JPH05132363A - Zirconium boride sintered compact, its production, circuit base and its production - Google Patents

Zirconium boride sintered compact, its production, circuit base and its production

Info

Publication number
JPH05132363A
JPH05132363A JP3322474A JP32247491A JPH05132363A JP H05132363 A JPH05132363 A JP H05132363A JP 3322474 A JP3322474 A JP 3322474A JP 32247491 A JP32247491 A JP 32247491A JP H05132363 A JPH05132363 A JP H05132363A
Authority
JP
Japan
Prior art keywords
zirconium boride
sintered body
group
metal
periodic table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3322474A
Other languages
Japanese (ja)
Inventor
Michio Horiuchi
道夫 堀内
Koichiro Hayashi
浩一郎 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP3322474A priority Critical patent/JPH05132363A/en
Publication of JPH05132363A publication Critical patent/JPH05132363A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To produce a ZrB2 sintered compact excellent in denseness and electrical characteristics by making one or more kinds of periodic table VIII group metals and Mn exist in a sintered material composed mainly of ZrB2. CONSTITUTION:With powdery ZrB2, one or more kinds of powdery metals and powdery metal compounds selected from periodic table VIII group metals such as Ni, Co and Fe, Mn and compounds thereof are admixed in an amount of >=0.01wt.% on metal base. The resultant mixture is sintered in a highly reduced-pressure atmosphere of 10-10<-4>Torr or in an atmosphere of periodic table 0 group inert gas such as Ar at 1500-2000 deg.C to obtain a sintered compact composed mainly of ZrB2, excellent in high denseness and showing a low electric resistance. A circuit base is obtained by applying a paste of the above-mentioned mixture to a circuit-forming part of an uncalcined ceramic base, heat treating the base in the air at <=500 deg.C for removing, e.g. an organic binder contained in the base and the paste and subsequently calcining it in the same manner as in the above-mentioned method.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はホウ化ジルコニウム焼結
体及びその製造方法並びに回路基板及びその製造法に関
し、更に詳細には電子部品材料として用いられるホウ化
ジルコニウム焼結体及びその製造方法並びに回路基板及
びその製造法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a zirconium boride sintered body and a method for producing the same, a circuit board and a method for producing the same, and more specifically, a zirconium boride sintered body used as a material for electronic parts and a method for producing the same. The present invention relates to a circuit board and a manufacturing method thereof.

【0002】[0002]

【従来の技術】ホウ化ジルコニウム(ZrB2)は、銅と同程
度の低電気抵抗値と優れた耐熱性とを有するため、回路
基板等の電子部品材料として注目されている。特に、蒸
着法又はスパッタ法によって形成されるホウ化ジルコニ
ウムから成る薄膜導体は、良好な緻密性と低電気抵抗値
とを呈するため、LSI等の回路材としての応用が期待
されている。一方、セラミック基板に銅等の良導電性金
属から成る厚膜導体である焼結体によって回路が形成さ
れた回路基板等の分野においても、回路を形成する導電
性金属焼結体の焼成とセラミック基板の焼成とを同時に
行う同時焼成法によって回路基板を製造すべく、耐熱性
を有する導電性焼結体が要請されている。このため、耐
熱性を有するホウ化ジルコニウムから成る焼結体によっ
て、回路基板等の回路を形成することが考えられる。
2. Description of the Related Art Zirconium boride (ZrB 2 ) has attracted attention as a material for electronic parts such as circuit boards because it has a low electric resistance value comparable to that of copper and excellent heat resistance. In particular, a thin film conductor made of zirconium boride formed by a vapor deposition method or a sputtering method exhibits good compactness and a low electric resistance value, and thus is expected to be applied as a circuit material such as an LSI. On the other hand, in the field of a circuit board in which a circuit is formed by a sintered body, which is a thick film conductor made of a good conductive metal such as copper, on a ceramic substrate, firing of a conductive metal sintered body for forming a circuit and ceramics In order to manufacture a circuit board by a co-firing method in which the board is fired at the same time, a heat-resistant conductive sintered body is required. Therefore, it is conceivable to form a circuit such as a circuit board with a sintered body made of zirconium boride having heat resistance.

【0003】[0003]

【発明が解決しようとする課題】ホウ化ジルコニウム
は、銅の溶融温度よりも高温で焼成される酸化アルミニ
ウム等のセラミック基板の焼成温度においても溶融する
ことがなく耐熱性に優れているため、高温度焼成セラミ
ック基板との同時焼成による回路基板の回路形成用に使
用可能である。しかしながら、セラミック基板の通常の
焼成条件、例えば窒素雰囲気下で高温焼成すると、得ら
れるホウ化ジルコニウム焼結体は低密度で且つ電気抵抗
値が極めて高いものとなる。このため、高温焼成セラミ
ック基板に回路を同時焼成によって形成する場合には、
従来、ホウ化ジルコニウムは用いられていなかった。こ
の点、本発明者は、優れた耐熱性と電気特性とを有する
ホウ化ジルコニウムを、その有する特性を可及的に劣化
させることなく焼成できれば、良好な電気特性と緻密性
とを呈する回路をセラミック基板と同時焼成によって得
ることができるものと考えた。そこで、本発明の目的
は、良好な緻密性と電気特性とを呈し得るホウ化ジルコ
ニウム焼結体及びその製造方法の提供、及び前記焼結体
によって回路が形成された回路基板及びその製造法の提
供にある。
Since zirconium boride does not melt even at the firing temperature of a ceramic substrate such as aluminum oxide which is fired at a temperature higher than the melting temperature of copper, it has excellent heat resistance. It can be used for circuit formation of a circuit board by co-firing with a temperature-fired ceramic substrate. However, when the ceramic substrate is fired under a usual firing condition, for example, in a nitrogen atmosphere at a high temperature, the obtained zirconium boride sintered body has a low density and an extremely high electric resistance value. Therefore, when a circuit is formed on a high-temperature fired ceramic substrate by co-firing,
Conventionally, zirconium boride has not been used. In this respect, the present inventor has found that a circuit exhibiting good electric characteristics and compactness can be obtained if zirconium boride having excellent heat resistance and electric characteristics can be fired without deteriorating the characteristics of the zirconium boride. We thought that it could be obtained by co-firing with a ceramic substrate. Therefore, an object of the present invention is to provide a zirconium boride sintered body capable of exhibiting good compactness and electrical characteristics, a method for producing the same, and a circuit board having a circuit formed by the sintered body and a method for producing the same. In offer.

【0004】[0004]

【課題を解決するための手段】本発明者は、前記目的を
達成すべく検討を重ねた結果、ホウ化ジルコニウムの粉
末中にニッケル(Ni)又はコバルト(Co)を添加混
合し、アルゴンガス雰囲気中で焼成したところ、緻密性
が良好で且つ低電気抵抗値の焼結体を得ることができる
ことを見出し、本発明に到達した。即ち、本発明は、ホ
ウ化ジルコニウム(ZrB2)を主成分とする焼結体に、周期
律表第8族に属する金属及びマンガンから成る群より選
ばれた一種又は二種以上の金属が含有されていることを
特徴とするホウ化ジルコニウム焼結体、及びホウ化ジル
コニウム(ZrB2)を主成分とする粉末に、周期律表第8族
に属する金属及びマンガン、及びその金属化合物から成
る群より選ばれた一種又は二種以上の金属及び/又は金
属化合物を添加混合し、高減圧雰囲気中又は周期律表第
0族に属する不活性ガス雰囲気中で焼成することを特徴
とするホウ化ジルコニウム焼結体の製造方法にある。
As a result of repeated studies to achieve the above object, the present inventor has added nickel (Ni) or cobalt (Co) to the powder of zirconium boride and mixed it in an argon gas atmosphere. The inventors have found that a sintered body having good compactness and a low electric resistance value can be obtained by firing in the inside, and thus reached the present invention. That is, according to the present invention, a sintered body containing zirconium boride (ZrB 2 ) as a main component contains one or more metals selected from the group consisting of metals belonging to Group 8 of the periodic table and manganese. A group consisting of a zirconium boride sintered body, a powder containing zirconium boride (ZrB 2 ) as a main component, a metal and manganese belonging to Group 8 of the periodic table, and a metal compound thereof. Zirconium boride, characterized in that one or more metals and / or metal compounds selected from the above are added and mixed, and the mixture is fired in a highly depressurized atmosphere or in an inert gas atmosphere belonging to Group 0 of the periodic table. There is a method for manufacturing a sintered body.

【0005】また、本発明は、セラミック基板に設けら
れた回路が、周期律表第8族に属する金属及びマンガン
から成る群より選ばれた一種又は二種以上の金属が含有
されたホウ化ジルコニウム(ZrB2)を主成分とする焼結体
によって形成されていることを特徴とする回路基板であ
る。更に、ホウ化ジルコニウム(ZrB2)を主成分とする粉
末に、周期律表第8族に属する金属及びマンガン、及び
その金属化合物から成る群より選ばれた一種又は二種以
上の金属及び/又は金属化合物を添加混合して得られた
ペーストを未焼成セラミック基板の回路形成部分に塗布
し、次いで、前記未焼成セラミック基板を500℃以下
の温度に加熱された大気中で加熱処理して前記未焼成セ
ラミック基板及びペースト中に含有された有機バインダ
ー等を除去した後、1500〜2000℃の温度に加熱
された高減圧雰囲気中又は周期律表第0族に属する不活
性ガス雰囲気中で焼成することを特徴とする回路基板の
製造法でもある。
Further, according to the present invention, the circuit provided on the ceramic substrate contains zirconium boride containing one or more metals selected from the group consisting of metals belonging to Group 8 of the periodic table and manganese. The circuit board is characterized by being formed of a sintered body containing (ZrB 2 ) as a main component. Further, a powder containing zirconium boride (ZrB 2 ) as a main component, a metal belonging to Group 8 of the periodic table and manganese, and one or more metals selected from the group consisting of metal compounds and / or The paste obtained by adding and mixing the metal compound is applied to the circuit forming portion of the unsintered ceramic substrate, and then the unsintered ceramic substrate is heat-treated in the atmosphere heated to a temperature of 500 ° C. or lower to obtain the unsintered product. After removing the fired ceramic substrate and the organic binder contained in the paste, fired in a highly decompressed atmosphere heated to a temperature of 1500 to 2000 ° C. or in an inert gas atmosphere belonging to Group 0 of the periodic table. It is also a method for manufacturing a circuit board.

【0006】かかる本発明において、周期律表第8族に
属する金属がニッケル、コバルト、鉄であること、或い
は焼結体に含有される金属の含有量又はホウ化ジルコニ
ウムの粉末に含有又は添加混合される金属の添加量が焼
結体又は粉末に対して0.01重量%以上であること
が、焼結体の緻密性及び電気抵抗値を更に一層良好とす
ることができる。また、ホウ化ジルコニウムの粉末の焼
成を10〜10-4Torrの高減圧雰囲気中又はアルゴンガ
ス雰囲気中で1500〜2000℃の焼成温度において
行うこと、ホウ化ジルコニウム(ZrB2)の粉末として、平
均粒径2μm以下、含有酸素量1.5重量%以下、及び
含有窒素量0.5重量%以下のものを使用することによ
って、容易に緻密性が良好で且つ低電気抵抗値の焼結体
を得ることができる。
In the present invention, the metal belonging to Group 8 of the Periodic Table is nickel, cobalt, iron, or the content of the metal contained in the sintered body or the powder contained in zirconium boride or added and mixed. When the added amount of the metal to be added is 0.01% by weight or more with respect to the sintered body or powder, the denseness and the electric resistance value of the sintered body can be further improved. In addition, firing of zirconium boride powder is performed at a firing temperature of 1500 to 2000 ° C. in a high-reduced pressure atmosphere of 10 to 10 −4 Torr or an argon gas atmosphere, and as an average of zirconium boride (ZrB 2 ) powder, By using a powder having a particle size of 2 μm or less, an oxygen content of 1.5% by weight or less, and a nitrogen content of 0.5% by weight or less, it is possible to easily obtain a sintered body having good compactness and a low electric resistance value. Obtainable.

【0007】[0007]

【作用】ホウ化ジルコニウムの粉末の焼成を、従来の高
温焼成セラミック基板の焼成雰囲気と同様に窒素雰囲気
中で行うと、得られる焼結体は低密度で且つ高電気抵抗
のものとなる。この焼結体のX線回折パターンを調査す
ると、ホウ化ジルコニウム特有の回折パターンが殆ど見
られず、窒化ジルコニウム(ZrN) の回折パターンが見ら
れた。この知見から、ホウ化ジルコニウムは窒素雰囲気
中での高温焼成において下記の反応によって窒化される
ためと推察される。 2ZrB2+3N2→2ZrN +4BN この点、本発明においては、ホウ化ジルコニウムの粉末
の焼成を高減圧雰囲気中又は周期律表第0族に属する不
活性ガス雰囲気中で行い且つ周期律表第8族に属する金
属及びマンガン、及びその化合物を焼成助剤として使用
することによって、ホウ化ジルコニウムの窒化を防止す
ると共に、ホウ化ジルコニウムの特性を可及的に維持し
て焼成できる結果、緻密性が良好で且つ低電気抵抗値の
ホウ化ジルコニウム焼結体を得ることができるのであ
る。この様な緻密性が良好で且つ低電気抵抗値の焼結体
は、回路基板の回路に好適に適用することができ、かか
る回路基板を製造する際に、ホウ化ジルコニウムの良好
な耐熱性を利用して、高温焼成前に、未焼成セラミック
基板等に含有されている有機バインダー等を除去する低
温加熱を大気中で充分に施すことができるため、回路を
形成する焼結体の剥離や拡散を防止できる。
When the powder of zirconium boride is fired in the nitrogen atmosphere like the firing atmosphere of the conventional high temperature fired ceramic substrate, the obtained sintered body has low density and high electric resistance. When the X-ray diffraction pattern of this sintered body was investigated, the diffraction pattern peculiar to zirconium boride was hardly seen, but the diffraction pattern of zirconium nitride (ZrN) was seen. From this finding, it is speculated that zirconium boride is nitrided by the following reaction in high temperature firing in a nitrogen atmosphere. 2ZrB 2 + 3N 2 → 2ZrN + 4BN In this respect, in the present invention, the firing of the zirconium boride powder is performed in a highly decompressed atmosphere or in an inert gas atmosphere belonging to Group 0 of the Periodic Table and in Group 8 of the Periodic Table. By using a metal and manganese belonging to the category III, and a compound thereof as a firing aid, it is possible to prevent nitriding of zirconium boride and perform firing while maintaining the characteristics of zirconium boride as much as possible, resulting in good compactness. Thus, a zirconium boride sintered body having a low electric resistance value can be obtained. Such a sintered compact having a good compactness and a low electric resistance value can be suitably applied to a circuit of a circuit board, and when manufacturing such a circuit board, the good heat resistance of zirconium boride can be obtained. By utilizing this, it is possible to sufficiently perform low-temperature heating in the atmosphere to remove the organic binder and the like contained in the unfired ceramic substrate before high-temperature firing, so peeling or diffusion of the sintered body that forms the circuit Can be prevented.

【0008】[0008]

【発明の構成】本発明のホウ化ジルコニウム焼結体に
は、周期律表第8族に属する金属及びマンガンから成る
群より選ばれた一種又は二種以上の金属が含有されてい
ることが肝要である。かかる金属が非含有のホウ化ジル
コニウム焼結体は、低密度で且つ電気抵抗値が高いもの
となる。ここで、周期律表第8族に属する金属として
は、ニッケル、コバルト、鉄が好ましく、特にニッケ
ル、コバルトを好ましく使用できる。この様な金属の焼
結体中の含有量は、0.01重量%以上が好ましい。金
属含有量が0.01重量%未満であると、焼結体の緻密
性及び電気抵抗値が悪化し易い傾向がある。尚、ホウ化
ジルコニウム中に余りに多量の金属を含有させると、焼
結体の特性がホウ化ジルコニウムの特性を喪失する傾向
にあるため、金属含有量の上限は20重量%、特に10
重量%とすることが好ましい。
It is important that the zirconium boride sintered body of the present invention contains one or more metals selected from the group consisting of metals belonging to Group 8 of the periodic table and manganese. Is. Such a metal-free zirconium boride sintered body has a low density and a high electric resistance value. Here, as the metal belonging to Group 8 of the periodic table, nickel, cobalt and iron are preferable, and nickel and cobalt can be particularly preferably used. The content of such a metal in the sintered body is preferably 0.01% by weight or more. When the metal content is less than 0.01% by weight, the compactness and electric resistance of the sintered body tend to be deteriorated. If the zirconium boride contains an excessively large amount of metal, the characteristics of the sintered body tend to lose the characteristics of zirconium boride. Therefore, the upper limit of the metal content is 20% by weight, particularly 10% by weight.
It is preferably set to wt%.

【0009】この様な本発明の焼結体は、ホウ化ジルコ
ニウムを主成分とする粉末に、周期律表第8族に属する
金属及びマンガン、及びその金属化合物から成る群より
選ばれた一種又は二種以上の金属及び/又は金属化合物
を添加混合し、高減圧雰囲気中又は周期律表第0族に属
する不活性ガス雰囲気中で焼成することによって得るこ
とができる。かかる本発明において、焼成に供するホウ
化ジルコニウムの粉末として、平均粒径2μm以下、含
有酸素量1.5重量%以下、及び含有窒素量0.5重量
%以下のものを使用することが、得られる焼結体の緻密
性及び電気抵抗値を良好にできる。また、ホウ化ジルコ
ニウムの粉末に添加する金属としては、ニッケル、コバ
ルト、鉄が好ましく、金属化合物としては、Ni2O3 、Ni
O 、CoO 、Co2O3 、Fe2O3、MnO2、NiFe2O4 等の酸化
物、Ni(OH)2 等の水酸化物、NiF2等のフッ化物、NiB等
のホウ素化物、Fe4N等の窒化物を具体的に挙げられる。
尚、周期律表第8族に属する金属又はマンガンの硝酸塩
も使用することができるが、含水性、潮解性を有するも
のは取扱や保管が困難となる。
Such a sintered body of the present invention is a powder containing zirconium boride as a main component, and one or more selected from the group consisting of metals and manganese belonging to Group 8 of the periodic table and metal compounds thereof. It can be obtained by adding and mixing two or more kinds of metals and / or metal compounds and firing in an atmosphere of high reduced pressure or an atmosphere of an inert gas belonging to Group 0 of the periodic table. In the present invention, it is advantageous to use a zirconium boride powder having an average particle size of 2 μm or less, an oxygen content of 1.5% by weight or less, and a nitrogen content of 0.5% by weight or less. It is possible to improve the compactness and electric resistance of the obtained sintered body. The metal added to the zirconium boride powder is preferably nickel, cobalt or iron, and the metal compound is Ni 2 O 3 or Ni.
O, CoO, Co 2 O 3 , Fe 2 O 3 , MnO 2 , oxides such as NiFe 2 O 4 , hydroxides such as Ni (OH) 2 , fluorides such as NiF 2 , borides such as NiB, Specific examples include nitrides such as Fe 4 N.
Although nitrates of metals or manganese belonging to Group 8 of the periodic table can be used, those having water content and deliquescent are difficult to handle and store.

【0010】この様な金属及び/又は金属化合物の添加
量は、ホウ化ジルコニウムを主成分とする粉末に対し金
属換算で0.01重量%以上とすることによって、得ら
れる焼結体の緻密性及び電気抵抗値を更に良好にでき
る。また、金属及び/又は金属化合物をホウ化ジルコニ
ウムの粉末に余りにも多量に添加すると、得られる焼結
体がホウ化ジルコニウムの特性を喪失する傾向にあるた
め、金属及び/又は金属化合物の上限は金属換算で20
重量%、特に10重量%とすることが好ましい。
The addition amount of such a metal and / or metal compound is 0.01% by weight or more in terms of metal with respect to the powder containing zirconium boride as a main component, whereby the compactness of the obtained sintered body is improved. And the electric resistance value can be further improved. Further, when the metal and / or the metal compound is added to the zirconium boride powder in an excessively large amount, the obtained sintered body tends to lose the characteristics of the zirconium boride, and therefore the upper limit of the metal and / or the metal compound is set. 20 in terms of metal
It is preferable to set the content to be 10% by weight, especially 10% by weight.

【0011】かかる金属及び/又は金属化合物が添加混
合された粉末の焼成は、高減圧雰囲気中又は周期律表第
0族に属する不活性ガス雰囲気中で施される。この焼結
体の焼成を、10〜10-4Torrの高減圧雰囲気中又はア
ルゴンガス雰囲気中で1500〜2000℃の焼成温度
において行うことによって、容易に緻密性及び電気抵抗
値が良好な焼結体を得ることができる。得られた焼結体
は、光沢を有する白色〜黒色を呈する。尚、ホウ化ジル
コニウムの未焼結体の色相は、黒色或いは黒褐色であ
る。ここで、ホウ化ジルコニウムを主成分とする粉末の
焼成を、酸化雰囲気中又は窒素雰囲気中で行うと、ホウ
化ジルコニウムの酸化又は窒化が発生し、得られる焼結
体の緻密性及び電気抵抗値が共に悪化する。以上、述べ
てきた本発明の焼結体は、良好な緻密性、低電気抵抗
値、及び耐熱性を呈するため、セラミック回路基板の回
路形成材料として好適である。つまり、本発明の焼結体
を回路形成材料として使用することによって、高温焼成
セラミック基板との同時焼成で回路基板の回路を形成で
きるのである。
The firing of the powder to which the metal and / or the metal compound is added and mixed is performed in a high-reduced pressure atmosphere or an inert gas atmosphere belonging to Group 0 of the periodic table. By firing this sintered body in a high-reduced pressure atmosphere of 10 to 10 -4 Torr or in an argon gas atmosphere at a firing temperature of 1500 to 2000 ° C., it is possible to easily sinter with good density and good electric resistance. You can get a body. The obtained sintered body exhibits glossy white to black. The hue of the unsintered body of zirconium boride is black or blackish brown. Here, when the powder containing zirconium boride as a main component is fired in an oxidizing atmosphere or a nitrogen atmosphere, oxidation or nitridation of zirconium boride occurs, and the compactness and electric resistance value of the obtained sintered body are obtained. Both get worse. As described above, the sintered body of the present invention exhibits good compactness, low electric resistance value, and heat resistance, and thus is suitable as a circuit forming material for a ceramic circuit board. That is, by using the sintered body of the present invention as a circuit-forming material, a circuit of a circuit board can be formed by co-firing with a high-temperature firing ceramic substrate.

【0012】かかる焼結体を用いた回路基板は、ホウ化
ジルコニウムを主成分とする粉末に、周期律表第8族に
属する金属及びマンガン、及びその金属化合物から成る
群より選ばれた一種又は二種以上の金属及び/又は金属
化合物を添加混合して得られたペーストを未焼成セラミ
ック基板の回路形成部分に塗布し、次いで、前記未焼成
セラミック基板を500℃以下の温度に加熱された大気
中で加熱処理して前記未焼成セラミック基板及びペース
ト中に含有された有機バインダー等を除去した後、15
00〜2000℃の温度に加熱された高減圧雰囲気中又
は周期律表第0族に属する不活性ガス雰囲気中で焼成す
ることによって得ることができる。この様に、ホウ化ジ
ルコニウムは、大気中で500℃以下の温度で加熱され
ても、ホウ化ジルコニウムの酸化等は進行せず安定状態
が保たれる。このため、1500〜2000℃の高温焼
成を施す前に、未焼成セラミック基板やペースト中に含
有されていた有機溶剤や有機バインダー等を充分に除去
した後に高温焼成を施すため、得られる回路基板の回路
を形成する焼結体が剥離したり拡散したりすることを防
止できる。
A circuit board using such a sintered body is a powder containing zirconium boride as a main component, a metal selected from the group consisting of metals and manganese belonging to Group 8 of the periodic table, and metal compounds thereof, or Atmosphere heated by applying a paste obtained by adding and mixing two or more kinds of metals and / or metal compounds to the circuit forming portion of the unfired ceramic substrate, and then heating the unfired ceramic substrate to a temperature of 500 ° C. or lower. After heat treatment in which the organic binder contained in the unfired ceramic substrate and paste is removed, 15
It can be obtained by firing in a highly decompressed atmosphere heated to a temperature of 00 to 2000 ° C. or in an inert gas atmosphere belonging to Group 0 of the periodic table. As described above, zirconium boride maintains a stable state even when heated at a temperature of 500 ° C. or lower in the atmosphere without causing oxidation of zirconium boride and the like. Therefore, before the high temperature firing of 1500 to 2000 ° C., the organic solvent, the organic binder and the like contained in the unfired ceramic substrate and the paste are sufficiently removed, and then the high temperature firing is performed. It is possible to prevent the sintered body forming the circuit from peeling off or diffusing.

【0013】[0013]

【実施例】本発明を実施例によって更に一層詳細に説明
する。本実施例中において示す金属化合物の添加量は金
属換算値である。 実施例1 平均粒径約1.6μm、酸素含有量約1.3wt%、窒素
含有量0.1wt%以下のホウ化ジルコニウム(ZrB2)の粉
末に、第1表に示す金属又は金属化合物を所定量添加し
ドライミル混合して混合粉末とした後、一軸加圧プレス
機によって成形し径5mm×長さ20mmの円柱状成形
物とした。この円柱状成形物を1900℃に加熱された
1Kgf/cm2 のアルゴンガス雰囲気中で3時間の焼成
を行った。得られた焼結体の外径寸法及び重量を測定し
て焼結体の密度を求めると共に、四端子法によって焼結
体の電気抵抗値を求めて結果を表1に併記した。尚、金
属又は金属化合物をホウ化ジルコニウム粉末に添加混合
することなく焼成した場合、得られた焼結体の密度及び
電気抵抗値を比較例として表1に併記した。
EXAMPLES The present invention will be described in more detail with reference to Examples. The addition amount of the metal compound shown in this example is a metal conversion value. Example 1 Zirconium boride (ZrB 2 ) powder having an average particle size of about 1.6 μm, an oxygen content of about 1.3 wt% and a nitrogen content of 0.1 wt% or less was added with a metal or a metal compound shown in Table 1. After adding a predetermined amount and mixing with a dry mill to obtain a mixed powder, it was molded by a uniaxial press machine to obtain a cylindrical molded product having a diameter of 5 mm and a length of 20 mm. This cylindrical molded product was fired for 3 hours in a 1 Kgf / cm 2 argon gas atmosphere heated to 1900 ° C. The outer diameter dimension and the weight of the obtained sintered body were measured to determine the density of the sintered body, and the electrical resistance value of the sintered body was determined by the four-terminal method. The results are also shown in Table 1. When a metal or a metal compound was fired without adding and mixing it to the zirconium boride powder, the density and electric resistance of the obtained sintered body are also shown in Table 1 as a comparative example.

【0014】[0014]

【表1】 [Table 1]

【0015】N0.1〜13の焼結体の密度及び電気抵抗値
は、金属を添加することなく焼成した比較例の焼結体に
比較して、いずれも良好な値を示した。特に、添加金属
として金属ニッケル(Ni)又は金属コバルト(Co)
を添加した水準(NO.1 〜2 、NO.8〜9)の焼結体は、高密
度で且つ低電気抵抗値を呈するものであった。
The density and electric resistance of the sintered bodies of N0.1 to 13 were all good values as compared with the sintered bodies of the comparative examples which were fired without adding metal. In particular, metallic nickel (Ni) or metallic cobalt (Co) is used as the additive metal.
The sintered bodies of the levels (NO. 1 to 2, NO. 8 to 9) to which was added had a high density and a low electric resistance value.

【0016】実施例2 実施例1の表1のNO.3〜5 で添加したNiO を2 〜10wt%
添加し且つ焼成雰囲気を約5×104Torr の焼成高減圧
雰囲気とする他は、実施例1と同様の手順で焼成し焼結
体を得た。各水準のNiO の添加量及び得られた焼結体の
密度及び電気抵抗値を示した。
Example 2 2-10% by weight of NiO added in No. 3-5 of Table 1 of Example 1
A sintered body was obtained by firing in the same procedure as in Example 1 except that the firing atmosphere was set to a firing high-reduced pressure atmosphere of about 5 × 10 4 Torr. The amount of NiO added at each level and the density and electric resistance of the obtained sintered body are shown.

【0017】[0017]

【表2】 [Table 2]

【0018】表2に示す様に、焼成雰囲気を高減圧雰囲
気としても、得られた焼結体の特性はアルゴン雰囲気中
で焼成して得られた焼結体の特性と略同等であった。
尚、NiO を10wt%添加したNO.16 の焼結体は、銀白色
の光沢を呈するものであった。
As shown in Table 2, even if the firing atmosphere was a high decompression atmosphere, the characteristics of the obtained sintered body were substantially the same as the characteristics of the sintered body obtained by firing in an argon atmosphere.
The NO.16 sintered body containing 10% by weight of NiO exhibited a silver-white luster.

【0019】実施例3 表1のNO.6において、焼成温度を1800℃とした他
は、実施例1と同様にして焼結体を得た。得られた焼結
体の特性は、密度4.63g/cm3 、電気抵抗値8.8Ω
・cmであった。この値は、表1のNO.6に示す焼結体の特
性値とほぼ同じである。
Example 3 A sintered body was obtained in the same manner as in Example 1 except that the firing temperature was changed to 1800 ° C. in No. 6 of Table 1. The characteristics of the obtained sintered body are a density of 4.63 g / cm 3 and an electric resistance value of 8.8Ω.
・ It was cm. This value is almost the same as the characteristic value of the sintered body shown in No. 6 of Table 1.

【0020】比較例 実施例1において、ホウ化ジルコニウム粉末に対して1
wt%添加する金属化合物、及び焼成雰囲気を表3の如く
変更した他は、実施例1と同様に行った。得られた焼結
体の特性を表3に併記した。尚、ホウ化ジルコニウム粉
末を単独で窒素雰囲気中で焼成した他は、実施例1と同
様にして得られた焼結体の特性も表3に併せて示した。
Comparative Example In Example 1, 1 was used for the zirconium boride powder.
The same procedure as in Example 1 was performed except that the metal compound added by wt% and the firing atmosphere were changed as shown in Table 3. The characteristics of the obtained sintered body are also shown in Table 3. Table 3 also shows the characteristics of the sintered body obtained in the same manner as in Example 1 except that the zirconium boride powder was fired alone in a nitrogen atmosphere.

【0021】[0021]

【表3】 [Table 3]

【0022】表3に示す焼結体いずれも、表1及び表2
に示すN0.1〜16の焼結体の密度よりも低く且つ電気抵抗
値も高いものであった。表3に示す焼結体のうち、NO.1
7 〜20の窒素雰囲気中で焼成して得られた焼結体の各々
について、粉砕しX線回折パターンを調査したところ、
ホウ化ジルコニウム(ZrB2)特有の回折パターンが殆ど見
られず、窒化ジルコニウム(ZrN) の回折パターンが観察
された。このことから、窒素雰囲気中でホウ化ジルコニ
ウム粉末を焼成することによって、ホウ化ジルコニウム
が窒化されることが判る。また、表3のNO.21 〜23の水
準の焼結体は、NO.17 〜20の焼結体に比較して、密度が
高く且つ電気抵抗値も低下しているものの、表1及び表
2のNO.1〜16の焼結体の特性よりも劣るものである。
All the sintered bodies shown in Table 3 are shown in Table 1 and Table 2.
The density was lower than the density of the sintered body of N0.1 to 16 and the electric resistance value was high. NO.1 among the sintered bodies shown in Table 3
Each of the sintered bodies obtained by firing in a nitrogen atmosphere of 7 to 20 was crushed and the X-ray diffraction pattern was examined.
Almost no diffraction pattern peculiar to zirconium boride (ZrB 2 ) was seen, and a diffraction pattern of zirconium nitride (ZrN) was observed. From this, it is understood that the zirconium boride is nitrided by firing the zirconium boride powder in the nitrogen atmosphere. In addition, although the sintered bodies of the levels of No. 21 to 23 in Table 3 have higher density and lower electric resistance than those of the sintered bodies of No. 17 to 20, This is inferior to the characteristics of the No. 1 to No. 16 sintered bodies.

【0023】実施例4 実施例1において使用したホウ化ジルコニウム粉末に金
属ニッケル(Ni)を1wt%添加した混合粉末を、アク
リル系バインダー、ブチルカルビトールアセテート、及
びテレビネオールから成るビークルと混練しホウ化ジル
コニウムペーストとした。一方、純度99.7wt%のア
ルミナ焼結基板を用意し、このアルミナ焼結基板上の回
路形成部分にスクリーン印刷によってホウ化ジルコニウ
ムペーストを塗布した後、1850℃に加熱された1Kg
f/cm2 のアルゴンガス雰囲気中で3時間の焼成を行
った。アルミナ焼結基板上のホウ化ジルコニウムの焼結
体から成る回路部分は、灰白色を呈する緻密質であり、
ピンセットによるスクラッチテストにおいても焼結体の
剥離が見られなかった。また、拡散等に起因するシミ等
も見られなかった。
Example 4 A mixed powder prepared by adding 1 wt% of metallic nickel (Ni) to the zirconium boride powder used in Example 1 was kneaded with a vehicle composed of an acrylic binder, butyl carbitol acetate, and television neol. Zirconium boride paste was used. On the other hand, an alumina sintered substrate having a purity of 99.7 wt% was prepared, and zirconium boride paste was applied by screen printing to the circuit forming portion on the alumina sintered substrate, and then heated to 1850 ° C. for 1 kg.
Firing was performed for 3 hours in an argon gas atmosphere of f / cm 2 . The circuit portion composed of a sintered body of zirconium boride on an alumina sintered substrate is a dense substance that exhibits an off-white color,
No peeling of the sintered body was observed in the scratch test with tweezers. In addition, no stain or the like due to diffusion was observed.

【0024】実施例5 実施例4において使用したホウ化ジルコニウムペースト
を、アクリル系バインダーを含む窒化アルミニウムから
成るグリーンシート上の回路形成部分にスクリーン印刷
した。このグリーンシートを、先ず、380℃の大気炉
中で3時間加熱し、グリーンシート及びホウ化ジルコニ
ウムペーストに含まれている有機バインダーや溶剤を除
去する。次いで、有機バインダー等を除去したグリーン
シートを1850℃に加熱された1Kgf/cm2 のアル
ゴンガス雰囲気中で5時間の焼成を行った。得られたセ
ラミック回路基板上のホウ化ジルコニウム焼結体から成
る回路は、灰〜銀色を呈する緻密体であって、剥離や拡
散が見られなかった。
Example 5 The zirconium boride paste used in Example 4 was screen-printed on a circuit forming portion on a green sheet made of aluminum nitride containing an acrylic binder. This green sheet is first heated in an atmospheric furnace at 380 ° C. for 3 hours to remove the organic binder and solvent contained in the green sheet and zirconium boride paste. Then, the green sheet from which the organic binder and the like were removed was fired for 5 hours in an argon gas atmosphere of 1 Kgf / cm 2 heated to 1850 ° C. The obtained circuit made of the zirconium boride sintered body on the ceramic circuit board was a dense body showing a gray to silver color, and no peeling or diffusion was observed.

【0025】[0025]

【発明の効果】本発明によれば、高温焼成によって高密
度で且つ低電気抵抗の焼結体を得ることができるため、
本発明の焼結体は、回路基板等の回路形成材料等の電子
部品材料として好適に使用できる。
According to the present invention, since a sintered body having a high density and a low electric resistance can be obtained by high temperature firing,
The sintered body of the present invention can be suitably used as an electronic component material such as a circuit forming material for a circuit board or the like.

Claims (10)

【特許請求の範囲】[Claims] 【請求項1】 ホウ化ジルコニウム(ZrB2)を主成分とす
る焼結体に、周期律表第8族に属する金属及びマンガン
から成る群より選ばれた一種又は二種以上の金属が含有
されていることを特徴とするホウ化ジルコニウム焼結
体。
1. A sintered body containing zirconium boride (ZrB 2 ) as a main component contains one or more metals selected from the group consisting of metals belonging to Group 8 of the periodic table and manganese. A zirconium boride sintered body characterized in that
【請求項2】 周期律表第8族に属する金属がニッケ
ル、コバルト、鉄である請求項1記載のホウ化ジルコニ
ウム焼結体。
2. The zirconium boride sintered body according to claim 1, wherein the metal belonging to Group 8 of the periodic table is nickel, cobalt or iron.
【請求項3】 焼結体に含有される金属の含有量が焼結
体に対して0.01重量%以上である請求項1又は請求
項2記載のホウ化ジルコニウム焼結体。
3. The zirconium boride sintered body according to claim 1, wherein the content of the metal contained in the sintered body is 0.01% by weight or more based on the sintered body.
【請求項4】 ホウ化ジルコニウム(ZrB2)を主成分とす
る粉末に、周期律表第8族に属する金属及びマンガン、
及びその金属化合物から成る群より選ばれた一種又は二
種以上の金属及び/又は金属化合物を添加混合し、高減
圧雰囲気中又は周期律表第0族に属する不活性ガス雰囲
気中で焼成することを特徴とするホウ化ジルコニウム焼
結体の製造方法。
4. A powder containing zirconium boride (ZrB 2 ) as a main component, metal and manganese belonging to Group 8 of the periodic table,
And one or more metals and / or metal compounds selected from the group consisting of the metal compounds thereof, and mixed and fired in a highly decompressed atmosphere or in an inert gas atmosphere belonging to Group 0 of the periodic table. A method for producing a zirconium boride sintered body, comprising:
【請求項5】 周期律表第8族に属する金属がニッケ
ル、コバルト、鉄である請求項4記載のホウ化ジルコニ
ウム焼結体の製造方法。
5. The method for producing a zirconium boride sintered body according to claim 4, wherein the metal belonging to Group 8 of the periodic table is nickel, cobalt or iron.
【請求項6】 ホウ化ジルコニウム(ZrB2)を主成分とす
る粉末に添加混合する金属及び/又は金属化合物が前記
粉末に対して金属換算で0.01重量%以上である請求
項4又は請求項5記載のホウ化ジルコニウム焼結体の製
造方法。
6. The metal or metal compound to be added to and mixed with the powder containing zirconium boride (ZrB 2 ) as a main component is 0.01 wt% or more in terms of metal based on the powder. Item 6. A method for producing a zirconium boride sintered body according to Item 5.
【請求項7】 ホウ化ジルコニウムの粉末の焼成を10
〜10-4Torrの高減圧雰囲気中又はアルゴンガス雰囲気
中で1500〜2000℃の焼成温度において行う請求
項4記載のホウ化ジルコニウム焼結体の製造方法。
7. Zirconium boride powder firing 10 times
The method for producing a zirconium boride sintered body according to claim 4, which is carried out at a firing temperature of 1500 to 2000 ° C. in a highly reduced pressure atmosphere of −10 −4 Torr or an argon gas atmosphere.
【請求項8】 ホウ化ジルコニウム(ZrB2)の粉末が、平
均粒径2μm以下、含有酸素量1.5重量%以下、及び
含有窒素量0.5重量%以下である請求項4、請求項
6、又は請求項7記載のホウ化ジルコニウム焼結体の製
造方法。
8. The zirconium boride (ZrB 2 ) powder has an average particle size of 2 μm or less, an oxygen content of 1.5% by weight or less, and a nitrogen content of 0.5% by weight or less. 6. The method for producing a zirconium boride sintered body according to claim 6 or 7.
【請求項9】 セラミック基板に設けられた回路が、周
期律表第8族に属する金属及びマンガンから成る群より
選ばれた一種又は二種以上の金属が含有されたホウ化ジ
ルコニウム(ZrB2)を主成分とする焼結体によって形成さ
れていることを特徴とする回路基板。
9. A circuit provided on a ceramic substrate contains zirconium boride (ZrB 2 ) containing one or more metals selected from the group consisting of metals belonging to Group 8 of the periodic table and manganese. A circuit board formed of a sintered body containing as a main component.
【請求項10】 ホウ化ジルコニウム(ZrB2)を主成分と
する粉末に、周期律表第8族に属する金属及びマンガ
ン、及びその金属化合物から成る群より選ばれた一種又
は二種以上の金属及び/又は金属化合物を添加混合して
得られたペーストを未焼成セラミック基板の回路形成部
分に塗布し、 次いで、前記未焼成セラミック基板を500℃以下の温
度に加熱された大気中で加熱処理して前記未焼成セラミ
ック基板及びペースト中に含有された有機バインダー等
を除去した後、1500〜2000℃の温度に加熱され
た高減圧雰囲気中又は周期律表第0族に属する不活性ガ
ス雰囲気中で焼成することを特徴とする回路基板の製造
法。
10. A powder containing zirconium boride (ZrB 2 ) as a main component and one or more metals selected from the group consisting of metals belonging to Group 8 of the periodic table and manganese, and metal compounds thereof. And / or a paste obtained by adding and mixing a metal compound is applied to the circuit forming portion of the unfired ceramic substrate, and then the unfired ceramic substrate is heat-treated in the atmosphere heated to a temperature of 500 ° C. or lower. After removing the organic binder and the like contained in the unfired ceramic substrate and paste, in a high depressurized atmosphere heated to a temperature of 1500 to 2000 ° C. or in an inert gas atmosphere belonging to Group 0 of the periodic table. A method for manufacturing a circuit board, which comprises firing.
JP3322474A 1991-11-11 1991-11-11 Zirconium boride sintered compact, its production, circuit base and its production Pending JPH05132363A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Publication Number Publication Date
JPH05132363A true JPH05132363A (en) 1993-05-28

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5364715A (en) * 1990-08-14 1994-11-15 Eveready Battery Company, Inc. Alkaline cells that are substantially free of mercury
JP2018106980A (en) * 2016-12-27 2018-07-05 日亜化学工業株式会社 Positive electrode material for nonaqueous secondary battery, nonaqueous secondary battery, and method for manufacturing positive electrode material for nonaqueous secondary battery

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5364715A (en) * 1990-08-14 1994-11-15 Eveready Battery Company, Inc. Alkaline cells that are substantially free of mercury
US5464709A (en) * 1990-08-14 1995-11-07 Eveready Battery Company, Inc. Alkaline cells that are substantially free of mercury
JP2018106980A (en) * 2016-12-27 2018-07-05 日亜化学工業株式会社 Positive electrode material for nonaqueous secondary battery, nonaqueous secondary battery, and method for manufacturing positive electrode material for nonaqueous secondary battery
US10673067B2 (en) 2016-12-27 2020-06-02 Nichia Corporation Positive electrode material for non-aqueous secondary batteries, non-aqueous secondary battery, and method for producing positive electrode material for non-aqueous secondary batteries
US10978694B2 (en) 2016-12-27 2021-04-13 Nichia Corporation Positive electrode material for non-aqueous secondary batteries, non-aqueous secondary battery, and method for producing positive electrode material for non-aqueous secondary batteries

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