JPH0513990A - Electronic part suction device - Google Patents

Abstract

PURPOSE:To enable electronic parts mounted on a film carrier to be protected against deformation and accurately mounted by a method wherein vacuum suction units which control a suction force for sucking an electronic part are arranged in parallel. CONSTITUTION:A vacuum suction unit 1 is a set composed of a vacuum ejector 11, a vacuum generating valve 12, and a vacuum breaking valve 13, and a suction nozzle 4 is additionally provided. The vacuum suction units 1 are connected together in parallel, and each unit 1 is set large enough in suction force to release an electronic part from a molding die or to transfer it or set weak enough in suction force to prevent an electronic part from getting out of position in an OLB process. The vacuum suction units 1 set in suction force as above are successively switched from one to another to carry out a series of operations, whereby an electronic part and its leads are protected against deformation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component suction device used in a process of mounting an electronic component mounted on a film carrier on a circuit board.

[0002]

2. Description of the Related Art In recent years, high density mounting has become the mainstream in the field of mounting electronic parts, and miniaturization of electronic parts, narrowing of leads and mounting of semiconductor chips have become common. In order to cope with such high-density mounting and to avoid the influence of heat when soldering an electronic component to a circuit board, a local heating soldering method using a laser is performed. As a typical example, there is a method of soldering an electronic component mounted on a film carrier with a laser.

A conventional electronic component suction device will be described below. FIG. 2 is a sectional view of a main part of a conventional electronic component suction device. In FIG. 2, 11 is a vacuum ejector, 12 is a vacuum generating valve, 13 is a vacuum breaking valve, and 14 is a suction nozzle.

The operation of the electronic component suction device constructed as described above will be described below. First, the electronic components separated from the film carrier after the leads have been formed using a mold are suctioned by the suction nozzle 14 by opening the vacuum generating valve 12, and the leads are soldered to the conductor wiring of the circuit board (outer lead bonding). , Below O
(Referred to as LB), but the suction force is constant during that time. Next, when the OLB process is completed, the vacuum generation valve 12 is closed and the vacuum break valve 13 is opened to stop adsorption.
The suction nozzle 14 is raised.

[0005]

However, the above conventional structure has a problem that the electronic components including the leads are deformed in the OLB process.

The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide an electronic component suction device in which an electronic component is not deformed in an OLB process.

[0007]

In order to achieve this object, an electronic component suction apparatus of the present invention has a vacuum suction unit for changing the suction force for sucking an electronic component mounted on a film carrier in multiple stages. is doing.

[0008]

With this structure, the electronic component can be sucked with a slightly strong suction force at the beginning, and the suction force can be lowered in the OLB process to such an extent that no displacement occurs.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram of an electronic component adsorption device according to an embodiment of the present invention. In FIG. 1, 1 is a vacuum suction unit, which is a vacuum ejector 11 shown in FIG.
The vacuum generating valve 12 and the vacuum breaking valve 13 are a set, and 4 is an adsorption nozzle. In the electronic component suction device of this embodiment, a plurality of vacuum suction units 1 are connected in parallel, and each vacuum suction unit 1 is connected.
Are set to a suction force required to take out the electronic component from the mold, a suction force required to transfer the electronic component, or a weak suction force that does not cause displacement in the OLB process. By performing a series of operations while sequentially switching the vacuum suction units 1 set in this way, it is possible to prevent deformation of the electronic components and their leads.

Further, the first vacuum suction unit 1 is set to a suction force necessary for taking out an electronic component from the mold,
The second vacuum suction unit 1 is set to a suction force that is a difference between the suction force required to take out the electronic component from the mold and the suction force required when the electronic component is conveyed, and the third vacuum suction unit 1 is set. The unit 1 is set to a suction force which is a difference between the suction force required in the OLB process and the suction force required when an electronic component is transported, so that the vacuum suction unit 1 is sequentially closed without closing it. By opening the vacuum suction unit 1, the required vacuum suction force can be obtained.

[0011]

As described above, according to the present invention, a plurality of vacuum suction units for controlling the suction force for sucking an electronic component are arranged in parallel, so that the electronic component mounted on the film carrier is deformed. Thus, it is possible to realize an electronic component suction device that can prevent the above-mentioned problems and enable accurate mounting.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an electronic component adsorption device according to an embodiment of the present invention.

FIG. 2 is a block diagram of a conventional electronic component suction device.

[Explanation of symbols]

 1 Vacuum adsorption unit

Claims (1)

Claim: What is claimed is: 1. An electronic component suction device having a vacuum suction unit for changing the suction force for sucking an electronic component mounted on a film carrier in multiple stages.