JPH0512616A - Production of magnetic head - Google Patents

Production of magnetic head

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Publication number
JPH0512616A
JPH0512616A JP3164573A JP16457391A JPH0512616A JP H0512616 A JPH0512616 A JP H0512616A JP 3164573 A JP3164573 A JP 3164573A JP 16457391 A JP16457391 A JP 16457391A JP H0512616 A JPH0512616 A JP H0512616A
Authority
JP
Japan
Prior art keywords
thin film
soft magnetic
magnetic
substrate
magnetic head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3164573A
Other languages
Japanese (ja)
Other versions
JP2669965B2 (en
Inventor
Toshiyuki Fujine
俊之 藤根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP3164573A priority Critical patent/JP2669965B2/en
Publication of JPH0512616A publication Critical patent/JPH0512616A/en
Application granted granted Critical
Publication of JP2669965B2 publication Critical patent/JP2669965B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Magnetic Heads (AREA)

Abstract

PURPOSE:To more drastically reduce the time for forming and working laminated soft magnetic thin films as compared with the forming and working of these films by dry etching since the forming and forming of the laminated soft magnetic thin films are executed by dicing using a blade. CONSTITUTION:Grooves 2 are formed on a substrate 1 consisting of a nonmagnetic material and the laminated soft magnetic thin films 5 are formed along the side walls 3a of these grooves 2; thereafter, the laminated soft magnetic thin films 5 are ground by the dicing using the blade 6 so as to reduce the thickness of the thin films toward the peak parts from the neighborhood of the peak parts of the side walls 2a.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、非磁性材料からなる基
板上に軟磁性薄膜を設け薄膜積層ヘッドとして構成され
る磁気ヘッドの製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a magnetic head having a soft magnetic thin film provided on a substrate made of a non-magnetic material, which is a thin film laminated head.

【0002】[0002]

【従来の技術】従来より、磁気記録媒体の高密度化に伴
いメタルテープのような高保磁力媒体が主流となってき
ているため、磁気ヘッドに使用される磁気コアの材料も
高い飽和磁束密度を有するものが要求されている。そこ
で、例えば図10に示すように、磁気コアとして高い飽
和磁束密度を有するFeAlSi合金から成る軟磁性薄膜21
を、非磁性材料から成る基板22上に設けてなる薄膜積
層型の磁気ヘッドチップ20が知られている。
2. Description of the Related Art Conventionally, high coercive force media such as metal tapes have become mainstream as the density of magnetic recording media has increased, so that the material of the magnetic core used in the magnetic head has a high saturation magnetic flux density. What you have is required. Therefore, for example, as shown in FIG. 10, a soft magnetic thin film 21 made of FeAlSi alloy having a high saturation magnetic flux density is used as a magnetic core.
There is known a thin film laminated magnetic head chip 20 in which is provided on a substrate 22 made of a non-magnetic material.

【0003】また、近年、長時間録画等に対応するため
にトラック幅が狭くなってきているが、上記のような磁
気ヘッドチップ20において、トラック幅に対応して軟
磁性薄膜21の厚さを薄くすると、磁気コアとしての磁
気断面積が減少し、その磁気抵抗が大きくなって、記録
・再生、特に再生効率が低下するという問題を生じてい
た。
In recent years, the track width has become narrower to accommodate long-time recording, but in the magnetic head chip 20 as described above, the thickness of the soft magnetic thin film 21 is set to correspond to the track width. If the thickness is reduced, the magnetic cross-sectional area of the magnetic core is reduced, the magnetic resistance is increased, and the recording / reproducing, particularly the reproducing efficiency is deteriorated.

【0004】そこで、上記問題を回避するために、図1
1に示すように、ギャップ23近傍の軟磁性薄膜21の
厚さを薄く形成する、つまり絞り込むことにより、狭い
トラック幅に対応する一方、ギャップ23近傍以外の軟
磁性薄膜21の厚さを厚くして磁気断面積を増やし、磁
気抵抗を低減した磁気ヘッドチップ20が提案されてい
る。
Therefore, in order to avoid the above problem, FIG.
As shown in FIG. 1, the soft magnetic thin film 21 in the vicinity of the gap 23 is formed thin, that is, narrowed down to correspond to a narrow track width, while increasing the thickness of the soft magnetic thin film 21 other than in the vicinity of the gap 23. A magnetic head chip 20 having a reduced magnetic resistance has been proposed.

【0005】上記のような磁気ヘッドチップ20の製造
方法について、以下説明する。まず、図12に示すよう
に、結晶化ガラス等の非磁性材料から成る略直方体形状
の基板22に、ダイシング加工により断面略V字状の溝
24を連続して形成した後、図13に示すように、これ
ら各溝24…の一方の側壁24a上に沿って軟磁性薄膜
21とSiO2等の非磁性体材料からなる絶縁層25とを、
真空蒸着法により所定の層数交互に積層蒸着して、所定
の厚さの軟磁性積層薄膜26を形成する。なお、軟磁性
積層薄膜26の積層構造は、以下簡略化して図示する。
A method of manufacturing the above magnetic head chip 20 will be described below. First, as shown in FIG. 12, a substantially rectangular parallelepiped substrate 22 made of a non-magnetic material such as crystallized glass is continuously formed with a groove 24 having a substantially V-shaped cross section by dicing, and then shown in FIG. Thus, the soft magnetic thin film 21 and the insulating layer 25 made of a non-magnetic material such as SiO 2 are provided along one side wall 24a of each of the grooves 24 ...
The soft magnetic laminated thin film 26 having a predetermined thickness is formed by alternately laminating a predetermined number of layers by vacuum vapor deposition. The laminated structure of the soft magnetic laminated thin film 26 will be simplified and illustrated below.

【0006】次に、図14に示すように、側壁24aの
頂点付近から頂点にいたる軟磁性積層薄膜26をイオン
ミリング等のドライエッチングにより所定厚さ分除去す
るために、基板22をイオン入射方向に対して傾けて、
イオンの当たる所望する軟磁性積層薄膜26部分にドラ
イエッチングを施す。このときの基板22の傾け方は、
溝24間に形成される山型部22aによって軟磁性積層
薄膜26上の山型部22a頂部付近にイオンが当たり、
他の部分にイオンの当たらない影をつくるようにする。
Next, as shown in FIG. 14, in order to remove the soft magnetic laminated thin film 26 from the vicinity of the apex of the side wall 24a to the apex by a predetermined thickness by dry etching such as ion milling, the substrate 22 is irradiated in the ion incident direction. Lean against
Dry etching is applied to a desired soft magnetic laminated thin film portion 26 where the ions hit. At this time, how to tilt the substrate 22 is
Ions hit the vicinity of the peaks of the peaks 22a on the soft magnetic laminated thin film 26 by the peaks 22a formed between the grooves 24,
Try to create a shadow that does not hit the ions on other parts.

【0007】その後、図15に示すように、ドライエッ
チングにより薄くなった軟磁性積層薄膜26部分である
トラック幅用薄膜26aの厚さをトラック幅に相当する
厚さとした基板22を作製する。続いて、図16に示す
ように、軟磁性積層薄膜26と後述する低融点ガラスと
の所望しない反応を防止するために、SiO2等の反応防止
膜を形成し、さらに、その反応防止膜の上に、上記低融
点ガラスとのぬれを改善するためにクロム等の活性金属
膜をスパッタリング法等により形成した複合膜27を形
成する。
Thereafter, as shown in FIG. 15, a substrate 22 is produced in which the thickness of the track width thin film 26a, which is the soft magnetic laminated thin film 26 portion thinned by dry etching, is set to a thickness corresponding to the track width. Subsequently, as shown in FIG. 16, in order to prevent an undesired reaction between the soft magnetic laminated thin film 26 and a low melting point glass described later, a reaction preventive film such as SiO 2 is formed, and further, the reaction preventive film is formed. On top of that, a composite film 27 is formed by forming an active metal film of chromium or the like by a sputtering method or the like in order to improve the wetting with the low melting point glass.

【0008】上記の工程後は、図17に示すように、溝
24上に低融点ガラス28を充填した後、図18に示す
ように、各山型部22a…の稜線を結んだ平面まで低融
点ガラス28の表面を研削すると共に、図19に示すよ
うに、その研削された面およびその反対面にコイル巻線
用溝29・29をそれぞれ形成して片側基板ブロック3
0を作製し、次いで、一対の片側基板ブロック30・3
0を非磁性ギャップ材(図示せず)を挟んで相互に接合
した後、所定の幅で切断することで、図11に示すよう
な磁気ヘッドチップ20を得る。
After the above steps, as shown in FIG. 17, after filling the groove 24 with the low melting point glass 28, as shown in FIG. 18, it is lowered to the plane connecting the ridge lines of the respective mountain portions 22a. The one-sided substrate block 3 is formed by grinding the surface of the melting point glass 28 and forming grooves 29, 29 for coil winding on the ground surface and the opposite surface thereof, respectively, as shown in FIG.
0, and then a pair of one-sided substrate blocks 30.
0s are bonded to each other with a non-magnetic gap material (not shown) sandwiched therebetween and then cut into a predetermined width to obtain a magnetic head chip 20 as shown in FIG.

【0009】このように上記磁気ヘッドチップ20で
は、狭いトラック幅に精度よく対応するため、ギャップ
23およびその近傍における軟磁性積層薄膜26の厚さ
を、ドライエッチングにより薄くし、一方、磁気ヘッド
の記録再生、特に再生効率を著しく向上させるために、
上記ギャップ23およびその近傍以外の磁気コア部分で
ある軟磁性積層薄膜26部分の厚みを厚くして磁気抵抗
を下げることにより、狭いトラック幅に対応すると共に
再生効率の高い磁気ヘッドを製造している。
As described above, in the above magnetic head chip 20, in order to accurately cope with a narrow track width, the thickness of the soft magnetic laminated thin film 26 in the gap 23 and in the vicinity thereof is reduced by dry etching, while the thickness of the magnetic head is reduced. In order to significantly improve recording / playback, especially playback efficiency,
The magnetic resistance is reduced by increasing the thickness of the soft magnetic laminated thin film 26 portion which is the magnetic core portion other than the gap 23 and the vicinity thereof to manufacture a magnetic head having a narrow track width and high reproducing efficiency. .

【0010】[0010]

【発明が解決しようとする課題】ところが、上記の方法
では、イオンミリング等のドライエッチングによる軟磁
性積層薄膜26の除去速度が数 100Å/minであることか
ら、必要な膜厚(絞り込み量)の軟磁性積層薄膜26を
除去するのに非常に長時間を要し、磁気ヘッド製造の生
産性が悪いという問題を生じている。
However, in the above method, since the removal rate of the soft magnetic laminated thin film 26 by dry etching such as ion milling is several hundred Å / min, the required film thickness (narrowing amount) can be obtained. It takes a very long time to remove the soft magnetic laminated thin film 26, which causes a problem that productivity of the magnetic head is poor.

【0011】[0011]

【課題を解決するための手段】本発明の磁気ヘッドの製
造方法は、上記課題を解決するために、結晶化ガラス等
の非磁性体材料からなる基板に溝を形成し、この溝の側
壁に沿って、例えばFeAlSi合金からなる軟磁性薄膜を形
成してなる磁気ヘッドの製造方法において、上記軟磁性
薄膜が、その厚さを前記側壁の頂点近傍から頂点に向か
って薄くなるようにブレードによるダイシング加工によ
り研削されてなっていることを特徴としている。
In order to solve the above-mentioned problems, the method of manufacturing a magnetic head according to the present invention forms a groove in a substrate made of a non-magnetic material such as crystallized glass and the side wall of the groove. Along the way, in a method of manufacturing a magnetic head formed by forming a soft magnetic thin film made of, for example, an FeAlSi alloy, the soft magnetic thin film is diced by a blade so that the thickness thereof decreases from near the apex of the side wall toward the apex. It is characterized by being ground by processing.

【0012】[0012]

【作用】上記の方法によれば、軟磁性薄膜の厚さを前記
側壁の頂点近傍から頂点に向かって薄く形成する研削加
工がブレードを用いたダイシング加工による研削によっ
て施されるので、従来のようにイオンミリング等のドラ
イエッチングによる軟磁性薄膜の形成加工と比べて、そ
の形成加工時間を大幅に短縮することができる。
According to the above method, since the grinding process for thinning the thickness of the soft magnetic thin film from the vicinity of the apex of the side wall toward the apex is performed by the dicing process using a blade, In addition, compared with the forming process of the soft magnetic thin film by dry etching such as ion milling, the forming process time can be significantly shortened.

【0013】[0013]

【実施例】本発明の一実施例について図1ないし図9に
基づいて説明すれば、以下の通りである。まず、図2に
示すように、結晶化ガラス等の非磁性材料からなる略直
方体形状の基板1の表面にピッチ寸法Aで、断面略V字
状の刃先のブレードを用いたダイシング加工(研削速
度、数mm/sec)により断面略V字状の溝2を相互に平行
に隣接して作成する。このとき、各溝2…は、基板1に
おける溝2の底部から上方に延ばす法線に対してほぼ左
右対称に形成される。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following will describe one embodiment of the present invention with reference to FIGS. First, as shown in FIG. 2, a dicing process (grinding speed) using a blade having a substantially V-shaped cross-section with a pitch dimension A on the surface of a substantially rectangular parallelepiped substrate 1 made of a non-magnetic material such as crystallized glass. , Several mm / sec) to form the grooves 2 having a substantially V-shaped cross section in parallel with each other. At this time, the grooves 2 are formed substantially symmetrically with respect to a normal line extending upward from the bottom of the groove 2 in the substrate 1.

【0014】その後、図3に示すように、溝2の一方の
側壁2aに沿ってFeAlSi合金等の軟磁性薄膜3を真空蒸
着法、あるいはスパッタリング法で形成する。続いて、
SiO2等の非磁性体材料からなる非磁性薄膜4を軟磁性薄
膜3上に真空蒸着法等により形成し、さらに、その上に
軟磁性薄膜3を上記と同様の方法で形成するというよう
に、所定の膜数だけ交互に積層して、所定の厚さの軟磁
性積層薄膜5を形成する。なお、図では軟磁性積層薄膜
5の積層状態を簡略化して示した。
After that, as shown in FIG. 3, a soft magnetic thin film 3 of FeAlSi alloy or the like is formed along one side wall 2a of the groove 2 by a vacuum deposition method or a sputtering method. continue,
A non-magnetic thin film 4 made of a non-magnetic material such as SiO 2 is formed on the soft magnetic thin film 3 by a vacuum deposition method or the like, and the soft magnetic thin film 3 is formed thereon by the same method as described above. By alternately laminating a predetermined number of films, a soft magnetic laminated thin film 5 having a predetermined thickness is formed. In the figure, the laminated state of the soft magnetic laminated thin film 5 is shown in a simplified manner.

【0015】次に、図1に示すように、隣接する溝2・
2間に形成される山型部1aの頂点近傍から頂点に向か
って軟磁性積層薄膜5の厚さが薄くなるように、軟磁性
積層薄膜5を断面略V字状の刃先のブレード6を用いた
ダイシング加工(研削速度、数mm/sec)により研削加工
する。このとき、山型部1aの頂点側にある軟磁性積層
薄膜5の厚さはトラック幅に相当する厚さとなってい
る。
Next, as shown in FIG. 1, adjacent grooves 2
The soft magnetic laminated thin film 5 is used with a blade 6 having a V-shaped cross section so that the thickness of the soft magnetic laminated thin film 5 decreases from the vicinity of the apex of the mountain-shaped portion 1a formed between the two toward the apex. Grinding with the same dicing process (grinding speed, several mm / sec). At this time, the thickness of the soft magnetic laminated thin film 5 on the apex side of the mountain-shaped portion 1a is a thickness corresponding to the track width.

【0016】また、ダイシング加工は、溝2の形状を示
す指標としての溝2の底部からの法線と一方の側壁2a
との角度Bに対して、その角度B以上の刃先の角度Cを
有するブレード6を用いて施され、その上、ブレード6
の刃先の一方の刃先壁面6aを、前記法線と一致させる
ことで、軟磁性積層薄膜5の研削加工を精度よく施すこ
とができる。
In the dicing process, the normal line from the bottom of the groove 2 and one side wall 2a as an index showing the shape of the groove 2 are used.
The blade 6 having a cutting edge angle C equal to or greater than the angle B with respect to the angle B
By aligning one of the blade edge wall surfaces 6a of the blade edge with the normal line, the soft magnetic laminated thin film 5 can be precisely ground.

【0017】続いて、図4に示すように、軟磁性積層薄
膜5と後述する低融点ガラスとの所望しない反応を防止
するために、SiO2等の反応防止膜を軟磁性積層薄膜5上
に形成し、次に、その反応防止膜の上に、上記低融点ガ
ラスとのぬれを改善するためにクロム等の活性金属膜を
スパッタリング法等により形成して、上記反応防止膜お
よび活性金属膜が積層された複合膜7を形成する。
Subsequently, as shown in FIG. 4, in order to prevent an undesired reaction between the soft magnetic laminated thin film 5 and the low melting point glass described later, a reaction preventive film such as SiO 2 is formed on the soft magnetic laminated thin film 5. Then, on the reaction preventive film, an active metal film such as chromium is formed by a sputtering method or the like in order to improve the wetting with the low melting point glass, and the reaction preventive film and the active metal film are formed. The laminated composite film 7 is formed.

【0018】その後、図5に示すように、各溝2…上に
前述した低融点ガラス8を充填し、次に、図6に示すよ
うに、充填された低融点ガラス8の表面を、前記各山型
部1aの稜線を結んだ平面まで研磨する。このとき、そ
の研磨面であるギャップ面9には軟磁性積層薄膜5がほ
ぼトラック幅となるように露出している。
Thereafter, as shown in FIG. 5, the above-mentioned low-melting glass 8 is filled on each groove 2 ... Then, as shown in FIG. Polishing is performed to a flat surface that connects the ridge lines of each mountain portion 1a. At this time, the soft magnetic laminated thin film 5 is exposed at the gap surface 9 which is the polished surface so that the soft magnetic laminated thin film 5 has almost the track width.

【0019】この後、図7に示すように、ギャップ面9
に、所定のギャップ長となるようにSiO2等の非磁性体材
料からなるギャップスペース材(図示せず)をスパッタ
リング法等により形成し、さらに、基板1におけるギャ
ップ面9とその反対面にコイル巻線用溝10・10をそ
れぞれ形成して片側基板ブロック11を作製する。
After this, as shown in FIG. 7, the gap surface 9
A gap space material (not shown) made of a non-magnetic material such as SiO 2 is formed on the substrate 1 by a sputtering method or the like so as to have a predetermined gap length. The winding grooves 10 and 10 are respectively formed to manufacture the one-sided substrate block 11.

【0020】次に、図8に示すように、一対の片側基板
ブロック11・11をギャップ面9が互いに対向すると
共に各軟磁性積層薄膜5が直線状としてギャップ12が
形成されるように位置を合わせ、加圧固定して各低融点
ガラス8…により接合して基板ブロック13を作製す
る。その後、その接合された基板ブロック13を所定の
ピッチDで切り出して、図9に示すような磁気ヘッドチ
ップ14を得る。
Next, as shown in FIG. 8, the pair of one-sided substrate blocks 11 and 11 are positioned so that the gap surfaces 9 are opposed to each other and the soft magnetic laminated thin films 5 are linear to form the gap 12. The substrates are bonded together, fixed under pressure, and bonded by the low melting point glass 8 ... Then, the bonded substrate block 13 is cut out at a predetermined pitch D to obtain a magnetic head chip 14 as shown in FIG.

【0021】上記のようにして得られた磁気ヘッドチッ
プ14は、以下図示しないが、ベース板への接着固定、
コイル巻線やテープ摺動面の研磨が施されて磁気ヘッド
を完成する。
Although not shown below, the magnetic head chip 14 obtained as described above is adhesively fixed to a base plate,
The magnetic winding is completed by polishing the coil winding and tape sliding surface.

【0022】このように上記実施例の方法では、得られ
た磁気ヘッドのトラック幅は、軟磁性積層薄膜5のダイ
シング加工による研削加工により、そのギャップ12と
なる軟磁性積層薄膜5の厚さが設定できて、例えば長時
間モード専用磁気ヘッドのように狭いトラック幅にも対
応でき、一方、最初に真空蒸着法等により形成される磁
気コアとしての軟磁性積層薄膜5の厚さは、充分な磁気
断面積を確保して、磁気抵抗の充分小さな所定の厚さに
設定できる。
As described above, in the method of the above-described embodiment, the track width of the obtained magnetic head has a thickness of the soft magnetic laminated thin film 5 which becomes the gap 12 by the grinding process of the soft magnetic laminated thin film 5 by the dicing process. The width of the soft magnetic laminated thin film 5 as a magnetic core formed by a vacuum deposition method or the like is sufficient. The magnetic cross section can be secured and the thickness can be set to a predetermined value with a sufficiently small magnetic resistance.

【0023】ところで、従来は、軟磁性積層薄膜の形成
加工にイオンミリング等のドライエッチングが用いられ
ており、その軟磁性積層薄膜のの除去速度が数100Å/mi
nであることから、必要な膜厚(絞り込み量)の軟磁性
積層薄膜を除去するのに非常に長時間を要し、磁気ヘッ
ド製造の生産性が悪かった。
By the way, conventionally, dry etching such as ion milling is used for forming the soft magnetic laminated thin film, and the removal rate of the soft magnetic laminated thin film is several hundred Å / mi.
Since it is n, it takes a very long time to remove the soft magnetic laminated thin film having a required film thickness (amount of narrowing down), and the productivity of magnetic head manufacturing is poor.

【0024】しかしながら、上記の方法では、軟磁性積
層薄膜5の厚さを側壁2aの頂点近傍から頂点に向かっ
て薄く形成する軟磁性積層薄膜5の形成加工がブレード
を用いたダイシング加工による研削によって施されるの
で、従来のようにイオンミリング等のドライエッチング
による軟磁性積層薄膜の形成加工と比べて、その形成加
工時間を大幅に短縮することができる。
However, in the above method, the soft magnetic laminated thin film 5 is formed by thinning the thickness of the soft magnetic laminated thin film 5 from the vicinity of the apex of the side wall 2a toward the apex by grinding by dicing using a blade. Since it is performed, the forming and processing time of the soft magnetic laminated thin film can be significantly shortened as compared with the conventional forming and processing of the soft magnetic laminated thin film by dry etching such as ion milling.

【0025】したがって、狭いトラック幅に対応でき、
その上、低い磁気抵抗を実現して記録再生効率、特に再
生効率の高いという優れた特性を有する磁気ヘッドが、
従来より短時間で製造でき、磁気ヘッド製造の生産性を
向上させることができる。
Therefore, a narrow track width can be accommodated,
Moreover, a magnetic head having excellent characteristics of realizing low magnetic resistance and high recording / reproducing efficiency, particularly high reproducing efficiency,
The magnetic head can be manufactured in a shorter time than before, and the productivity of manufacturing the magnetic head can be improved.

【0026】[0026]

【発明の効果】本発明の磁気ヘッドの製造方法は、以上
のように、狭いトラック幅に対応すると共に磁気抵抗の
小さな磁気ヘッドを製造するために、磁気コアとなる軟
磁性薄膜におけるギャップ付近の厚さを薄くする形成加
工をブレードによるダイシング加工により施す方法であ
る。
As described above, according to the method of manufacturing a magnetic head of the present invention, in order to cope with a narrow track width and to manufacture a magnetic head having a small magnetic resistance, the magnetic head in the vicinity of a gap in a soft magnetic thin film to be a magnetic core is manufactured. This is a method of performing a forming process for reducing the thickness by a dicing process using a blade.

【0027】それゆえ、従来は軟磁性薄膜の厚さを薄く
する形成加工がイオンミリング等によるドライエッチン
グにより施されており、そのドライエッチングの速度が
遅いため、形成加工に時間がかかり、磁気ヘッドの製造
における生産性が悪化していたが、上記方法では、軟磁
性薄膜の形成加工がブレードを用いたダイシング加工に
よる研削によって施されるので、従来より、その形成加
工時間を大幅に短縮することができる。
Therefore, conventionally, the forming process for reducing the thickness of the soft magnetic thin film is performed by dry etching such as ion milling. Since the dry etching speed is slow, the forming process takes a long time and the magnetic head. However, in the above method, since the forming process of the soft magnetic thin film is performed by grinding by dicing process using a blade, the forming process time can be significantly shortened compared to the conventional method. You can

【0028】この結果、長時間モード用等の狭いトラッ
ク幅に対応できると共に、磁気断面積を増加させて、記
録再生効率、特に再生効率を向上させた磁気ヘッドの製
造を短時間で効率よくでき、磁気ヘッドの製造における
生産性を向上させることができるという効果を奏する。
As a result, it is possible to efficiently manufacture a magnetic head which can cope with a narrow track width for a long time mode or the like and which has an increased magnetic cross-sectional area to improve recording / reproducing efficiency, particularly reproducing efficiency, in a short time. Thus, it is possible to improve the productivity in manufacturing the magnetic head.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の磁気ヘッドの製造方法において、ダイ
シング加工により軟磁性積層薄膜が形成加工されている
基板の要部正面図である。
FIG. 1 is a front view of an essential part of a substrate on which a soft magnetic laminated thin film is formed by a dicing process in a method for manufacturing a magnetic head of the present invention.

【図2】上記製造方法における溝の形成された基板の斜
視図である。
FIG. 2 is a perspective view of a substrate in which a groove is formed in the above manufacturing method.

【図3】上記溝に軟磁性積層薄膜が形成された基板の要
部正面図である。
FIG. 3 is a front view of an essential part of a substrate in which a soft magnetic laminated thin film is formed in the groove.

【図4】上記軟磁性積層薄膜上に複合層が形成された基
板の要部正面図である。
FIG. 4 is a front view of an essential part of a substrate in which a composite layer is formed on the soft magnetic laminated thin film.

【図5】溝に低融点ガラスが充填された上記基板の要部
正面図である。
FIG. 5 is a front view of a main part of the substrate in which a groove is filled with a low melting point glass.

【図6】上記低融点ガラスの表面が研削された基板の要
部正面図である。
FIG. 6 is a front view of a main part of a substrate in which the surface of the low melting point glass is ground.

【図7】上記基板にコイル巻線用溝を形成した片側基板
ブロックの斜視図である。
FIG. 7 is a perspective view of a one-sided substrate block in which a coil winding groove is formed on the substrate.

【図8】一対の上記片側基板ブロックを接合した基板ブ
ロックの斜視図である。
FIG. 8 is a perspective view of a substrate block obtained by joining a pair of the one-sided substrate blocks.

【図9】上記基板ブロックを切断してなる磁気ヘッドチ
ップの斜視図である。
FIG. 9 is a perspective view of a magnetic head chip obtained by cutting the substrate block.

【図10】従来の磁気ヘッドチップの斜視図である。FIG. 10 is a perspective view of a conventional magnetic head chip.

【図11】従来の他の磁気ヘッドチップの斜視図であ
る。
FIG. 11 is a perspective view of another conventional magnetic head chip.

【図12】上記磁気ヘッドチップの製造方法において、
溝の形成された基板の斜視図である。
FIG. 12 is a method for manufacturing the above magnetic head chip,
It is a perspective view of the board | substrate with which the groove was formed.

【図13】溝に軟磁性積層薄膜が形成された上記基板の
要部正面図である。
FIG. 13 is a front view of an essential part of the substrate in which a soft magnetic laminated thin film is formed in a groove.

【図14】軟磁性積層薄膜がドライエッチングされてい
る上記基板の正面図である。
FIG. 14 is a front view of the substrate in which the soft magnetic laminated thin film is dry-etched.

【図15】軟磁性積層薄膜の一部がドライエッチングさ
れた上記基板の要部正面図である。
FIG. 15 is a front view of a main part of the substrate, in which a part of the soft magnetic laminated thin film is dry-etched.

【図16】積層合金薄膜上に複合層が形成された上記基
板の要部正面図である。
FIG. 16 is a front view of relevant parts of the substrate, in which a composite layer is formed on a laminated alloy thin film.

【図17】低融点ガラスが充填された上記基板の要部正
面図である。
FIG. 17 is a front view of a main portion of the substrate filled with a low melting point glass.

【図18】低融点ガラスの表面が研磨された上記基板の
要部正面図である。
FIG. 18 is a front view of a main part of the substrate in which the surface of the low melting point glass is polished.

【図19】上記基板にコイル巻線溝等を形成してなる片
側基板ブロックの斜視図である。
FIG. 19 is a perspective view of a one-sided substrate block formed by forming coil winding grooves and the like on the substrate.

【符号の説明】[Explanation of symbols]

1 基板 2 溝 2a 側壁 5 軟磁性積層薄膜(軟磁性薄膜) 6 ブレード 1 Substrate 2 Groove 2a Side Wall 5 Soft Magnetic Laminated Thin Film (Soft Magnetic Thin Film) 6 Blade

Claims (1)

【特許請求の範囲】 【請求項1】非磁性体材料からなる基板に溝を形成し、
この溝の側壁に沿って軟磁性薄膜を形成してなる磁気ヘ
ッドの製造方法において、 上記軟磁性薄膜が、その厚さを前記側壁の頂点近傍から
頂点に向かって薄くなるようにブレードを用いるダイシ
ング加工により研削されてなっていることを特徴とする
磁気ヘッドの製造方法。
Claims: 1. A groove is formed on a substrate made of a non-magnetic material,
In a method of manufacturing a magnetic head in which a soft magnetic thin film is formed along the side wall of this groove, a dicing is performed using a blade so that the thickness of the soft magnetic thin film becomes thinner from near the apex of the side wall toward the apex thereof. A method of manufacturing a magnetic head, characterized by being ground by processing.
JP3164573A 1991-07-04 1991-07-04 Manufacturing method of magnetic head Expired - Fee Related JP2669965B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3164573A JP2669965B2 (en) 1991-07-04 1991-07-04 Manufacturing method of magnetic head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3164573A JP2669965B2 (en) 1991-07-04 1991-07-04 Manufacturing method of magnetic head

Publications (2)

Publication Number Publication Date
JPH0512616A true JPH0512616A (en) 1993-01-22
JP2669965B2 JP2669965B2 (en) 1997-10-29

Family

ID=15795741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3164573A Expired - Fee Related JP2669965B2 (en) 1991-07-04 1991-07-04 Manufacturing method of magnetic head

Country Status (1)

Country Link
JP (1) JP2669965B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9130359B2 (en) 2012-03-06 2015-09-08 Sabic Global Technologies B.V. Energy absorbing system for electric vehicle charging station and methods for making and using the same
WO2016202282A1 (en) * 2015-06-18 2016-12-22 宝山钢铁股份有限公司 Ultra-high strength ultra-high toughness oil casing steel, oil casing, and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139110A (en) * 1985-12-11 1987-06-22 Sony Corp Manufacture of magnetic head
JPS6323210A (en) * 1986-07-16 1988-01-30 Sanyo Electric Co Ltd Magnetic head and its production

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139110A (en) * 1985-12-11 1987-06-22 Sony Corp Manufacture of magnetic head
JPS6323210A (en) * 1986-07-16 1988-01-30 Sanyo Electric Co Ltd Magnetic head and its production

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9130359B2 (en) 2012-03-06 2015-09-08 Sabic Global Technologies B.V. Energy absorbing system for electric vehicle charging station and methods for making and using the same
WO2016202282A1 (en) * 2015-06-18 2016-12-22 宝山钢铁股份有限公司 Ultra-high strength ultra-high toughness oil casing steel, oil casing, and manufacturing method thereof

Also Published As

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JP2669965B2 (en) 1997-10-29

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