JPH05138517A - Position setting method for wheel spindle stock in double-headed grinder - Google Patents
Position setting method for wheel spindle stock in double-headed grinderInfo
- Publication number
- JPH05138517A JPH05138517A JP32369091A JP32369091A JPH05138517A JP H05138517 A JPH05138517 A JP H05138517A JP 32369091 A JP32369091 A JP 32369091A JP 32369091 A JP32369091 A JP 32369091A JP H05138517 A JPH05138517 A JP H05138517A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- positions
- grindstone
- correction
- wheel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はCNC両頭研削盤におけ
る砥石修正後の研削位置の設定方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for setting a grinding position after a grindstone is corrected in a CNC double head grinding machine.
【0002】[0002]
【従来の技術】図2はCNC両頭研削盤の正面図であ
る。機台1上には端面の研削作用面を対向して円板形の
砥石2L,2Rを備えた砥石台3L,3Rが砥石2L,
2R研削作用面間の間隔を調整出来るように機台1に係
合している。機台1には夫々数値制御のサーボモータ4
L,4Rが設けられ、これらサーボモータ4L,4Rの
出力軸はねじ送り装置5L,5Rにより砥石台3L,3
Rに連結されている。サーボモータ4L,4Rは電子計
算機化された数値制御装置(CNC)6によって制御さ
れるようになっている。機台1上のテーブル7に備えた
図示されない送り装置で加工物Wは図の紙面の交叉方向
に移動して加工物Wの両面WC,WRが両砥石2L,2
Rの端面の研削作用面により研削される。砥石2L,2
Rは、砥石台3L,3Rを一定位置まで後退させ、図示
されない砥石修正装置により端面即ち、研削作用面をド
レッシングされる。砥石台3L,3Rの移動は数値制御
装置6によりサーボモータ4L,4Rを駆動し、ねじ送
り装置5L,5Rにより行われる。2. Description of the Related Art FIG. 2 is a front view of a CNC double-headed grinder. On the machine base 1 are grindstones 3L and 3R having disk-shaped grindstones 2L and 2R facing the grinding action surfaces of the end faces.
It is engaged with the machine base 1 so that the space between the 2R grinding working surfaces can be adjusted. Each machine base 1 has a numerically controlled servo motor 4
L, 4R are provided, and the output shafts of these servomotors 4L, 4R are grindstones 3L, 3 by screw feed devices 5L, 5R.
It is connected to R. The servomotors 4L and 4R are controlled by a numerical controller (CNC) 6 which is an electronic computer. The workpiece W is moved in the crossing direction of the paper surface of the drawing by the feeding device (not shown) provided on the table 7 on the machine base 1 so that both sides WC and WR of the workpiece W are both grinding wheels 2L and 2L.
It is ground by the grinding action surface of the end surface of R. Whetstone 2L, 2
In R, the grindstone bases 3L and 3R are retracted to a predetermined position, and the end surface, that is, the grinding action surface is dressed by a grindstone correction device (not shown). The movement of the grindstone bases 3L and 3R is performed by driving the servomotors 4L and 4R by the numerical control device 6 and the screw feeding devices 5L and 5R.
【0003】図3は従来例の研削位置の設定方法を示
す。図3Aは両砥石2L,2Rが砥石修正位置(0)に
ある状態、図3B,Cは両砥石2L,2Rが異なる研削
位置(1),(2)にある状態を示している。研削位置
の設定は (1) 図3Aの砥石修正位置より図3Bの研削位置へ
手動で左砥石台3Lを長さL1、右砥石台3Rを長さR
1前進して研削位置を設定した後、実機で加工物Wを研
削し寸法確認を行ない、移動した上記長さL1,R2を
各々プログラム設定する。 (2) 研削位置を図3Bの(1)から図3Cの(2)
へ変える場合は砥石修正位置から研削位置へ移動した長
さL1,R1を各々L2,R2に変える。 (3) 研削位置(1),(2)を変えることは図3B
の加工物寸法M1を図3CのM2に変えることである
が、加工物Wの寸法M1,M2より砥石台位置を夫々差
引きして移動長さL2,R2を算出するか或は実機研削
の後に砥石台位置を割出した後、プログラムを設定す
る。FIG. 3 shows a conventional grinding position setting method. FIG. 3A shows a state in which both grindstones 2L and 2R are at the grindstone correction position (0), and FIGS. 3B and 3C show a state in which both grindstones 2L and 2R are at different grinding positions (1) and (2). The setting of the grinding position is (1) Manually move from the grinding wheel correction position of FIG. 3A to the grinding position of FIG. 3B by setting the left grinding wheel head 3L to the length L1 and the right grinding wheel head 3R to the length R.
After moving forward by 1 and setting the grinding position, the workpiece W is ground by an actual machine to check the dimensions, and the moved lengths L1 and R2 are set as programs. (2) The grinding position is changed from (1) in FIG. 3B to (2) in FIG. 3C.
When changing to, the lengths L1 and R1 moved from the grindstone correction position to the grinding position are changed to L2 and R2, respectively. (3) Changing the grinding positions (1) and (2) is as shown in Fig. 3B.
Is to change the workpiece size M1 of FIG. 3C to M2 of FIG. 3C, but the wheel head positions are subtracted from the dimensions M1 and M2 of the workpiece W respectively to calculate the moving lengths L2 and R2, or After indexing the wheel head position later, set the program.
【0004】[0004]
【発明が解決しようとする課題】上記の通常は両頭研削
盤の砥石台位置は研削位置と修正(ドレス)位置とがあ
り、左右の砥石台共研削・修正位置が異なる場合は、各
々の位置設定を各位置間の移動量で設定していた。即ち
研削位置と砥石修正位置の移動長さで決められていた。
このため、現在研削位置と砥石修正位置の砥石台移動長
さを変更する場合加工物の寸法差と併せて計算しなけれ
ばならないという繁雑さがある。そこで砥石修正位置か
ら、研削位置の設定を行うとその都度実機研削を行ない
寸法確認を行わねばならないという面倒さがある。Generally, the grinding wheel head positions of the above-mentioned double-headed grinding machine have a grinding position and a correction (dress) position, and if the left and right grinding wheel heads have different grinding / correction positions, each position is different. The setting was set by the amount of movement between each position. That is, it was determined by the moving length between the grinding position and the whetstone correction position.
For this reason, when changing the moving length of the grinding wheel head between the current grinding position and the grinding wheel correction position, it is necessary to calculate together with the dimensional difference of the workpiece. Therefore, if the grinding position is set from the whetstone correction position, it is necessary to perform actual machine grinding each time to check the dimensions.
【0005】本発明は上記従来例の課題を機械仮想中心
を設けることにより、研削位置への砥石移動長さを容易
に求め得る両頭研削盤における研削位置の設定方法を提
供することを目的とする。It is an object of the present invention to provide a method of setting a grinding position in a double-sided grinder, which can easily find the length of movement of the grindstone to the grinding position by providing a virtual center of the machine. .
【0006】[0006]
【課題を解決するための手段】本発明は両砥石台が後退
した砥石修正位置と、両砥石が前進した研削位置をと
り、砥石修正後砥石を研削位置へ移動する数値制御両頭
研削盤の砥石位置設定方法において、(1)砥石修正位
置より研削位置を手動にて設定した後、研削して実機研
削寸法確認を行い、加工物寸法値M1及び適宜に定め
た、仮想機械中心よりの一方の砥石の研削作用面までの
偏りN1を各々プログラム設定すると共に上記各砥石台
の位置をメモリーする。(2)一方の砥石台の研削位置
と砥石修正位置の差L1=C−N1、他方の砥石台の研
削位置と砥石修正位置の差R1=C′−(M1−N1) C=L1+N1 C′=R1+(M1−N1) ただしC,C′=機械仮想中心より砥石修正位置におけ
る各砥石研削作用面までの距離を演算し、メモリーす
る。(3)研削位置を他の加工物の加工寸法M2、機械
仮想中心からの一方の砥石の砥石研削作用面までの偏り
N2に変える場合はM1→M2,N1→N2にプログラ
ム設定変行し、砥石修正位置と研削位置との砥石台位置
の差L2,R2は L2=C−N2 R2=C′−(M2−N2) を求めることにより研削位置を設定することを特徴とす
る両頭研削盤に於ける研削位置の設定方法である。SUMMARY OF THE INVENTION According to the present invention, a grindstone for a numerically controlled double-sided grinder that takes a grinding wheel correction position in which both grinding wheel heads are retracted and a grinding position in which both grinding wheels are advanced and moves the grinding wheel after grinding wheel correction to the grinding position. In the position setting method, (1) after manually setting the grinding position from the grindstone correction position, the actual machine grinding dimension is confirmed by grinding, and the workpiece dimension value M1 and one of the appropriately determined virtual machine center The deviation N1 of the grindstone to the grinding surface is programmed and the position of each grindstone is stored in memory. (2) Difference L1 = C-N1 between grinding position of one wheel head and grinding wheel correction position, difference R1 = C '-(M1-N1) C = L1 + N1 C'from grinding position of another wheel head and grinding wheel correction position = R1 + (M1-N1) where C and C '= distance from the virtual center of the machine to each grinding wheel grinding operation surface at the grinding wheel correction position is calculated and stored. (3) When changing the grinding position to the machining dimension M2 of another workpiece and the deviation N2 from the virtual center of the machine to the grindstone grinding surface of one grindstone, change the program setting to M1 → M2, N1 → N2, The difference L2, R2 between the grindstone correction position and the grindstone position between the grinding position is L2 = C-N2 R2 = C '-(M2-N2) The double-sided grinder is characterized by setting the grinding position. This is the method of setting the grinding position in the.
【0007】[0007]
【実施例】以下、本発明の実施例を図面に従って説明す
る。Embodiments of the present invention will be described below with reference to the drawings.
【0008】図1は砥石の関係位置を示すもので、砥石
2L,2Rは図3に於ける両頭研削盤における砥石2
L,2Rである。以下、図1、図3を参照して述べる。
図1Aは砥石修正位置(0)、図1Bは研削位置
(1)、図1Cは第2の研削位置(2)に砥石2L,2
Rが位置することを示している。砥石2L,2Rは砥石
台3L,3RがCNC制御装置6によって制御されるサ
ーボモータ4L,4Rがねじ送り装置5L,5Rを駆動
して移動することに伴なって移動する。FIG. 1 shows the relative positions of the grindstones, and the grindstones 2L and 2R are the grindstones 2 in the double-sided grinder shown in FIG.
L and 2R. Hereinafter, description will be made with reference to FIGS. 1 and 3.
1A shows a grindstone correction position (0), FIG. 1B shows a grinding position (1), and FIG. 1C shows a second grinding position (2).
It shows that R is located. The grindstones 2L and 2R move as the grindstone bases 3L and 3R move by the servomotors 4L and 4R controlled by the CNC control device 6 driving the screw feeding devices 5L and 5R.
【0009】本発明の研削位置の設定は次のように行わ
れる。 図1Aの砥石修正位置より図1Bの研削位置(1)
を手動にて設定した後、研削して実機研削寸法確認を行
い、加工物寸法値M1及び適宜に定めた、機械仮想中心
M/Cよりの一方例えば左側の砥石2Lの研削作用面ま
での偏りN1を各々プログラム設定すると共に上記各砥
石台の位置(1)をメモリーする。 一方の砥石台2Lの研削位置と砥石修正位置の差L
1=C−N1他方の砥石台の研削位置と砥石修正位置の
差R1=C′−(M1−N1) C=L1+N1 C′=R1+(M1−N1) ただしC,C′=機械仮想孔中心M/Cより砥石修正位
置における各砥石研削作用面までの距離。 研削位置を他の加工物の加工寸法M2、機械仮想中
心M/Cからの一方の砥石2Lの砥石研削作用面までの
偏りをN2に変える場合はM1→M2,N1→N2にプ
ログラム設定変更し、砥石修正位置と研削位置との砥石
台位置の差L2,R2は L2=C−N2 R2=C′−(M2−N2) を求めることにより研削位置を設定する。The setting of the grinding position of the present invention is performed as follows. Grinding position (1) in FIG. 1B from the whetstone correction position in FIG. 1A
After manually setting, the grinding dimensions are confirmed by grinding, and the deviation of the workpiece dimension value M1 and an appropriately determined one from the machine virtual center M / C, for example, the grinding action surface of the grindstone 2L on the left side. N1 is programmed respectively and the position (1) of each of the above-mentioned grindstones is memorized. Difference L between the grinding position of one wheel head 2L and the grinding wheel correction position
1 = C-N1 Difference between the grinding position of the other wheel head and the grinding wheel correction position R1 = C '-(M1-N1) C = L1 + N1 C' = R1 + (M1-N1) where C, C '= machine virtual hole center Distance from M / C to each grinding wheel grinding action surface at the grinding wheel correction position. When changing the deviation of the grinding position from the machining size M2 of another workpiece to the virtual machine center M / C to the grindstone grinding surface of one grindstone 2L to N2, change the program setting to M1 → M2, N1 → N2. , L2, R2, which is the difference between the grindstone position and the grindstone correction position, is set by finding L2 = C-N2 R2 = C '-(M2-N2).
【0010】即ち、一般に左右砥石2L,2Rの研削位
置の変更はC−N,C′−(M−N)として変更すると
研削位置を加工物寸法に設定することができる。上記に
おいて機械仮想中心M/Cは任意に選択できる。That is, generally, when the grinding positions of the left and right grindstones 2L and 2R are changed to C-N and C '-(M-N), the grinding positions can be set to the workpiece size. In the above, the machine virtual center M / C can be arbitrarily selected.
【0011】[0011]
【発明の効果】本発明は以上のように機械仮想中心M/
Cを想定して、砥石修正位置と機械仮想中心からの距離
C,C′を用いて研削位置を求めるようにしたから、両
砥石台の各々の研削位置、修正位置が異なる場合におい
ても研削加工物の寸法値を設定することに依り、研削位
置を容易に決めることが出来る効果がある。INDUSTRIAL APPLICABILITY As described above, the present invention has the machine virtual center M /
Assuming C, the grinding position is obtained by using the grinding wheel correction position and the distances C and C ′ from the virtual center of the machine. Therefore, even if the grinding positions and the correction positions of both grinding stone heads are different, the grinding process is performed. There is an effect that the grinding position can be easily determined by setting the dimension value of the object.
【図1】実施例の平面図である。FIG. 1 is a plan view of an embodiment.
【図2】両頭平面研削盤の正面図である。FIG. 2 is a front view of a double-sided surface grinder.
【図3】従来例の平面図である。FIG. 3 is a plan view of a conventional example.
M1 加工物寸法 N1 偏り M2 他の加工物の加工寸法 N2 偏り M/C 機械仮想中心 2L 砥石 2R 砥石 M1 Workpiece size N1 Unbalanced M2 Processing size of other workpieces N2 Unbalanced M / C Virtual machine center 2L Grindstone 2R Grindstone
Claims (1)
砥石台が前進した研削位置をとり、砥石修正後砥石を研
削位置へ移動する数値制御両頭研削盤の砥石位置設定方
法において、(1)砥石修正位置より研削位置を手動に
て設定した後、研削して実機研削寸法確認を行い、加工
物寸法値M1及び適宜に定めた、仮想機械中心よりの一
方の砥石の研削作用面までの偏りN1を各々プログラム
設定すると共に上記各砥石台の位置をメモリーする。
(2)一方の砥石台の研削位置と砥石修正位置の差L1
=C−N1、他方の砥石台の研削位置と砥石修正位置の
差 R1=C′−(M1−N1) C=L1+N1 C′=R1+(M1−N1) ただしC,C′=機械仮想中心より砥石修正位置におけ
る各砥石研削作用面までの距離を演算し、メモリーす
る。(3)研削位置を他の加工物の加工寸法M2、機械
仮想中心からの一方の砥石の砥石研削作用面までの偏り
N2に変える場合はM1→M2,N1→N2にプログラ
ム設定変行し、砥石修正位置と研削位置との砥石台位置
の差L2,R2は L2=C−N2 R2=C′−(M2−N2) を求めることにより研削位置を設定することを特徴とす
る両頭研削盤に於ける研削位置の設定方法。1. A grinding wheel position setting method for a numerically controlled double-headed grinder in which a grinding wheel correction position in which both whetstone heads are retracted and a grinding position in which both whetstone heads are moved forward is taken and the whetstone after grinding wheel correction is moved to the grinding position. 1) After manually setting the grinding position from the grindstone correction position, grinding is performed to check the actual machine grinding dimension, and the workpiece dimension value M1 and an appropriately determined grinding action surface of one grindstone from the virtual machine center The deviation N1 is set in each program, and the positions of the respective grindstones are stored in memory.
(2) Difference L1 between the grinding position of one wheel head and the grinding wheel correction position
= C-N1, the difference between the grinding position of the other wheel head and the grinding wheel correction position R1 = C '-(M1-N1) C = L1 + N1 C' = R1 + (M1-N1) where C, C '= from the virtual center of the machine The distance to each grinding wheel grinding surface at the grinding wheel correction position is calculated and stored. (3) To change the grinding position to the machining size M2 of another workpiece and the deviation N2 from the virtual center of the machine to the grinding surface of one grindstone, the program setting is changed to M1 → M2, N1 → N2. The difference L2, R2 between the grindstone correction position and the grindstone position between the grinding position is L2 = C-N2 R2 = C '-(M2-N2) The double-sided grinder is characterized by setting the grinding position. Setting method of grinding position in.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32369091A JP3295114B2 (en) | 1991-11-12 | 1991-11-12 | How to set the position of the wheel head in a double-head grinding machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32369091A JP3295114B2 (en) | 1991-11-12 | 1991-11-12 | How to set the position of the wheel head in a double-head grinding machine |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05138517A true JPH05138517A (en) | 1993-06-01 |
JP3295114B2 JP3295114B2 (en) | 2002-06-24 |
Family
ID=18157512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32369091A Expired - Lifetime JP3295114B2 (en) | 1991-11-12 | 1991-11-12 | How to set the position of the wheel head in a double-head grinding machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3295114B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001334446A (en) * | 2000-05-30 | 2001-12-04 | Komatsu Electronic Metals Co Ltd | Manufacturing method and device for silicon wafer |
-
1991
- 1991-11-12 JP JP32369091A patent/JP3295114B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001334446A (en) * | 2000-05-30 | 2001-12-04 | Komatsu Electronic Metals Co Ltd | Manufacturing method and device for silicon wafer |
Also Published As
Publication number | Publication date |
---|---|
JP3295114B2 (en) | 2002-06-24 |
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