JPH0487349A - Method and equipment of sorting semiconductor element - Google Patents

Abstract

PURPOSE:To sort easily and quickly in the fabricating process whether or not a semiconductor element is defective by transferring to a sorting process to sort information obtained from the inspection process whether or not the semiconductor element is acceptable. CONSTITUTION:Wafer 1 loaded onto the center of the upper surface of an adhesive sheet 3 at the upper surface of a wafer ring 2 conveyed from the preliminary process is first provided with a bar code 4 at one side of the wafer ring 2 in order to discriminate each wafer 1. In the die sort process 22, a number of this bar code 4, a result of inspection of accepted and unaccepted semiconductor elements of wafer 1, and the positions of positioning pins 5 and 6 for wafer 1 are written in a floppy disk. Next, in the sorting and fabricating process 26 a bar code reader protrudent upward from the wafer stage of a wafer takeout unit reads a bar code of the wafer supplied to the wafer takeout unit, discriminates whether or not the semiconductor element signed in the die sort process is acceptable, and only the accepted elements are sent out to the next fabrication process 25.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a method and apparatus for sorting semiconductor elements.

(Conventional Technique #i) In FIG. 5 showing a process diagram of a conventional semiconductor element sorting method, a semiconductor wafer (hereinafter referred to as a wafer), not shown, sent from a previous process is first processed in a die sorting process 32. A probe (not shown) is brought into contact with the electrodes of each semiconductor element on the wafer in order to conduct an electrical test. Those semiconductor elements determined to be defective are marked with a circular mark of approximately 0.3 to llff11 using ink or a laser marker. When using ink, it is stamped in black or red and sent to the next dicing step 23.

In this dicing step 23, the wafer is cut vertically and horizontally like the edges of the substrate, and is sent to the next sorting and mounting step 33 in a state in which each semiconductor element can be separated.

Then, in this sorting and mounting step 33, after first detecting the position of each semiconductor element, the defect mark stamped in the die sorting step described above is detected by a recognition camera, processed by an image processing device, and non-defective products are sorted out. After passing through the sorting step 34, the material is supplied to the next step, such as a die bonding device.

(Problem to be Solved by the Invention) However, in the semiconductor element sorting method and apparatus for sorting out whether semiconductor elements are good or bad in such a process, a recognition camera or an image processing device is required in the sorting/mounting process 33. Therefore, not only does the equipment for the sorting/mounting process 33 become large-sized, but also the time required for one sorting process 34 means that good semiconductor devices cannot be supplied to the die bonding equipment in time, and the operating rate of the die bonding equipment decreases. There is also a risk that it may decline.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor element selection method and apparatus that can quickly and easily determine whether a semiconductor element is good or bad in a mounting process and can prevent a decrease in the operating rate of a die bonding apparatus.

[Structure of the invention]

(Means and operations for solving problem 111) One of the present inventions is an inspection process of inspecting a semiconductor wafer sent from a previous process, and cutting the semiconductor wafer inspected in this inspection process into semiconductor elements. In a semiconductor device sorting method that includes a cutting process and a sorting process in which the semiconductor elements cut in this cutting process are sorted and non-defective products are sent to the next process, information on the quality of the semiconductor elements obtained in the inspection process is transferred to the sorting process. This is a semiconductor device sorting method that can quickly and easily select good or bad semiconductor devices in the mounting process by sorting the semiconductor devices. In a semiconductor device sorting device that inspects a mounted semiconductor wafer, sorts the semiconductor devices after cutting, and sends them to the next process, a bar code is provided on the wafer ring and a transfer means is provided to transfer the inspection data to the sorting device. This makes it possible to quickly and easily select the quality of semiconductor devices during the mounting process.

(Embodiment) Hereinafter, an embodiment of the semiconductor element sorting method and apparatus of the present invention will be described with reference to the drawings. However, parts that overlap with Fig. 5 are omitted.

FIG. 1 is a process diagram of the semiconductor device sorting method and apparatus of the present invention, FIG. 2 is a diagram showing a semiconductor wafer ring of the semiconductor device sorting method of the present invention and the device, and FIG. 3 is a diagram showing a semiconductor wafer ring of the present invention. FIG. 4 is a perspective view showing a method for sorting semiconductor elements and an inspection apparatus for the apparatus according to the present invention. FIG.

1 and 2, the wafer 1 that has been transported from the previous process and placed on the center of the upper surface of the adhesive sheet 3 on the upper surface of the wafer ring 2 is first placed on one side of the wafer ring 2, as shown in FIG. Barcode 4 to identify each wafer 1
is assigned, and in the die sorting step 32, the number of this barcode 4, the inspection results of good or bad for each semiconductor element on the wafer 1, and the position of the wafer 1 with respect to the positioning pins 5 and 6 are determined via a control device, which will be described later. and written to a floppy disk, which will be described later.

Next, in the sorting/mounting step 26, a barcode reading device protruding above the wafer stage of the takeout unit, which will be described later, reads the barcode number of the wafer supplied to the takeout unit, and the semiconductors stamped in the die sorting step 22 are read. It is determined whether the elements are good or bad, and only the good ones are sent to the next process, the mounting process 25.

In the method for sorting semiconductor elements in such a process, in the sorting process 24 before the mounting process 25, the pass/fail judgment process using a recognition camera or an image processing device can be omitted, so that the semiconductor elements in the mounting process can be quickly and easily This method provides a method for selecting semiconductor devices that can determine whether the devices are good or bad.

On the other hand, in the inspection apparatus shown in FIG.
Drive motors IIA and 12A that drive the X-Y table 8A in the X and Y directions are provided on the side surfaces of the X-Y table 8A. The lower end of the wafer stage 7A, which has a substantially keyhole shape when viewed from above, is fixed, and positioning pins 5 and 6 are provided on the upper surface of the wafer stage 7A. It is placed in engagement with 6.

Furthermore, a die inspection probe head 15 with an L-shaped tip is currently extending above the wafer ring 7A, and the output signal line at the base end of this probe head 15 is connected to a separate control device 13A. It is connected to the. Also, on the top surface of the left end of wafer ring 7A.

A barcode reading device 9 is attached and protrudes from the tip of an arm (not shown) with the inspection surface facing down with a gap provided, and its output signal line is also connected to the control device 13A.

Furthermore, a wafer position detection camera 16 is provided above the probe head 15, and its output signal line is also connected to the control device 13A, and the above-mentioned drive motors IIA, 12
The input side of A is also connected to a control device 13A, and a floppy disk unit 14A is connected to this control device 13A.

In the semiconductor sorting device inspection device configured as described above, when inspecting a wafer that has been transferred from the previous process and placed on the wafer ring 2, first, the wafer ring 2 is positioned at a predetermined position on the wafer stage 7A. It is positioned and placed via pins 5 and 6.

Next, the barcode reading device 9 reads the barcode 4 provided on the top surface of the wafer ring 2, and the control device 13A reads the barcode 4 provided on the top surface of the wafer ring 2.
The data is sent to the floppy disk unit 14A via the floppy disk and written on the floppy disk.

Next, the position of the wafer 1 is detected by the wafer position detection camera 16, and the drive motor II is controlled via the control device 13A.
A and 12A are driven, and the θ axis (not shown) is also driven to correct the position of the wafer 1 to a predetermined position with respect to the probe 15. Write to floppy disk.

Next, a probe 15 is attached to the electrode of each semiconductor element on the wafer 1.
Test by touching the tip of the

The result is determined by the control device 13A, and the determined result is sent to the floppy disk unit 14A and written on the floppy disk.

On the other hand, in the sorting apparatus shown in FIG. 4, an arm portion of a die pickup unit 10 (details omitted) is rotatably provided above the wafer stage 7B, and the wafers cut in the die sorting step 22 of FIG. 1 is positioned and placed on the upper surface of the wafer stage 7B together with the wafer ring 2.

In this sorting device, similarly to FIG. 3, the barcode reader 9 first reads the barcode 4 shown in FIG. The test data and the like are transferred to the storage section of the control device 13B from which it is read. Then, the control device 13B moves the drive motors IIB and 12B according to the data, and the non-defective semiconductor elements are sequentially moved to the rotating gripping position of the gripping section at the tip of the die pickup unit 10, and the die pickup unit 10 is driven. , are sequentially supplied to a bonding section of a die bonding apparatus (not shown) in the next step.

In the above embodiment, the storage medium for the inspection results in the inspection process was a floppy disk, but other storage means may also be used, and the storage medium for the inspection results in the inspection process may be temporarily stored in either the inspection device or the sorting device. data may be transferred between these control devices.

Further, in the above embodiment, the case where the selected semiconductor elements are supplied to a die bonding apparatus has been described, but the present invention may also be applied to refilling a tray or bonding to a carrier tape.

〔Effect of the invention〕

As described above, according to the semiconductor device sorting method of the present invention, there is an inspection step of inspecting the semiconductor wafer sent from the previous step, a cutting step of cutting the semiconductor wafer inspected in this inspection step into semiconductor devices, and In the semiconductor device sorting method, which consists of a sorting process in which cut semiconductor elements are sorted and non-defective products are sent to the next process, information on the quality of the semiconductor elements obtained in the inspection process is transferred to the sorting process for selection, so that the mounting process It is possible to obtain a method for manufacturing a semiconductor device that can quickly and easily select whether the semiconductor device is good or bad.
Furthermore, according to the semiconductor element sorting apparatus of the present invention, the semiconductor element sorting apparatus inspects the semiconductor wafer transferred from the previous process and placed on the wafer ring, sorts out the semiconductor elements after cutting, and sends them to the next process. In , a bar code was attached to the wafer ring, a transfer means was provided to transfer the inspection data to the sorting device, and the inspection data was used for sorting, making it possible to quickly and easily sort out whether the semiconductor elements are good or bad using the mounting device. Accordingly, it is possible to obtain a semiconductor device sorting device that can perform the following steps.

[Brief explanation of drawings]

FIG. 1 is a process diagram showing an embodiment of the semiconductor element sorting method and apparatus of the present invention, and FIG. 2 is a process diagram showing an embodiment of the semiconductor element sorting method and apparatus of the present invention, in which a semiconductor wafer is attached to a wafer ring. FIG. 3 is a perspective view showing the semiconductor device sorting method of the present invention and an inspection apparatus for the same;
FIG. 4 is a perspective view showing a semiconductor device sorting method and a sorting device of the present invention, and FIG. 5 is a process diagram showing an example of a conventional semiconductor device sorting method and device.
- Semiconductor wafer 2... wafer ring 411. Barcode 9...Barcode reader 13A, 1
3B...control device 14A, 14B...floppy disk unit 22
... Die sorting process 23... Dicing process 24
...Selection process 25...Mounting process 26...
Selection and mounting process agent Patent attorney Noriyuki Chika Figure 2 Figure 1 Figure Figure

Claims (2)

[Claims] (1) An inspection process for inspecting the semiconductor wafer sent from the previous process, a cutting process for cutting the semiconductor wafer inspected in this inspection process into semiconductor elements, and a cutting process for cutting the semiconductor elements cut in this cutting process. In a semiconductor device sorting method comprising a sorting step of sorting and sending non-defective products to the next step, information on the quality of the semiconductor devices obtained in the inspection step is transferred to the sorting step, and the semiconductor devices are sent to the next step. A method for sorting semiconductor elements. (2) In a semiconductor element sorting device that inspects a semiconductor wafer transferred from a previous process and placed on a wafer ring, sorts semiconductor elements after cutting, and sends them to the next process, providing a bar code on the wafer ring; A semiconductor device sorting device, comprising a transfer means for transferring the inspection data to the sorting device.