JPH05140738A - Sputtering device - Google Patents

Abstract

PURPOSE:To provide a sputtering device capable of forming a film having high adhesive strength on a substrate. CONSTITUTION:A pair of targets 3 are arranged parallel to each other in a sputtering device so that the faces 4, 5 to be sputtered confront each other with a certain space S in-between and plural substrate holders 11 are circularly arranged around the space S at regular intervals so that the holders 11 are made almost parallel to the central axes of the targets 3. A retractable deposition preventing plate 26 is interposed between the targets 3 and the holders 11 and each of deposition preventing plates 31 is interposed between the adjacent holders 11 so as to isolate the holders 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a facing target type sputtering apparatus.

[0002]

2. Description of the Related Art In a facing target type sputtering apparatus,
The structure in which a plurality of substrate holders are arranged is Japanese Patent Publication Sho 6
It is well known as disclosed in Japanese Patent Publication 1-53426.

A problem of this type of device is that the film formed on the substrate is peeled off or the characteristics of the interface of the substrate are deteriorated, resulting in deterioration of characteristics. When the cause was examined, it was found that the target cleaning could not be performed.

Therefore, when the inventors provided an adhesion preventive plate (shutter) as an easily conceivable method, the sputtered particles could be captured and the target could be cleaned.

[0005]

However, when the reverse sputtering for the purpose of cleaning the substrate was carried out by the above-mentioned conventional sputtering apparatus, the adhesion of the film was not increased. When the cause was examined, it was found that the substrate was contaminated by the sputtered particles from the facing or adjacent substrate holder during the reverse sputtering.

The present invention has been made to solve the above-mentioned conventional problems, and prevents the sputtered particles generated from another substrate holder facing or adjacent to the substrate from being attached to the substrate during reverse sputtering. An object of the present invention is to provide a sputtering apparatus which can keep a substrate clean and can form a film having a strong adhesive force on the substrate in a subsequent target sputtering step.

[0007]

A sputtering apparatus provided by the present invention comprises a pair of targets arranged in parallel so that the sputtering surfaces face each other with a constant space, and a target on the outer periphery of the constant space. In a sputtering apparatus having a plurality of substrate holders arranged in an annular shape at regular intervals so as to be substantially parallel to the axis of the target, each substrate holder is placed between the plurality of adjacent substrate holders. An anti-adhesion plate is provided so as to partition the. Further, another retractable protection plate is disposed between the pair of targets and the plurality of substrate holders.

[0008]

The anti-adhesion plate according to the present invention captures the spatter particles from another substrate holder facing or adjoining in the reverse sputtering step for the purpose of cleaning the substrate, and prevents them from adhering to the surface of the substrate or the target. Can be prevented.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 shows a vertical cross section of the sputtering apparatus of the embodiment, and FIG. 2 shows a horizontal cross section.

In the figure, 1 is a vacuum container, and 2 and 3 are a pair of targets arranged in the vacuum container 1. Both targets 2 and 3 are arranged in parallel so that the respective sputtering surfaces 4 and 5 face each other with a constant space S therebetween. Reference numerals 6 and 7 are magnets for generating a sputtering magnetic field H in a direction orthogonal to the sputtering surfaces 4 and 5, 8 and 9 are cathode electrodes, and 10 is a sputtering power source. Reference numeral 11 denotes a substrate holder that is annularly arranged on the outer peripheral portion of the fixed space S so as to be substantially parallel to the axes of the targets 2 and 3 and confront the coaxial center. There are 6 in all, and they are arranged at equal intervals.

Reference numeral 12 denotes a rotary shaft of the holder 12 fixed to the substrate holder 11, 13 denotes a bevel gear fixed to the rotary shaft 12, 1
Reference numeral 4 denotes an annular fixed gear (Zero roll gear). Bevel gear 1
Reference numeral 3 meshes with an annular fixed gear 14. Reference numeral 15 is an annular spur gear which is attached to an annular fixed gear 14 via a bearing 16 and coaxially rotates thereover. The rotating shaft 12 of the substrate holder 11 is attached to an annular spur gear 15 via a bearing 17. A drive gear 18 meshes with an annular spur gear 15, and is driven by a motor 19 installed outside the vacuum container 1. Reference numeral 20 denotes a drive shaft of the drive gear 18, which is hermetically sealed from the vacuum container 1. Now, when the drive gear 20 is rotated by the motor 19, the annular spur gear 15 rotates,
Each substrate holder 11 revolves around an annular fixed gear 14 while rotating.

Reference numeral 21 denotes a cylindrical heater for heating the substrate, 22
Is a cylindrical reflection plate, and is interposed between the substrate holder 11 and the bevel gear 13 and the annular fixed gear 14 outside the substrate holder 11. The heater 21 and the reflection plate 22 are vertically divided into two parts with the rotating shaft 12 of the substrate holder 11 interposed therebetween so that the rotating shaft 12 does not interfere with the rotation of the substrate holder 11.

Reference numeral 23 denotes a high frequency power source for reverse sputtering, which is connected to the fixed gear 14 in the vacuum container 1 via a power supply shaft 25 hermetically sealed with a matching unit 24 so that high frequency power can be supplied. There is. The power supply shaft 25 introduced into the vacuum container 1 has a structure in which an insulator is provided around the shaft in order to prevent the sputtering, and the periphery of the shaft is wrapped with a metal so as to have a ground potential.

Reference numeral 26 denotes a cylindrical deposition preventing plate, which is provided between the targets 2 and 3 and the substrate holder 11 so as to be vertically movable (retracted) by a driving device. The drive device referred to here is composed of a cylinder 27 installed on the atmosphere side of a base flange at the bottom of the vacuum container 1 and a cylinder shaft 30 that is hermetically sealed by a bellows flange 28 and is coupled to a ring-shaped attachment plate mounting table 29. It is configured. The deposition-prevention plate 26 is configured to be easily replaceable in consideration of maintenance.

As shown in FIG. 2, reference numeral 31 denotes a flat plate-shaped attachment plate disposed between adjacent substrate holders 11 so as to partition the holders. The deposition preventive plate 31 is radially attached to the annular spur gear 15 from the axes of the targets 2 and 3. Further, the anti-adhesion plate 31 does not interfere with the cylindrical heater 21, the reflection plate 22 and the fixed gear 14 which are vertically divided into two parts when rotating. Slit 3
1a is for that purpose. The deposition-inhibiting plate 31 may be provided radially outside the cylindrical deposition-inhibiting plate 26. 32
Is a cylindrical shield plate.

Since the sputtering apparatus of the embodiment has the above-mentioned structure, the substrate cleaning is performed in the following manner, for example.

The substrate is attached to the substrate holder 11, the vacuum container 1 is hermetically sealed, and the substrate is evacuated to about 5 × 10 ⁻⁵ Pa by a vacuum exhaust device, and the substrate is heated to a set temperature at the same time as the exhaust. A predetermined amount of inert gas (for example, argon) is supplied to the vacuum container 1 that has been evacuated by an inert gas supply device. After that, a high frequency is applied to the substrate holder 11 from a high frequency power source 23 to ionize argon.

At this time, the ionized argon collides with the substrate holder 11, the substrate, etc., so that the substrate holder 1
Sputtered particles are generated from 1 and the substrate. The particles reach the deposition preventing plates 26, 31 and adhere to them to be solidified. Therefore, the surface of the substrate cleaned by sputtering is kept clean without being contaminated by sputtered particles from another substrate holder 11. In cleaning the substrate, the substrate holder may or may not revolve.

When the reverse sputtering is completed, the high frequency power source 23
Then, the pre-sputtering process for the next target cleaning is started. In this step, DC or high frequency is applied to the cathode electrodes 8 and 9 by the sputtering power source 10 to clean the surfaces of the targets 2 and 3. After the target cleaning is completed, the cylindrical deposition preventive plate 26 is lowered, and the target sputtered particles are adhered and solidified on the surface of the clean substrate, whereby a film having a strong adhesion can be formed.

[0020]

As described above, according to the present invention, the substrate is kept clean by adhering the sputtered particles generated from another substrate holder to the deposition preventive plate during the reverse sputtering. In the target sputtering step, a film having strong adhesion can be formed on the substrate.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view of a facing target type sputtering apparatus according to an embodiment.

FIG. 2 is a sectional view taken along line II-II of FIG.

[Explanation of symbols]

 2.3 Target 4,5 Sputtering surface S Stable space 11 Substrate holder 26 Cylindrical deposition plate (other deposition plate) 31 Flat plate deposition plate (deposition plate)

Claims (2)

[Claims] 1. A pair of targets whose sputtering surfaces are arranged in parallel so as to face each other with a constant space, and an outer peripheral portion of the constant space so as to be substantially parallel to the axis of the target. In a sputtering device having a plurality of substrate holders arranged in a ring at regular intervals, a deposition preventive plate is arranged between the plurality of adjacent substrate holders so as to partition each substrate holder. A sputtering device characterized by. 2. The sputtering apparatus according to claim 1, wherein another retractable plate is provided between the pair of targets and the plurality of substrate holders.