JPH0477409B2 - - Google Patents
Info
- Publication number
- JPH0477409B2 JPH0477409B2 JP26497485A JP26497485A JPH0477409B2 JP H0477409 B2 JPH0477409 B2 JP H0477409B2 JP 26497485 A JP26497485 A JP 26497485A JP 26497485 A JP26497485 A JP 26497485A JP H0477409 B2 JPH0477409 B2 JP H0477409B2
- Authority
- JP
- Japan
- Prior art keywords
- fuse element
- fuse
- terminals
- lead wire
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- 238000004381 surface treatment Methods 0.000 claims 2
- 238000000034 method Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26497485A JPS62126517A (ja) | 1985-11-27 | 1985-11-27 | プリント配線板用小形ヒユ−ズ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26497485A JPS62126517A (ja) | 1985-11-27 | 1985-11-27 | プリント配線板用小形ヒユ−ズ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62126517A JPS62126517A (ja) | 1987-06-08 |
JPH0477409B2 true JPH0477409B2 (fr) | 1992-12-08 |
Family
ID=17410795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26497485A Granted JPS62126517A (ja) | 1985-11-27 | 1985-11-27 | プリント配線板用小形ヒユ−ズ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62126517A (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6393045U (fr) * | 1986-12-09 | 1988-06-16 |
-
1985
- 1985-11-27 JP JP26497485A patent/JPS62126517A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62126517A (ja) | 1987-06-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6268691A (ja) | レ−ザビ−ムで溶接する方法 | |
US3233034A (en) | Diffusion bonded printed circuit terminal structure | |
US4902867A (en) | Method of joining an insulated wire to a conductive terminal | |
WO1996017405A1 (fr) | Procede de realisation d'un branchement electrique | |
JP3552189B2 (ja) | ワイヤを有する電子部品 | |
US3519982A (en) | Method and means of forming electrical connections with conductors | |
US3451122A (en) | Methods of making soldered connections | |
US3519778A (en) | Method and apparatus for joining electrical conductors | |
JPH0477409B2 (fr) | ||
JP2538657B2 (ja) | ハイブリッドモジュ―ル | |
US4777558A (en) | Electronic device | |
JPH0326615Y2 (fr) | ||
JPH0131673B2 (fr) | ||
JPS6160570B2 (fr) | ||
JPS5937549B2 (ja) | ワイヤ−取付方法 | |
WO1998051135A1 (fr) | Ameliorations apportees aux procedes de fabrication de coffrets de branchement et leurs composants | |
JPS643333B2 (fr) | ||
JP3683247B2 (ja) | 微小ジョイントメタル接合方法及び導電性テープ | |
JPH0528752Y2 (fr) | ||
JPS60213017A (ja) | チツプ状固体電解コンデンサ | |
JPH0794035A (ja) | 中継接続用テープ電線 | |
JPS6211767B2 (fr) | ||
JPH01206587A (ja) | チップ型部品の塔載方法 | |
JP2002015837A (ja) | 抵抗発熱体及びその製造方法 | |
JPH02156606A (ja) | リード線の接続構造 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |