JPH0487282A - Socket for resin seal type integrated circuit element - Google Patents

Abstract

PURPOSE:To shorten the development due date and reduce the development cost by manufacturing five types of socket parts of a two-way flat package and multiple types of base substrate sections, and combining them to form a socket. CONSTITUTION:Groove sections 28 are selectively formed on a splittable base substrate section 21 integrally formed with a support plate 20 so that lead terminals 25 of a resin seal type integrated circuit(IC) element 23 to be measured can be installed, the base substrate section 21 is penetrated by the lead terminals 25, and a support plate 20 is exposed at the bottom section. Projections 29 are formed at the portions of the base substrate section 21 constituting the walls of the groove sections 28 so that the lead terminals 25 of the resin seal type IC element 23 to be measured can be brought into contact with them, and separate sections 30... are formed to secure the respective insulation state. Separate sections 27... are arranged in groove sections 22. The development cost is made minimum, and the development due date can be shortened.

Description

Detailed Description of the Invention [Objective of the Invention] (Industrial Field of Application) The present invention relates to a socket used for evaluating a resin-sealed integrated circuit device, and particularly relates to a two-way flat package (FQatPa -ckage) type (T
ype) is used to evaluate the characteristics of resin-sealed integrated circuit elements.

(Conventional technology) Integrated circuit devices, which occupy an important position in the semiconductor industry, have become increasingly highly integrated, functionally improved (Up), and diversified and realized at a faster speed (Speed). Currently, improvements are being made to meet the needs of people. In response to the progress and improvement of integrated circuit devices, the envelope is also becoming more diverse in layers and has more pins (P in ), so it is becoming more miniaturized.

Many of these integrated circuit devices are protected by a rectangular or square sealing resin layer, or an envelope, coated with a so-called transfer molding method, and outer leads (outer leads) led out to the outside. r Lead (hereinafter referred to as lead terminal) is used to connect electrically with other devices. To evaluate the characteristics of such resin-sealed integrated circuit devices, there are die sorter tests (hereinafter referred to as D/S tests) and product tests. Matches the shape of the vessel (
Match) socket is required. That is,
The pitch of the lead terminals led out from the envelope (P it c
11) If there is even one difference in the number, overall length, overall width, or dimensions of the envelope, it may be necessary to develop a special socket. Before explaining the structure of such a socket, the shape and dimensions of the envelope will be explained with reference to FIGS. 1a-d. QFP (Q
uad FQat Package) and SOP (
SmaQ 1 0ut Line Package
), but the top view of the sop is shown in Figure 1a, and the side view is shown in Figure 1a.
FIG. 1D is an enlarged view of the cross section of the lead terminal shown in FIG. 1C. As shown in FIG. 1C, the resin-sealed integrated circuit device 1 has lead terminals 3 electrically connected to the integrated circuit device (not shown) embedded in the encapsulation resin layer 2 led out. In addition, for surface mount type or lead terminal insertion type, the lead terminal 2 is attached as shown in Fig. 1d.
It is ready to be molded and inserted into equipment.

The matching characters written in each figure are based on the EIAJ standard, and the matching characters, terms, and their contents are summarized in Table 1 below.

Table 1 (blank below) Next, the main parts of the structure of the flat package socket will be explained with reference to FIGS. 2 to 4. That is, Fig. 2 shows a top view, Fig. 3 shows a cross-sectional view of the holding board in an open state, which is attached to a support that forms part of the socket so that it can be opened and closed, and Fig. 4 shows the holding board in an open state. The support body and the inside of both are shown in a perspective view. As shown in FIG. 2, the support 4
and a stopper 6 outside the holding board 5 that fixes both together.
The socket for a flat package is constructed as shown in FIG. (Only one is shown in the figure)
is installed. The end of this contactor 7... is connected to the support 4
The terminals are extended to the outside to function as measurement lead terminals 8, and the lengths of adjacent terminals are changed to avoid mistakes. In addition, the contactor 7... has an open leg portion 9.
A protrusion 10 is installed on one open leg 9 and brought into contact with the lead terminal 3 led out from the flat package, that is, the sealing resin layer 2, for measurement. In order to ensure this contact, the holding board 5 has a pair of holding parts 1.
1.11 is formed corresponding to the contactor 7, and further integrated with the stopper 6. For this purpose, an overhanging part 12 is provided at a position slightly larger than the thickness of the holding board 5, and a concave part 14 is formed at the end of the holding board 5 which fits into the convex part 13 at the end of the projecting part 12 to support the holding board 5. A body 4 is fixed together and a lead terminal 2 and a contact 7 are brought into reliable contact.

Furthermore, the holding board 5 can be opened and closed via a rod-shaped part 15 formed on the support body 4 and which operates as a fulcrum, and the stopper 6 also has a second rod-shaped part 16 which functions as a second fulcrum.
This allows the lid body 5 to be held down. FIG. 4a shows a state in which the holding board 5 is fixed to the support body 4 by the stopper 6, and FIG. 4 shows a state in which the holding board 5 is opened.

(Problems to be Solved by the Invention) (1) The dimensions of the SOP flat package shown in Table 1 are: (e) Lead terminal pitch (unit: mm) 1.27
(LFP), 1.0 (MFP), 0.8.0.6
5 (VSOP), 5 types of 0.5, ■e Outer lead row spacing 225m1Q, 300m1Q, 375m1Ω
, 45QmiQ, ■Number of test bins, ■E package width,
■If any of the dimensions of ■Ho, HE total length, total width, and ■L outer lead length are different from ■~■, a new socket will definitely be required.

(2) Since a dedicated socket is required for each flat package with different dimensions, the development cost increases.

(3) Since new sockets are constantly required, the development lead time becomes longer.

(4) The dimensions of the socket itself and the measurement lead patterns extending from the contacts all vary, making it impossible to standardize the measurement circuit.

The present invention was made under these circumstances, and in particular,
The aim is to shorten development delivery times and reduce development costs by aiming for common use and standardization of each lead terminal.

[Structure of the invention] (Means for solving problems) A base board made of an insulating material that can be separated.

a support plate installed corresponding to the base board section;

a groove portion selectively formed in the base substrate portion; a separate portion installed on the base substrate portion across the groove portion; a convex portion formed in the base substrate portion adjacent to the groove portion; and a convex portion fixed to the convex portion. A resin-sealed semiconductor element to be measured, a lead terminal of the resin-sealed semiconductor element to be measured, a contactor installed on the base substrate part so as to be connected to the lead terminal, and a rod-shaped rod-shaped semiconductor element attached to the base substrate part. and a rotatable rod.

a holding board that opens and closes together with the rod-shaped portion and holds down the lead terminals of the resin-sealed semiconductor element to be measured; a measurement terminal that electrically contacts the contacts and extends to the outside through the support plate; and the leads. The socket for a resin-sealed integrated circuit element according to the present invention has a mechanism that is formed at the boundary between the base substrate portion corresponding to the terminal and the support plate and is separable so that the base substrate portion can be fitted to each other. It has characteristics.

Further, a base substrate portion made of an insulating material and divisible, a support plate installed corresponding to the base substrate portion, and a groove portion selectively formed in the base substrate portion.

a separate part installed on the base substrate part with the groove part in between; a convex part formed on the base substrate part adjacent to the groove part; and a resin-sealed semiconductor element to be measured that is engaged with the convex part;
A lead terminal of the resin-sealed semiconductor element to be measured, a contact installed on the base substrate so as to be connected to the lead terminal, a rotatable rod-shaped part attached to the base substrate, and a rotatable rod-shaped part that opens and closes together with the rod-shaped part. and a holding board that holds down the lead terminals of the resin-sealed semiconductor element to be measured, a measurement terminal that electrically contacts the contact and extends to the outside through the support plate, and a base that corresponds to the lead terminal. A mechanism formed at the boundary between the substrate portion and the support plate and capable of fitting each other to both the divisible base substrate portion, a convex portion formed at the end of the contact and connected to the lead terminal, and the protrusion portion. The resin-sealed integrated circuit according to the present invention also includes a metal contact surface attached to the holding board portion corresponding to the above-mentioned projection, and a second projection provided on the contact longer than the projection and holding the lead terminal together with the metal contact surface. There are some characteristics of sockets for circuit elements.

(Function) In conventional sockets, it was necessary to design all new sockets from ■ to ■, but with the present invention, four types with different lead pitches (
Type) 1.27mm.

The pitch is basically 1.0 mm, 0.8 mm, 0.65 and 0.5 mm, and the test bin is manufactured with the largest pitch. By changing the width of the package, that is, the resin sealing layer, by changing the positioning holes and pins of the mechanism formed on the base plate to enable them to fit together, a two-way flat package socket for all types can be completed.

(Example) Examples according to the present invention are shown in Fig. 5 a, b, Fig. 6 a,
b, Figure 7 a, b, Figure 8 a, b, Figure 9 a, b,
c. The explanation will be made with reference to FIGS. 10 and 11, and new numbers will be added to parts that are the same as those in the prior art to aid understanding. In addition, Fig. 5 a and b.

Figure 6 aSb, Figure 8 a, b and Figure 9 a, b.

The first embodiment is shown in C, and the second embodiment is shown in FIGS. 10 and 11, and parts common to both embodiments are shown in FIGS. 7a and 7b.

In both embodiments constituting the resin-sealed integrated circuit element socket according to the present invention, the support plate 20 (see FIGS. 8a and 8b)
and a base board part 21 made of an insulator arranged correspondingly, and the base board part 21 has a contactor 22.
(See Figures 5.6.8a and 10.11), lead terminals 25 ( (See Figure 6), holding board 26, support plate 20 and base board part 21
It consists of a mechanism 27 that is installed at the boundary between the two and can be fitted together. Among the figures showing the first embodiment, Figure 5.6a,
b shows the operating state of the holding board 26, and FIGS. 8a and b
1 shows the entire resin-sealed integrated circuit element socket.

Next, the relationship among these parts and related parts will be explained.

Grooves 28 are selectively formed in the base substrate portion 21, which is formed integrally with the support plate 20 and is separable, so that the lead terminals 25 of the resin-sealed integrated circuit element 23 to be measured shown in FIG. The support plate 20 can be installed at the bottom by penetrating the base board part 21 as shown in FIG. 6a.
is exposed. A convex portion 29 is formed on the base substrate portion 21 portion constituting the wall of the groove portion 28 so that the lead terminal 25 of the resin-sealed integrated circuit element 23 to be measured can come into contact with it, and further to ensure the respective insulation state. As is clear from FIGS. 5 to 9, separate portions 30 are formed.

Therefore, in the figure, the separate parts 27 are arranged within the groove part 22.

By the way, the lead terminals 25 of the resin-sealed integrated circuit element 23 to be measured, which are held by the convex portions 28, are held down by the holding board 22, which includes a holding board 22 shown in FIGS. By attaching the restraining board 26 to the rod-like part 31 which functions as a fulcrum and can be opened and closed freely, the behavior shown in FIGS. 6a and 8a can be achieved. The detailed structure of the rod-shaped portion 31 is not directly related to the present invention and will therefore be omitted.

Furthermore, in the present application, a mechanism 27 is installed at the boundary between the support plate 20 and the base substrate section 21 so that they can fit into each other, but a convex section 28...the resin-sealed integrated circuit element to be measured is fixed between the two. It is constructed by forming positioning holes 32 and positioning pins 33 in the base substrate part 21 and the support plate 20 according to the pitch of the lead terminals 25 for each of the 23 models. Moreover, since the base board part 21 is divided into two parts, male and female pins and holes are naturally installed at equal intervals on both sides, and positioning holes 32 and positioning pins 33 that maintain a predetermined distance are formed. Therefore, there is no need to go to the trouble of making one for each pitch, which not only reduces investment costs, but also has the advantage that the width of the sealing resin can be changed.

Specifically, as shown in FIG. 8a, FIG. 9a, FIG. 10, and FIG. Furthermore, as shown in FIGS. 5a and 6a, the base substrate portion 21 is divided into two parts. The mechanisms 27 that can be fitted into each other are formed on the base substrate portion 21 and the support plate 20 corresponding to the lead terminals 25 of the resin-sealed integrated circuit element 23 to be measured.

In addition, the dimensions of the mechanisms 27 that can be fitted together are the lead row spacing 255 (
miQ), 300 (miQ), 375 (miQ)
A positioning pin 33 corresponding to a half distance of 475 (miQ) is provided on the base board part 21, and a positioning hole 32 is also formed in the support plate 20 part opposite to this, and the two are fitted and integrated. do. As a result, the lead pitch for sockets for resin-sealed integrated circuit elements is 1.27 mm.

It is sufficient to manufacture 1.0 mm, 0.8 mm, 0.65 mm, and 0.5 mm.

In a socket for a resin-sealed integrated circuit element having such a structure, the lead terminal 25 of the resin-sealed integrated circuit element 23 to be measured is connected to the holding plate substrate 26 and the contactor 22, as shown in Figure 5.6. It is fixed to the convex portion 29 and a predetermined measurement is performed. A plurality of these contactors 22 are formed corresponding to each lead terminal 25, and the separator 30 is arranged between them as described above to ensure mutual insulation. As shown in the figure, the contactor 22 is composed of a pair of open legs 34 and 34 connected at one end, and the tip thereof is led out of the support plate 20 in preparation for connection with other equipment. Care was taken to ensure that measurements were made by changing the length.

In this way, the contact 22 for electrical measurement is naturally made of a conductive metal, and a protrusion 35 is formed at the end of one open leg 34 to ensure that the lead terminal 25 engaged with the protrusion 28 Connect to. As shown in the prior art section, the lead terminals 25 are bent twice at right angles and the straight portions are made flat, so that reliable contact can be achieved by pressing with the holding board 26.

In the embodiment according to FIGS. 10 and 11, two protrusions 35 are provided.
and the second protruding portion 35', and a metal contact surface 36 is also installed on the corresponding holding board 26 part to change the connection with the lead terminal 25 from a point contact to a surface contact, thereby lowering the contact resistance. are doing.

Furthermore, as shown in FIG. 9C, the end of one of the open legs 34 of the contactor 21 has a double structure to increase the elastic limit, thereby improving reliability. The connected part is extended and led to the outside to function as a measurement lead 37.

[Effects of the invention] Taking a two-way flat package as an example, if five types of socket parts and multiple types of base board parts are manufactured and combined to form a socket, it is possible to measure almost all types of two-way flat package integrated circuit elements. become. Therefore, ■ - You are freed from socket development for each type, and ■ Development costs (Cost) are reduced.
) is minimized, and ■ there are no restrictions on development delivery time. Furthermore, contact errors between the lead terminal of the resin-sealed integrated circuit element to be measured and the socket for the resin-sealed integrated circuit element are eliminated, and the contact resistance is reduced, making it possible to correct the problem. It has the advantage of being able to perform accurate and highly reliable measurements.

[Brief explanation of the drawing]

FIG. 1a is a top view of the resin-sealed integrated circuit element to be measured, FIG. 1 is a side view of FIG. 1a, FIG. 1C is a cross-sectional view of FIG. 1a, and FIG. Figure 1 is an enlarged view of a portion of Figure 2. Figure 2 shows the open state of the holding board of a conventional resin-sealed integrated circuit element socket. Perspective view in open state, Figures 5a and b
6a and 6b are a partial sectional view and a top view of a socket for a resin-sealed integrated circuit element according to the present invention, and FIG. 7aXb
8A and 8B are cross-sectional views and top views showing essential parts of a resin-sealed integrated circuit device socket according to the present invention, and FIGS. 8a and 8b are cross-sectional views and top views of the resin-sealed integrated circuit device socket according to the present invention. Figures 9a, b, and c are other cross-sectional views, a top view, and an enlarged cross-sectional view of essential parts of a resin-sealed integrated circuit element socket according to the present invention, and Figures 10 and 11 are according to the present invention. FIG. 3 is a sectional view of another embodiment of the invention. 1.23: Resin-encapsulated integrated circuit element to be measured, 2.24:
Sealing resin layer, 3.25: Lead terminal, 4.21: Base board part, 5.26: Suppression board, 6: Stopper 20, support plate, 7.22: Contact, 8.37: Measurement lead, 9.34. Spreading part, 10.35.35': Protruding part, 11: Suppressing part, 12: Overhanging part, 13.2
9. Convex portion, 14: Concave portion, 27: Fitting mechanism
28: Groove portion, 30, Separator, 15.16.31 Rod-shaped portion, 32: Positioning pin, 33. Positioning hole, 36: Metal contact surface.

Claims (2)

[Claims] (1) A base board part made of an insulating material and divisible, a support plate installed corresponding to the base board part, a groove part selectively formed in the base board part, and a base board part sandwiching the groove part. a separate part installed in the base substrate part adjacent to the groove part, a convex part formed on the base substrate part adjacent to the groove part, a resin-encapsulated semiconductor element to be measured that is engaged with the convex part, and a lead of the resin-encapsulated semiconductor element to be measured. a terminal, a contact element installed on a base substrate portion so as to be connected to the lead terminal, a rotatable rod-shaped portion attached to the base substrate portion, and a rotatable rod-shaped portion that opens and closes together with the rod-shaped portion and is connected to a resin-sealed semiconductor element to be measured. A holding board that holds down the lead terminal, a measurement terminal that electrically contacts the contact and extends to the outside through the support plate, and a boundary portion between the base board portion and the support plate that correspond to the lead terminal. A socket for a resin-sealed integrated circuit element, characterized in that both of the divisible base substrate parts are provided with a mechanism that allows them to be fitted to each other. (2) a base board part made of an insulating material and which can be divided; a support part installed corresponding to the base board part; a groove part selectively formed in the base board part; and a base board part sandwiching the groove part. a separate part installed in the base substrate part adjacent to the groove part, a convex part formed on the base substrate part adjacent to the groove part, a resin-encapsulated semiconductor element to be measured that is engaged with the convex part, and a lead of the resin-encapsulated semiconductor element to be measured. a terminal, a contact installed on a base substrate so as to be connected to the lead terminal, a rotatable rod-shaped section attached to the base substrate, and a resin-sealed semiconductor element to be measured that opens and closes together with the rod-shaped section. A holding board that holds down the lead terminal, a measurement terminal that electrically contacts the contact and extends to the outside through the support plate, and a boundary portion between the base board portion and the support plate that correspond to the lead terminal. and a mechanism that makes it possible to fit each other into both sides of the divisible base board, a protrusion formed at the end of the contact and connected to the lead terminal, and a metal contact attached to the holding board part corresponding to the protrusion. A socket for a resin-sealed integrated circuit element, characterized in that the socket has a second protrusion that is provided on the contact and is longer than the protrusion and that holds the lead terminal together with the metal contact surface.