JPH0481193B2 - - Google Patents
Info
- Publication number
- JPH0481193B2 JPH0481193B2 JP58245107A JP24510783A JPH0481193B2 JP H0481193 B2 JPH0481193 B2 JP H0481193B2 JP 58245107 A JP58245107 A JP 58245107A JP 24510783 A JP24510783 A JP 24510783A JP H0481193 B2 JPH0481193 B2 JP H0481193B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- chip
- display panel
- electrode
- isotropic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910044991 metal oxide Inorganic materials 0.000 claims description 7
- 150000004706 metal oxides Chemical class 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000000605 extraction Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000010408 film Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000011521 glass Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、透明電極板から構成される表示パネ
ルに駆動用導体装置を直接実装した表示パネルモ
ジユールに関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a display panel module in which a driving conductor device is directly mounted on a display panel composed of a transparent electrode plate.
（従来の構成とその問題点）
透明電極（以下ITOという。）が形成された２
枚のガラス板からなる表示パネル（例えば液晶パ
ネル）に、駆動用の導体装置（以下チツプとい
う。）を実装する場合は、先のITO電極上にメタ
ライズするとともに、チツプのアルミ電極パツド
にもハンダバンプを形成しなければならなかつ
た。これら両者の接続は、チツプのアルミパツド
上に設けられたハンダバンプによつて、いわゆる
ハンダ付けによつて行うものである。従つてITO
のように金属酸化物導電膜上にはハンダ付けでき
ない。そのためITO上にはハンダ付けを可能とす
るため、クロム、金、ニツケルなどによるメタラ
イズ処理しなければならない。一方、チツプのア
ルミパツド部にハンダバンプを設けるためには、
チタン、クロム、銅の薄膜上にハンダメツキまた
は錫メツキと鉛メツキの二層を施さなければなら
ない。このように、液晶パネルの引出し電極であ
るITO上へチツプを実装するめには、ITOのメタ
ライズや、チツプのアルミパツド部へのバンプ形
成など、複雑なプロセスが必要であり、歩留まり
の低下、製品コストのアツプなど多くの問題点を
有するものである。(Conventional configuration and its problems) Transparent electrode (hereinafter referred to as ITO) is formed 2
When mounting a driving conductor device (hereinafter referred to as a chip) on a display panel (for example, a liquid crystal panel) made of two glass plates, metallize the ITO electrodes and also solder bumps on the aluminum electrode pads of the chip. had to be formed. These two connections are made by so-called soldering using solder bumps provided on the aluminum pads of the chips. Therefore ITO
It is not possible to solder onto a metal oxide conductive film like this. Therefore, to enable soldering on ITO, it must be metallized with chrome, gold, nickel, etc. On the other hand, in order to provide solder bumps on the aluminum pad of the chip,
Two layers of solder plating or tin plating and lead plating must be applied on a thin film of titanium, chromium, or copper. In this way, mounting a chip onto ITO, which is the lead electrode of a liquid crystal panel, requires complex processes such as metallizing the ITO and forming bumps on the aluminum pad of the chip, resulting in lower yields and higher product costs. There are many problems such as the increase in
（発明の目的）
本発明はITO膜をメタライズ処理することな
く、表示パネルへ半導体チツプを実装した、安価
な表示パネルモジユールを提供することを目的と
する。(Objective of the Invention) An object of the present invention is to provide an inexpensive display panel module in which a semiconductor chip is mounted on a display panel without metalizing an ITO film.
（発明の構成）
上記目的を達成するために、本発明は、金属酸
化物導電膜からなる透明引出し電極部を有する表
示パネルと、この表示パネルの透明引出し電極部
に接続される電極パツド部を有する駆動用の半導
体装置とを備え、前記電極パツド部を、第一の等
方性導電層とこの第一の等方性導電層上に形成さ
れた第二の異方性導電層とより構成し、前記第二
の異方性導電層を前記透明引出し電極部に熱圧着
したものである。(Structure of the Invention) In order to achieve the above object, the present invention provides a display panel having a transparent lead-out electrode portion made of a metal oxide conductive film, and an electrode pad portion connected to the transparent lead-out electrode portion of the display panel. a driving semiconductor device having a drive semiconductor device, wherein the electrode pad portion includes a first isotropic conductive layer and a second anisotropic conductive layer formed on the first isotropic conductive layer. The second anisotropic conductive layer is thermocompression bonded to the transparent lead-out electrode portion.
（実施例の説明）
本発明の表示パネルモジユールは、チツプのア
ルミパツド部のバンプ構造として、二層のそれぞ
れ異なる特性を持つ合成樹脂系導電ペーストを用
いたバンプを形成するもので、第一の等方性導電
層は感光性を有する樹脂、例えばエポキシアクリ
レート系樹脂、感光性ポリイミド系樹脂等が使用
できる。導電性金属酸化物は酸化錫、酸化インジ
ウム、酸化チタンなどの粉末が有効である。導電
性を有する金属粉末は光の透過が極度に低下する
ため適当でない。等方性導電層とは光硬化性樹脂
と導電粉末からなるペーストを被膜としたときに
水平、垂直方向に同じ導電性を示すことを云い、
異方性導電層とは樹脂と導電粉末からなり、導電
粉末が前記等方性導電層のそれよりは少なく含有
しており、被膜とした後、圧着することによつて
垂直方向（厚み方向）に導電性を有するもので、
水平方向には導電粉末が少なく導電性を有しない
ものである。(Description of Embodiments) The display panel module of the present invention forms bumps using two layers of synthetic resin conductive paste each having different characteristics as a bump structure on the aluminum pad portion of the chip. For the isotropic conductive layer, a photosensitive resin such as an epoxy acrylate resin, a photosensitive polyimide resin, etc. can be used. Powders of tin oxide, indium oxide, titanium oxide, etc. are effective as the conductive metal oxide. Metal powder having electrical conductivity is not suitable because the transmission of light is extremely reduced. An isotropic conductive layer is a layer that exhibits the same conductivity in the horizontal and vertical directions when a paste made of photocurable resin and conductive powder is used as a coating.
The anisotropic conductive layer is made of resin and conductive powder, and contains a smaller amount of conductive powder than the isotropic conductive layer, and after forming a film, it is compressed to form a film in the vertical direction (thickness direction). It is conductive to
There is less conductive powder in the horizontal direction and it has no conductivity.
本発明の作用について説明すると、チツプまた
はウエハー全面に硬化性電性ペーストを厚みが５
〜30ミクロンになるように塗布、乾燥後、アルミ
パツド部のみを露光し、不要部分を現像した後、
ポストキユアさせる。次に異方性導電性ペースト
を全面に厚みが５〜30ミクロン程度に塗布、乾燥
させ、ウエハーであれば所定のチツプサイズにダ
イシングしてチツプとする。このチツプを表示パ
ネルの回路基板に設けた属酸化物導電膜からなる
透明引出し電極部上に熱圧着することによつて、
第二の異方性導電層の樹脂が溶融し、第一の等方
性導電層と回路基板の電極部間に第二の異方性導
電層に含有する導電粉末が挾み込まれ、垂直方向
に導通する。第二の異方性導電層の樹脂は、冷却
されると固着し、チツプを回路基板に固定する役
を果す。第一の等方性導電層は、チツプのアクテ
イブエリアが回路基板に接しないように、適当な
ギヤツプを設けるために必要であり、第二の異方
性導電層は、チツプの固定と垂直方向の導電性と
チツプ全面の保護の役を持つものである。 To explain the operation of the present invention, a curable electrically conductive paste is applied to the entire surface of a chip or wafer to a thickness of 5 mm.
After coating to a thickness of ~30 microns and drying, only the aluminum pad part was exposed and the unnecessary parts were developed.
Post cure. Next, an anisotropic conductive paste is applied to the entire surface to a thickness of about 5 to 30 microns, dried, and if it is a wafer, it is diced into a predetermined chip size. By thermocompression bonding this chip onto a transparent extraction electrode part made of a metal oxide conductive film provided on a circuit board of a display panel,
The resin of the second anisotropic conductive layer is melted, and the conductive powder contained in the second anisotropic conductive layer is sandwiched between the first isotropic conductive layer and the electrode part of the circuit board, and conduction in the direction. The resin of the second anisotropic conductive layer solidifies when cooled and serves to secure the chip to the circuit board. The first isotropic conductive layer is necessary to provide a suitable gap so that the active area of the chip does not touch the circuit board, and the second anisotropic conductive layer is required to secure the chip and to provide a vertical gap. It has high conductivity and protects the entire surface of the chip.
実施例
本発明の一実施例として、第一の等方性導電層
及び第二の異方性導電層の材料としてそれぞれ以
下の配合として塗料化（ペースト化）した。Example As an example of the present invention, the materials for the first isotropic conductive layer and the second anisotropic conductive layer were made into a paint (paste) with the following formulations.
(i) 第一の等方性導電層の配合
光硬化性樹脂（東レ(株)、フオトニース）……
100重量部。(i) Composition of first isotropic conductive layer Photocurable resin (Toray Industries, Inc., Photonice)...
100 parts by weight.
導電性金属酸化物粉（三菱金属(株)、酸化錫粉Ｔ
−１）……30重量部。 Conductive metal oxide powder (Mitsubishi Metals Co., Ltd., tin oxide powder T
-1)...30 parts by weight.
溶剤（関東化学、Ｎ−メチル−２−ピロリド
ン）……５重量部。 Solvent (Kanto Kagaku, N-methyl-2-pyrrolidone)...5 parts by weight.
(iv) 第二の異方性導電層の配合
熱可塑性樹脂（東洋紡(株)、バイロン）……100
重量部。(iv) Compounding of second anisotropic conductive layer Thermoplastic resin (Toyobo Co., Ltd., Vylon)...100
Weight part.
導電性金属酸化物粉（三菱金属(株)、酸化錫粉Ｔ
−１）……３重量部。 Conductive metal oxide powder (Mitsubishi Metals Co., Ltd., tin oxide powder T
-1)...3 parts by weight.
溶剤（関東化学、MEK）……50重量部。 Solvent (Kanto Kagaku, MEK)...50 parts by weight.
それぞれの材料を配合し、アルミナボールミル
で15時間混合した。この塗料をCMOSが形成さ
れた４インチウエハー上にスピンナーでコーテイ
ングし第一の等方性導電層の厚みは10ミクロンに
なるように形成し、80℃、60分の乾燥後、アルミ
パツド部のみを露光して現像液にて未露光部を除
去した。さらにポストキユアとして200℃、30分、
300℃、30分、400℃、30分のステツプでキユアし
第一の等方性導電層とした。さらに第二の異方性
導電層として同様にスピンナーで厚みが30ミクロ
ンになるよう全面に塗布し、110℃、60分で乾燥
させた。ウエハーを所定のチツプサイズにダイシ
ングし、チツプの完成品を得た。一方回路基板と
してガラス板の片面に透明導電膜をパターニング
した液晶パネルを使用し、このITOで形成した電
極部にチツプを載置し、チツプの裏面から150℃、
30Kg／cm2の圧力と温度で圧着した。このようにし
て必要のチツプをITOガラス板に圧着し、液晶パ
ネルモジユールを完成させた。その後、このモジ
ユールに電気信号を加え液晶パネルの表示が完全
であることを確認した。 Each material was blended and mixed in an alumina ball mill for 15 hours. This paint was coated on a 4-inch wafer on which CMOS was formed using a spinner to form a first isotropic conductive layer with a thickness of 10 microns, and after drying at 80°C for 60 minutes, only the aluminum pad part was coated. After exposure, the unexposed areas were removed using a developer. Furthermore, as a post cure, 200℃, 30 minutes,
It was cured in steps of 300°C for 30 minutes and 400°C for 30 minutes to form a first isotropic conductive layer. Furthermore, a second anisotropic conductive layer was similarly applied to the entire surface using a spinner to a thickness of 30 microns, and dried at 110° C. for 60 minutes. The wafer was diced into a predetermined chip size to obtain a finished chip product. On the other hand, a liquid crystal panel with a transparent conductive film patterned on one side of a glass plate was used as a circuit board, a chip was placed on the electrode part formed of ITO, and the temperature was heated at 150°C from the back side of the chip.
Pressure bonding was carried out at a pressure and temperature of 30Kg/cm 2 . In this way, the necessary chips were crimped onto the ITO glass plate, and the liquid crystal panel module was completed. Afterwards, we applied an electrical signal to this module and confirmed that the display on the liquid crystal panel was perfect.
本発明はアルミ電極パツドに第一の等方性導電
層と第二の異方性導電層を有するチツプを、ITO
で形成された回路基板の電極部上へ熱圧着するこ
とによつて得られる表示パネルモジユールであ
る。近年デイスプレー技術の進展により各種デイ
スプレーが開発されている。例えばLCD、EL、
プラズマ、デイスプレー、ECDなどがある。こ
れらデイスプレーは多数のドツトから構成され、
いずれも透明電極であるITOを使用するものであ
る。一方、半導体装置を用いた駆動用モジユール
に対する実装技術の進歩もめざましいものがある
が、まだ多数の課題を持つている。本発明はこの
ような問題点に解決を与えたものである。 The present invention provides an aluminum electrode pad with a chip having a first isotropic conductive layer and a second anisotropic conductive layer.
This is a display panel module obtained by thermocompression bonding onto the electrode portion of a circuit board formed by. In recent years, various displays have been developed due to advances in display technology. For example, LCD, EL,
There are plasma, display, ECD, etc. These displays are composed of many dots,
Both use ITO, which is a transparent electrode. On the other hand, although there has been remarkable progress in mounting technology for drive modules using semiconductor devices, there are still many issues to be solved. The present invention provides a solution to these problems.
（発明の効果）
以上説明したように、本発明は、第一の等方性
導電層とその上に積層した第二の異方性導電層と
からなる電極パツド部を半導体装置に形成するこ
とによつて、今まで不可能であつたITO上へ直接
実装ができるもので、このチツプを使用すること
によつて作られたモジユールは軽薄短小のニーズ
にマツチングするだけでなく、従来のようなフリ
ツプチツプの如く複雑なプロセスを経ることなく
簡単に製造でき、製品の歩どまり向上と低コスト
化を達成し得るものであり、企業的価値大なるも
のである。(Effects of the Invention) As explained above, the present invention provides a method for forming an electrode pad portion in a semiconductor device, which includes a first isotropic conductive layer and a second anisotropic conductive layer laminated thereon. This allows for direct implementation on ITO, which has not been possible until now, and modules created using this chip not only meet the needs of light, thin, short and small, but also It can be easily manufactured without going through complicated processes like flip chips, and can improve product yield and reduce costs, and has great corporate value.
Claims (1)
を有する表示パネルと、この表示パネルの透明引
出し電極部に接続される電極パツド部を有する駆
動用の半導体装置とを備え、前記電極パツド部
は、第一の等方性導電層とこの第一の等方性導電
層上に形成された第二の異方性導電層とより構成
されており、前記第二の異方性導電層を前記透明
引出し電極部に熱圧着してなる表示パネルモジユ
ール。1. A display panel having a transparent lead-out electrode portion made of a metal oxide conductive film, and a driving semiconductor device having an electrode pad portion connected to the transparent lead-out electrode portion of the display panel, the electrode pad portion comprising: It is composed of a first isotropic conductive layer and a second anisotropic conductive layer formed on the first isotropic conductive layer, and the second anisotropic conductive layer is connected to the transparent conductive layer. A display panel module that is thermocompression bonded to the extraction electrode part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24510783A JPS60140289A (en) | 1983-12-28 | 1983-12-28 | Display panel module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24510783A JPS60140289A (en) | 1983-12-28 | 1983-12-28 | Display panel module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60140289A JPS60140289A (en) | 1985-07-25 |
| JPH0481193B2 true JPH0481193B2 (en) | 1992-12-22 |
Family
ID=17128717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24510783A Granted JPS60140289A (en) | 1983-12-28 | 1983-12-28 | Display panel module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60140289A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62173434A (en) * | 1986-01-27 | 1987-07-30 | Stanley Electric Co Ltd | Manufacture of liquid crystal display |
| JPH0745065Y2 (en) * | 1987-08-17 | 1995-10-11 | 三洋電機株式会社 | Liquid crystal display element |
| JP3041980B2 (en) * | 1991-02-14 | 2000-05-15 | セイコーエプソン株式会社 | Liquid crystal panel and method of manufacturing liquid crystal panel |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5425464A (en) * | 1977-07-29 | 1979-02-26 | Nippon Kokuen Kogyo Kk | Method of making electrode connector for liquid crystal indicator tube |
-
1983
- 1983-12-28 JP JP24510783A patent/JPS60140289A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60140289A (en) | 1985-07-25 |
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