JPH0513512A - Carrier tape - Google Patents

Abstract

PURPOSE:To provide a carrier tape which can be positioned with high accuracy in a semiconductor assembling process. CONSTITUTION:This carrier tape 1 is made of a flexible insulating material and leads 7 formed on the surface of the tape 1 are joined with a semiconductor element. The tape 1 uses at least one of perforated holes 2 as a positioning hole and, for example, a circular hole 40 and long circular hole 41 are used as the positioning hole.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a carrier tape in which semiconductor elements are joined and resin-sealed.

[0002]

2. Description of the Related Art In recent years, TAB (Tape Autemated Bonding) using a tape carrier has been used in place of the wire bonding method which has been widely used in the past as an electrode bonding technology for integrated circuit elements (hereinafter referred to as "IC") The law has been adopted.

FIGS. 4A and 4B are a plan view and a side sectional view showing a tape carrier used in this type of TAB method.
In the figure, 1 is a film-shaped carrier tape,
The entire structure is made of a flexible insulating material such as polyimide resin. Perforation holes 2 are provided on both side edges of the carrier tape 1 at predetermined intervals in the longitudinal direction of the main body 1a, and a center device hole 4 facing the semiconductor element 3 is provided in the center portion in the width direction. Also,
Around the center device hole 4, there are provided a plurality of outer lead holes 6 that are connected to each other via a bridge portion 5. Between the outer lead hole 6 and the center device hole 4, for example, copper is provided. A lead support portion 9 for holding the lead 7 made of a conductive metal material such as is provided. Further, the lead 7 has an inner lead portion 7a whose tip faces the device hole 4 and is joined to the bump 8 of the semiconductor element 3 by thermocompression bonding, and one of the outer lead hole 6 which is continuously provided to the inner lead portion 7a. It is composed of an outer lead portion 7b that covers the portion and a test pad portion 7c that is connected to the outer lead portion 7b and is joined to the tape body 1a.

Next, the manufacturing process will be described. First,
The bumps 8 formed on the semiconductor element 3 and the inner lead portions 7a formed on the carrier tape 1 by photolithography.
Align with. At this time, there is always a one-to-one correspondence between the bumps 8 and the inner lead portions 7a. Then, a heated bonding tool (not shown) is applied to the bumps 8
The bump 8 and the inner lead portion 7a are thermocompression bonded by lowering the bump 8 and the inner lead portion 7a. Next, the carrier tape 1 to which the semiconductor element 3 is bonded is molded with a sealing resin. As the resin sealing step, there are various means such as a potting method using a liquid resin, a method using a semi-curable resin, and a transfer molding method for sealing a mold. Further, the sealing shape may be one that covers the entire semiconductor element 3 or one that covers only the upper surface thereof. Next, the sealed semiconductor element is cut by the outer lead portion 7b of the carrier tape 1 and bonded to a substrate (resin substrate, ceramic substrate, etc.) by a thermocompression bonding method or a reflow method. Through the above steps, the perforation hole 2 is used as a positioning means and a feeding means of the carrier tape 1 during the work (especially during the resin sealing step and the outer lead bonding step).

[0005]

In the above-mentioned conventional apparatus, all the perforation holes 2 which serve as a reference for positioning in the assembly process are square holes, and it is difficult to perform accurate positioning with these square holes.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a carrier tape which enables accurate positioning in the assembly process of a semiconductor device.

[0007]

In the carrier tape according to the present invention, at least one of the perforation holes is used as a positioning hole, and the positioning hole is used as a positioning hole.
It is characterized by using round holes and oblong holes.

[0008]

According to the carrier tape of the present invention, since at least one of the perforation holes is used as a positioning hole, highly accurate positioning can be performed in the assembly process, and a semiconductor device having high reliability and high yield can be manufactured. be able to.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. In the figure, reference numeral 1 denotes a film-shaped carrier tape, which is entirely made of an insulating material such as a flexible polyimide resin. Perforation holes 2 are provided on both side edges of the carrier tape 1 at predetermined intervals in the longitudinal direction of the main body 1a. 6 is an outer lead hole, 7 is a lead made of a conductive metal material such as copper,
Reference numeral 7c indicates a test pad portion. Reference numeral 40 denotes a positioning circular hole provided on one side of the perforation hole 2, which enables accurate positioning in the resin sealing process or the outer lead bonding process. In the present embodiment, the reason why the round hole is used is that the positioning of the round hole enables the positioning with higher accuracy than the positioning using the square hole.

In the above embodiment, only the round holes are used as the positioning holes, but as shown in FIG. 2, the positioning round holes are used.
A positioning oval hole 41 may be provided as an aid to 40. The oval holes 41 for positioning play a role of absorbing the elongation of the carrier tape 1 due to the rise of the mold temperature in the molding process. Further, as shown in FIG. 3, one positioning round hole 40 is provided, and positioning oval holes 41 are provided at both ends thereof.

[0011]

As described above, according to the present invention, since at least one positioning hole is provided in the perforation hole of the carrier tape, highly accurate positioning can be performed in the assembly process such as resin sealing and outer lead bonding. There is a possible effect.

[Brief description of drawings]

FIG. 1 is a plan view showing a carrier tape according to an embodiment of the present invention.

FIG. 2 is a plan view showing a carrier tape according to another embodiment of the present invention.

FIG. 3 is a plan view showing a carrier tape according to another embodiment of the present invention.

FIG. 4 is a plan view and a side sectional view showing a conventional tape carrier.

[Explanation of symbols]

1 carrier tape 2 perforation holes 3 Semiconductor element 5 bridge 6 Outer lead hole 7 leads 7c Test pad section 40 Positioning round hole 41 oblong hole for positioning

Claims (3)

[Claims] 1. A carrier tape which is made of a flexible insulating material and has leads formed on the surface thereof and joined to a semiconductor element, wherein at least one of the perforation holes is a positioning hole. And carrier tape. 2. The carrier tape according to claim 1, wherein the positioning hole is a round hole. 3. The carrier tape according to claim 1, wherein two types of holes, a round hole and an oblong hole, are used as the positioning holes.