JPH049748U - - Google Patents
Info
- Publication number
- JPH049748U JPH049748U JP5007690U JP5007690U JPH049748U JP H049748 U JPH049748 U JP H049748U JP 5007690 U JP5007690 U JP 5007690U JP 5007690 U JP5007690 U JP 5007690U JP H049748 U JPH049748 U JP H049748U
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- image sensor
- silicon
- sensor according
- type image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- 229910052710 silicon Inorganic materials 0.000 claims 3
- 239000010703 silicon Substances 0.000 claims 3
- 229910021417 amorphous silicon Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
- Electronic Switches (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
Description
第１図は本考案の一実施例の一体構造センサの
断面構造図、第２図は本考案の他の実施例の断面
構造図、第３図は従来例の断面構造図である。
１……アルミニウムマウント、２……ＰＣＢ、
３……駆動走査回路、４……発熱体、５……アル
ミニウム電極、６……層間絶縁層、７……遮光層
、８……光センサ、９……透明電極、１０……保
護膜、１１……ＬＥＤ、１２……ガラス基板。
FIG. 1 is a cross-sectional structural diagram of an integral structure sensor according to an embodiment of the present invention, FIG. 2 is a cross-sectional structural diagram of another embodiment of the present invention, and FIG. 3 is a cross-sectional structural diagram of a conventional example. 1...Aluminum mount, 2...PCB,
3... Drive scanning circuit, 4... Heating element, 5... Aluminum electrode, 6... Interlayer insulating layer, 7... Light shielding layer, 8... Optical sensor, 9... Transparent electrode, 10... Protective film, 11...LED, 12...Glass substrate.
Claims (1)
同一基板上にシリコンの感光センサを配置したこ
とを特徴とするサーマルヘツド一体構造型イメー
ジセンサ。 (2) 上記シリコン部材をアモルフアスシリコン
で構成したことを特徴とする請求項(1)記載のサ
ーマルヘツド一体構造型イメージセンサ。 (3) 上記シリコン部材をＮ−Ｉ−Ｐ型構造とし
たことを特徴とする請求項(1)記載のサーマルヘ
ツド一体構造型イメージセンサ。[Claims for Utility Model Registration] (1) An image sensor integrated with a thermal head, characterized in that a silicon photosensitive sensor is arranged on the same substrate as on or near the heating element of the thermal head. (2) The thermal head integrated structure type image sensor according to claim (1), wherein the silicon member is made of amorphous silicon. (3) The thermal head integrated structure type image sensor according to claim (1), wherein the silicon member has an N-I-P type structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990050076U JP2527036Y2 (en) | 1990-05-14 | 1990-05-14 | Thermal head integrated structure type image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990050076U JP2527036Y2 (en) | 1990-05-14 | 1990-05-14 | Thermal head integrated structure type image sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH049748U true JPH049748U (en) | 1992-01-28 |
| JP2527036Y2 JP2527036Y2 (en) | 1997-02-26 |
Family
ID=31568319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990050076U Expired - Lifetime JP2527036Y2 (en) | 1990-05-14 | 1990-05-14 | Thermal head integrated structure type image sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2527036Y2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61232757A (en) * | 1985-04-06 | 1986-10-17 | Oki Electric Ind Co Ltd | Optical sensor device |
| JPS61242068A (en) * | 1985-04-19 | 1986-10-28 | Matsushita Electronics Corp | Image sensor |
| JPS62117366A (en) * | 1985-11-18 | 1987-05-28 | Fujitsu Ltd | Manufacture of amorphous silicon image sensor |
| JPS6330063A (en) * | 1986-07-23 | 1988-02-08 | Canon Inc | Serial type recorder |
-
1990
- 1990-05-14 JP JP1990050076U patent/JP2527036Y2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61232757A (en) * | 1985-04-06 | 1986-10-17 | Oki Electric Ind Co Ltd | Optical sensor device |
| JPS61242068A (en) * | 1985-04-19 | 1986-10-28 | Matsushita Electronics Corp | Image sensor |
| JPS62117366A (en) * | 1985-11-18 | 1987-05-28 | Fujitsu Ltd | Manufacture of amorphous silicon image sensor |
| JPS6330063A (en) * | 1986-07-23 | 1988-02-08 | Canon Inc | Serial type recorder |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2527036Y2 (en) | 1997-02-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |