JPH05140266A - Preparation of resin composition for laminated board and laminated board - Google Patents

Abstract

PURPOSE:To prepare the subject compsn. which intercepts ultraviolet rays and has a high resistance to heat and chemicals by compounding an epoxy compd. having a naphthalene or anthracene backbone into the compsn. CONSTITUTION:An epoxy compd. having a naphthalene or anthracene backbone is compounded into the subject compsn. The obtd. compsn. is impregnated into a sheet like substrate and dried. The resulting prepreg, alone or together with other kinds of prepreg, is thermally press molded to give a laminated board which intercepts ultraviolet rays and has a high resistance to heat and chemicals. While the curing of an ultraviolet-curable solder resist is generally accelerated by ultraviolet rays having wavelengths of 300-400nm, the compsn, contg. the compd. absorbs and hence intercepts ultraviolet rays having the above-mentioned wavelengths because of the presence of the naphthalene or anthracene backbone in the compd.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition for a laminate suitable for use as a substrate of a printed wiring board having an ultraviolet shielding function and a method for producing the laminate.

[0002]

2. Description of the Related Art In recent years, in a double-sided printed wiring board, a solder resist forming method by double-sided simultaneous exposure has been increasing in order to miniaturize circuits and improve efficiency of circuit processing steps. In this case, in the case where the ordinary resin for laminate is used as the substrate of the printed wiring board, there is a drawback that ultraviolet rays pass through the laminate and expose the solder resist on the back surface. In order to prevent this, a method of adding a light absorber such as a coumarin-based light absorber or a light shield such as titanium oxide to the resin for the laminate has been proposed for the purpose of shielding ultraviolet rays.

[0003]

The resin composition for laminates having the ultraviolet shielding function uses a light absorber or a light shielding agent as an additive, and these are contained in the resin skeleton during the curing reaction of the resin. Heat resistance of the laminated plate,
There is a problem of poor chemical resistance. The problem to be solved by the present invention is to provide a resin composition having an ultraviolet ray shielding function and suitable for producing a laminated board having good heat resistance and chemical resistance. Another object is to produce a laminate having an ultraviolet ray shielding function and having good heat resistance and chemical resistance.

[0004]

In order to solve the above problems, the resin composition for laminates according to the present invention is characterized by containing a compound in which an epoxy group is added to a naphthalene or anthracene skeleton. Further, the laminated plate is manufactured by heat-pressing a part or all of the prepreg obtained by impregnating and drying the resin composition in a sheet-shaped base material.

[0005]

In general, the curing of the UV-curable solder resist is promoted by UV rays having a wavelength of 300 to 400 nm.
The resin composition according to the present invention, which contains a compound having a naphthalene skeleton or an anthracene skeleton, can absorb ultraviolet rays having the above wavelength and has an excellent ultraviolet ray shielding function. Furthermore, since the compound is one in which a reactive epoxy group is added to the main skeleton, it is possible to introduce a rigid structure of naphthalene or anthracene into the crosslinked structure of the resin, which results in excellent heat resistance and resistance. Chemical properties can be imparted to the laminate.

[0006]

【Example】

Example 1 20 parts by weight of the naphthalene skeleton epoxy resin (Chemical formula 1) (epoxy equivalent: 140), bisphenol A type brominated epoxy resin (epoxy equivalent: 500, bromine content: 20)
%) 80 parts by weight, 4 parts by weight of dicyandiamide and 0.4 parts by weight of benzyldimethylamine were impregnated into a woven glass cloth (thickness: 0.18 mm) and dried to give a resin amount of 4
0% by weight of prepreg was obtained. Two pieces of the above prepreg are laminated, copper foil (thickness: 18 μm) is arranged on both surfaces, and heated and pressed at a temperature of 170 ° C. and a pressure of 40 kgf / cm ² for 90 minutes,
A double-sided copper-clad laminate having a thickness of 0.4 mm was obtained. The naphthalene skeleton epoxy resin of (Chemical formula 1) was prepared by reacting 1 mol of 1,5-dihydroxynaphthalene with 9 mol of epichlorohydrin at a temperature of 120 ° C. for 3 hours while dropping 2 mol of an aqueous sodium hydroxide solution, and then reducing excess epichlorohydrin under reduced pressure. It was obtained by recovering and removing alkali.

[0007]

[Chemical 1]

Example 2 The anthracene skeleton epoxy resin (epoxy equivalent: 184) of Chemical formula 2 was used in place of the naphthalene skeleton epoxy resin of Example 1, and the other conditions were the same as in Example 1 and the thickness was 0.4 mm. A double-sided copper clad laminate of Sano was obtained. The anthracene skeleton epoxy resin of Chemical formula 2 is obtained by reacting 1,8-dihydroxyanthraquinone and epichlorohydrin as raw materials in the same manner as in the case of the naphthalene skeleton epoxy resin of Example 1.

[0009]

[Chemical 2]

Conventional Example 1 100 parts by weight of bisphenol A type brominated epoxy resin (epoxy equivalent: 500, bromine content: 20% by weight)
A varnish containing 3 parts by weight of dicyandiamide, 0.4 parts by weight of benzyldimethylamine, and 0.5 parts by weight of coumarin (light absorber) was prepared. Otherwise, the same procedure as in Example 1 was performed, and both sides having a thickness of 0.4 mm were prepared. A copper clad laminate was obtained.

Conventional Example 2 100 parts by weight of bisphenol A type brominated epoxy resin (epoxy equivalent: 500, bromine content: 20% by weight)
A varnish containing 3 parts by weight of dicyandiamide, 0.4 parts by weight of benzyldimethylamine, and 5 parts by weight of titanium oxide (light-shielding agent) was prepared. A stretched laminate was obtained.

Comparative Example 1 100 parts by weight of bisphenol A type brominated epoxy resin (epoxy equivalent: 500, bromine content: 20% by weight)
A varnish containing 3 parts by weight of dicyandiamide and 0.4 parts by weight of benzyldimethylamine was prepared, and otherwise the same as in Example 1 to obtain a 0.4 mm-thick double-sided copper-clad laminate.

The characteristics of these double-sided copper-clad laminates are shown in Table 1.

[0014]

[Table 1]

* 1 Measured by TMA method * 2 Based on JIS-C-6481 ○: No abnormality ×: Rough skin

[0016]

As is apparent from Table 1, the laminate using the resin composition according to the present invention has excellent ultraviolet ray shielding properties, heat resistance and chemical resistance.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical display location B32B 27/38 7016-4F 31/20 7141-4F C08J 5/04 CFC 7188-4F 5/24 CFC 7188-4F H05K 1/03 K 7011-4E // B29K 63:00 105: 08 B29L 9:00 4F 31:34 4F C08L 63:00 8830-4J

Claims (2)

[Claims] 1. A resin composition for laminates, which comprises a compound in which an epoxy group is added to a naphthalene or anthracene skeleton. 2. A prepreg obtained by impregnating and drying a resin composition containing a compound obtained by adding an epoxy group to a naphthalene or anthracene skeleton to a part or all of the prepreg, followed by heat and pressure molding. Laminated board manufacturing method.