JPH051101Y2 - - Google Patents
Info
- Publication number
- JPH051101Y2 JPH051101Y2 JP1983164251U JP16425183U JPH051101Y2 JP H051101 Y2 JPH051101 Y2 JP H051101Y2 JP 1983164251 U JP1983164251 U JP 1983164251U JP 16425183 U JP16425183 U JP 16425183U JP H051101 Y2 JPH051101 Y2 JP H051101Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulating sheet
- circuit board
- main surface
- printed circuit
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 description 9
- 230000037431 insertion Effects 0.000 description 7
- 238000003780 insertion Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16425183U JPS6071185U (ja) | 1983-10-24 | 1983-10-24 | 絶縁シ−ト構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16425183U JPS6071185U (ja) | 1983-10-24 | 1983-10-24 | 絶縁シ−ト構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6071185U JPS6071185U (ja) | 1985-05-20 |
| JPH051101Y2 true JPH051101Y2 (US06559137-20030506-C00071.png) | 1993-01-12 |
Family
ID=30360153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16425183U Granted JPS6071185U (ja) | 1983-10-24 | 1983-10-24 | 絶縁シ−ト構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6071185U (US06559137-20030506-C00071.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5758746Y2 (US06559137-20030506-C00071.png) * | 1978-08-16 | 1982-12-15 | ||
| JPS5834989A (ja) * | 1981-08-27 | 1983-03-01 | 株式会社東芝 | 電子部品の実装方法 |
-
1983
- 1983-10-24 JP JP16425183U patent/JPS6071185U/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5758746Y2 (US06559137-20030506-C00071.png) * | 1978-08-16 | 1982-12-15 | ||
| JPS5834989A (ja) * | 1981-08-27 | 1983-03-01 | 株式会社東芝 | 電子部品の実装方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6071185U (ja) | 1985-05-20 |
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