductive adhesive are characterized in that powder of a conductive substance is mixed in the insulating adhesive, or the surface of the particles of the insulating adhesive is covered with a metal film.
【０００８】[0008]
【作用】本発明の構成により、絶縁性接着剤シートの中
に分散した導電性粒子自体が接着剤として作用し、且つ
加圧加熱により変形するため、可撓性樹脂からなるベー
スフイルムの上の透明電極を傷付けることなく導通さ
せ、微小クラックが発生しても、前記導電性粒子が溶け
て前記微小クラック間に入り込んで硬化するため、クラ
ックの進行を阻止する作用を有する。According to the constitution of the present invention, the conductive particles themselves dispersed in the insulating adhesive sheet act as an adhesive and are deformed by heating under pressure, so that the conductive film on the base film made of a flexible resin is formed. Even if the transparent electrode is brought into conduction without being damaged and a minute crack is generated, the conductive particles are melted and enter between the minute cracks to be hardened, so that it has an action of preventing the progress of the crack.
【０００９】[0009]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。図１には、本発明の異方性導電膜についての第１
実施例を示し、図１（ａ）は圧着前の異方性導電膜その
ものの断面形状であり、図１（ｂ）は、その異方性導電
膜が透明電極を形成した二つのベースフイルム間に圧着
された状態を示している。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a first example of the anisotropic conductive film of the present invention.
FIG. 1A shows a cross-sectional shape of the anisotropic conductive film itself before pressure bonding, and FIG. 1B shows a space between two base films in which the anisotropic conductive film forms a transparent electrode. It has been crimped to.
【００１０】本発明の異方性導電膜Ａ1 は、熱硬化型の
エポキシ樹脂系の接着剤を絶縁性接着剤シート１１と
し、この絶縁性接着剤シート１１の中に、導電性粒子１
２が分散される構成からなり、その導電性粒子１２は、
エポキシ樹脂系の接着剤１２ａにカーボンの微粉末から
なる導電物質１２ｂを混入して粒子化したものである。In the anisotropic conductive film A 1 of the present invention, a thermosetting epoxy resin adhesive is used as an insulating adhesive sheet 11, and the conductive particles 1 are contained in the insulating adhesive sheet 11.
2 is dispersed, and the conductive particles 12 are
The conductive material 12b made of fine carbon powder is mixed into the epoxy resin adhesive 12a to form particles.
【００１１】導電性粒子１２の粒子径は、この実施例の
場合、ベースフイルムであるＰＥＴ基板１３上の透明電
極１４のパターン幅及び高さが１２５μｍ，０．２μｍ
であるため、約２０μｍとした。よって、透明電極１４
のパターン幅及び高さに応じて、その粒子径は５〜５０
μｍに適宜変更される。In the present embodiment, the particle size of the conductive particles 12 is 125 μm and 0.2 μm, respectively, when the pattern width and height of the transparent electrode 14 on the PET substrate 13 which is the base film.
Therefore, it was set to about 20 μm. Therefore, the transparent electrode 14
Depending on the pattern width and height of the
It is appropriately changed to μm.
【００１２】導電性粒子１２として接着剤１２ａには、
６０〜８０℃のガラス転移点を有する熱硬化型の性質か
らなるエポキシ樹脂系接着剤が使用された。このような
接着剤は、ベースフイルムであるＰＥＴ基板同士の接
続、又はＰＥＴ基板とＴＡＢとの接続の際、接着剤のガ
ラス転移点がＰＥＴ基板のガラス転移点よりも低いこと
から、ＰＥＴ基板に導電性粒子１２の痕跡を付けること
がなく接着させることができる。ＰＥＴ基板のガラス転
移点を越えても、導電性粒子が軟化しないと、接着の際
の加圧により、導電性粒子によりＰＥＴ基板が歪み、透
明電極（ＩＴＯ）にダメージを与えることになる。導電
性粒子中の接着剤としては、エポキシ樹脂系接着剤の
他、フェノール樹脂系接着剤等を使用することができ
る。As the conductive particles 12, the adhesive 12a includes
An epoxy resin adhesive having a thermosetting property having a glass transition point of 60 to 80 ° C. was used. Such an adhesive has a glass transition point lower than that of the PET substrate when the PET substrates, which are base films, are connected to each other or the PET substrate and the TAB are connected to each other. The conductive particles 12 can be adhered without leaving a trace. If the conductive particles do not soften even if the glass transition point of the PET substrate is exceeded, the PET particles will be distorted by the conductive particles due to the pressure applied during adhesion, and the transparent electrode (ITO) will be damaged. As the adhesive in the conductive particles, a phenol resin adhesive or the like can be used in addition to the epoxy resin adhesive.
【００１３】導電性粒子１２を分散させる絶縁性接着剤
シート１１としては、熱硬化型のエポキシ樹脂系接着剤
が使用された。絶縁性接着剤シート１１中に分散される
導電性粒子１２の分散濃度は、透明電極１４のパターン
幅及び高さに応じて変更され、絶縁性接着剤シート１１
の厚みは、導電性粒子１２の粒子径と一致する厚みとし
てシート状に形成される。As the insulating adhesive sheet 11 in which the conductive particles 12 are dispersed, a thermosetting epoxy resin adhesive is used. The dispersion concentration of the conductive particles 12 dispersed in the insulating adhesive sheet 11 is changed according to the pattern width and height of the transparent electrode 14, and the insulating adhesive sheet 11
Is formed in a sheet shape so as to have a thickness corresponding to the particle diameter of the conductive particles 12.
【００１４】このようにして構成された本発明の異方性
導電膜Ａ1 は、可撓性樹脂からなる二つのベースフイル
ム１３の上の透明電極１４間に配置され、二つのベース
フイルム１３の両側から加圧、加熱すると、図１（ｂ）
に示されるように、エポキシ樹脂系の接着剤の粒子１２
ａと導電物質１２ｂとからなる導電性粒子１２は、透明
電極１４との間で軟化変形すると共に、絶縁性接着剤シ
ート１１は二つのベースフイルム１３の間を結合して硬
化する。The anisotropic conductive film A 1 of the present invention thus constructed is disposed between the transparent electrodes 14 on the two base films 13 made of a flexible resin, and the two base films 13 are formed. When pressurized and heated from both sides, Fig. 1 (b)
As shown in FIG.
The conductive particles 12 including a and the conductive material 12b are softened and deformed with the transparent electrode 14, and the insulating adhesive sheet 11 bonds between the two base films 13 and hardens.
【００１５】よって、導電性粒子１２は自己保持され、
絶縁性接着剤シート１１の硬化により、導電性粒子１２
の移動を防ぎ、ベースフイルムは結合する。そして、透
明電極に微小クラックが発生している場合において、本
発明の異方性導電膜Ａ1 の導電性粒子１２は前記クラッ
クの間に充填され、クラックの進行を抑え、断線を防止
する作用をもたらす。Therefore, the conductive particles 12 are self-supported,
By curing the insulating adhesive sheet 11, the conductive particles 12
To prevent the movement of the base film. When the transparent electrode has micro cracks, the conductive particles 12 of the anisotropic conductive film A 1 of the present invention are filled between the cracks to suppress the progress of cracks and prevent disconnection. Bring
【００１６】前記実施例において、異方性導電膜は、導
電性粒子１２を絶縁性接着剤シート１１に分散している
が、その絶縁性接着剤シートの代わりに、ゴム系接着剤
１１Ａを使用することができる。この実施例では、ゴム
系接着剤１１Ａの中に導電性粒子１２を分散攪拌した
後、透明電極１４を形成した可撓性樹脂からなるベース
フイルム１３上に、図２に示すように、一定の厚みで印
刷し、しかる後、他方の透明電極１４を形成したベース
フイルム１３と重ね合わせ、加熱加圧して両ベースフイ
ルムを接合する。この場合においても、この接合時に、
透明電極表面に微小クラックが発生しても、導電性粒子
がクラック間に充填され、クラックの進行を抑え、断線
を防止する作用をもたらす。In the above-mentioned embodiment, the anisotropic conductive film has the conductive particles 12 dispersed in the insulating adhesive sheet 11, but the rubber adhesive 11A is used in place of the insulating adhesive sheet. can do. In this embodiment, after the conductive particles 12 are dispersed and stirred in the rubber-based adhesive 11A, a fixed film is formed on the base film 13 made of a flexible resin on which the transparent electrode 14 is formed, as shown in FIG. After printing with a thickness, the base film 13 on which the other transparent electrode 14 is formed is superposed, and heated and pressed to bond both base films. Even in this case, at the time of this joining,
Even if a minute crack is generated on the surface of the transparent electrode, the conductive particles are filled in between the cracks, which suppresses the progress of the crack and prevents disconnection.
【００１７】図３は本発明の他の異方性導電膜の実施例
を示す。図３（ａ）は圧着前の本発明の異方性導電膜そ
のものの断面形状を示し、その異方性導電膜が、夫々透
明電極（ＩＴＯ）を形成した二つのベースフイルムの間
に圧着された後の状態の断面を図３（ｂ）で示してい
る。FIG. 3 shows another embodiment of the anisotropic conductive film of the present invention. FIG. 3A shows a cross-sectional shape of the anisotropic conductive film of the present invention itself before pressure bonding, and the anisotropic conductive film is pressure bonded between two base films each having a transparent electrode (ITO) formed thereon. FIG. 3B shows a cross section of the state after the heating.
【００１８】本発明の異方性導電膜Ａ2 は、熱硬化型の
エポキシ樹脂系の接着剤を絶縁性接着剤シート１１と
し、この絶縁性接着剤シート１１の中に、導電性粒子１
５が分散される構成からなり、その導電性粒子１５は、
エポキシ樹脂系の粉末接着剤（例えば、東レ（株）製の
商品名「トレパールＥＰ−ＡＤ）の粒子１５ａと、この
接着剤粒子１２ａ表面に金属メッキ処理を施し、メッキ
皮膜１５ｂとを設けたものである。前記メッキ皮膜１５
ｂにより、導電性を有するものである。この場合、粉末
接着剤の粒子１５ａの平均粒子径が１０μｍであり、メ
ッキ皮膜１５ｂの厚みは０．２μｍとした。なお、メッ
キ皮膜１５ｂの厚みは、他の条件に応じて０．１〜１０
μｍ程度とすることができる。メッキ皮膜１５ｂは、蒸
着手段により形成することも可能である。本発明の前記
異方性導電膜Ａ2 において、絶縁性接着剤シート１１の
中の導電性粒子１５すなわちエポキシ樹脂系の粉末接着
剤の粒子１５ａは６０〜８０℃程度でガラス転移点に達
し、その後、硬化に到るものを使用される。In the anisotropic conductive film A 2 of the present invention, a thermosetting epoxy resin adhesive is used as the insulating adhesive sheet 11, and the conductive particles 1 are contained in the insulating adhesive sheet 11.
5 is dispersed, and the conductive particles 15 are
Epoxy resin-based powder adhesive (for example, Toray Co., Ltd. trade name “Trepearl EP-AD”) particles 15a, and adhesive particles 12a whose surface is subjected to metal plating treatment and plated coating 15b is provided. The plating film 15
By b, it has conductivity. In this case, the particles 15a of the powder adhesive had an average particle diameter of 10 μm, and the plating film 15b had a thickness of 0.2 μm. The thickness of the plating film 15b is 0.1-10 depending on other conditions.
It can be about μm. The plating film 15b can also be formed by vapor deposition means. In the anisotropic conductive film A 2 of the present invention, the conductive particles 15 in the insulating adhesive sheet 11, that is, the particles 15a of the epoxy resin-based powder adhesive reach the glass transition point at about 60 to 80 ° C., After that, the one that reaches the curing is used.
【００１９】このような異方性導電膜Ａ2 を、可撓性樹
脂からなる二つのベースフイルムの上の透明電極１３，
１４間に設け、二つのベースフイルムの両側から加圧、
加熱すると、図３（ｂ）に示されるように、エポキシ樹
脂系の粉末接着剤の粒子１５ａは変形し、その外側に位
置するメッキ皮膜１５ｂは破れ、破れたメッキ皮膜１５
ｂからエポキシ樹脂系の粉末状接着剤粒子１５ａが溶け
て出して硬化する。したがって、本発明の導電性粒子１
２のエポキシ樹脂系の粉末接着剤の粒子１５ａは柔らか
く変形しながら、破れたメッキ皮膜１５ｂを剥離飛散す
ることなく、同時に変形するため、透明電極１４の表面
を傷付けることがなく、ベースフイルム１３間を接続す
ることができる。Such an anisotropic conductive film A 2 is formed on the transparent electrodes 13 on two base films made of a flexible resin.
It is installed between 14 and pressure is applied from both sides of the two base films.
When heated, as shown in FIG. 3B, the particles 15a of the epoxy resin-based powder adhesive are deformed, the plating film 15b located outside thereof is broken, and the broken plating film 15 is broken.
The epoxy resin-based powdery adhesive particles 15a are melted and ejected from b to cure. Therefore, the conductive particles 1 of the present invention
The particles 15a of the epoxy resin-based powder adhesive of No. 2 are deformed softly, and at the same time, they are deformed without peeling and scattering the torn plating film 15b. Therefore, the surface of the transparent electrode 14 is not damaged and the base film 13 is not damaged. Can be connected.
【００２０】そして、前記粉末状接着剤粒子１２ａはベ
ースフイルム１３上の透明電極（ＩＴＯ）１４に固着す
ることにより、仮に、透明電極に微細なクラックが発生
した場合においても、粉末状接着剤粒子１２ａの接着機
能により、粉末状接着剤粒子１２ａはクラックの間に充
填され、クラックの進行を抑えることができる。そし
て、従来の金属粒子と比べて、本発明の導電性粒子１２
は柔らかく、したがって、基板上の透明電極に対して変
形等の影響を与えることが少ない。By adhering the powdery adhesive particles 12a to the transparent electrode (ITO) 14 on the base film 13, even if fine cracks are generated in the transparent electrode, the powdery adhesive particles 12a are formed. Due to the adhesive function of 12a, the powdery adhesive particles 12a are filled between the cracks, and the progress of the cracks can be suppressed. And compared with the conventional metal particles, the conductive particles 12 of the present invention
Is soft, and therefore, the transparent electrode on the substrate is rarely affected by deformation or the like.
【００２１】本発明の異方性導電膜においては、絶縁性
接着剤シート１１と、該絶縁性接着剤シート１１の中に
分散して設けられた粉末状接着剤粒子１２ａ，１５ａを
有する導電性粒子１２，１５とからなり、接着剤粒子１
２ａ，１５ａと絶縁性接着剤シート１１の樹脂の性質と
して、熱可塑性又は熱硬化性のいずれを選んでもかまわ
ない。In the anisotropic conductive film of the present invention, a conductive material having an insulating adhesive sheet 11 and powdery adhesive particles 12a and 15a dispersed in the insulating adhesive sheet 11 is provided. Adhesive particle 1 consisting of particles 12 and 15
As the properties of the resin of 2a, 15a and the insulating adhesive sheet 11, either thermoplasticity or thermosetting may be selected.
【００２２】また、前記絶縁性接着樹脂シートを熱可塑
性接着剤とし、導電性接着剤の粒子を熱硬化性接着剤と
することにより、絶縁性接着樹脂シートの加熱温度を低
く設定することができ、樹脂材料からなるベースフイル
ムに与える温度の影響を小さくすることができ、更に、
リペアを行う場合、接着されたベースフイルムを剥離さ
せ易い。更に、前記絶縁性接着樹脂シートを熱硬化性接
着剤とし、導電性接着剤の粒子を熱可塑性接着剤とする
ことにより、絶縁性接着樹脂シートは耐熱温度をあげる
ことができ、信頼性が向上する。By using the insulating adhesive resin sheet as a thermoplastic adhesive and the particles of the conductive adhesive as a thermosetting adhesive, the heating temperature of the insulating adhesive resin sheet can be set low. It is possible to reduce the effect of temperature on the base film made of resin material.
When repairing, the adhered base film is easily peeled off. Furthermore, by using the insulating adhesive resin sheet as a thermosetting adhesive and using the particles of the conductive adhesive as a thermoplastic adhesive, the insulating adhesive resin sheet can have a higher heat resistant temperature and improved reliability. To do.
【００２３】[0023]
【発明の効果】本発明の構成により、絶縁性接着剤シー
トの中に分散した導電性粒子自体が接着剤として作用
し、且つ加圧加熱により変形するため、可撓性樹脂から
なるベースフイルムの上の透明電極を傷付けることなく
導通させ、微小クラックが発生しても、前記導電性粒子
が溶けて前記微小クラック間に入り込んで硬化するた
め、クラックの進行を阻止する効果を有する。According to the constitution of the present invention, since the conductive particles themselves dispersed in the insulating adhesive sheet act as an adhesive and are deformed by pressure and heating, a base film made of a flexible resin is used. Even if the upper transparent electrode is brought into conduction without being damaged, and even if a minute crack is generated, the conductive particles are melted and enter between the minute cracks to be hardened, which has an effect of preventing the progress of the crack.
【図１】本発明の異方性導電膜に関する第１の実施例で
あり、（ａ）は使用前の異方性導電膜の概略断面図、
（ｂ）はベースフイルムの上の透明電極間において、加
圧加熱された状態を示す異方性導電膜の概略断面図であ
る。FIG. 1 is a first embodiment of the anisotropic conductive film of the present invention, (a) is a schematic cross-sectional view of the anisotropic conductive film before use,
(B) is a schematic cross-sectional view of the anisotropic conductive film showing a state of being pressurized and heated between the transparent electrodes on the base film.
【図２】本発明の異方性導電膜の変形例をベースフイル
ムの上の透明電極端子に適用した概略断面図である。FIG. 2 is a schematic cross-sectional view in which a modified example of the anisotropic conductive film of the present invention is applied to a transparent electrode terminal on a base film.
【図３】本発明の異方性導電膜に関する第２の実施例で
あり、（ａ）は使用前の異方性導電膜の概略断面図、
（ｂ）はベースフイルムの上の透明電極間において、加
圧加熱された状態を示す異方性導電膜の概略断面図であ
る。FIG. 3 is a second embodiment relating to the anisotropic conductive film of the present invention, (a) is a schematic sectional view of the anisotropic conductive film before use,
(B) is a schematic cross-sectional view of the anisotropic conductive film showing a state of being pressurized and heated between the transparent electrodes on the base film.
【図４】従来の印刷される形式の異方性導電膜を示す概
略断面図である。FIG. 4 is a schematic sectional view showing an anisotropic conductive film of a conventional printed type.
Ａ1 ，Ａ2 異方性導電膜 １１ 絶縁性接着剤シート １１Ａ ゴム系接着剤 １２ 導電性粒子 １２ａ 粉末状接着剤粒子 １２ｂ 混入された導電物質 １３ ベースフイルム １４ 透明電極 １５ 導電性粒子 １５ａ 絶縁性粉末状接着剤粒子 １５ｂ メッキ皮膜A 1 , A 2 anisotropic conductive film 11 insulating adhesive sheet 11A rubber adhesive 12 conductive particles 12a powdered adhesive particles 12b mixed conductive material 13 base film 14 transparent electrode 15 conductive particles 15a insulating Powder adhesive particles 15b Plating film
フロントページの続き (72)発明者 鳴海 雄二 東京都大田区中馬込１丁目３番６号 株式 会社リコー内 (72)発明者 高橋 久雄 東京都大田区中馬込１丁目３番６号 株式 会社リコー内 (72)発明者 藤村 浩 東京都大田区中馬込１丁目３番６号 株式 会社リコー内 (72)発明者 坂寄 寛幸 東京都大田区中馬込１丁目３番６号 株式 会社リコー内Front Page Continuation (72) Inventor Yuji Narumi 1-3-6 Nakamagome, Ota-ku, Tokyo Within Ricoh Company (72) Inventor Hisao Takahashi 1-3-6 Nakamagome, Ota-ku, Tokyo Within Ricoh Company (72) Inventor Hiroshi Fujimura 1-3-6 Nakamagome, Ota-ku, Tokyo In Ricoh Co., Ltd. (72) Inventor Hiroyuki Sakayo 1-3-6 Nakamagome, Ota-ku, Tokyo In Ricoh Co., Ltd.
Claims (4)
着剤の粒子を分散させたことを特徴とする異方性導電
膜。1. An anisotropic conductive film in which particles of a conductive adhesive are dispersed in an insulating adhesive resin sheet.
接着剤に導電物質の粉末を混入したことを特徴とする請
求項１記載の異方性導電膜。2. The anisotropic conductive film according to claim 1, wherein as the particles of the conductive adhesive, a powder of a conductive substance is mixed in an insulating adhesive.
接着剤の粒子の表面を金属皮膜で覆ったことを特徴とす
る請求項１記載の異方性導電膜。3. The anisotropic conductive film according to claim 1, wherein, as the particles of the conductive adhesive, the surfaces of the particles of the insulating adhesive are covered with a metal film.
剤により構成したことを特徴とする請求項１記載の異方
性導電膜。4. The anisotropic conductive film according to claim 1, wherein the insulating adhesive resin sheet is made of a rubber adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03303230A JP3100436B2 (en) | 1991-11-19 | 1991-11-19 | Anisotropic conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03303230A JP3100436B2 (en) | 1991-11-19 | 1991-11-19 | Anisotropic conductive film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05142560A true JPH05142560A (en) | 1993-06-11 |
| JP3100436B2 JP3100436B2 (en) | 2000-10-16 |
Family
ID=17918448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03303230A Expired - Fee Related JP3100436B2 (en) | 1991-11-19 | 1991-11-19 | Anisotropic conductive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3100436B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012064559A (en) * | 2010-08-16 | 2012-03-29 | Nippon Shokubai Co Ltd | Conductive fine particulate and anisotropic conductive material |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5143329B2 (en) * | 2002-02-28 | 2013-02-13 | 日立化成工業株式会社 | Manufacturing method of circuit connection body |
-
1991
- 1991-11-19 JP JP03303230A patent/JP3100436B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012064559A (en) * | 2010-08-16 | 2012-03-29 | Nippon Shokubai Co Ltd | Conductive fine particulate and anisotropic conductive material |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3100436B2 (en) | 2000-10-16 |
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