JPH0492636U - - Google Patents

Info

Publication number
JPH0492636U
JPH0492636U JP40266690U JP40266690U JPH0492636U JP H0492636 U JPH0492636 U JP H0492636U JP 40266690 U JP40266690 U JP 40266690U JP 40266690 U JP40266690 U JP 40266690U JP H0492636 U JPH0492636 U JP H0492636U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP40266690U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP40266690U priority Critical patent/JPH0492636U/ja
Publication of JPH0492636U publication Critical patent/JPH0492636U/ja
Pending legal-status Critical Current

Links

JP40266690U 1990-12-28 1990-12-28 Pending JPH0492636U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP40266690U JPH0492636U (en) 1990-12-28 1990-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP40266690U JPH0492636U (en) 1990-12-28 1990-12-28

Publications (1)

Publication Number Publication Date
JPH0492636U true JPH0492636U (en) 1992-08-12

Family

ID=31880548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP40266690U Pending JPH0492636U (en) 1990-12-28 1990-12-28

Country Status (1)

Country Link
JP (1) JPH0492636U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011176262A (en) * 2010-01-27 2011-09-08 Hitachi Kokusai Electric Inc Substrate treating apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01161829A (en) * 1987-12-18 1989-06-26 Tel Sagami Ltd Heat treating apparatus
JPH01170017A (en) * 1987-12-25 1989-07-05 Toshiba Corp Semiconductor processing device
JPH01280312A (en) * 1987-09-29 1989-11-10 Tel Sagami Ltd Heat treatment device
JPH03249936A (en) * 1990-02-26 1991-11-07 Tokyo Electron Ltd Sealing device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01280312A (en) * 1987-09-29 1989-11-10 Tel Sagami Ltd Heat treatment device
JPH01161829A (en) * 1987-12-18 1989-06-26 Tel Sagami Ltd Heat treating apparatus
JPH01170017A (en) * 1987-12-25 1989-07-05 Toshiba Corp Semiconductor processing device
JPH03249936A (en) * 1990-02-26 1991-11-07 Tokyo Electron Ltd Sealing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011176262A (en) * 2010-01-27 2011-09-08 Hitachi Kokusai Electric Inc Substrate treating apparatus

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Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19970506