JPH0487651U - - Google Patents

Info

Publication number
JPH0487651U
JPH0487651U JP13021390U JP13021390U JPH0487651U JP H0487651 U JPH0487651 U JP H0487651U JP 13021390 U JP13021390 U JP 13021390U JP 13021390 U JP13021390 U JP 13021390U JP H0487651 U JPH0487651 U JP H0487651U
Authority
JP
Japan
Prior art keywords
conductor
semiconductor element
semiconductor device
exterior
portable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13021390U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13021390U priority Critical patent/JPH0487651U/ja
Publication of JPH0487651U publication Critical patent/JPH0487651U/ja
Pending legal-status Critical Current

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例による携帯用半導
体装置の外観図、第2図はこの考案による携帯用
半導体装置の断面図、第3図は従来の携帯用半導
体装置の外観図、第4図はその断面図である。図
において、1は携帯用半導体装置、2は導電性の
外装材、3は誘電体の外装材、4は導電体の
外装材、5は絶縁物質、6は半導体素子、7は
基板である。なお、図中、同一符号は同一、又は
相当部分を示す。
FIG. 1 is an external view of a portable semiconductor device according to an embodiment of this invention, FIG. 2 is a sectional view of a portable semiconductor device according to this invention, FIG. 3 is an external view of a conventional portable semiconductor device, and FIG. The figure is a sectional view thereof. In the figure, 1 is a portable semiconductor device, 2 is a conductive exterior material, 3 is a dielectric exterior material, 4 is a conductive exterior material, 5 is an insulating material, 6 is a semiconductor element, and 7 is a substrate. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を搭載した携帯用半導体装置におい
て、携帯用半導体装置は半導体素子と半導体素子
を搭載した基板とそれらを包囲し外力から保護す
る外装から構成され、上記外装は導電体のまわり
を絶縁体でおおい、さらに上記絶縁体のまわりを
上記導電体とは異なる導電体でおおつたことを特
徴とする携帯用半導体装置。
A portable semiconductor device equipped with a semiconductor element is composed of a semiconductor element, a substrate on which the semiconductor element is mounted, and an exterior that surrounds them and protects them from external forces.The exterior includes an insulator surrounding a conductor. Furthermore, the portable semiconductor device is characterized in that the insulator is further covered with a conductor different from the conductor.
JP13021390U 1990-11-30 1990-11-30 Pending JPH0487651U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13021390U JPH0487651U (en) 1990-11-30 1990-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13021390U JPH0487651U (en) 1990-11-30 1990-11-30

Publications (1)

Publication Number Publication Date
JPH0487651U true JPH0487651U (en) 1992-07-30

Family

ID=31877571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13021390U Pending JPH0487651U (en) 1990-11-30 1990-11-30

Country Status (1)

Country Link
JP (1) JPH0487651U (en)

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