JPH05136540A - Mounting board - Google Patents

Abstract

PURPOSE:To actualize the arranging method of board inspecting holes making the increase in the part mounting density and the improvement of board inspection feasibility in a printed circuit board. CONSTITUTION:Two different kinds of board 13, 14 are arranged on a combined board 12 while a dummy board 15 is fitted to the peripheral part. After mounting parts, board inspecting holes 16 of perforations for dividing respective board 13, 14 are made around these boards 13, 14. Besides, the insides of these board inspecting holes 16 are copper-plated to be connected to an arbitrary pattern 18. The board inspecting lands and board separating holes are held in common to be the holes 16 thereby enabling the part mounting density to be increased. Furthermore, within the combined board 12 arranged with multiple board 13, 14, the holes 16 are held in common thereby enabling not only the unit board inspection but also respective board inspection in connected state to be made feasible.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting board.

[0002]

2. Description of the Related Art Conventionally, the mounting board shown in FIG. 3 has been the mainstream. Hereinafter, this will be described with reference to FIG.

As shown in the figure, the assembled substrate 1 includes a substrate 2, a substrate 3,
The board 4, the board 5, and the discarded board 6 are provided. Inside the boards 2, 3, 4, and 5, a component 7 and a board inspection land 9 are arranged, respectively. In addition, each substrate 2,
A groove 8 for separating the substrates is provided between the substrates in order to separate the substrates except for a part where the 3, 4, and 5 are connected to each other.

When performing a board inspection, the boards 2, 3, 4, 5
The board inspection machine 10 according to the position of the board inspection land 9 in
The contact probe 11 mounted on the board descends and comes into contact with the board inspection lands 9 of the boards 2, 3, 4, and 5 set in the board inspection machine 10, and the inspection signal is sent to perform the inspection.

[0005]

In the conventional board inspection land 9, it is necessary to provide the board inspection land 9 in the boards 2, 3, 4, and 5, so that a limited board area is used as the board inspection land 9. This is an obstacle to high-density component mounting. Further, since the substrates 2, 3, 4, and 5 in the assembled substrate 1 are not electrically connected to each other, the substrates can be inspected only by the individual substrates. This means that substrates 2, 3,
This means that it is necessary to electrically connect the substrates 2, 3, 4, 5 in order to perform the inspection in a state where the substrates 4, 5 are finally used, which is a problem of improving the efficiency of the substrate inspection. Was there.

The present invention solves the above-mentioned problems, and not only enables effective use of a limited area on a substrate to improve the component mounting density, but also makes it possible to perform inspections in a state where the substrate is finally used. The present invention provides a board inspection land that enables adjustment to be performed efficiently on an assembled board.

[0007]

A perforated board separating hole necessary for separating each board in an assembled board and a board inspection land are combined, and an arbitrary pattern is formed on the board. The structure is such that it is connected to the inspection land.

[0008]

With the above-described structure, the present invention effectively utilizes the limited area on the board to improve the component mounting density, and also enables inspection and adjustment in the final use state of the board. It can be efficiently performed on the assembled substrate.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIG.
A description will be given with reference to (a), (b) and FIG.

As shown in the figure, reference numeral 12 is an assembled board before mounting, and the assembled board 12 is composed of boards 13 and 14 of different types. Around the assembly board 12, a waste board 15 necessary when the assembly board 12 is mounted by a mounting machine.
Is attached. In order to separate the boards 13 and 14 after the components are mounted on the assembled board 12, board inspection holes 16 are formed around each board at a perforated pitch, and the end faces of the board inspection holes 16 are chamfered. ing. Further, the periphery and the inner surface of the end face portion of the substrate inspection hole 16 are plated with copper 17 and are connected to an arbitrary pattern 18 from a plurality of substrates 13 and 14, and the substrate inspection hole is used for separating the substrates at the same time. Has become a hole.

During the board inspection, the contact probes 11 descend and come into contact with the board inspecting holes 16 to inspect the boards 13 and 14, so that the contact between the board inspecting holes 16 and the contact probe 11 is as described above. The end surface of the board inspection hole 16 is chamfered in order to improve the property. Further, since the board inspection hole 16 also serves as a board separation hole at the same time, when the board 13 and the board 14 are separated, the copper plating 17 applied to the board inspection hole 16 peels off and contacts the adjacent board inspection hole 16. In order to prevent this, the shape of the board inspection hole is as shown in the figure.

[0012]

As described above, the board separating land and the board inspecting land are shared to form the board inspecting hole 16, so that the board inspecting lands inside the board can be reduced and high density component mounting can be realized. Further, since the board inspection holes are provided at the board ends, it becomes possible to electrically connect the arbitrary patterns 18 of the boards 13 and 14 in the assembled board 12, and the board 13 and 14 are finally used. Thus, inspection and adjustment can be efficiently performed on the assembled substrate 12.

[Brief description of drawings]

FIG. 1 is a perspective view of an assembled board using a board inspection hole of the present invention.

FIG. 2 is a sectional view of the board inspection hole of the present invention.

FIG. 3 is a perspective view of a conventional assembly board and board inspection machine.

[Explanation of symbols]

 1 Conventional Assembly Board 2 Conventional Board A 3 Conventional Board B 4 Conventional Board C 5 Conventional Board C 6 Conventional Discarded Board 7 Parts 8 Board Separation Groove 9 Conventional Board Inspecting Land 10 Board Inspector 11 Contact Probe 12 Assembly board using the board inspection hole of the present invention 13 Board A using the board inspection hole of the present invention 14 Board B using the board inspection hole of the present invention 15 Discarded board using the board inspection hole of the present invention 16 Board inspection hole of the present invention 17 Copper plated portion 18 Arbitrary pattern

Claims (2)

[Claims] 1. A mounting board for high-density mounting, wherein a board inspection land on the board is shared with a board separating hole of an assembled board. 2. A means for enabling board inspection in a state where a plurality of boards are connected without separating each board from the board by connecting an arbitrary pattern of each board to a board separation hole on the board. Featured mounting board.