JPH0479242A - Bonding wire for semiconductor element - Google Patents

Bonding wire for semiconductor element

Info

Publication number
JPH0479242A
JPH0479242A JP2192798A JP19279890A JPH0479242A JP H0479242 A JPH0479242 A JP H0479242A JP 2192798 A JP2192798 A JP 2192798A JP 19279890 A JP19279890 A JP 19279890A JP H0479242 A JPH0479242 A JP H0479242A
Authority
JP
Japan
Prior art keywords
alloy
wire
neck part
strength
busbar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2192798A
Other languages
Japanese (ja)
Other versions
JP2813434B2 (en
Inventor
Katsuyuki Toyofuku
豊福　克之
Ichiro Nagamatsu
永松　一郎
Shinji Shirakawa
白川　信次
Sukehito Iga
祐人 伊賀
Takeshi Kujiraoka
鯨岡　毅
Norimasa Murakami
村上　憲正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP2192798A priority Critical patent/JP2813434B2/en
Priority to US07/729,226 priority patent/US5364706A/en
Priority to GB9115519A priority patent/GB2248416B/en
Priority to MYPI91001293A priority patent/MY107874A/en
Publication of JPH0479242A publication Critical patent/JPH0479242A/en
Application granted granted Critical
Publication of JP2813434B2 publication Critical patent/JP2813434B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To make strength of a neck part equivalent to that of a busbar or more and to improve the drawing strength of wire by coating an outer peripheral surface of a core which consists of a specified metal or an alloy thereof with a coating material which consists of a specified metal or an alloy thereof. CONSTITUTION:A coating material 1 which consists of high purity Ag or Ag alloy is clad on a core 2 which consists of high purity Au or Au alloy. Then, wire drawing processing is performed. After annealing treatment is performed in the middle of the processing, a busbar of a specified wire diameter is formed by wire drawing processing. Furthermore, stress is removed. In the constitution, a neck part is thermally affected during ball formation, and an outer peripheral part of the core and an inner peripheral part of a coating member of the neck part mutually diffuse; thereby, a diffusion layer consisting of Au-Ag alloy is formed and strength of the neck part is improved compared with a busbar without a diffusion layer. Therefore, it is possible to make strength of the neck part equivalent to that of the busbar or more. It is thereby possible to obtain thinner bonding wire, to reduce bonding pitch accordingly and to realize high density package of an LSI.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は半導体素子のチップ電極と外部リードとを接続
するために用いられる半導体素子用ボンディング線、特
にボールボンディング法に好適なものに関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a bonding wire for a semiconductor device used for connecting a chip electrode of a semiconductor device and an external lead, and particularly to a bonding wire suitable for the ball bonding method.

〈従来の技術〉 従来、この種の半導体素子用ボンディング線として例え
ばキャピラリーの先端から垂下したＡｕ線の先端を電気
トーチにより溶融させてボールを形成し、このボールを
半導体素子のチップ電極に圧着して接着せしめ、その後
ループ状に外部リードまで導いて該外部リードに圧着・
切断することにより、チップ電極と外部リードを接続さ
せたものがある。<Prior art> Conventionally, this type of bonding wire for semiconductor devices has been used, for example, by melting the tip of an Au wire hanging from the tip of a capillary with an electric torch to form a ball, and then press-bonding this ball to the chip electrode of a semiconductor device. Then, lead it in a loop shape to the external lead and crimp/bond it to the external lead.
Some devices have chip electrodes and external leads connected by cutting.

〈発明が解決しようとする課題〉 しかし乍ら、このような従来の半導体素子用ホンディン
グ線ではボール形成時にこのボール直上のネック部が熱
影響を受けて線材中に蓄積された応力が緩和されるため
、熱影響を受けない母線に比べ機械的強さが低下し、そ
の結果ホンディング作業中にネック部が破断したりワイ
ヤ倒れやワイヤ垂れが発生すると共に、製品の温度サイ
クル寿命試験において繰り返し温度変化により熱膨張・
収縮して発生する応力がネック部に集中し、ネック部の
破断が発生し易いという問題かある。<Problems to be Solved by the Invention> However, in such conventional bonding wires for semiconductor devices, the neck portion directly above the ball is affected by heat during ball formation, and the stress accumulated in the wire is relaxed. As a result, the mechanical strength is lower than that of a bus bar that is not affected by heat, resulting in neck breakage, wire collapse, and wire sagging during honding operations, as well as repeated failures during product temperature cycle life tests. Thermal expansion due to temperature changes
There is a problem in that the stress generated by contraction concentrates on the neck part, making it easy for the neck part to break.

一方、近年ＬＳＩの高密度実装化に伴って多ピン化傾向
が強まる中、ボンディング線を細線化してボンディング
ピッチを短縮することが要求されている。On the other hand, in recent years, as LSIs have become more densely packaged and the number of pins has increased, there has been a demand for thinner bonding lines to shorten the bonding pitch.

しかし、前述のボンディング線ではネック部が破断し易
いためにその線径を細くすることができず、上記要求を
満足し得ないという問題もある。However, the above-mentioned bonding wire has the problem that the neck portion is easily broken, so that the diameter of the wire cannot be made thinner, and the above-mentioned requirements cannot be satisfied.

本発明は斯る従来事情に鑑み、ネック部の強さを母線と
同等以上にすることを目的とする。In view of such conventional circumstances, the present invention aims to make the strength of the neck portion equal to or higher than that of the generatrix.

〈課題を解決するための手段〉 上記課題を解決するために本発明が講する技術的手段は
、高純度Ａｕ又は杓合金からなる芯線の外周面に高純度
Ａｇ又はＡｇ合金からなる被覆材を被覆したことを特徴
とするものである。<Means for Solving the Problems> The technical means taken by the present invention to solve the above problems is to apply a coating material made of high purity Ag or Ag alloy to the outer peripheral surface of the core wire made of high purity Au or ladle alloy. It is characterized by being coated.

そして、高純度Ａｕとは不可避不純物を含む９９．９９
％以上のものを用い、Ａｕ合金とは高純度ＡｕにＰｄ　
（２０ａ１％以下）　、Ｐｔ　（１５ａｔ％以下）　、
Ｃｕ、　ＩｎＧｅ、　ＭＯ，Ｙ、　２＋　（５ａ＋％以
下）　、Ｂｅ、　Ｃａ、　Ｌａ、　Ｍｇ（１ａ；％以下
）や母材の融点より低い沸点を有する低沸点元素等の中
から選ばれる一種又は二種以上含有させたものを用い、
Ａｕ合金とすることにより常温及び高温での機械的強さ
を向上させて高速ボンディングを可能にすると共に、ボ
ール形成時におけるネック部の結晶粒粗大化を防止して
いる。And, high purity Au is 99.99% containing unavoidable impurities.
% or more, Au alloy is high purity Au and Pd.
(20a1% or less), Pt (15at% or less),
One or two selected from Cu, InGe, MO, Y, 2+ (5a+% or less), Be, Ca, La, Mg (1a;% or less) and low boiling point elements having a boiling point lower than the melting point of the base material. Using one containing more than seeds,
By using an Au alloy, the mechanical strength at room temperature and high temperature is improved to enable high-speed bonding, and at the same time, coarsening of crystal grains in the neck portion during ball formation is prevented.

また、高純度Ａｇとは不可避不純物を含む９９．９９％
以上のものを用い、Ａｇ合金とは高純度ＡｇにＰｄ（２
Ｑａｆ％以下）　、Ｐｔ　（８ａｆ％以下）　、ＣＬ　
　Ｉｎ、　ＭｇＹ（５ａ＋％以下）　、Ｂｃ、　Ｃａ、
　Ｌａ、　ｌｒ　（ｌａｔ％以下）や母材の融点より低
い沸点を有する低沸点元素等の中から選ばれる一種又は
二種以上含有させたものを用い、Ａｇ合金とすることに
より常温及び高温での機械的強さを向上させて高速ボン
ディングを可能にすると共に、ボール形成時におけるネ
ック部の結晶粒粗大化を防止している。In addition, high purity Ag is 99.99% containing unavoidable impurities.
Using the above, Ag alloy is high purity Ag and Pd (2
Qaf% or less), Pt (8af% or less), CL
In, MgY (5a+% or less), Bc, Ca,
By using an Ag alloy containing one or more elements selected from La, lr (lat% or less) and low boiling point elements with a boiling point lower than the melting point of the base material, it can be used at room temperature and high temperature. It improves mechanical strength, enables high-speed bonding, and prevents coarsening of crystal grains in the neck portion during ball formation.

〈作用〉 本発明は上記技術的手段によれば、ボール形成時にネッ
ク部が熱影響を受けて該ネック部の芯線の外周部分と被
覆材の内周部分とが相互拡散することにより、Ａｕ−Ａ
ｇ合金からなる拡散層を形成してネック部の強度が拡散
層のない母線に比べ向上するものである。<Function> According to the above-mentioned technical means, the neck portion is affected by heat during ball formation, and the outer circumferential portion of the core wire of the neck portion and the inner circumferential portion of the covering material mutually diffuse, so that Au- A
By forming a diffusion layer made of g-alloy, the strength of the neck portion is improved compared to a generatrix without a diffusion layer.

〈実施例〉 以下、具体的な実施例について説明する。<Example> Specific examples will be described below.

各試料は高純度Ａｇ又はＡｇ合金からなる被覆材１を高
純度Ａｕ又はＡｕ合金からなる芯線２にクラッドし、次
に線引き加工を施し、その途中で焼なまし処理を施した
後に線引加工で線径３０μの母線に成形し、更に応力除
去を行ったものであり、図示せる如く上記被覆材１の外
径をＤ□、芯線２の外径をＤ２としてこれら両者の径比
Ｄ２／Ｄ□％を変えている。Each sample is made by cladding a core wire 2 made of high-purity Au or Au alloy with a covering material 1 made of high-purity Ag or Ag alloy, then subjected to wire-drawing, and then subjected to annealing treatment in the middle of the process, followed by wire-drawing. As shown in the figure, the outer diameter of the covering material 1 is D□, the outer diameter of the core wire 2 is D2, and the ratio of these two diameters is D2/D. □% is changing.

各試料の径比Ｄ　２　／　Ｄ　ｔ％は次表に示す通りで
あって、その試料Ｎα１〜１０は高純度Ａｇの被覆材１
を高純度Ａｕの芯線２にクラッドした実施品、試料定１
１〜１２は高純度ＡｌｊにＰｄをＬｏａｆ％含有させた
被覆材１を高純度Ａｕの芯線２にクラッドした実施品、
試料Ｎα１３は高純度Ａｇの被覆材１を高純度ＡｕにＰ
ｄを１０ａｊ％含有させた芯線２にクラッドした実施品
、試料Ｎα１４は高純度Ａｇ又はＡｇ合金の被覆材１及
び高純度Ａｕ又はＡｕ合金の芯線２のどちらか一方か或
いは両方にこれら母材の融点より低い沸点を有する低沸
点元素を含有させてクラッドした実施品、試料Ｎα１５
は従来の半導体素子用ボンディング線の一例を示す比較
品である。The diameter ratio D2/Dt% of each sample is as shown in the following table, and the samples Nα1 to Nα10 are coated with high-purity Ag coating material 1.
Sample specification 1: cladding on high-purity Au core wire 2
1 to 12 are actual products in which a core wire 2 of high purity Au is clad with a coating material 1 made of high purity Alj containing loaf% of Pd;
Sample Nα13 is a coating material 1 made of high-purity Ag and replaced with high-purity Au.
Sample Nα14 is a sample Nα14 which is clad with a core wire 2 containing 10aj% of d. Sample Nα15, a product clad with a low boiling point element having a boiling point lower than the melting point
is a comparative product showing an example of a conventional bonding wire for semiconductor devices.

本実施例の場合には試料Ｎα１４として高純度Ａｇの被
覆材１を高純度ＡｕにＰを５００ａｔｐｐｍ含有させた
芯線２にクラッドしたものを例示し、これにより、ボー
ル形成時においてボール中の低沸点元素か蒸発飛散して
、金属特有のガス吸収を防いで接合に良好なボールが得
られると共に、ネック部中の低沸点元素は蒸発できない
が気化しようとして応力を発生し、これに伴ってボンデ
ィング後のネック部の破断強度が応力の発生しない母線
に比べ向上させている。In the case of this example, as sample Nα14, a core wire 2 made of high-purity Au containing 500 atppm of P is clad with a coating material 1 of high-purity Ag, which reduces the boiling point of the ball during ball formation. Elements evaporate and scatter, preventing gas absorption peculiar to metals and producing a ball that is good for bonding.Also, low boiling point elements in the neck cannot evaporate but try to vaporize and generate stress, which causes stress after bonding. The rupture strength of the neck part is improved compared to the generatrix where stress does not occur.

また、試料ＮｃＬ１５として高純度Ａｕ　（９９，９９
％）からなるＡｕ線を例示している。In addition, high purity Au (99,99
%) is illustrated.

上記試料によってプルテストを所定回数（ｎ＝４０）宛
行い、夫々のプル強度及びネック部以外の母線部分で破
断した回数と、チップ割れの有無を測定した結果を次表
に示す。A pull test was conducted a predetermined number of times (n=40) using the above samples, and the results of measuring each pull strength, the number of breaks at the generatrix portion other than the neck, and the presence or absence of chip cracking are shown in the following table.

尚、各実施例の中でＣモード破断の数及びチ・ンプ割れ
の有無に基づき３ランクに区別し、チップ割れがなくし
かもＣモード破断の数が多いものから少ないものへ順に
◎、○、×と判定した。In addition, each example is classified into three ranks based on the number of C-mode fractures and the presence or absence of chip cracking, and is ranked from ◎, ○, to those with no chip cracking and the highest number of C-mode fractures to the lowest. It was judged as ×.

この測定結果により本発明の各実施品はＣモード破断の
数が比較品に比べて明らかに多いことからネック部がそ
れ以外の母線部分より強いことが判り、更に１５≦Ｄ２
／Ｄ工≦５５及び８０≦Ｄ２／Ｄ１≦９９の範囲の実施
品がネック部の強度とボール形成時のボール硬さに優れ
ることが理解され、更に被覆材１の材質をＡｇ合金とす
るか又は芯線２の材質をＡｕ合金とするか、或いは低沸
点元素を含有させることにより最適になることが理解さ
れる。As a result of this measurement, the number of C-mode fractures in each of the products according to the present invention is clearly greater than that of the comparative product, which indicates that the neck portion is stronger than the other generatrix portions, and furthermore, 15≦D2
It is understood that the products in the range of D/D≦55 and 80≦D2/D1≦99 are superior in neck strength and ball hardness during ball formation. Alternatively, it is understood that the material of the core wire 2 may be made of an Au alloy or contain a low boiling point element to become optimal.

〈発明の効果〉 本発明は上記の構成であるから、以下の利点を有する。<Effect of the invention> Since the present invention has the above configuration, it has the following advantages.

■　ボール形成時にネック部が熱影響を受けて該ネック
部の芯線の外周部分と被覆材の内周部分とが相互拡散す
ることにより、Ａｕ−Ａｇ合金からなる拡散層を形成し
てネック部の強度が拡散層のない母線に比べ向上するの
で、ネック部の強さを母線と同等以上にすることができ
る。■ During ball formation, the neck is affected by heat and the outer periphery of the core wire of the neck and the inner periphery of the coating material interdiffuse, forming a diffusion layer made of Au-Ag alloy and forming a diffusion layer of the neck. Since the strength is improved compared to a bus bar without a diffusion layer, the strength of the neck portion can be made equal to or higher than that of the bus bar.

従って、ホール形成時にネック部が熱影響を受けて母線
より弱くなる従来のものに比べ、ボンディング作業中の
ネック部の破断やワイヤ倒れ、ワイヤ垂れが発生しない
と共に、製品の温度サイクル寿命試験において繰り返し
温度変化により発生する応力が母線全体に分散して吸収
され、ボンディング線の破断の最頻発生部位であるネッ
ク部の破断は劇的に減少し、信頼性が向上する。Therefore, compared to conventional products where the neck part is affected by heat during hole formation and becomes weaker than the bus bar, the neck part does not break during bonding, the wire falls down, or the wire sag, and the product is repeatedly tested during temperature cycle life tests. Stress caused by temperature changes is dispersed and absorbed over the entire generatrix, dramatically reducing the number of fractures at the neck, which is the most common site of bonding wire fracture, and improving reliability.

■　ネック部が破断し難くなるので、ボンディング線の
線径を微細化でき、これに伴いボンディングピッチの短
縮化が可能となり、ＬＳＩの高密度実装が図れる。(2) Since the neck part becomes difficult to break, the wire diameter of the bonding wire can be made finer, thereby making it possible to shorten the bonding pitch and achieving high-density mounting of LSIs.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明の一実施例を示す半導体素子用ボンディン
グ線の拡大縦断面図である。The drawing is an enlarged vertical cross-sectional view of a bonding wire for a semiconductor device showing an embodiment of the present invention.

Claims (1)

【特許請求の範囲】[Claims] 　高純度Ａｕ又はＡｕ合金からなる芯線の外周面に高純
度Ａｇ又はＡｇ合金からなる被覆材を被覆したことを特
徴とする半導体素子用ボンディング線。A bonding wire for a semiconductor device, characterized in that a core wire made of high purity Au or an Au alloy is coated with a covering material made of high purity Ag or an Ag alloy.
JP2192798A 1990-07-20 1990-07-20 Bonding wire for semiconductor device Expired - Fee Related JP2813434B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2192798A JP2813434B2 (en) 1990-07-20 1990-07-20 Bonding wire for semiconductor device
US07/729,226 US5364706A (en) 1990-07-20 1991-07-12 Clad bonding wire for semiconductor device
GB9115519A GB2248416B (en) 1990-07-20 1991-07-18 Clad bonding wire for semiconductor device
MYPI91001293A MY107874A (en) 1990-07-20 1991-07-18 Clad bonding wire for semiconductor device.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2192798A JP2813434B2 (en) 1990-07-20 1990-07-20 Bonding wire for semiconductor device

Publications (2)

Publication Number Publication Date
JPH0479242A true JPH0479242A (en) 1992-03-12
JP2813434B2 JP2813434B2 (en) 1998-10-22

Family

ID=16297168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2192798A Expired - Fee Related JP2813434B2 (en) 1990-07-20 1990-07-20 Bonding wire for semiconductor device

Country Status (1)

Country Link
JP (1) JP2813434B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009093554A1 (en) 2008-01-25 2009-07-30 Nippon Steel Materials Co., Ltd. Bonding wire for semiconductor device
US7812358B2 (en) 2005-09-13 2010-10-12 Showa Denko K.K. Light-emitting device
US8299356B2 (en) 2007-12-03 2012-10-30 Nippon Steel Materials Co., Ltd. Bonding wire for semiconductor devices
US8389860B2 (en) 2007-12-03 2013-03-05 Nippon Steel Materials Co., Ltd. Bonding wire for semiconductor devices
US8815019B2 (en) 2009-03-17 2014-08-26 Nippon Steel & Sumikin Materials., Ltd. Bonding wire for semiconductor
US11696624B2 (en) 2019-08-08 2023-07-11 Ykk Corporation Fastener stringer and slide fastener provided with the fastener stringer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2914578B2 (en) 1990-07-20 1999-07-05 田中電子工業株式会社 Bonding wire for semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7812358B2 (en) 2005-09-13 2010-10-12 Showa Denko K.K. Light-emitting device
US8299356B2 (en) 2007-12-03 2012-10-30 Nippon Steel Materials Co., Ltd. Bonding wire for semiconductor devices
US8389860B2 (en) 2007-12-03 2013-03-05 Nippon Steel Materials Co., Ltd. Bonding wire for semiconductor devices
WO2009093554A1 (en) 2008-01-25 2009-07-30 Nippon Steel Materials Co., Ltd. Bonding wire for semiconductor device
US7952028B2 (en) 2008-01-25 2011-05-31 Nippon Steel Materials Co., Ltd. Bonding wire for semiconductor device
US8815019B2 (en) 2009-03-17 2014-08-26 Nippon Steel & Sumikin Materials., Ltd. Bonding wire for semiconductor
US11696624B2 (en) 2019-08-08 2023-07-11 Ykk Corporation Fastener stringer and slide fastener provided with the fastener stringer

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