JPH0511073B2 - - Google Patents

Info

Publication number

JPH0511073B2

JPH0511073B2 JP10981087A JP10981087A JPH0511073B2 JP H0511073 B2 JPH0511073 B2 JP H0511073B2 JP 10981087 A JP10981087 A JP 10981087A JP 10981087 A JP10981087 A JP 10981087A JP H0511073 B2 JPH0511073 B2 JP H0511073B2

Authority

JP

Japan

Prior art keywords

wall

crucible

thickness

pbn

reaction chamber

Prior art date

1987-05-07

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

Links

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• PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 26
• 239000002994 raw material Substances 0.000 claims description 10
• 229910052582 BN Inorganic materials 0.000 claims description 9
• 238000005229 chemical vapour deposition Methods 0.000 claims description 5
• 238000000034 method Methods 0.000 description 15
• QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 9
• 239000013078 crystal Substances 0.000 description 7
• OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
• 150000001875 compounds Chemical class 0.000 description 6
• 229910002804 graphite Inorganic materials 0.000 description 6
• 239000010439 graphite Substances 0.000 description 6
• 238000004519 manufacturing process Methods 0.000 description 5
• 239000004065 semiconductor Substances 0.000 description 5
• 229910021529 ammonia Inorganic materials 0.000 description 4
• 229910052796 boron Inorganic materials 0.000 description 4
• -1 boron halide Chemical class 0.000 description 4
• 239000000758 substrate Substances 0.000 description 4
• 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
• OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
• 230000000052 comparative effect Effects 0.000 description 3
• 230000000694 effects Effects 0.000 description 3
• 238000004299 exfoliation Methods 0.000 description 3
• 239000000463 material Substances 0.000 description 3
• 238000001451 molecular beam epitaxy Methods 0.000 description 3
• FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 3
• 230000015572 biosynthetic process Effects 0.000 description 2
• 238000003475 lamination Methods 0.000 description 2
• 238000002844 melting Methods 0.000 description 2
• 230000008018 melting Effects 0.000 description 2
• 229910052751 metal Inorganic materials 0.000 description 2
• 239000002184 metal Substances 0.000 description 2
• 229910045601 alloy Inorganic materials 0.000 description 1
• 239000000956 alloy Substances 0.000 description 1
• 239000006227 byproduct Substances 0.000 description 1
• 230000008602 contraction Effects 0.000 description 1
• 238000001816 cooling Methods 0.000 description 1
• 238000005260 corrosion Methods 0.000 description 1
• 230000007797 corrosion Effects 0.000 description 1
• 230000032798 delamination Effects 0.000 description 1
• JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
• 239000010419 fine particle Substances 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• 239000012535 impurity Substances 0.000 description 1
• 150000002739 metals Chemical class 0.000 description 1
• 239000000565 sealant Substances 0.000 description 1
• 238000000926 separation method Methods 0.000 description 1
• 230000002269 spontaneous effect Effects 0.000 description 1
• 239000010935 stainless steel Substances 0.000 description 1
• 229910001220 stainless steel Inorganic materials 0.000 description 1
• 238000004506 ultrasonic cleaning Methods 0.000 description 1
• 235000012431 wafers Nutrition 0.000 description 1