JPH0487651U - - Google Patents
Info
- Publication number
- JPH0487651U JPH0487651U JP13021390U JP13021390U JPH0487651U JP H0487651 U JPH0487651 U JP H0487651U JP 13021390 U JP13021390 U JP 13021390U JP 13021390 U JP13021390 U JP 13021390U JP H0487651 U JPH0487651 U JP H0487651U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- semiconductor element
- semiconductor device
- exterior
- portable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 3
- 239000012212 insulator Substances 0.000 claims 2
- 239000000463 material Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はこの考案の一実施例による携帯用半導
体装置の外観図、第２図はこの考案による携帯用
半導体装置の断面図、第３図は従来の携帯用半導
体装置の外観図、第４図はその断面図である。図
において、１は携帯用半導体装置、２は導電性の
外装材、３は誘電体の外装材、４は導電体の
外装材、５は絶縁物質、６は半導体素子、７は
基板である。なお、図中、同一符号は同一、又は
相当部分を示す。
FIG. 1 is an external view of a portable semiconductor device according to an embodiment of this invention, FIG. 2 is a sectional view of a portable semiconductor device according to this invention, FIG. 3 is an external view of a conventional portable semiconductor device, and FIG. The figure is a sectional view thereof. In the figure, 1 is a portable semiconductor device, 2 is a conductive exterior material, 3 is a dielectric exterior material, 4 is a conductive exterior material, 5 is an insulating material, 6 is a semiconductor element, and 7 is a substrate. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
て、携帯用半導体装置は半導体素子と半導体素子
を搭載した基板とそれらを包囲し外力から保護す
る外装から構成され、上記外装は導電体のまわり
を絶縁体でおおい、さらに上記絶縁体のまわりを
上記導電体とは異なる導電体でおおつたことを特
徴とする携帯用半導体装置。 A portable semiconductor device equipped with a semiconductor element is composed of a semiconductor element, a substrate on which the semiconductor element is mounted, and an exterior that surrounds them and protects them from external forces.The exterior includes an insulator surrounding a conductor. Furthermore, the portable semiconductor device is characterized in that the insulator is further covered with a conductor different from the conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13021390U JPH0487651U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13021390U JPH0487651U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0487651U true JPH0487651U (en) | 1992-07-30 |
Family
ID=31877571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13021390U Pending JPH0487651U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0487651U (en) |
-
1990
- 1990-11-30 JP JP13021390U patent/JPH0487651U/ja active Pending
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