JPH0492636U - - Google Patents
Info
- Publication number
- JPH0492636U JPH0492636U JP40266690U JP40266690U JPH0492636U JP H0492636 U JPH0492636 U JP H0492636U JP 40266690 U JP40266690 U JP 40266690U JP 40266690 U JP40266690 U JP 40266690U JP H0492636 U JPH0492636 U JP H0492636U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP40266690U JPH0492636U (en) | 1990-12-28 | 1990-12-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP40266690U JPH0492636U (en) | 1990-12-28 | 1990-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0492636U true JPH0492636U (en) | 1992-08-12 |
Family
ID=31880548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP40266690U Pending JPH0492636U (en) | 1990-12-28 | 1990-12-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0492636U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011176262A (en) * | 2010-01-27 | 2011-09-08 | Hitachi Kokusai Electric Inc | Substrate treating apparatus |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01161829A (en) * | 1987-12-18 | 1989-06-26 | Tel Sagami Ltd | Heat treating apparatus |
JPH01170017A (en) * | 1987-12-25 | 1989-07-05 | Toshiba Corp | Semiconductor processing device |
JPH01280312A (en) * | 1987-09-29 | 1989-11-10 | Tel Sagami Ltd | Heat treatment device |
JPH03249936A (en) * | 1990-02-26 | 1991-11-07 | Tokyo Electron Ltd | Sealing device |
-
1990
- 1990-12-28 JP JP40266690U patent/JPH0492636U/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01280312A (en) * | 1987-09-29 | 1989-11-10 | Tel Sagami Ltd | Heat treatment device |
JPH01161829A (en) * | 1987-12-18 | 1989-06-26 | Tel Sagami Ltd | Heat treating apparatus |
JPH01170017A (en) * | 1987-12-25 | 1989-07-05 | Toshiba Corp | Semiconductor processing device |
JPH03249936A (en) * | 1990-02-26 | 1991-11-07 | Tokyo Electron Ltd | Sealing device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011176262A (en) * | 2010-01-27 | 2011-09-08 | Hitachi Kokusai Electric Inc | Substrate treating apparatus |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19970506 |