JPH0477238U - - Google Patents
Info
- Publication number
- JPH0477238U JPH0477238U JP1990120522U JP12052290U JPH0477238U JP H0477238 U JPH0477238 U JP H0477238U JP 1990120522 U JP1990120522 U JP 1990120522U JP 12052290 U JP12052290 U JP 12052290U JP H0477238 U JPH0477238 U JP H0477238U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- wire bonding
- semiconductor wire
- hard particles
- bonding apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07178—Means for aligning
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990120522U JPH0477238U (enExample) | 1990-11-16 | 1990-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990120522U JPH0477238U (enExample) | 1990-11-16 | 1990-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0477238U true JPH0477238U (enExample) | 1992-07-06 |
Family
ID=31868424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990120522U Pending JPH0477238U (enExample) | 1990-11-16 | 1990-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0477238U (enExample) |
-
1990
- 1990-11-16 JP JP1990120522U patent/JPH0477238U/ja active Pending