JPH0488648A - Suction mechanism and handler - Google Patents

Abstract

PURPOSE:To enable a suction mechanism to securely suck and hold a sucked object and to smoothly test a semiconductor device by a method wherein a positioning member is provided bearing against a tray or a protrusion provided to a transfer path. CONSTITUTION:A suction pad 40a and a positioning member 40b provided protrudent surrounding the suction pad 40a are provided to a suction mechanism 40. When a semiconductor device 30 is taken out from a tray 20 (outward transfer path 5) (inward transfer ward 6) as sucked or put in a tray 20 as released from a suction pad 40a, the positioning member 40b is made to bear against a partitioning wall 20a (aide protrusions 5b and 6b) of the tray 20 (transfer paths 5 and 6). Therefore, the semiconductor device 30 can be protected against damage caused by the collision between the device and the suction pad 40a when the tray 20 is warped. When the sucking action is wrongly performed against the tray 20 not loaded with the semiconductor device 40, troubles that the 40a turns the tray 20 upside down sucking the tray 20 itself or the like can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a suction mechanism and a handler, and particularly relates to a technique that is effective when applied to an inspection process in the manufacture of semiconductor devices.

[Conventional technology]

For example, in the manufacturing process of semiconductor devices such as memory elements and logic elements, predetermined operations are carried out to detect defects in the semiconductor devices and grade them according to their operating speeds when shipping or receiving assembled semiconductor devices. Tests are carried out, and equipment that performs such operational tests typically feeds each semiconductor device individually to the test system, or automatically separates it based on the test results. A so-called handler is used that automatically performs operations such as loading/storing.

By the way, in such a handler, a mechanism for individually taking out semiconductor devices from a tray containing a plurality of semiconductor devices and returning the semiconductor devices to the tray is disclosed in Japanese Patent Application Laid-Open No. 1-172771, for example. - Vacuum suction technology is used as disclosed in Japanese Patent Application Laid-Open No. 1-172776.

That is, the semiconductor device is suction-held/released by negative pressure acting on the open end of a vacuum suction pad connected to a desired vacuum source via an on-off valve or the like.

[Problem to be solved by the invention]

In the case of the above-mentioned prior art, if the tray in which the single conductor device is housed is flat, the semiconductor device can be held by the vacuum suction pad.

However, if the suction height of the semiconductor device varies due to deformation of the tray, or if the suction operation is performed at a position where there is no semiconductor device for some reason, the suction pad may collide with the semiconductor device, causing the semiconductor device to be damaged. There are problems such as damage to the terminals, suction pads attracting the tray itself and overturning it, scattering semiconductor devices in the work space, and causing problems such as operation stoppage.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a suction mechanism capable of accurately suctioning and holding an object to be suctioned.

Another object of the present invention is to provide a handler that can smoothly test a semiconductor device.

The promise and other objects and novel features of the present station will become apparent from the written description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the suction mechanism of the present invention includes a tray that is equipped with a suction pad capable of suction and release of suction using negative pressure, and has a protrusion formed in the thickness direction of the suction object at a position facing at least one side of the suction object. Alternatively, it is a suction mechanism that performs at least one of a take-out operation and a placement operation of the object to be attracted to the conveyance path, and is provided with a positioning member that comes into contact with a protrusion on the tray or the conveyance path.

Further, the handler according to the present invention includes a test head for testing semiconductor devices, a loader section for receiving trays containing semiconductor devices to be tested, and a loader section for dispensing trays containing tested semiconductor devices. an unloader section to carry out an unloader section, a transfer path for carrying out a semiconductor device transfer operation between the loader section and unloader section and the test head, and a take-out operation and mounting of a semiconductor device between a tray and a transfer path in the loader section and unloader section. A handler comprising a first suction device that performs the operation (and a second suction mechanism that performs the operation of taking out and placing the single conductor device between the test head and the conveyance path, the first suction mechanism and the second suction device The suction mechanism according to claim 1 is used for at least one of the suction mechanisms.

[Effect]

According to the above-described suction mechanism of the present invention, for example, the protrusion dimension of the positioning member that abuts the protrusion on the tray or conveyance path on which the suction target is placed is adjusted between the suction pad and the suction target during the suction operation. Even if there are variations in the height of the tray or conveyance path, the suction pad will not collide with the object to be attracted, and the suction pad will not collide with the tray or conveyance path itself. It is possible to reliably avoid problems such as adsorption of objects, and it is possible to accurately perform suction and holding operations for objects to be adsorbed.

Further, according to the handler of the present invention, by using the suction mechanism according to claim 1, which is provided with a positioning member as at least one of the first suction mechanism and the second suction mechanism, it is possible to The probability of failures such as operation stoppage due to damage to the I or overturning of the tray due to erroneous suction is reliably reduced, and testing work on semiconductor devices can be carried out smoothly.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of a suction mechanism and a handler using the suction mechanism according to an embodiment of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a side view showing an example of a suction mechanism according to an embodiment of the present invention, FIG. 2 is a perspective view showing an example of a tray in which an object to be sucked is stored, and FIG. FIG. 1 is a plan view schematically showing an example of the configuration of a handler that is an embodiment of the present invention.

First, the configuration of the handler of this embodiment will be explained.

On top of the housing 1, there is a test head 2. A loader section 3 and an unloader section 4 are respectively provided, and furthermore, between the test head 2 and each of the loader section 3 and unloader section 4, there is a row conveyance path consisting of, for example, a well-known T-king beam. 5 and a return conveyance path 6 are laid.

Test head 2 has multiple sockets) A and socket).
A semiconductor device is loaded into each of the sockets A and B, and the semiconductor device is tested.

A pair of untested tray separating claws 3a, an untested tray separating claw 3b, and an untested tray feeding claw 3c have a plurality of trays 20 stacked on top of each other as shown in FIG. 2 in the loader section 3. and a loader unit 3d are provided, and the one at the bottom is loaded by the untested tray feed claw 3c)
It has a structure in which it is sequentially sent to the 3d side at a predetermined pitch.

In the tray 20 of this embodiment, a plurality of storage sections 20b each having a concave cross section and partitioned into a lattice shape by a partition wall 20a are arranged at a desired pitch in directions orthogonal to each other, and each storage section 20b has a semiconductor device mounted thereon. The structure is such that 30 can be stored.

The preceding evidence loader unit 3d is provided with a plurality of suction mechanisms 40 that can be moved up and down as shown in FIG. multiple semiconductor devices 3
0 all at once and held by the loader receiving part 5 of the row conveyance path 5.
Perform the operation to place it at position a.

On the other hand, on the side of the unloader section 4, there is an empty tray separation claw 4a on which a plurality of trays 20, in which semiconductor devices 30 that have been wiped and tested are placed in a stacked state, are placed on the test rack 2. A separating claw 4b, an empty tray feeding claw 4c, and an unloader unit 4d are arranged.

Then, one tray 20 at the bottom is sent to the unloader unit 4d at a predetermined pitch.

A plurality of suction mechanisms 40 are arranged in the unloader unit 4d in the direction in which the semiconductor devices 30 are arranged on the tray 20, and a plurality of suction mechanisms 40 are arranged on the side of the test head 2 at the position of the unloader pickup 6a provided at the end of the return conveyance path 6. The inspected semiconductor devices 30 arriving from
An operation is performed to store one row at a time.

The row conveyance path 5 and the return conveyance path 6 are provided with guide protrusions 5b and 6b at both ends in the longitudinal direction, and are structured to prevent the semiconductor devices 30 from falling off during the conveyance operation. .

On the other hand, the A side traverse head)'2a (B
m) a rubber head 2b) is arranged;

The A-side traverse head 2a (B-side traverse head 2b) has an A-side suction suction mechanism 40 that suction-holds the semiconductor device 30 located on the row conveyance path 5 and loads it into the socket A (socket B). Cylinder 2c (B side suction cylinder 2d) Socket A (
An A-side holder that performs the pressing and fixing operation of the semiconductor device IF 50 against the socket) B) and the operation of taking out the inspected semiconductor device 30 from the socket A (socket B) and placing it on the return conveyance path 6 or the defective product storage section C. Cylinder 2e (Ba
Holding cylinder 21), flutter Afll1 for release operation.
1) Rubber head 2a (B side traverse head 2b)
An A-side detachment cylinder 2g (B-side detachment cylinder 2h) is provided to move the cylinder up and down.

In this case, the suction mechanism 40 includes a suction pad 40a that protrudes from the center and performs suction and release operations for the semiconductor device 30, and a positioning member 40b that protrudes at a position surrounding the suction pad 40a. It is configured.

When the semiconductor device 30 is taken out by suction and stored by the suction release operation between the tray 20 (transfer path 5) and the return conveyance path 6, the positioning member 40 is
b comes into contact with the partition wall 20a (guide protrusion 5b) (guide protrusion 6b) of the tray 2Ω (sex transport path 5) (return transport path 6), for example, due to warping deformation of the tray 20, etc. This prevents the suction pad 40a from colliding with the semiconductor device 3Q and damaging the semiconductor device 30, and prevents the suction pad 40a from colliding with the semiconductor device 3Q, and prevents the suction pad 40a from colliding with the semiconductor device 3Q, and prevents the suction pad 40a from colliding with the semiconductor device 3Q, and prevents the suction pad 40a from colliding with the semiconductor device 3Q, and prevents the suction pad 40a from colliding with the semiconductor device 3Q, and prevents the suction pad 40a from colliding with the semiconductor device 3Q, and prevents the suction pad 40a from colliding with the semiconductor device 3Q and preventing the semiconductor device 3Q from being damaged. In addition, the suction pad 40a prevents damage such as suction of the tray 20 itself and overturning it.

Hereinafter, an example of the operation of the suction mechanism 40 and the handler equipped with the suction mechanism 40 in this embodiment will be described.

First, in the loader section 3, the tray 20 containing a plurality of semiconductor devices 30 to be inspected is moved to the uninspected tray feed claw 3C.
By the feeding operation, the loader unit (3d) is moved intermittently at a predetermined pitch and positioned at the bottom of the loader unit (3d).

The loader unit) 3d simultaneously lowers a plurality of suction mechanisms 40 onto the tray 20 arriving immediately below, and suction-holds a plurality of semiconductor devices 30 corresponding to - rows at once.

At this time, in each of the suction mechanisms 40, the positioning member 4
By bringing the suction pad 40a into contact with the partition wall 20a of the tray 20, the suction pad 40a can always be accurately positioned with respect to the semiconductor device 30 without being affected by warping or deformation of the tray 20. The suction pad 40a can accurately hold the semiconductor device 30 without applying an excessive pressing force to the device 30 or causing concerns about the tray 20 itself being attracted and overturned.

That is, normally, the position control of the suction pad 40a in the height direction is performed by monitoring the pressure of the vacuum system connected to the suction pad 40a using a sensor or the like, and when the vacuum system becomes negative pressure below a predetermined level. The semiconductor device 30 is attached to the suction pad 40a
It performs a control operation that recognizes that it is being held at the tip of the body. In such a control operation, if the semiconductor device [30 is not present at a predetermined position, the suction pad 40a
In the case of the suction mechanism 40 of this embodiment, the tip of the suction pad 40a descends until it is blocked by the object, resulting in malfunctions such as suctioning the tray 20 itself. In this case, the lowering position of the suction pad 40a is always accurately set by the contact position between the positioning member 40b and the partition wall 20a of the tray 20, so that the above-mentioned inconvenience does not occur.

This also applies to the suction operation in the sexual transport path 5 and the return transport path 6, which will be described later.

In this way, the loader unit 3d that accurately holds the plurality of semiconductor devices 30 moves to the side of the sexual recruitment route 5,
The semiconductor device 30 is delivered to each of a plurality of loader receiving portions 5a provided at a predetermined pitch in the longitudinal direction of the transport path 5.

The plurality of semiconductor devices 30 placed on the transport path 5 are intermittently moved toward the test head 2 at a predetermined pitch by the transport operation of the transport path 5.

Then, the semiconductor device 30 that has reached the position directly under the A-side traverse head 2a is suction-held by the A-side suction cylinder 2c, and after being loaded into the socket A, the semiconductor device 30 is fixed by a plurality of steps (not shown) by the back-side holding cylinder 2e. Stable electrical contact between the external connection terminal and socket A is ensured, and in this state, a predetermined operating signal is applied to perform an operation test for a predetermined period of time.

The semiconductor device [30 that has completed the operation test in this way is held by the suction mechanism 40 of the A-side holding cylinder 2e, and is transferred to the return conveyance path 6 if it is determined to be a good product, or to the defective device if it is determined to be a defective product. It is placed in the good product storage section C.

A similar operation is performed in parallel on the socket B side.

The tested semiconductor device 30 placed on the return transport path 6 is
The intermittent feeding operation of the return conveyance path 6 reaches the unloader pickup 6a of the unloader section 4, and the pushing-up operation of the unloader pickup 6a causes individual suction of the unloader units 4d waiting directly above the unloader pickup 6a. It is sucked and held by the mechanism 40.

The unloader unit 4d holding the plurality of tested semiconductor devices 30 moves to the side of the unloader section 4, and is moved to each of the plurality of storage sections 20b corresponding to one row of trays 20 arriving immediately below by the empty tray feeding claw 4C. The semiconductor device 30 is placed.

In this way, the suction mechanism 40 in the handler of this embodiment
According to the above, since the positioning member 40b is provided, the tray 20 can be moved without being affected by deformation of the tray 20, etc.
0 and line conveyance path 5. To accurately perform suction holding of a semiconductor device 30 by a suction pad 40a and detachment operation by suction release from a return conveyance path 6 etc. without causing any trouble such as damage to the semiconductor device 1[30 or overturning of the tray 20. I can do it.

As a result, semiconductor packaging can be carried out by the handler without any operational stoppage due to overturning of the tray 20, etc. A predetermined test of f30 can be conducted smoothly.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the shape of the positioning member in the suction mechanism and the configuration of the handler are not limited to those exemplified in the above embodiments, but may be other shapes or configurations as long as they provide the same function.

〔Effect of the invention〕

Among the inventions disclosed in this application, the effects obtained by typical inventions are briefly described below.

That is, according to the adsorption mechanism of the present invention, for example,
The protrusion dimensions of the positioning member that abuts the protrusion on the tray or conveyance path on which the object to be attracted is placed are set so that the suction pad and the object to be attracted have an appropriate positional relationship during suction operation, etc. Therefore, even if there are variations in the amount of trays or transport paths, it is possible to reliably avoid problems such as the suction pad colliding with the object to be suctioned, or the suction pad suctioning the tray or transport path itself. This allows the suction and holding operation of the suction object to be performed accurately.

Further, according to the handler of the present invention, the suction mechanism can accurately suction hold and remove the semiconductor device, thereby preventing damage to the semiconductor device or stoppage of operation due to tray overturning due to erroneous suction. The probability that a failure will occur is definitely reduced, and testing of semiconductor devices can be carried out smoothly.

[BRIEF DESCRIPTION OF THE DRAWINGS] Fig. 1 is a side view showing an example of a suction mechanism according to an embodiment of the present invention; Fig. 2 is a perspective view showing an example of a tray in which objects to be adsorbed are stored; FIG. 3 is a plan view schematically showing an example of the configuration of a handler that is an embodiment of the present invention. ■...Housing, 2...Test head, 2a...A side traverse head, 2b...B (Il traverse head, 2C...A side suction cylinder, 2d...B side suction cylinder , 2e...A side holding cylinder, 2f...
B side holding cylinder, 2g...A side release cylinder, 2
h...B side detachment cylinder, 3...Loader part, 3a.
...Untested tray separation claw, 3b...Untested tray separation claw,
3C...Untested tray feed claw, 3d...Loader unit, 4...Unloader section, 4a...Empty tray separation claw, 4b...Empty tray separation claw, 4C...Empty tray Feed claw, 4d... Unloader unit, 5... Sex feeding path, 5a... Loader receiving portion, 5b... Guide protrusion, 6...
...Return conveyance path, 6a...Unloader pickup, 6
b... Guide projection, 20... Tray, 20a... Partition wall, 20b... Storage section, 30... Semiconductor device,
40... Suction mechanism, 40a... Suction pad, 4Qb
・・・Positioning member, A...Socket, B...Socket, C・Pa・Defective product storage section. Agent Patent Attorney Dai Tsutsui Wa 20b: Storage Department No. 2

Claims (1)

[Scope of Claims] 1. A tray equipped with a suction pad capable of suction and release of suction using negative pressure, and having a protrusion formed in the thickness direction of the suction object at a position facing at least one side of the suction object. or a suction mechanism that performs at least one of a take-out operation and a placement operation of the object to be sucked between the conveyance path and the suction mechanism, comprising a positioning member that abuts the protrusion on the tray or the conveyance path. Features an adsorption mechanism. 2. The suction mechanism according to claim 1, wherein the object to be suctioned is a semiconductor device. 3. a test head for testing semiconductor devices; a loader section for accepting trays containing semiconductor devices before testing; and an unloader section for unloading trays containing tested semiconductor devices; a transport path for performing a transport operation of the semiconductor device between the loader section and the unloader section and the test head; a take-out operation of the semiconductor device between the tray and the transport path in the loader section and unloader section; A handler comprising a first suction mechanism that performs a placing operation, and a second suction mechanism that performs an operation of taking out and placing the semiconductor device between the test head and the transport path, the handler comprising: a first suction mechanism that performs a placing operation; At least one of the mechanism and the second adsorption mechanism,
A handler using the suction mechanism according to claim 1.