JPS6029819Y2 - Structure of high-density connector for LSI module - Google Patents

Description

[Detailed description of the invention] The present invention relates to the configuration of a high-density circuit unit in which a plurality of ceramic packages containing LSI modules are mounted on a motherboard, and particularly relates to an interconnection structure that is highly reliable and enables high-density coupling. .

In high-performance electronic devices such as large computers, it has become common to connect multiple ceramic packages housing 6 chips in a high density to a motherboard to form a high-density unit circuit. .

The ceramic package and the motherboard are connected by a conventional connector.

That is, as shown in FIG.
A plurality of contact pins C with a square pitch of /m are derived, and a contact sleeve e is disposed in a predetermined through hole of the motherboard d, facing the contact pins C. The contact pin group is engaged with the contact sleeve group. The connector structure was to do so.

To explain the shape of the pair of contact parts in more detail, as shown in FIG. 2, the contact sleeve e to be engaged with the contact pin C forms a two-piece collet jack with the slotted groove f. The tail end pin g is engaged with a predetermined through hole of the motherboard d.

However, in plug-in contact connectors with such a configuration, the insertion/extraction force to obtain a predetermined contact pressure on the contact parts tends to be large, and in particular, the arrangement pitch error of the opposing contact parts may cause the insertion/extraction force to increase. This has the disadvantage that the force is further increased and the contact is uneven, resulting in a lack of contact reliability.

The object of the present invention is to correct the above-mentioned drawbacks and provide a high-density connector structure that is highly reliable and enables high-density ink connection between an LSI package and a motherboard.

The present invention provides a high-density connector structure in which a plurality of contacts led out to a ceramic substrate of an LSI module are brought into contact with contact pins installed in predetermined through holes of a motherboard. A hemispherical contact made of a soft low-melting point alloy is welded to the motherboard, and the tip of a contact pin planted on the motherboard is formed into a cylindrical point, and the contact pin and the contactor are opposed to each other. The present invention is characterized in that the contactor is provided with means for holding the contactor in pressure contact with the motherboard, thereby plastically deforming the contactor and press-fitting the tip of the contact pin.

Next, preferred embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 3 is a side view showing the structure of a unit contact element of a connector according to the present invention, and FIG. 4 is a partially sectional side view showing the engagement state of the element.
Butt pattern 3 of the circuit to accommodate and lead out to the other side
4 is a hemispherical contact made of a soft low-melting point metal, and 5 is a contact pin planted on a motherboard 6.

In the figure, reference numeral 1 denotes a ceramic package that houses an LSI chip 2 on one side and has a butt pattern 3 in a predetermined lattice arrangement derived from the LSI chip 2 on the other side.

Then, on the bat pattern, a soft low melting point alloy having base metals of i, In, and Pb is deposited in a hemispherical shape as shown in the following table, for example, to form the contact 4.

Further, a sharp vertebral cusp 51 is formed on the head of the contact pin 5 which engages a lead pin 52 in a group of through holes facing the contactor 4 of the motherboard 6 made of a resin substrate.

The connector of the present invention is further provided with a clamp mechanism (not shown) that positions and presses these contact element units.

In such a connector, when the connector is engaged, a plastically deformed contact 4' is formed in which the tip 51 of the contact pin is press-fitted into the contact 4 and embedded in it, as shown in Fig. 4. This makes it possible to ensure contacts with low electrical resistance and excellent dust and rust resistance.

In addition, the contact 4' that was generated when this connector was disconnected
If the concave traces are heated with a hot air heater, etc., they will be restored to the state of 4 by surface tension, so they are highly reproducible, and since the contacts are formed by matching the actual items, pitch differences between the contact elements will not be a problem.

As explained above, the present invention has the effect of providing a connector structure with extremely high reliability and excellent reproducibility.

[Brief explanation of the drawing]

1 and 2 are schematic diagrams illustrating the structure of a conventional connector, and FIGS. 3 and 4 are partially sectional side views showing the structure of a unit contact element of a connector according to the present invention. In the figure, 1 is a ceramic substrate, 2 is an LSI chip,
3 is a pattern bat, 4 is a contact, 5 is a contact pin, and 6 is a motherboard.

Claims (1)

[Scope of utility model registration request] In the structure of a high-density connector in which a plurality of contacts led out to a ceramic substrate of an LSI module are brought into contact with contact pins planted in predetermined through holes of a motherboard, a soft low-density connector is attached to a patterned butt on the surface of the ceramic substrate. A hemispherical contact made of a melting point alloy is welded, and the tip of a contact pin set on the motherboard is shaped into a cylindrical point, and the contact pin and the contact are opposed to each other, and the ceramic substrate is attached to the ceramic substrate. 1. A structure of a high-density connector for an LSI module, characterized in that the contacts are plastically deformed to press-fit the tips of the contact pins by providing means for press-fitting and holding the contacts to a motherboard.