JPH021141A - Probe apparatus - Google Patents

Abstract

PURPOSE:To obtain a probe apparatus which can be operated in an unmanned manner by a method wherein a type indicator formed on a semiconductor wafer is recognized by a recognition means and an exchange means used to exchange a probe card on the basis of information from this type indication is installed. CONSTITUTION:An image of a carrula code 1b as a type indication of a wafer 1a is picked up from the upper part of a TV camera 32. The carrula code 1b can be recognized by an access operation to a RAM 35 where an output of a type discriminator 33 has been stored for each address. On the basis of this information, a probe card exchange mechanism 28 is actuated by an instruction of a CPU 34, and grips a probe card 13 inside a probe cassette 37; this card is transferred to an inspection center position 10 and is inserted into a support ring 19 of a head plate 38. Thereby, a proper probe card is exchanged automatically with probe one corresponding to a type of a semiconductor wafer; the wafer can be inspected by using the probe card 13 corresponding to the semiconductor water.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a probe device.

(Prior Art) There is a semiconductor wafer inspection apparatus that inspects the electrical circuits of chips formed on a semiconductor wafer. In this semiconductor wafer inspection apparatus, an apparatus that presses a probe terminal electrode against an electrode pad of a semiconductor wafer (hereinafter referred to as a wafer) to inspect the electrical characteristics of a chip is known as a probe apparatus.

For example, JP-A-56-130936. Japanese Unexamined Patent Publication No. 1983-
It is described in Publication No. 21838.

In the above probe device, the wafer is transported from a cassette in which the wafer is stored to the inspection section, and is brought into contact with the probe needle of a probe card provided in the inspection section.

In particular, in the above-mentioned probe apparatus, it is common to test several hundred pieces of one type in a connected manner. Furthermore, when inspecting wafers of other types, the wafers are inspected after manually replacing the probe card.

(Problem to be solved by the invention) However, as the types of IC products increase,
As the production volume of products has been decreasing, there has been a demand for probe devices for small-volume, high-mix production in semiconductor wafer manufacturing.

Conventional probe devices have the disadvantage that each time the type of wafer is changed, a probe card corresponding to the wafer must be selected and manually replaced for inspection. In addition, when inspecting a large variety of wafers in small quantities, it is necessary to replace the probe card. Since this method relies on replacing the probe card manually, there is a drawback that unattended operation cannot be performed.

SUMMARY OF THE INVENTION An object of the present invention, which has been made in view of the above-mentioned conventional drawbacks, is to provide a probe device that can automatically exchange probe cards and can be operated unmanned.

[Structure of the invention]

(Means for Solving the Problems) The present invention provides a probe device that inspects electrical characteristics by providing a semiconductor wafer on a supporting surface, in which a recognition means recognizes a type indication provided on the semiconductor wafer, and from this type indication. The present invention is characterized in that an exchange means is configured to exchange probe cards based on the information.

(Function) With the configuration as described above, the type of semiconductor wafer that has arrived at the inspection section of the probe device can be extracted to determine the type of probe card.

Then, the determined probe card can be driven and controlled so as to be placed at the center of the test, thereby making it possible to perform the test.

For example, the holder reads the type of wafer from the wafer surface passed from the loader section, determines the probe card suitable for this wafer, transports this probe card from the probe card cassette, and fixes it on the top of the wafer. It is set up as follows. Then, the wafer can be moved up and down and brought into contact with the probe needles of the probe card for inspection.

In addition, based on the above wafer type, probe card (1
If 3) is replaced, there is no need to manually replace the probe card even when the types of wafers are different, and unattended inspection can be performed overnight even for a small number of different types of wafers.

(Example) Hereinafter, an example in which the probe device of the present invention is applied to a wafer prober will be specifically described with reference to one drawing.

In this embodiment, a probe card corresponding to the type of sea urchin is automatically selected, and an automatic inspection is performed using a probe card corresponding to the above-mentioned wafer type.

First, the configuration of the wafer prober of this embodiment will be explained.

As shown in FIG. 9, the wafer prober (2) is roughly divided into a loader section (2) and an inspection section (2).

The loader section (2) takes out a wafer from a cassette containing, for example, a 5-inch external evaporator, pre-aligns the wafer, and transfers it to the inspection section (2). It is transported back to the factory.

Incidentally, a keyboard (A) for inputting information for operating this device is arranged above the loader section (2).

The inspection section (■) adsorbs and fixes the wafer transported through the loader section (■) onto a chuck, and aligns the wafer by driving and controlling the chuck in the X- and Y-axis directions and in the θ rotation direction. do. By bringing the probe needles of the probe card into contact with the electrodes of the chips formed on the aligned wafer, electrical continuity can be established with an external tester (not shown). The electrical characteristics of the chips are then tested using an external tester after the wafer has been made conductive.

A microscope (2) is rotatably disposed above the inspection part (2) and is provided for preliminary observation of the contact state of the probe needle.

To further explain this inspection section (2) with reference to FIG. 8, there is a chuck drive section 0 that drives the chuck in the X-axis, Y-axis, Z-axis, and θ rotational directions, and an alignment means that aligns the wafer in one direction. It consists of ■. These can be controlled by the control means of the CPU.

Furthermore, the wafer (1a) in the wafer prober (■)
In this flow, an inspection section (2) is arranged on the side of the loader section (2), and a wafer transfer position 0 is set at the right end of this inspection section (2). Then, the receiver transports the wafer (1a) handed over from the loader section (2) to the inspection center position (10) as shown by arrow A, adds probe needle traces to the wafer, and moves the probe needle as shown by arrow B to the wafer. It is conveyed to the underside of a television camera (12) which is a recognition means for recognizing traces. here,
The lower side of the TV camera (12) is the alignment center position (1
5).

As shown in FIG. 7, after the needle mark is recognized, the θ rotation direction of the probe card (13) and the chuck (14
) of the wafer (1a
) is at the inspection center position (10)
transported to. Then, the wafer (1a) is sequentially blown.

The above is an outline of the flow of the wafer (1a) in the wafer prober ω.

The above alignment means (2) will be further explained with reference to FIG. The wafer (1a) is at the alignment position (1
It is movable between the reading position where the state reached to 5) is read by the needle trace shown by the solid line in FIG. 7, and the inspection center position (10) shown by the two-dot chain line in FIG. The movement here is carried out by the nut part (3) which is freely movable along the pole screw shaft (17a) which is rotationally driven by the motor (17).
0) is supported. The moving means is configured to be moved by driving a motor (17).

The probe needle (16) is attached to the probe card (13) at the inspection center position (10), and the ring insert (18) of the probe card (13) is inserted inside the support ring (19). There is.

The ring insert (18) and support ring (19) are rotatable. A rotator (20) provided on the outer periphery of the ring insert (18) is interlocked with a circumferential rotation mechanism (21). And CPU (8)
The above rotation is controlled by. For example, the difference between the reference value and the recognized value can be calculated by the needle trace recognition means (24), and the circumferential rotation mechanism (21) can be driven using the calculated value.

Similarly, the chuck drive unit 0 can be corrected in the X-axis direction and the Y-axis direction using a drive system corresponding to the correction value.

Above the inspection center position (10) is a television camera (12) comprising a visual recognition mechanism such as an ITV.
is provided to image the needle marks added to the electrode pads of the chips of the wafer (1a). The television signal from this television camera (12) is transmitted to the needle track discriminator (
22), where it is compared with a predetermined threshold level to determine the presence or absence of needle marks, and this needle mark information is input to C
The information is stored in each address of the RAM (23) via the PUe. The television camera (12), needle mark discriminator (22), CPU and RAM (23) are as follows:
This is an example of the needle trace recognition means (24) of the present invention.

The characteristic configuration of this actual flow side wafer prober ■ will be explained using Fig. 1.
1a) is provided with an exchange means (25) arranged to recognize the type of wafer (1a) and automatically inspect it with a probe card (13) that is compatible with this wafer (1a) and prepared in advance. .

The exchange means (25) includes a display recognition unit (26) that extracts product type information from the recognition pattern of the wafer (la) and further recognizes the type of product, and a probe card (13) corresponding to the recognized product type. ) to the inspection center position (10) and insert the support ring (19), and a probe card exchange mechanism (28) that physically moves the probe card (13). ).

That is, between the information extraction position (31) for reading the product type indication of the wafer (1a) and the inspection center position (10), there is a gap between the alignment position (15 in FIG. 7) of the wafer (1a) and the inspection center position (10). Similarly, a nut (30) fixed to the support shaft of the chuck 14 is screwed into the ball screw shaft (17a) extending horizontally, and the ball screw shaft (17a) is rotated. The chuck (14) is movable by a moving means constituted by a motor (17), and the position of the wafer (1a) on the chuck (14) is also movable.

Above the information extraction position (31), a television camera (12) consisting of a recognition means such as an ITV is installed, and type information is symbolized and displayed on the surface of the wafer (1a). A certain Carla code (1c) is to be imaged. The television signal from this television camera (32) is input to a product type discriminator (33), where it is compared with a predetermined threshold level to determine the type of product. This Carla code information is CPU (34
) are stored at each address of RAM (35). In addition, the above TV camera (32), type discriminator (33), CPU (34) and RAM (
35) is an example of the display recognition unit (26) of the present invention.

Furthermore, a control unit (13) that selects and controls the transfer of a probe card (13) that is applied to the information obtained from the type display on the wafer (1a) surface based on the product type discrimination result in the display recognition unit (26); 27) is provided.

The probe card exchange mechanism (28) is controlled by the control section (27). This probe card exchange mechanism (28) takes out the probe card (13) from the probe card cassette (37) based on the information obtained by the display recognition section (26) and places it on the head plate (38) at the inspection center position (10). This is a mechanism that is transported and inserted into the support ring (19).

To further explain the probe card exchange mechanism (28) with reference to FIGS. 2 and 3, the CPU (34
) Pre-stored in multiple other types of probe cards (13
a, 13b...) are removably placed on the stepped portion, and a transport member (39) that transports the probe card cassette (37) to the inspection center position [(10)]. It is composed of.

The probe card cassette (37) has an ejection opening (41) for taking out the probe card (13) when the stored probe card (13) is transported to the test center position (10). It is set up so that you are facing towards it.

In addition, in the cassette part on the opposite side to the above-mentioned outlet (41),
An opening is formed to allow the arm (42) of the transport member (39) to enter, take out the probe card (13) from the exit side, and transport it to the inspection center position (10). .

The conveyance member (39) transports the probe card (13) from the probe card cassette (37) to the inspection center position (10).
), and a ring insert (18) of the probe card (13) to be transported, which is movably provided at the tip of this arm (42). A gripping member (29) that grips the hollow part, and a second gripping member (29) that grips the hollow part by moving the arm up and down.
9) to another probe card (13) position.

This vertically moving member (43) includes a nut (53) fixed to the arm (42), a ball screw shaft (52) that is threaded into the nut and extends vertically, and a motor (52) that rotates the ball screw shaft. 51) and a rotation prevention member that prevents rotation of the arm (42) when the ball screw shaft (52) is rotated.

In this example, the blocking member is constituted by two pairs of vertical guide frames and a vertical hole formed in the arm and through which the guide rod passes.

As a result, the arm (4) of the transport member (39) takes out the probe card (13) from the probe card cassette (37).
2) can move forward and backward parallel to the chuck (14) surface.

As shown in FIG. 2, the gripping member (29) of this movable arm (42) grips the hollow part of the ring insert (18) and moves it from the probe card cassette (37) to the center of the test. It is designed to be driven to extend up to (10).

The arm (42) has an arm (42) as shown in FIG.
The pinion (44) and rack (45) are arranged so that the gripping member (29) constituting the solid shaft portion at the tip of 2) can move forward and backward.
is provided. Also, by rotating this pinion (44), the arm (42) can be attached to the gripping member (29).
from the probe card cassette (37 in Figure 3).

It is configured to be driven to the inspection center position (10). This drive control is executed by the CPU (34).

The gripping member (29) is movably provided and has one side configured to grip the hollow portion of the ring insert (18) by outputting a gripping force from the inside to the outside.

The negative side of the pressing block (46) is provided along the inner circumference of the hollow portion, and a rubber member serving as a friction member is fixed to this side along the circumference.

The suppression block (46) is driven in the direction of the arrow in FIG. 4 by an air cylinder (47). In order to prevent the pressing block (46) from falling, a physical member may be provided that partially lifts the pressing block (46) from the bottom to the top. Further, a guide rod (48) is provided when the suppression block (46) moves in the expanding direction and the contracting direction.

Next, the effect will be explained.

One wafer (1a) is taken out from the cassette in the loader section (2) and, after pre-alignment, is transferred to the chuck (14) in the inspection section (2). In addition, in the inspection section (■), the above-mentioned wafer (la) is inspected by the television camera (32) of the display recognition section (26).
). And, as shown in Figure 1,
The wafer (1) is viewed from above the fixed television camera (32).
In a), an image is taken of ID (49), which is the product type display, for example, the Carla code (1b).

That is, recognition of the display displayed in the Carla code (1b) of the product type display on the wafer (1a) side is performed by the product type discriminator (3).
R A M (35) where the output of 3) was recorded for each address.
can be executed by accessing That is, as shown in FIG. 5, the type of wafer (1a) can be confirmed by scanning and the arrangement of the numbers in the Carla code (1c). Based on this information, the drive motor (51) is rotated as shown in FIG. 3 under the command of the CPU (34), and the arm (42)
3) is moved up and down so as to face.

Next, as shown in FIG. 4, the binion (44) is driven and the gripping member (29) holds the probe card cassette (37).
The probe card (13) is taken out by grasping the corresponding probe card (13) inside and extending it to the inspection center position (10). Then, in the extended state, the arm (42) is lowered by the drive motor (51), and the probe card (13) is attached to the support ring (19) of the head plate (38) located at the inspection center position (10). ). Furthermore, a needle mark is added to the wafer (1a), the correction amount of the probe card (13) is detected from the needle mark, the probe card (13) is automatically corrected, and the electrode pad of the wafer (1a) is Probe needle (16)
can be inspected by touching it.

The results of this inspection are marked on the Carla code (1c) in order to identify chips that are found to be defective.

For example, if these numbers are not marked at all, it is O, if only the 1 part is marked, it is 1. If only the 1 and 2 parts are marked, it is 3, and all parts are marked. If it is marked, it represents 15.

When the marking of the Carla code (lc) as described above is completed, the wafer (1a) is unloaded from the wafer a holder by the wafer loading mechanism and is housed in the wafer cassette. On the other hand, the CPU (17) stores identification numbers as well as data (map) indicating the location of defective chips within the wafer (1a), and this map is stored on a recording medium such as a floppy disk. , or sent to a redundancy process or non-defective product selection process via a host computer or the like. and,
In these steps, the semiconductor wafer (1a) is read from the Carla code (1b) using, for example, an optical reader or the like.
The identification number is read, matched with the above map, and processing is performed according to this map.

By doing the above, the probe card (13) corresponding to the type of wafer (1a) is selected and the inspection center position (10) is selected.
Since the operation of inserting the support ring (19) into the support ring (19) is automatically performed, there is no need for manual operation, and all-night operation is possible. In addition, even if the number of probe card (13) replacement operations increases during inspection of a small number of wafers and a wide variety of wafers, since the probe card (13) is automatically replaced, the probe card (13) can be replaced manually. 13) Correction errors due to individual differences do not occur as in the case of replacement.

Furthermore, it is possible to limit the number of sheets to be inspected. For example, if you enter information that limits 20 sheets of the same type and 30 sheets of other types, only the first 20 sheets will be identified by type, and the remaining 19 sheets will be continuously inspected without identifying the type. However, it is possible to reduce the time by identifying the type of only one of the 30 sheets in the second inspection and inspecting the remaining 29 sheets without identifying the type.

Also, when determining whether a chip is good or not after the redundancy process or dicing process, the Carla code (1b) and the mark on it are never be subdivided. Therefore, it is possible to match the data (map) indicating the position of defective semiconductor chips obtained by electrical inspection using the probe device with the chips disposed on each wafer (la). For this reason,
Post-processes such as redundancy process or non-defective selection after dicing process can be performed without marking individual defective chips. Furthermore, even if marking is done with an inker, the area where the ink is likely to scatter is limited to the area around the Carla code (lb), so compared to the case where inking is done on each defective chip, It also has the effect of suppressing the occurrence of defective products due to ink scattering.

In addition, in the above embodiment, an example was explained in which the Carla code (lb) was used as the recognition pattern, but the present invention is not limited to this embodiment, and the Carla code (lb) is used as the recognition pattern.
Of course, patterns other than 1b) may be used as recognition patterns.

〔Effect of the invention〕

According to the present invention, the probe card corresponding to the type of semiconductor wafer is automatically replaced with the appropriate one, and the probe guard corresponding to the semiconductor wafer can be used for inspection, greatly reducing the burden of replacement on one worker. In addition, it is possible to inspect a wide variety of products in small quantities.

[Brief explanation of the drawing]

FIG. 1 is a block diagram illustrating exchange means in which the probe device of the present invention is applied to a wafer prober of an embodiment, and FIGS. 2 and 3 show that the conveying member of the probe card exchange mechanism used in FIG. A top view and a side view to explain the transportation from the card cassette to the inspection center position, FIG. 4 is an explanatory diagram to explain the arm and gripping member provided on the transportation member in FIG. 1, and FIGS. 5 and 6 7 is an explanatory diagram illustrating the Carla coat on the wafer surface recognized by the display recognition unit in FIG. 1, and FIG. 7 is an explanatory diagram illustrating the alignment means used in the wafer prober of FIG. 1. 8 is an explanatory diagram for explaining the system of the wafer prober shown in FIG. 1, and FIG. 9 is an explanatory diagram for explaining the appearance of the wafer prober shown in FIG. 1. 1... Wafer prober 1a... Wafer 2...
Loader section 3...Inspection section 6...Chuck drive section 7...Alignment means 8...CPU tq34, CPU, 9-Receiver is at transfer position 1
0...Inspection center position 11...Recognition means (for alignment) 12.32...
・TV camera 13--Probe card (13a, 13b) 14--
・Chuck 15...Alignment position 16
... Probe needle 18 ... Ring insert 19 ... Support ring 22 ... Needle trace discriminator 2
3... RAM 24... Needle mark discrimination means 25..., Replacement means (for probe card) 26...
・Display recognition unit 27...Control unit (for probe card) 28...Probe card exchange mechanism 29...Gripping member 30...Nut 31.
...Information extraction position (same as alignment position) 33...
・Type discriminator 35...RAM37...Probe card cassette 38...Head plate 39...Transportation member 42...
・Arm patent applicant Tokyo Electron Ltd. Geomata 1 History Means Figure Figure Figure Figure Figure Figure Figure

Claims (1)

[Claims] In a probe device for testing electrical characteristics of a semiconductor wafer provided on a supporting surface, a recognition means recognizes a product type indicator provided on the semiconductor wafer, and a probe is operated based on information from the product type indicator. A probe device comprising an exchange means for exchanging cards.