JP3124758B2 - Flame retardant epoxy resin composition, prepreg and laminated product - Google Patents
Flame retardant epoxy resin composition, prepreg and laminated productInfo
- Publication number
- JP3124758B2 JP3124758B2 JP11153232A JP15323299A JP3124758B2 JP 3124758 B2 JP3124758 B2 JP 3124758B2 JP 11153232 A JP11153232 A JP 11153232A JP 15323299 A JP15323299 A JP 15323299A JP 3124758 B2 JP3124758 B2 JP 3124758B2
- Authority
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- Japan
- Prior art keywords
- epoxy resin
- resin composition
- prepreg
- item
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ハロゲンフリーの
難燃性エポキシ樹脂組成物、それを含浸したプリプレグ
並びに積層板、銅張積層板及びプリント配線板の積層製
品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a halogen-free flame-retardant epoxy resin composition, a prepreg impregnated with the composition, and a laminate product of a laminate, a copper-clad laminate and a printed wiring board.
【０００２】[0002]
【従来の技術】近年、世界的な環境問題、人体に対する
安全性についての関心の高まりに伴なって、電気・電子
機器については、従来からの難燃性に加えて、より少な
い有害性、より高い安全性という要求が増大している。
すなわち、電気・電子機器は、単に燃えにくいだけでな
く、有害ガスや発煙などの発生が少ないことが要望され
ている。従来、電気・電子部品を搭載するガラス基材エ
ポキシ樹脂のプリント配線板は、エポキシ樹脂として、
難燃剤の臭素を含有する臭素化エポキシ樹脂、特にテト
ラブロモビスフェノールＡ型エポキシ樹脂が一般に使用
されている。2. Description of the Related Art In recent years, as environmental concerns around the world and concerns about safety for the human body have increased, electric and electronic devices have become less hazardous in addition to the conventional flame retardancy. The demand for high security is increasing.
That is, it is demanded that electric / electronic devices not only hardly burn, but also generate less harmful gas and smoke. Conventionally, printed wiring boards made of glass-based epoxy resin on which electrical and electronic components are mounted
Brominated epoxy resins containing bromine as a flame retardant, especially tetrabromobisphenol A type epoxy resins, are commonly used.
【０００３】このような臭素化エポキシ樹脂は、良好な
難燃性を有するものの、燃焼時に有害なハロゲン化水素
（臭化水素）ガスを発生することや、ブロモ化ダイオキ
シン、フラン類を発生する可能性があるため、その使用
が抑制されつつある。[0003] Such brominated epoxy resins have good flame retardancy, but can generate harmful hydrogen halide (hydrogen bromide) gas upon combustion, and can also generate brominated dioxins and furans. Therefore, its use is being suppressed.
【０００４】そこで、例えば、窒素化合物、リン化合
物、有機化合物等を配合した種々のエポキシ樹脂組成物
が開発されている（英国特許第１，１１２，１３９号明
細書、日本国特開平２−２６９７３０号公報参照）。Therefore, for example, various epoxy resin compositions containing a nitrogen compound, a phosphorus compound, an organic compound and the like have been developed (British Patent No. 1,112,139, Japanese Patent Application Laid-Open No. 2-269730). Reference).
【０００５】しかし、これらに記載の化合物では、エポ
キシ樹脂の硬化に悪影響を及ぼしたり、硬化組成物の耐
湿性、耐熱性を低下させる等の問題点があった。[0005] However, the compounds described above have problems such as adversely affecting the curing of the epoxy resin and lowering the moisture resistance and heat resistance of the cured composition.
【０００６】[0006]
【発明が解決しようとする課題】本発明の目的は、ハロ
ゲンを含まずに良好な難燃性を示す（ハロゲンフリー）
とともに、上記従来技術の欠点を解消した難燃性エポキ
シ樹脂組成物を提供することにある。An object of the present invention is to exhibit good flame retardancy without halogen (halogen free).
Another object of the present invention is to provide a flame-retardant epoxy resin composition which has solved the above-mentioned disadvantages of the prior art.
【０００７】さらに、本発明は、そのような難燃性エポ
キシ樹脂組成物で含浸されたプリプレグ、並びにこれら
プリプレグを用いて製造された積層板、銅張積層板およ
びプリント配線板を提供することをも目的とする。Further, the present invention provides a prepreg impregnated with such a flame-retardant epoxy resin composition, and a laminate, a copper-clad laminate and a printed wiring board manufactured using these prepregs. Also aim.
【０００８】[0008]
【課題を解決するための手段】本発明者らは、上記の目
的を達成しようと鋭意研究を重ねた結果、樹脂組成物
に、９，１０−ジヒドロ−９−オキサ−１０−ホスファ
フェナントレン−１０−オキサイド（以下、ＨＣＡと略
す）又はその誘導体をエポキシド化合物その他に適当に
組み合わせるという新規な配合によって、ハロゲンを含
まずに良好な難燃性を示すとともに、耐湿性、耐熱性が
向上し、上記目的が達成されることを見いだし、本発明
を完成させたものである。Means for Solving the Problems The inventors of the present invention have made intensive studies to achieve the above object, and as a result, a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-resin was added to a resin composition. By a novel combination of appropriately combining 10-oxide (hereinafter abbreviated as HCA) or a derivative thereof with an epoxide compound or the like, while exhibiting good flame retardancy without containing halogen, moisture resistance and heat resistance are improved, The inventors have found that the above-mentioned object is achieved, and have completed the present invention.
【０００９】即ち、本発明は、 （Ａ）９，１０−ジヒドロ−９−オキサ−１０−ホスフ
ァフェナントレン−１０−オキサイドまたはその誘導
体、 （Ｂ）グリシジルエーテル系エポキシ樹脂、 （Ｃ）エポキシ用硬化剤としてノボラック型フェノール
樹脂および （Ｄ）水酸化アルミニウム を必須成分とし、エポキシ用硬化剤としてアミノ基をも
つ化合物を含まないことを特徴とするハロゲンフリーの
難燃性エポキシ樹脂組成物である。また、そのようなエ
ポキシ樹脂組成物で含浸されたプリプレグ、並びにこれ
らプリプレグを用いて製造された積層板、銅張積層板お
よびプリント配線板である。That is, the present invention provides (A) 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or a derivative thereof, (B) a glycidyl ether-based epoxy resin, and (C) curing for epoxy. the novolak type phenolic resin and (D) aluminum hydroxide as essential components, a flame-retardant epoxy resin composition of the halogen-free, characterized in that no compound having an amino group as the epoxy curing agent as the agent. Also, a prepreg impregnated with such an epoxy resin composition, and a laminate, a copper-clad laminate, and a printed wiring board manufactured using these prepregs.
【００１０】以下、本発明を詳細に説明する。Hereinafter, the present invention will be described in detail.
【００１１】本発明に用いる（Ａ）９，１０−ジヒドロ
−９−オキサ−１０−ホスファフェナントレン−１０−
オキサイド及びその誘導体としては、特に耐熱性、耐湿
性、難燃性、耐薬品性の観点から、９，１０−ジヒドロ
−９−オキサ−１０−ホスファフェナントレン−１０−
オキサイド（ＨＣＡ）が好適である。ＨＣＡ及びその誘
導体は、下記一般式に示されるものであり、さらにその
融点は、８０℃以上であることが好ましい。(A) 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10- used in the present invention
Oxides and derivatives thereof are preferably 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10- from the viewpoint of heat resistance, moisture resistance, flame retardancy, and chemical resistance.
Oxide (HCA) is preferred. HCA and its derivatives are represented by the following general formula, and the melting point thereof is preferably 80 ° C. or higher.
【００１２】[0012]
【化２】 （但し、式中、Ｒは水素原子、フェノキシ基又はアルキ
ル基を表す）本発明に用いるエポキシド化合物として
は、（Ｂ）グリシジルエーテル系エポキシ樹脂が好適で
ある。これには、ビスフェノールＡ型エポキシ樹脂、ビ
スフェノールＦ型エポキシ樹脂、ノボラック型エポキシ
樹脂等が挙げられ、これらは単独又は２種以上混合して
使用することができる。また、このエポキシ樹脂には、
グリシジルエーテル系の変性エポキシ樹脂も含まれる。
変性エポキシ樹脂として例えば、ＢＴ樹脂などを使用す
ることができる。Embedded image (Wherein, R represents a hydrogen atom, a phenoxy group or an alkyl group) As the epoxide compound used in the present invention, (B) a glycidyl ether-based epoxy resin is preferable. These include bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolak type epoxy resin and the like, and these can be used alone or in combination of two or more . Also, in this epoxy resin,
A glycidyl ether-based modified epoxy resin is also included.
As the modified epoxy resin, for example, a BT resin or the like can be used.
【００１３】本発明に用いるエポキシ用硬化剤として
は、（Ｃ）ノボラック型フェノール樹脂を用いる。 [0013] As a curing agent for epoxy used in the present invention
Is used (C) a novolak-type phenolic resin.
【００１４】本発明においては、必要に応じて、硬化促
進剤を用いる、硬化促進剤としては、必要な場合、通常
のエポキシ樹脂促進剤として用いられる第三アミン、イ
ミダゾール、芳香族アミンのうちの少なくとも一種を用
いることができる。In the present invention, if necessary, a curing accelerator is used. If necessary, a curing accelerator selected from tertiary amines, imidazoles and aromatic amines used as ordinary epoxy resin accelerators is used. At least one can be used.
【００１５】（Ｂ）成分のビスフェノールＡ型エポキシ
樹脂などは、ビスフェノールＡとエピクロルヒドリンと
をアルカリの存在下で反応させるために、その反応残
渣、反応副生成物としての不純物ハロゲンが残存する。
ハロゲンフリーの本発明において使用される（Ａ）〜
（Ｃ）成分と硬化促進剤は、不純物ハロゲンの含有量が
０．１重量％以下のものと定義される。The bisphenol A type epoxy resin of the component (B) reacts bisphenol A with epichlorohydrin in the presence of an alkali, so that a reaction residue and impurity halogen as a reaction by-product remain.
(A) used in the present invention which is halogen-free
The component (C) and the curing accelerator are defined as those having an impurity halogen content of 0.1% by weight or less.
【００１６】本発明に用いる（Ｄ）水酸化アルミニウム
は、難燃性などの補助添加剤として使用する無機充填剤
であり、樹脂含浸性等の樹脂特性を阻害しない範囲で可
能である。 (D) Aluminum hydroxide used in the present invention
Is an inorganic filler used as an auxiliary additive such as flame retardancy, and can be in a range not impairing resin properties such as resin impregnation .
【００１７】本発明のエポキシ樹脂組成物において、化
合物などの配合割合は、（Ａ）のＨＣＡ及びその誘導体
が２〜５０重量％、（Ｄ）水酸化アルミニウムは、１０
〜５０重量％の割合である。また、（Ａ）成分＋（Ｄ）
成分が、樹脂組成物において、２０〜５０重量％配合す
ることが好ましい。In the epoxy resin composition of the present invention, the compounding ratio of the compound and the like is such that HCA and its derivative (A) are 2 to 50% by weight, and (D) aluminum hydroxide is 10% by weight.
５０50% by weight. In addition, (A) component + (D)
The components are preferably blended in the resin composition at 20 to 50% by weight.
【００１８】本発明のエポキシ樹脂組成物は、これをプ
ロピレングリコールモノメチルエーテル等の好適な有機
溶剤で希釈してワニスとなし、これをガラス不織布、ガ
ラス織布等の多孔質ガラス基材に塗布、含浸させ、加熱
するという通常の方法によりプリプレグを製造すること
ができる。また、このプリプレグを複数枚重ね合わせ、
その積層構造の片面又は両面に銅箔を重ね合わせた後、
これを通常の条件で加熱・加圧してガラスエポキシ銅張
積層板を得ることができる。この時、銅箔を用いなけれ
ば積層板が得られる。多層板は、銅張積層板（内層板）
に回路を形成し、ついで銅箔をエッチング処理した後、
内層板の少なくとも片面にプリプレグおよび銅箔を重ね
合わせ、これを例えば、１７０℃，４ＭＰａの圧力で１
００分間加熱・加圧するという通常の方法により製造す
ることができる。さらに、プリント配線板は、銅張積層
板もしくは多層板にスルーホールを形成し、スルーホー
ルメッキを行った後、所定の回路を形成するという通常
の方法により製造することができる。The epoxy resin composition of the present invention is diluted with a suitable organic solvent such as propylene glycol monomethyl ether to form a varnish, which is applied to a porous glass substrate such as a glass nonwoven fabric or a glass woven fabric. The prepreg can be manufactured by a usual method of impregnating and heating. Also, multiple prepregs are stacked,
After laminating copper foil on one or both sides of the laminated structure,
This is heated and pressed under normal conditions to obtain a glass epoxy copper clad laminate. At this time, a laminate can be obtained without using a copper foil. Multilayer board is copper-clad laminate (inner board)
After forming a circuit, and then etching the copper foil,
A prepreg and a copper foil are overlaid on at least one surface of the inner layer plate, and the prepreg and the copper foil are pressed at 170 ° C. and a pressure of 4 MPa, for example.
It can be manufactured by a usual method of heating and pressurizing for 00 minutes. Further, the printed wiring board can be manufactured by a usual method of forming a through hole in a copper-clad laminate or a multilayer board, performing through-hole plating, and then forming a predetermined circuit.
【００１９】[0019]
【発明の実施の形態】以下、本発明を実施例により説明
するが、本発明はこれらの実施例によって限定されるも
のではない。以下の実施例および比較例において「部」
とは「重量部」を意味する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited to these examples. "Part" in the following Examples and Comparative Examples
Means "parts by weight".
【００２０】実施例１ ビスフェノールＡ型エポキシ樹脂のエピコート１００１
（油化シェル社製商品名、エポキシ当量４５６、樹脂固
形分７０重量％）３００部、クレゾールノボラックエポ
キシ樹脂のＹＤＣＮ−７０４Ｐ（東都化成社製商品名、
エポキシ当量２１０、樹脂固形分７０重量％）３２０
部、ビスフェノールＡ型ノボラック樹脂（大日本インキ
化学社製商品名、水酸基価１１８、樹脂固形分７０重量
％）２６４部、ＨＣＡ（三光社製商品名、融点１１８
℃）１５０部、水酸化アルミニウム２６０部および２−
エチル−４−メチルイミダゾール０．９部からなる混合
物に溶媒としてプロピレングリコールモノメチルエーテ
ル（ＰＧＭ）を加えて樹脂固形分６５重量％のエポキシ
樹脂ワニスを調製した。Example 1 Bisphenol A type epoxy resin epicoat 1001
(Trade name of Yuka Shell Co., epoxy equivalent 456, resin solid content 70% by weight) 300 parts, YDCN-704P of cresol novolak epoxy resin (trade name of Toto Kasei Co., Ltd.,
Epoxy equivalent 210, resin solid content 70% by weight) 320
Parts, 264 parts of bisphenol A type novolak resin (trade name, manufactured by Dainippon Ink and Chemicals, hydroxyl value 118, resin solid content 70% by weight), HCA (trade name, manufactured by Sanko Co., melting point 118)
° C) 150 parts, aluminum hydroxide 260 parts and 2-
Propylene glycol monomethyl ether (PGM) was added as a solvent to a mixture consisting of 0.9 parts of ethyl-4-methylimidazole to prepare an epoxy resin varnish having a resin solid content of 65% by weight.
【００２１】下記比較例１〜２は実施例１の対照例であ
る。 The following Comparative Examples 1 and 2 are comparative examples of Example 1.
You.
【００２２】比較例１ 臭素化エポキシ樹脂のエピコート５０４５（油化シェル
社製商品名、エポキシ当量４８０、樹脂固形分７５重量
％）６００部、ビスフェノールＡ型ノボラック樹脂（大
日本インキ化学社製商品名、水酸基価１１８、樹脂固形
分７０重量％）１５８部および２−エチル−４−メチル
イミダゾール０．６部からなる混合物に溶媒としてプロ
ピレングリコールモノメチルエーテル（ＰＧＭ）を加え
て樹脂固形分６５重量％のエポキシ樹脂ワニスを調製し
た。Comparative Example 1 600 parts of a brominated epoxy resin Epicoat 5045 (trade name, manufactured by Yuka Shell Co., epoxy equivalent: 480, resin solid content: 75% by weight), bisphenol A type novolak resin (trade name, manufactured by Dainippon Ink and Chemicals, Inc.) Propylene glycol monomethyl ether (PGM) as a solvent was added to a mixture consisting of 158 parts, hydroxyl value 118, resin solid content 70% by weight) and 2-ethyl-4-methylimidazole 0.6 part to obtain a resin solid content 65% by weight. An epoxy resin varnish was prepared.
【００２３】比較例２ 臭素化エポキシ樹脂のエピコート５０４５（油化シェル
社製商品名、エポキシ当量４８０、樹脂固形分７５重量
％）５００部、クレゾールノボラックエポキシ樹脂のＹ
ＤＣＮ−７０４Ｐ（東都化成社製商品名、エポキシ当量
２１０、樹脂固形分７０重量％）１００部、ジシアンジ
アミド１４部および２−エチル−４−メチルイミダゾー
ル０．６部からなる混合物に溶媒としてプロピレングリ
コールモノメチルエーテル（ＰＧＭ）を加えて樹脂固形
分６５重量％のエポキシ樹脂ワニスを調製した。Comparative Example 2 500 parts of a brominated epoxy resin Epicoat 5045 (trade name, manufactured by Yuka Shell Co., epoxy equivalent 480, resin solid content 75% by weight), Y of cresol novolak epoxy resin
A mixture of 100 parts of DCN-704P (trade name, manufactured by Toto Kasei Co., epoxy equivalent 210, resin solid content 70% by weight), 14 parts of dicyandiamide and 0.6 part of 2-ethyl-4-methylimidazole was used as a solvent to prepare propylene glycol monomethyl as a solvent. Ether (PGM) was added to prepare an epoxy resin varnish having a resin solid content of 65% by weight.
【００２４】実施例１および比較例１〜２で得たエポキ
シ樹脂ワニスの各々を１８０μｍガラス不織布に連続的
に塗布・含浸させ、１６０℃の温度で乾燥してプリプレ
グを製造した。こうして得られたプリプレグ８枚を重ね
合わせ、この積層体の両面に厚さ１８μｍの銅箔をさら
に重ね合わせて１７０℃の温度、４Ｍｐａの圧力で１０
０分間加熱・加圧し、厚さ１．６ｍｍのガラスエポキシ
銅張積層板を得た。得られた銅張積層板についての特性
評価結果を表１に示す。Each of the epoxy resin varnishes obtained in Example 1 and Comparative Examples 1 and 2 was continuously applied and impregnated on a 180 μm glass nonwoven fabric, and dried at a temperature of 160 ° C. to produce a prepreg. Eight prepregs thus obtained are superimposed, and a copper foil having a thickness of 18 μm is further superimposed on both surfaces of the laminate.
Heating and pressing were performed for 0 minutes to obtain a glass epoxy copper-clad laminate having a thickness of 1.6 mm. Table 1 shows the property evaluation results of the obtained copper-clad laminate.
【００２５】また、同じプリプレグを重ね合わせ、その
両面に厚さ３５μｍの銅箔を重ね合わせて同様に加熱・
加圧して板厚０．８ｍｍの内層板を製造した。この内層
板の両面に上記プリプレグを重ね合わせ、その上にそれ
ぞれ厚さ１８μｍの銅箔を重ね合わせて同様に加熱・加
圧して板厚１．６ｍｍの多層板を製造した。得られた多
層板についての特性評価結果を表２に示す。Further, the same prepreg is overlapped, and a copper foil having a thickness of 35 μm is overlapped on both surfaces thereof.
Pressing produced an inner layer plate having a thickness of 0.8 mm. The prepreg was superimposed on both sides of the inner layer plate, and a copper foil having a thickness of 18 μm was superimposed thereon, and heated and pressed similarly to produce a 1.6 mm thick multilayer plate. Table 2 shows the results of evaluating the characteristics of the obtained multilayer board.
【００２６】[0026]
【表１】 [Table 1]
【００２７】＊２：ＩＥＣ−Ｐｂ１１２に準じて測定し
た。* 2: Measured according to IEC-Pb112.
【００２８】＊３：ＪＩＳ−Ｃ−６４８１に準じて測定
した。* 3: Measured according to JIS-C-6481.
【００２９】＊４：２６０℃の半田浴上に、表に示した
各時間サンプルを浮かべ、フクレの有無を試験した。◎
印…全部無し、○印…一部有り、△印…大部有り、×印
…全部有り。* 4: A sample was floated on a solder bath at 260 ° C. for each time shown in the table, and the presence or absence of blisters was tested. ◎
Mark: None, ○: Some, △: Large, X: All.
【００３０】＊５：処理条件Ａは煮沸４時間、処理条件
Ｂは１２０℃，２気圧の水蒸気中。* 5: Treatment condition A was boiling for 4 hours, and treatment condition B was in steam at 120 ° C. and 2 atm.
【００３１】上記処理条件Ａ及びＢで処理後、２６０℃
の半田浴中に３０秒間浸漬し、フクレの有無を観察し
た。◎印…全部無し、○印…一部有り、△印…大部有
り、×印…全部有り。After processing under the above processing conditions A and B,
Was immersed in a solder bath for 30 seconds, and the presence or absence of blisters was observed. ◎: none, ○: some, △: most, ×: all.
【００３２】[0032]
【表２】 [Table 2]
【００３３】＊２：ＪＩＳ−Ｃ−６４８１に準じて測定
した。* 2: Measured according to JIS-C-6481.
【００３４】＊３：処理条件Ａは煮沸２時間、処理条件
Ｂは煮沸４時間。上記処理条件Ａ及びＢで処理後、２６
０℃の半田浴中に３０秒間浸漬し、フクレの有無を観察
した。◎印…全部無し、○印…一部有り、△印…大部有
り、×印…全部有り。* 3: Treatment condition A is boiling for 2 hours, and treatment condition B is boiling for 4 hours. After processing under the above processing conditions A and B, 26
It was immersed in a solder bath at 0 ° C. for 30 seconds, and the presence or absence of blisters was observed. ◎: none, ○: some, △: most, ×: all.
【００３５】[0035]
【発明の効果】以上の説明および表１、表２から明らか
なように、本発明によれば、ハロゲンを含有しないで優
れた難燃性を示し、しかも耐熱性、耐湿性、耐薬品性に
優れるガラスエポキシ銅張積層板を与えるエポキシ樹脂
組成物が提供される。このようなガラスエポキシ銅張積
層板を用いて環境特性を付与し、かつ種々の特性に優れ
たプリント配線板を製造することができる。As apparent from the above description and Tables 1 and 2, according to the present invention, excellent flame retardancy is obtained without containing halogen, and heat resistance, moisture resistance and chemical resistance are improved. An epoxy resin composition is provided that provides an excellent glass epoxy copper clad laminate. By using such a glass epoxy copper clad laminate, it is possible to provide a printed wiring board which imparts environmental characteristics and is excellent in various characteristics.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｃ０８Ｋ 3:22 5:51） (72)発明者 鈴木 鉄秋 埼玉県川口市領家５丁目14番25号東芝ケ ミカル株式会社 川口工場内 (56)参考文献 特開 平11−124489（ＪＰ，Ａ) 特開 平９−324108（ＪＰ，Ａ) 特開 平10−330596（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) C08L 63/00 - 63/10 C08K 3/22 C08K 5/51 C08J 5/24 B32B 27/38 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification code FI C08K 3:22 5:51) (72) Inventor Tetsuaki Suzuki 5-14-25 Ryoke, Kawaguchi-shi, Saitama Toshiba Chemical Corporation Inside the Kawaguchi Plant (56) References JP-A-11-124489 (JP, A) JP-A-9-324108 (JP, A) JP-A-10-330596 (JP, A) (58) Fields studied (Int. Cl 7, DB name) C08L 63/00 -. 63/10 C08K 3/22 C08K 5/51 C08J 5/24 B32B 27/38
Claims (6)
−１０−ホスファフェナントレン−１０−オキサイドま
たはその誘導体、 （Ｂ）グリシジルエーテル系エポキシ樹脂、 （Ｃ）エポキシ用硬化剤としてノボラック型フェノール
樹脂および （Ｄ）水酸化アルミニウム を必須成分とし、エポキシ用硬化剤としてアミノ基をも
つ化合物を含まないことを特徴とするハロゲンフリーの
難燃性エポキシ樹脂組成物。(1) 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or a derivative thereof, (B) a glycidyl ether-based epoxy resin, and (C) a novolak type epoxy curing agent. phenol resin and (D) aluminum hydroxide as essential components, a halogen-free flame retardant epoxy resin composition characterized by containing no compound having an amino group as an epoxy curing agent.
−１０−ホスファフェナントレン−１０−オキサイドお
よびその誘導体が、下記一般式に示されるものである、
請求項１記載のハロゲンフリーの難燃性エポキシ樹脂組
成物。 【化１】 （但し、式中、Ｒは水素原子、フェノキシ基又はアルキ
ル基を表す）2. (A) 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and a derivative thereof are represented by the following general formula:
The halogen-free flame-retardant epoxy resin composition according to claim 1. Embedded image (Wherein, R represents a hydrogen atom, a phenoxy group or an alkyl group)
キシ樹脂組成物によってガラス基材が含浸されたことを
特徴とするプリプレグ。 3. A prepreg, wherein a glass substrate is impregnated with the epoxy resin composition according to claim 1 .
項３記載のプリプレグからなることを特徴とする積層
板。 4. A claims the epoxy resin composition is cured
Item 4. A laminate comprising the prepreg according to Item 3 .
項３記載のプリプレグからなる基板および該基板の少な
くとも片面に接合された銅箔を備えたことを特徴とする
銅張積層板。 5. A according to which the epoxy resin composition is cured
Item 4. A copper-clad laminate comprising a substrate made of the prepreg according to item 3, and a copper foil bonded to at least one surface of the substrate.
項３記載のプリプレグからなる基板および該基板の少な
くとも片面に形成された銅箔回路を備えたことを特徴と
するプリント配線板。 6. The claims which the epoxy resin composition is cured
Item 4. A printed wiring board comprising: a substrate made of the prepreg according to item 3 ; and a copper foil circuit formed on at least one surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11153232A JP3124758B2 (en) | 1999-06-01 | 1999-06-01 | Flame retardant epoxy resin composition, prepreg and laminated product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11153232A JP3124758B2 (en) | 1999-06-01 | 1999-06-01 | Flame retardant epoxy resin composition, prepreg and laminated product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000336253A JP2000336253A (en) | 2000-12-05 |
| JP3124758B2 true JP3124758B2 (en) | 2001-01-15 |
Family
ID=15557952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11153232A Expired - Fee Related JP3124758B2 (en) | 1999-06-01 | 1999-06-01 | Flame retardant epoxy resin composition, prepreg and laminated product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3124758B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002201364A (en) * | 2001-01-05 | 2002-07-19 | Fujitsu Ltd | Flame-retardant resin composition and build-up substrate using the same |
| JP4783984B2 (en) * | 2001-02-15 | 2011-09-28 | 日立化成工業株式会社 | Resin composition, use thereof and production method thereof |
| JP2011017026A (en) * | 2010-10-15 | 2011-01-27 | Hitachi Chem Co Ltd | Resin composition, use of the same, and method for preparing the same |
| CN103965588A (en) * | 2014-05-28 | 2014-08-06 | 苏州生益科技有限公司 | Halogen-free thermosetting resin composition, prepreg and laminated board |
-
1999
- 1999-06-01 JP JP11153232A patent/JP3124758B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000336253A (en) | 2000-12-05 |
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