JPH0480930A - Die-bonding device - Google Patents

Abstract

PURPOSE:To enable a specific chip to be taken out for the title bonding process regardless of the dispersion in the stretch of wafer tapes by a method wherein the chip position slip per shift corresponding to the chip number by a shifting means is adjusted by a position adjusting means to repeat the specific chip number shift. CONSTITUTION:When A chip 45a in the first row wafer left side is die-bonded to reach the upper end position, a CPU 81 transmits a table leftward shifting signal to shift a table lateral direction shifting mechanism 42a by one chip size leftward. Next, the position slip of the chip 45a is adjusted by a table position adjusting mechanism 42c further more, repspective shifts are counted to shift the table 41 by the shift set up number Kco so that the specific chip A may be controlled to reach the chip taken out position. Through these procedures, the CPU 81c recognizing the chip 45a adjusts the slip from the specific position by the table position adjusting mechanism 42c and simultaneously judging if the chip 45a reaches the shift set up number Kco so as to repeat the processing.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a die bonding apparatus.

(Prior Art) Conventionally, the above-mentioned die bonding apparatus uses a wafer that is attached to a wafer tape and placed on a table with the chips spread apart by uniform pulling from the periphery of the tape. Die bonding is performed by taking out chips from a predetermined position on the wafer. After that, the table is shifted in one direction by the equivalent of one chip determined by the size of the chip and the expected elongation of the wafer tape. However, since the degree of elongation of the wafer tape varies depending on the location, the table is shifted by the equivalent of one chip. A slight displacement occurs in the chip position after shifting. For this reason, after the table has been shifted by an amount equivalent to one chip, the table position adjustment means is used to correct the positional deviation and adjust the position to eliminate the above-mentioned positional deviation, and then the next die bonding is performed.

(Problems to be Solved by the Invention) For example, in the case of a test wafer, a plurality of types of chips may be formed at predetermined intervals within the same wafer. When die bonding chips of the same type on a test wafer, it is necessary to skip chips of different types and take out the desired chip.To do this, it is necessary to remove the amount of movement equivalent to one chip. It is conceivable to shift the table at once by an amount multiplied by the number of chips to be moved.

However, as mentioned above, the elongation of the wafer tape varies depending on the location, so if the table is uniformly shifted by an amount equal to one chip multiplied by the number of chips to be moved, the desired chip position and The deviation from the chip take-out position may become so large that the table position adjusting means may not be able to align the desired chip with the chip take-out position.

An object of the present invention is to provide a die bonding apparatus that can perform die bonding of a desired chip by skipping a plurality of chips within the same wafer.

(Means for Solving !l!!I) The present invention is characterized by a shift means 2 that shifts the table 1 on which the wafer is mounted in at least one direction, and after the shift means 2 shifts a predetermined amount, die bonding is performed. a table position adjusting means 3 for adjusting the table position so that a target chip is at a predetermined position for taking out the chip from the table 1;
In a die bonding apparatus that takes out the chips at the predetermined position and performs die bonding after the position adjustment by the above, a counting means 4 detects a shift equivalent to one chip by the shift means 2 and counts up, and the number of chips to be moved is a count value setting means 5 for setting a predetermined count value corresponding to the count value, a comparison means 6 for comparing the count result by the count means 4 with the count value by the count value setting means 5, and a count result by the comparison means 6. The control means 7 is provided for repeatedly performing the shift equivalent to one chip by the shift means 2 and the position adjustment by the table position adjustment means 3 until a comparison result that the count values are the same is obtained. It is in.

(Function) In the die bonding apparatus configured as above,
When the shift means 2 shifts the table 1 on which the wafer is mounted in a predetermined direction by an amount equivalent to one chip, the table position adjustment means 3 adjusts the position of the chip that has been misaligned due to the shift to a predetermined position for taking out the chip. at the same time,
Counting means 4 counts the shifts. Further, the comparison means 6 compares this count result with a count value set in advance in the count value setting means 5. The control means 7 then performs the following operations until the comparison result obtained by the comparison means 6 is that the count result and the count value are the same.
A shift corresponding to one chip by the shift means 2 and a position adjustment by the table position adjustment means 3 are repeatedly performed.

(Effects of the Invention) As described above, according to the present invention, the table position adjustment means 3 adjusts the positional deviation of chips for each shift equivalent to one chip by the shift means 2, and the shift of a predetermined number of chips is performed. It is controlled so that it repeats. Therefore, even if there is variation in the elongation of the wafer tape between chips, desired chips formed on the wafer at a predetermined number of chips can be accurately taken out and die bonded.

(Example) An example of the present invention will be described below based on the drawings.
2 and 3 schematically show a die bonding apparatus according to the present invention.

The die bonding apparatus includes a lead frame transport section 10 that supplies a lead frame 16 to a die bonding position, a preform operation section 20 that applies adhesive to a die bonding site 16a of the lead frame 16, and a wafer 4.
5 to the wafer mounting section 40;
A wafer mounting section 40 that mounts a wafer 45 and adjusts the position of the wafer in the front-back and left-right directions, and a chip push-up section 50 that pushes up a chip 45a at a predetermined position within the wafer 45.
A bonding operation section 60 takes out the chip 45m on the wafer mounting section 40 and bonds it to the die bonding section 16a of the lead frame 16, and an electric control device 80 electrically controls the driving of each section.

The lead frame transport section 1o includes a frame loader section 11 that loads the lead frame 16, and a frame loader section 1.
The frame feeder section 12 conveys the lead frame 16 supplied from the frame feeder section 1 toward the bonding table 13, and the frame unloader section 14 accommodates the lead frame 16 that has undergone die bonding and is conveyed by the frame feeder section 12. There is. The frame loader section 11 employs, for example, a frame stacking and separation method, stores lead frames 16 therein, and sequentially feeds the lead frames 16 to the frame feeder section 12 using a pusher (not shown). The frame feeder section 12 is
A lead frame transport mechanism 12a is provided which hooks a feed claw into a hole formed in a tie bar of the lead frame 16 and automatically feeds the lead frame 16 by an amount of movement in accordance with a control signal in the right direction.

The frame unloader section 14 employs, for example, a magazine stacker system, and stores the die-bonded lead frame 16 transported from the frame feeder section 12 in a magazine having a predetermined shape.

The preform operation section 20 includes a preform arm 21 and a preform drive mechanism 22 that drives the arm 21 in the front-rear and up-down directions, and the preform operation section 20 includes a preform arm 21 and a preform drive mechanism 22 that drives the arm 21 in the front-rear and up-down directions. A predetermined amount of adhesive such as silver paste is supplied from a nozzle at the tip of the preform arm 21 to the die bonding site 16a.

The wafer transport unit 30 is a wafer loader unit 3 that stores a wafer ring 34 on which a diced wafer 45 adhered to a wafer tape is placed in a magazine (not shown) and supplies the wafer ring 34 to the wafer feed unit 32 by a pusher (not shown).
1, a wafer sending section 32 for sending supplied wafer rings 34 to a table 41 to be described later, and a packet section 28 for storing used wafer rings 34 transferred from the table 41 by the wafer sending section 32.

The wafer mounting section 40 includes a table 41 on which the wafer ring 34 is mounted, a table drive mechanism 42 that moves the table 41 in the front-rear and left-right directions, and a wafer tape that is evenly stretched outward to place the wafer 45 on each chip 45a. A separating wafer stretching mechanism (not shown) is provided. The table drive mechanism 42 is a table lateral shift mechanism 4 that moves the table 41 in the horizontal (left and right) and vertical (front and back) directions by a movement amount corresponding to one chip according to a control signal.
2a and table vertical shift mechanism 42b, table 4
1 is provided with a table position adjustment mechanism 42c that adjusts the position of No. 1 in accordance with a table position adjustment signal.

The chip push-up section 50 includes a chip push-up section drive mechanism 52 that pushes up the chip 45a at the chip take-out position on the wafer 45 by driving the push-up bar 51 in response to a control signal, and the chip push-up section drive mechanism 52 pushes up the chip 45a at the chip take-out position on the wafer 45. This facilitates peeling off the chip 45a.

The bonding operation unit 60 includes a bonding arm 61 having a collet 61a for picking up and removing chips at its tip, and a bonding drive mechanism 62 that moves the arm 61 in the front-rear and up-down directions. The bonding arm 61 is equipped with a vacuum mechanism (not shown) and attaches and detaches the chip 45a at the collet 61a portion. Also, collet 61
The weight is adjusted so that a predetermined weight is applied to portion a during die bonding. The bonding drive mechanism 62 extends and contracts the bonding arm 61 in the front-rear direction and moves it in the up-down direction.
5a is taken out and transferred to the die bonding site 16a of the lead frame 16 to perform die bonding.

As shown in FIG. 5, the electric control device 80 includes a lead frame detection image processing device 15 that detects the position and supply state of the lead frame 16, and a chip 45 on the table 41.
a chip detection image processing device 43 that detects the a position, etc.;
Power switch 71 that supplies power to the die bonding equipment
an operation panel 7o equipped with etc., and a microcomputer 8
1, etc., and each image processing device 15.43 and operation panel 70 are connected to a microcomputer 81.

The lead frame detection image processing device 15 is disposed above the bonding table 13, detects that the lead frame 16 is supplied to a predetermined die bonding position, sends a detection signal to the electric control device 80, and sends the detection result. An image is displayed on the monitor 15a. The chip detection image processing device 43 is disposed above the table 41, and detects the deviation of the chip 45a on the wafer from the chip take-out position, the chip 4
A defective shape and a defective characteristic (defective mark) of 5a are detected, a detection signal is generated and sent to the electric control device 80, and the detection result is displayed as an image on the monitor 43a.

Detection of the chip 45a is normally performed by binary image processing that makes the chip 45a white and other parts black.

The operation panel 70 is provided on the front side of the die bonding apparatus, and includes a power switch 71. It is provided with setting input means 72 and the like for setting a shift setting number Kco corresponding to the number of chips to be moved.

The microcomputer 81 includes a ROM8lb, a CPU81c, and a RAM8 connected to a bus 81a.
1d, an input interface 81e, and an output interface 81f. The ROM 8 lb stores a program corresponding to the flowcharts shown in FIGS. 6 and 7, the CPU 81 c starts executing the program in response to the closing of the power switch 71, and the RAM 81 d
is used to temporarily store variable data necessary for executing the program.

The input interface 81e includes an image processing device 15 for lead frame detection and an image processing device 43 for chip detection.
are connected via A/D converters 82 and 83, and each switch on the operation panel 70 is directly connected. A/D
The converters 82 and 83 digitally convert the detection signals from the respective detection image processing devices 15 and 43 and supply the converted signals to the input interface 81e.

The output interface 81f includes a lead frame transport mechanism 12a, a preform drive mechanism 22°, a table horizontal shift mechanism 42a, a table vertical shift mechanism 42b,
The table position adjustment mechanism 420, the chip push-up section drive mechanism 52, and the bonding drive mechanism 62 are connected to each drive circuit 91.
~97. As described above, each of these mechanisms includes the lead frame 16. Pre-7 ohm arm 21, table 41. It drives the chip push-up bar 51 and the bonding arm 61, and is composed of a rotation mechanism such as a step motor (not shown), driving mechanical parts, etc. Each of the drive circuits 91 to 97 controls energization of each of the mechanisms described above in response to a drive signal from the microcomputer 81.

In this embodiment configured as described above, the operation panel 7
When the power switch 71 provided at 0 is closed, the CP
The U81c starts executing the program shown in FIG. 6 in step 100, and initializes various data such as wafer size, table movement amount, lead frame movement amount, etc. in step 101.

Further, in step 102, a shift setting number Kco (shift [) corresponding to the number of chips to be moved is inputted by the rout input means 72 and stored in the ROM 8 lb.

In this example, only the A chip of the wafer 45 shown in FIG. , when it reaches the top of the wafer @ (chip top edge position), move one chip at a time to the right B
It is assumed that the chip and the C chip are skipped to reach the step, and then the same order is followed to reach the final chip. However, the initial setting position may be set to the upper left (in this case, the indication in parentheses in FIG. 6 is followed). Further, the position directions of the chips are horizontal and vertical directions as shown in FIG. 4, and the moving directions of the table are horizontal and front-back directions as shown by the dotted line in FIG.

Next, the CPU 81c resets the chip shift number Kc to rOJ in step 103, and determines whether the chip 45a is a reject chip (defective chip) in step 104. If the chip 45a is not defective, the CPU 81
c moves the program to step 105 based on the determination of "NO" in step 104 and executes a predetermined bonding operation routine, and if the chip 45a is defective, the program advances to step 1 based on the determination of rYESJ. 1
06 and execute the following steps.

As shown in FIG. 7, in the bonding operation routine, the chip 45a on the table 41 is attached to the lead frame 16.
It is attached to the die bonding part 16a of C
P U 81 c generates a preform drive signal in step 201 and causes the preform drive mechanism 22 to drive the preform arm 21 to apply adhesive to the die bonding portion 16 a of the lead frame 16 .

Next, in step 202, the CPU 81c generates a bonding arm forward movement signal, drives the bonding drive mechanism 62, moves the bonding arm 61 forward from the initial position by the amount of movement corresponding to the signal, and then proceeds to step 203. A bonding arm lowering signal is generated, and the bonding arm 61 is lowered by the amount of movement corresponding to the signal by the bonding drive mechanism 62, so that the collet 61a at the tip of the bonding arm 61 approaches the chip surface of the table 41.

Here, the CPU 81c generates a chip suction signal in step 204 to drive a vacuum mechanism (not shown), and in step 205 generates a chip push-up section drive signal to drive the chip push-up section drive mechanism 52, and the push-up bar 51 The chip 45a at the take-out position is pushed up and the collet 61a at the tip of the bonding arm 61 attracts the chip 45a.

Next, in step 206, the CPU 81c generates a bonding arm raise signal to cause the bonding drive mechanism 62 to raise the bonding arm 61 to its original height, and in step 207, generates a bonding arm backward movement signal to cause the bonding drive mechanism 62 to raise the bonding arm 61 to its original height. Return the bonding arm 61 to its initial position on the lead frame.

Furthermore, the CPU 81c generates a bonding arm lowering signal in step 208, causes the bonding drive mechanism 62 to lower the bonding arm 61, and causes the chip 45a to
is installed at the die bonding site 16a of the lead frame 16.

Here, the CPU 81c eliminates the chip suction signal in step 209 to release the vacuum suction of the chip 45a by the vacuum mechanism, generates a scrub drive signal in step 210, and causes the bonding drive mechanism 62 to remove the tip of the bonding arm 61. By vibrating the collet 61a, the chip 4
Vibration is applied to 5a to bond the chip onto the lead frame 16.

After die bonding is performed as described above, the CPU8
1c generates a bonding arm lift signal in step 211, returns the bonding arm 61 to the initial position on the lead frame 16 by the bonding drive mechanism 62, and generates a lead frame conveyance signal in step 212, causing the lead frame conveyance mechanism to 12a moves the die-bonded lead frame 16 and sets a new lead frame 16 at a predetermined die-bonding position. At this time, the CPU 81c performs step 21
3, it is determined whether or not a lead frame detection signal has been received from the image processing device 15 for lead frame detection, and when the lead frame detection signal is received, based on the determination that rYEsJ is received, the bonding operation routine is terminated and the program returns to step 106. .

The CPU 81c performs step 1 after die bonding.
At step 06, a table forward movement signal is generated to drive the table vertical shift mechanism 42b, and the table 41 is moved forward by the amount of movement of one chip according to the signal, and at step 107, a table position adjustment signal is generated. This causes the table position adjustment mechanism 420 to adjust the deviation of the chip 45a from the predetermined position. Here, the CPU 81c determines whether or not the chip is at the top end position in step 108,
If it is not yet at the upper end position, the program moves to step 109 based on the determination that rNOJ, and it is determined whether or not the chip is a reject chip. If it is not a reject chip, C
PU81 c is based on the determination that it is rNOJ, and step 10
The bonding operation routine is executed in step 5, and based on the determination "rYES" in case of a reject chip, step 10 is executed.
6, 107 to move and adjust the position of the table.

In this way, when all the A chips 45a in the first row on the left side of the wafer have been subjected to the die bonding process and have reached the top end position of the chips,
The CPU 81c determines rYEsJ in step 108, moves the program to step 110, generates a table leftward movement signal, and shifts the table lateral direction shift mechanism 42a.
is driven to move the table 41 to the left by the amount of movement of one chip according to the signal. The portion from step 110 to step 117 constitutes the main part of this embodiment, in which the table 41 is shifted to the left one chip at a time by the lateral shift mechanism 42a, and the positional shift of the chip 45a is corrected at each shift position. Adjusted by table position adjustment mechanism 42c and counted each shift by a counter,
Shift setting number Kc.

After shifting the table 41 by a certain amount, control is performed so that a desired chip A is placed at the chip take-out position.

At step 111, the CPU 81c connects the chip 45a.
If it is determined that rY has been recognized, in step 111
Based on the determination that EsJ is EsJ, the program moves to step 115, generates a table position adjustment signal, causes the table position adjustment mechanism 42c to adjust the deviation of the chip 45a from the predetermined position, and at step 116, changes the number of chip shifts K.
Increase c by "1". Furthermore, CPU 81c
At step 117, it is determined whether the number of chip shifts Kc has reached the set shift number Kco, and if it has not reached it yet, the program is executed at step 1 based on the determination that rNOJ.
10 and repeat steps 110 to 117 described above.

Here, if the CPU 81c determines in step 111 that the chip 45a cannot be recognized at the movement position,
Based on the determination "NO", the program moves to step 112 and a chip recognition operation is performed.

The CPU 81c determines whether or not the chip 45a has been recognized based on the image information provided by the chip detection image processing device 43 indicating that a wafer edge continues or that a wafer tape can be recognized, and information such as the wafer size stored in the ROM in advance. , if the chip 45a is recognized, step 1
Based on the determination "rYES" in step 13, the program returns to step 115. Further, if the CPU 81c determines that the chip 45a is not recognized, the process proceeds to step 113 with [NO].
Based on the determination of J, execution of the program is terminated in step 114.

As the CPU 81c repeats steps 110-117 in this manner, the table 41 is repeatedly shifted to the left. Then, when the chip shift number Kc reaches the shift setting number Kco, the CPU 81c performs step 11.
Based on the determination that rYEsJ is determined in step 7, the program moves to step 118, and it is determined whether or not the chip is at the upper end position. If it is not at the top end position of the chip, it means that the chip 45a is always present above, so in this case, the CPU 8
1c, based on the determination of rNOJ in step 118, the program moves to step 119, generates a table forward movement signal, drives the table vertical shift mechanism 42b, and moves the table 41 by one chip in accordance with the signal. move forward by the amount of movement. Further, the CPU 81c generates a table position adjustment signal in step 120 to cause the table position adjustment mechanism 420 to adjust the position of the chip 45a to eliminate the positional deviation, and returns the program to step 118.

When the chip reaches the upper end position by repeating the processing from step 118 to step 120, the CPU 81c moves the program to step 121 based on the determination rYESJ in step 118, resets the chip count number Kc to rOJ, and Start the bonding process for the step in the column. Furthermore, the CPU 81c determines whether or not the chip is a reject chip in step 122, and if it is a reject chip, the program proceeds to step 123 based on the determination of rYESJ, generates a table backward movement signal, and activates the table vertical shift mechanism. 42b,
The table 41 is moved backward by the amount of movement of one chip in response to the signal. Then, in step 124, a table position adjustment signal is generated to cause the table position adjustment mechanism 42c to adjust the position of the chip 45a so as to eliminate the positional deviation.
The program returns to step 122.

If the chip is not a reject chip, the CPU 81C determines in step 122 that the chip is rNOJ, moves the program to step 125, and executes the bonding operation routine as described above. After that, the CPU 81c generates a table backward movement signal in step 126, drives the table vertical shift mechanism 42b, and moves the table 41 backward by the amount of movement of one chip according to the signal.
Further, in step 127, a table position adjustment signal is generated to cause the table position adjustment mechanism 42c to adjust the position of the chip 45a so as to eliminate the positional deviation, and the program proceeds to step 128, where it is determined whether the chip is at the lower end position or not.

If the chip is not yet at the lower end position, the CPU 81C moves the program to step 129 and determines whether or not it is a reject chip. If it is not a reject chip, the bonding operation routine is executed in step 125, and if it is a reject chip, the bonding operation routine is executed in step 126. , 127, the table is moved and the chip position is adjusted.

After repeating the processing from step 125 to step 129, when the chip reaches the lower end position, the CPU 81c returns rYES.
Based on the determination that the signal is J, the program moves to step 130, generates a table leftward movement signal, drives the table lateral shift mechanism 42a, and moves the table 41 to the left by the amount of movement of one chip according to the signal. Move to. The portion from step 130 to step 137 forms the main part of this embodiment, similar to the portion from step 110 to step 117 described above, and on the condition that the CPU 81C recognizes the chip 45a in step 131,
In step 135, a table position adjustment signal is generated to drive the table position adjustment mechanism 42C to adjust the position of the chip 45a, and then in step 136, the number of chip shifts K
c is increased by "1", and it is further determined in step 137 whether or not the set shift number Kco has been reached. Then, the program from step 130 to step 137 is executed until the number of chip shifts Kc reaches the set shift number Kco.

In this way, every time the table moves by 1 chip, 45 chips
By adjusting the position of a and shifting the table 41 a number of times corresponding to the set shift number Kco, the table 41 is moved so that the desired chip A comes to the chip take-out position.
can be moved.

Note that, in step 131, the CPU 81c updates the chip 45a.
If it is determined that the chip is not recognized, the CPU-81c performs the chip recognition operation in step 132, as described in steps 112 to 114 above, and then performs the chip recognition operation in step 1.
At step 33, it is determined whether or not the chip 45a is recognized.
If it is determined that it has been recognized, the program returns to step 135 based on the determination that it is rYEsJ, and if it is determined that it is not recognized, it is caused to proceed to step 134 based on the determination that it is rNOJ, and the execution of the program is ended.

The CPU 81c performs steps 130 to 13 above.
7 is repeated, and when the chip shift number KC reaches the set shift number Kco, the program moves to step 138 based on the determination of rYEsJ in step 137, and it is determined whether or not the chip is at the lower end position.

If the chip is not yet at the bottom end position, the CPU 81C
Based on the determination "o", the program moves to step 139, generates a table backward movement signal, drives the table vertical shift mechanism 42b, and moves the table 41 backward by the amount of movement of one chip according to the signal. let step 1
A table position adjustment signal is generated at 40 to adjust the table position tv.
The chip 45a is adjusted by the amva mechanism 42c so as to eliminate the positional shift, and the program returns to step 138. After repeating steps 138 or 6140, C
When the PU 81 c recognizes the lower end position of the chip, the program returns to step 103 based on the determination that rYEsJ in step 138, starts the bonding process of the step in the jla-th column, and thereafter returns to step 103 as described above.
The process from step 140 is repeated. In the course of this process, if the CPU 81c determines in step 113 or step 133 that the chip 45a is not recognized, step 1 is performed based on the "NO" determination.
14 or 134.6 As explained above, in this embodiment, when multiple types of chips are arranged in rows at predetermined intervals on the wafer 45 as shown in FIG. When moving between each row when bonding a specific type of chips in succession, the table 41 is shifted by a distance of one chip by a table lateral shift mechanism 42a, and positional deviation is eliminated by a table position adjustment mechanism 42c. Table 4 is adjusted as shown in FIG.
1 can be accurately shifted to chip positions spaced apart by a predetermined distance, and a desired type of chip can be taken out and die-bonded.

Next, a modification of the above embodiment will be described. In this modification, only one predetermined row of the wafer 45 shown in FIG. tli4 is subjected to dyeing.

Move one chip at a time from the desired step on the left to the right,
This method deals with the case where the B chip and C chip are skipped to reach the step, and only the step is continuously die-bonded from the left end to the right. The configuration of this modification is the same as that of the above embodiment, and the ROM 8 lb stores a program corresponding to the flowchart shown in FIG.

In this modified example configured as described above, when the power switch 71 is closed, the CPU 81c starts executing the program shown in FIG. 8 in step 300, and in step 3
In step 01, various data such as wafer size, table movement amount, lead frame movement amount, etc. are initialized. Further, in step 302, the shift setting number Kco corresponding to the number of chips to be moved is input using the setting input means 72, and the shift setting number Kco corresponding to the number of chips to be moved is input.
Store it in b.

Next, the CPU 81c resets the chip shift number Kc to "0" in step 303, and resets the chip shift number Kc to "0" in step 304.
Determine whether or not 5a is a reject chip.1 If the chip is not a reject chip, the CPU 81c moves the program to step 305 based on the determination of "No" and executes the above-described predetermined bonding operation routine (see FIG. 7). If the chip is rejected, the program moves to step 306 based on the determination rYESJ, and the following steps are executed.

Next, in step 306, the CPU 81c generates a table leftward movement signal, drives the table lateral shift mechanism 42a, and moves the table 41 leftward by the amount of movement corresponding to one chip according to the signal.

The portion from step 306 to step 311 constitutes the main part of this modification, and includes the lateral shift mechanism 42a.
The table 41 is shifted by the amount of movement of one chip, the table position adjustment mechanism 42c is adjusted so as to eliminate the displacement of the chip 45a at each shift position, and each shift is counted by a counter, and the set shift number Kco After shifting the table 41 by the amount, the desired chip A is placed at the chip take-out position.

That is, if the CPU 81c determines that the chip 45a has been recognized, the program moves to step 309 based on the determination of "rYES" in step 307, and a table position adjustment signal is generated, and the table position is adjusted to correct the positional deviation of the chip 45a. The mechanism 420 adjusts and step 31
0, the chip shift number Kc is increased by "1". Further, the CPU 81c determines in step 311 whether the chip shift number Kc has reached the shift setting number Kco,
If it has not yet been reached, the program returns to step 306 based on the determination that it is rNOJ, and steps 306 to 311 are repeated. During this execution, CPU8
1c does not recognize the chip 45a in step 307, the program proceeds to step 308 and the program execution ends.

When the number of chip shifts Kc reaches the set number of shifts Kco, the CPU 81c returns the program to step 303 based on a determination of "rYES" in step 311, and repeats the processing from step 303 to step 311. Then, in step 307, the CPU 81c uses the chip 45a.
cannot be recognized, and the processes from step 303 to step 311 are repeated until the program execution is terminated at step 308.

As explained above, in this modification, it is possible to accurately take out and die bond the desired chips arranged on the wafer from left to right every Kco chips.

[Brief explanation of the drawing]

FIG. 1 is a claim correspondence view corresponding to the structure of the present invention described in the claims, FIG. 2 is a schematic plan view of a die bonding apparatus according to the present invention, and FIG. 3 is a line XX-XX in FIG. 4 is a diagram showing the order of die bonding within a wafer, FIG. 5 is a diagram showing the electrical control device of FIG. 2, and FIG. FIG. II7 is a flowchart corresponding to the bonding operation routine of FIG.
FIG. 8 is a flowchart of a program according to a modified example. Explanation of symbols

Claims (1)

[Claims] Shifting means for shifting a table on which a wafer is mounted in at least one direction, and a predetermined amount for taking out a chip to be die bonded from the table after shifting by a predetermined amount by the shifting means. and a table position adjustment means for adjusting the table position so that the table position is adjusted to the position of the die bonding apparatus, the die bonding apparatus takes out the chip at the predetermined position and performs die bonding after the table position adjustment means adjusts the table position so that the table position is adjusted by the table position adjustment means. A counting means for detecting a shift equivalent to one chip and counting up; a count value setting means for setting a predetermined count value corresponding to the number of chips to be moved; and a count result by the counting means and the count value setting means. a comparison means for comparing the count value obtained by the comparison means; and a shift corresponding to one chip by the shift means and the table position adjustment until a comparison result is obtained that the count result by the comparison means and the count value are the same. A die bonding apparatus comprising: a control means for repeatedly performing position adjustment by the means;