CN2395398Y - Electric connector - Google Patents

Electric connector Download PDF

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Publication number
CN2395398Y
CN2395398Y CN99226264U CN99226264U CN2395398Y CN 2395398 Y CN2395398 Y CN 2395398Y CN 99226264 U CN99226264 U CN 99226264U CN 99226264 U CN99226264 U CN 99226264U CN 2395398 Y CN2395398 Y CN 2395398Y
Authority
CN
China
Prior art keywords
electric connector
spherical
terminal
insulating body
scolder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN99226264U
Other languages
Chinese (zh)
Inventor
林有旭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Kunshan Computer Connector Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Foxconn Kunshan Computer Connector Co Ltd
Application granted granted Critical
Publication of CN2395398Y publication Critical patent/CN2395398Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/0949Pad close to a hole, not surrounding the hole
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10325Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10734Ball grid array [BGA]; Bump grid array
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3436Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The utility model relates to an electric connector, which is provided with an insulating body, the inner part of which is provided with a plurality of passages used for containing corresponding number of terminals, each terminal comprises a needle column-shaped pin part which is extended out of the lower surface of the insulating body with a definite distance, so the lower surface of the insulating body is provided with an inserting member having the characteristics which are the small or similar with the characteristics of a circuit motherboard used for installing the utility model. The inserting member is provided with a plurality of holes, each hole and the corresponding containing passage are aligned into a line, so that the tail end part of the pin part of each terminal can enter and pass through the corresponding hole. The lower surface of the inserting member at the side parts of the holes is connected with ball-shaped solder, a circuit track is arranged between the ball-shaped solder and the corresponding hole, and the ball-shaped solder and the holes are electrically connected.

Description

Electric connector
The utility model relates to and a kind ofly has spherical array package type in its bottom side (Ball GridArray, the BGA) electric connector of terminal refer in particular to a kind of plant part that is provided with in its bottom side and be beneficial to spherical scolder and plant electric connector on it in advance.
CPU (CPU) is the necessary element in the PC.For cooperating the economic factor of considering circuit board manufacturer and the following upgrade requirement that satisfies the user, CPU electrically connects with a female type electric connector and main circuit board usually.Relevant therewith existing electric connector for socket can be with reference to United States Patent (USP) the 5th, 399,108,5,489,218 and 5,679, No. 020 etc., wherein the former is the one chip insulating body, so that low insertion force (Low Insertion Force, connection LIF) to be provided, in addition both then for the two-piece type insulating body so that zero insertion force (Zero Insertion Force, connection ZIF) to be provided.In recent years, (these tradition had pin column type terminal and will no longer continue to produce with the electric connector for socket that the wave soldering mode is connected on the circuit board for Surface Mounting Technology, SMT) in vogue because the surface adhering technology.
For some has circuit package wafer with the circuit board similar features, use the spherical part that connects, be spherical array package (Ball Grid Array, BGA) mode, to utilize surface adhering technology (SMT) to be mounted on the circuit has been a kind of mature technique, therefore just produced a kind of below the basal surface of electric connector for socket bonding spherical contact jaw pin, promptly spherical scolder is to replace conventional needle column terminal tails.But so still can produce some problems, the material that subject matter is circuit board and electric connector for socket is different, spherical scolder is planted to be connected to will run into the difficult problem that some is produced on the electric connector for socket basal surface.In addition, electric connector for socket is made by ejection formation, and it is made with precision and circuit board with closed tolerance is compared and originally just had than high tolerance, will cause planting some location and copline problem when receiving the shape scolder and electric connector for socket is original than high tolerance; Moreover, because circuit board has different material behaviors with electric connector for socket, thereby at electric connector for socket and utilize spherical scolder to install between the circuit board of itself, because thermal expansion (Coefficient of Thermal Expansion, CTE) different inconsistent phenomenons of being derived will produce overstress on spherical scolder, like this under the cycling that starts or close, especially manufacturer carried out before selling the life cycle temperature test time can cause breaking of spherical scolder.
The utility model purpose is to provide a kind of electric connector, it is provided with spherical array package type (Ball Grid Array in the bottom side, BGA) terminal deploying, utilize spherical contact portion, be spherical scolder, thus avoid with the circuit board that itself is installed between because the different dislocation misalignment problems of deriving of thermal coefficient of expansion.
The purpose of this utility model is achieved in that and comprises tool by the utility model several accommodate passage to accommodate the insulating body of corresponding number terminal, every butt comprises the pin column terminal pin portion of extending the outer certain distance of insulating body lower surface, the lower surface of insulating body is provided with the plant part, it has identical or akin characteristic with settling circuit motherboard of the present utility model, in the plant part, be provided with several holes to align being aligned and to make the terminal part of each terminal pin portion can enter and pass corresponding perforations with the corresponding passage of accommodating, spherical scolder is then planted and is connected on the hole plant part lower surface on every side, and be provided with circuit trace to electrically connect the two between the hole of each spherical scolder and correspondence, the pin portion of each terminal can utilize the wave soldering course of processing to be plugged in the corresponding hole of plant part, and is finally electrically connected by circuit trace between spherical scolder and this hole and spherical scolder.Like this, earlier to several spherical solder reflow heating, make again to be cured just the utility model to be connected behind the spherical scolder partial melting be welded on the circuit board.
Owing to adopt such scheme, make the utility model adopt technology reliable and that empirical tests is crossed, promptly between terminal pins column afterbody and plant part, use traditional wave soldering course of processing, and use tradition that spherical scolder is planted technology on the circuit sheet material that is connected to circuit board or identical material, to replace in the prior art spherical scolder is directly planted the instability on electric connector for socket, uncontrollable processing procedure.Simultaneously, because plant part and circuit board are same material, fracture phenomena will no longer take place in spherical scolder because of thermal coefficient of expansion is different near its join domain separately.With existing spherical array package type (BGA) electric connector for socket, the situation that is about on the lower surface that spherical scolder directly is installed on insulating body is compared, the utility model can prevent from starting or closing the circulation change of Yin Wendu in the closed procedure and the thermal stress fatigue phenomenon that causes, and can strengthen the reliability of pad relatively.
The utility model is described in further detail below in conjunction with drawings and Examples.
Fig. 1 is the amplification view of the utility model structure;
Fig. 2 is the amplification bottom view of plant part bottom surface section structure of the present utility model;
Fig. 3 is the amplification view of the utility model group local structure when circuit motherboard.
Understand for ease of clear, the most of similar elements during the present embodiment difference is graphic all indicates identical reference drawing number.As depicted in figs. 1 and 2, electric connector 10 comprises that being provided with several accommodates passage 14 insulating body 12 of (only showing among the figure), this accommodates the terminal 16 of passage 14 in order to accommodate corresponding number, the upper portion of this terminal 16 (not shown) then with needle-like array package (Pin GirdArray, PGA) the conducting end pin of the wafer module contact that matches, and the pin portion 18 of terminal 16 extends outside the lower surface 20 of insulating body 12.
Plant part 22 is arranged on the below of insulating body 12, it comprises respectively the hole 24 that passage 14 aligns being aligned mutually of accommodating with corresponding insulating body 12, so that the terminal part 19 of the pin portion 18 of terminal 16 is still extensible by wherein in traditional wave soldering course of processing.
On the lower surface 28 of plant part 22 holes 24 sides, plant and be connected to spherical scolder 26, and spherical scolder 26 and hole 28 between be provided with the usefulness of circuit trace 30 to electrically connect as both.
The method that has two kinds of combined insulation bodies 12 and plant part 22 in the present embodiment.First method is at first spherical scolder 26 to be planted on the lower surface 28 that is connected to plant part 22, covers spherical scolder 26 then, makes the terminal part 19 of the pin portion 18 of terminal 16 pass corresponding hole 24 respectively and is welded in the corresponding hole 24 with the wave soldering course of processing.Second method then is connected in the terminal part 19 of spherical scolder 26 and terminal 16 pin portions 18 on the plant part 22 simultaneously, wherein the soldering paste material is coated in earlier near the link position of spherical scolder 26 and hole 24 on this lower surface 28, the terminal part 19 of spherical scolder 26 and terminal 16 pin portions 18 is contacted with the soldering paste material, with solder reflow process the terminal part 19 of spherical scolder 26 and pin portion 18 can be fixed on the plant part 22 at last.
Again as shown in Figure 3, after electric connector 10 is made, whole electric connector 10 can be made each spherical scolder 26 reciprocation and is fixed in corresponding leading on the mat 102 by another time reflow soldering course of processing, and electric connector 10 is directly installed on the circuit motherboard 100.Like this, terminal 16, circuit trace 30 and 26 in spherical scolder can set up by needle-like array package type CPU (CPU, not shown) connect styletable to the circuit motherboard 100 connection pad 102 and the transmission path of corresponding circuits.

Claims (5)

1. electric connector, it utilizes the surface adhering technology groups to be connected on the circuit board, comprise insulating body and several terminals of accommodating wherein, it is characterized in that: below insulating body, be provided with the plant part, itself and circuit board have the close material of performance, be connected to several spherical scolders and plant on the lower surface of plant part, described each spherical scolder all constitutes with corresponding terminal and electrically connects.
2. electric connector according to claim 1, the part that it is characterized in that planting comprise that further several are located at the hole around the spherical scolder respectively, and the terminal part of each terminal places in the corresponding hole.
3. electric connector according to claim 2 is characterized in that being provided with circuit trace between each spherical scolder and its corresponding hole.
4. electric connector according to claim 3, it is certain for moving to it is characterized in that spherical scolder and corresponding terminal exist in vertical direction.
5. electric connector according to claim 4, the hot property of the novel circuit board of part and this reality of assembling that it is characterized in that planting is close.
CN99226264U 1998-08-20 1999-04-13 Electric connector Expired - Fee Related CN2395398Y (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13698098A 1998-08-20 1998-08-20
US09/136,980 1998-08-20

Publications (1)

Publication Number Publication Date
CN2395398Y true CN2395398Y (en) 2000-09-06

Family

ID=22475300

Family Applications (1)

Application Number Title Priority Date Filing Date
CN99226264U Expired - Fee Related CN2395398Y (en) 1998-08-20 1999-04-13 Electric connector

Country Status (3)

Country Link
US (1) US6257904B1 (en)
CN (1) CN2395398Y (en)
TW (1) TW395601U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102760983A (en) * 2011-04-28 2012-10-31 亚旭电脑股份有限公司 Connector with a locking member
CN108695606A (en) * 2017-03-31 2018-10-23 泰科电子日本合同会社 Socket
CN112751226A (en) * 2019-10-29 2021-05-04 泰科电子日本合同会社 Socket with improved structure

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6394819B1 (en) 1998-10-29 2002-05-28 The Whitaker Corporation Dielectric member for absorbing thermal expansion and contraction at electrical interfaces
US6692269B2 (en) * 2000-12-15 2004-02-17 Di/Dt, Inc. Circuit module with universal connectivity
US6776623B1 (en) * 2001-06-11 2004-08-17 Picolight Incorporated Transceiver mounting adapters
AU2002235716A1 (en) * 2001-12-07 2003-07-09 Infineon Technologies Ag Electro-optical transmission module
CA2409912C (en) 2002-10-25 2008-04-01 Ibm Canada Limited-Ibm Canada Limitee Improvements in grounding and thermal dissipation for integrated circuit packages
TW200743268A (en) * 2006-05-02 2007-11-16 Hon Hai Prec Ind Co Ltd Electrical connector
JP5869282B2 (en) * 2011-10-03 2016-02-24 タイコエレクトロニクスジャパン合同会社 Electrical connector
JP2015049986A (en) * 2013-08-30 2015-03-16 富士通株式会社 Connector and manufacturing method therefor
US10218098B1 (en) * 2017-08-28 2019-02-26 Finisar Corporation Module mount interposer
US10348015B2 (en) 2017-11-13 2019-07-09 Te Connectivity Corporation Socket connector for an electronic package

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4349862A (en) * 1980-08-11 1982-09-14 International Business Machines Corporation Capacitive chip carrier and multilayer ceramic capacitors
US5691041A (en) * 1995-09-29 1997-11-25 International Business Machines Corporation Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer
TW392975U (en) * 1998-09-29 2000-06-01 Hon Hai Prec Ind Co Ltd Electrical connector

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102760983A (en) * 2011-04-28 2012-10-31 亚旭电脑股份有限公司 Connector with a locking member
CN108695606A (en) * 2017-03-31 2018-10-23 泰科电子日本合同会社 Socket
CN112751226A (en) * 2019-10-29 2021-05-04 泰科电子日本合同会社 Socket with improved structure
CN112751226B (en) * 2019-10-29 2024-05-31 泰科电子日本合同会社 Socket

Also Published As

Publication number Publication date
TW395601U (en) 2000-06-21
US6257904B1 (en) 2001-07-10

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee