JPH0142951Y2 - - Google Patents

Description

[Detailed explanation of the idea] Industrial applications This invention relates to a socket for electronic components.

BACKGROUND OF THE INVENTION Recent advances in semiconductor electronic components, especially LSI technology, have been remarkable, and highly integrated LSI elements have been developed. For example, multiple rows of leads are arranged around the four sides of a flat rectangular mold.
An example is an LSI element (for example, a PGA type LSI element).

Such an electronic component is comprised of a special package consisting of the leads and a molded part in which the leads are embedded, and a semiconductor pellet embedded within the package. A so-called handler used in the electronic component inspection process uses a socket exclusively for the electronic component. As shown in FIGS. 2a and 2b, this dedicated socket has a structure in which a plurality of rows of contact pins 20 are embedded around the four sides of an insulating substrate 10 in correspondence with the lead positions of electronic components. This contact pin has a lead insertion hole 21 open therein, and a contact piece (not shown) made of, for example, phosphor bronze is provided inside the lead insertion hole 21, and the lead of the electronic component is sandwiched between the contact pieces to make contact. It is configured to make an electrical connection between the pin 20 and the electronic component.

Problems that the invention aims to solve However, because of the high degree of integration, the number of leads in electronic components such as those mentioned above is significantly greater than in ordinary devices. Therefore, when inserting the lead into the socket, the insertion pressure is very large, and if you try to force the lead into the socket, there is a problem that the contact piece or the lead of the electronic component will be deformed.

Another problem is that as the insertion is repeated many times, the deformation occurs and poor contact occurs at that portion, making it impossible to accurately measure the characteristics of the electronic component.

This invention was devised in view of the above circumstances, and the purpose is to provide a new socket for electronic components that does not cause deformation or poor contact at the contact part even when the lead is inserted and removed many times. There is.

Means for Solving the Problems The socket of this invention includes an insulating substrate and a plurality of contact pins attached to the insulating substrate into which leads of electronic components are inserted, and the contact pins are electrically conductive. a holder consisting of a body, a movable terminal consisting of an electrical conductor provided slidably in the axial direction in a hole of the holder, and a movable terminal provided in the hole of the holder electrically connecting the holder and the movable terminal; The movable terminal is provided with a spring that resiliently urges the movable terminal toward the electronic component, and the movable terminal is provided with a lead insertion recess having an inner diameter larger than the outer diameter of the lead of the electronic component.

Operation: The lead of the electronic component is inserted into the lead insertion recess of the movable terminal of the contact pin. In that case, in order to ensure electrical connection between the two, the electronic component is pressed against the socket using appropriate pressing means.

Embodiment FIG. 1 shows a contact pin of this invention. That is, a plurality of rows (two rows in the figure) of contact pins 40 are arranged around the four sides of an appropriately shaped insulating substrate 30.
are buried corresponding to the leads of electronic components.
The tip 41 of the holder 41 of this contact pin 40
1 is fixed to a land provided on the back side of the insulating substrate 30 by soldering or other means.
31 is a connector, and the terminal 311 of this connector 31 and the land are connected by printed wiring or lead wires (not shown). Connector 31
is connected to a measuring device (not shown).

FIG. 3 is a detailed sectional view of the contact pin 40. The contact pin 40 includes a holder 41 made of an electrical conductor, a movable terminal 42, and a spring 4.
It has 3. That is, the holder 41 is formed in an elongated convex shape, and a hole 412 is formed in the holder 41, and the movable terminal 42 is housed in the hole 412. Note that an inwardly bent taper 413 is formed at the tip of the hole 412 so that the movable terminal 42 does not protrude. Therefore, the movable terminal 4
2 is in a state where it can freely slide in the axial direction within the hole 412. The movable terminal 42 has a lead insertion recess 4.
21 is opened, and the inner diameter of this recess 421 is set larger than the outer diameter of the lead of the electronic component to be inserted. For example, the outer diameter of the lead insertion recess 421 should be reduced by about 20% compared to the outer diameter of the lead.
It is appropriate to increase the size by ~50%.

Furthermore, the bottom of the recess 421 is formed into a mortar shape as shown. Therefore, when a lead of an electronic component is inserted into the lead insertion recess 421, the tip of the lead always comes into contact with the bottom of the recess 421, so that good contact between the lead and the movable terminal 42 can be ensured.

43 is a spring, and the spring 43 is inserted between the bottom of the hole 421 of the holder 41 and the movable terminal 42, and therefore serves to elastically bias the movable terminal 42 toward the lead side of the electronic component; It has the role of electrically connecting the movable terminal 42 and the holder 41.

That is, the spring 43 has its tip connected to the movable terminal 4.
2 by welding or brazing, while the other end may be similarly fixed to the holder 41, or by simply inserting it into the hole 412, such fixing means can be used. There is no need to intervene.

After the electronic component is inserted into the socket, the electronic component is pressed from above, and a known pressing means can be used for this purpose.

Effects of the invention This invention replaces the contact piece in the conventional technology.
While the movable terminal is supported by an elastic biasing means such as a spring, a recess is provided in the movable terminal, and the inner diameter of the recess is set to be larger than the outer diameter of the lead of the electronic component.

Therefore, even if the lead is inserted many times, there will be no deformed portion, and furthermore, no large pressing force is required for insertion. Therefore, there is no risk of poor conduction occurring between the lead and the socket.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of one embodiment of this invention, Fig. 2a is a conventional socket for electronic components, and Fig. 2b is a perspective view of a conventional socket for electronic components.
FIG. 3 is a cross-sectional view taken along the line A--A in Figure a, and a vertical cross-sectional view of the contact pin. 30...Insulating substrate, 40...Contact pin,
41...Holder, 42...Movable terminal, 43...Spring.

Claims (1)

[Scope of utility model registration request] It is equipped with an insulating substrate, and a plurality of contact pins that are attached to the insulating substrate and into which leads of electronic components are inserted, and the contact pins are arranged in a holder made of an electrically conductive material and inserted into a hole of the holder in an axial direction. a movable terminal made of an electrical conductor that is slidably provided on the holder, and a spring that is provided in the hole of the holder to electrically connect the holder and the movable terminal and elastically bias the movable terminal toward the electronic component side. 1. A socket for an electronic component, characterized in that the movable terminal is provided with a lead insertion recess having an inner diameter larger than the outer diameter of the lead of the electronic component.