JPH0482187B2 - - Google Patents
Info
- Publication number
- JPH0482187B2 JPH0482187B2 JP25768686A JP25768686A JPH0482187B2 JP H0482187 B2 JPH0482187 B2 JP H0482187B2 JP 25768686 A JP25768686 A JP 25768686A JP 25768686 A JP25768686 A JP 25768686A JP H0482187 B2 JPH0482187 B2 JP H0482187B2
- Authority
- JP
- Japan
- Prior art keywords
- masking agent
- coating layer
- solder masking
- substrate
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003795 chemical substances by application Substances 0.000 claims description 43
- 230000000873 masking effect Effects 0.000 claims description 42
- 229910000679 solder Inorganic materials 0.000 claims description 42
- 239000011247 coating layer Substances 0.000 claims description 39
- 239000010410 layer Substances 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000001993 wax Substances 0.000 description 15
- 239000000919 ceramic Substances 0.000 description 5
- 238000010924 continuous production Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 235000014676 Phragmites communis Nutrition 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Ceramic Capacitors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25768686A JPS63110760A (ja) | 1986-10-29 | 1986-10-29 | 電子部品及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25768686A JPS63110760A (ja) | 1986-10-29 | 1986-10-29 | 電子部品及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63110760A JPS63110760A (ja) | 1988-05-16 |
| JPH0482187B2 true JPH0482187B2 (enExample) | 1992-12-25 |
Family
ID=17309698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25768686A Granted JPS63110760A (ja) | 1986-10-29 | 1986-10-29 | 電子部品及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63110760A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04217107A (ja) * | 1990-12-17 | 1992-08-07 | Murata Mfg Co Ltd | 圧電共振素子の製造方法 |
| JP3435637B2 (ja) * | 2000-06-27 | 2003-08-11 | 株式会社村田製作所 | 電子部品の製造方法 |
-
1986
- 1986-10-29 JP JP25768686A patent/JPS63110760A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63110760A (ja) | 1988-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |