JPH0476875B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a carrier that is a housing for a flat IC package.

Conventional configurations and their problems In recent years, devices have rapidly become smaller, and in order to meet market needs such as ultra-thin and ultra-miniature devices, electronic component packaging has also become denser. There is. Along with this trend, flat IC packages having thinner lead wires or lead wires with narrower pitches have come to be used more frequently. As a result, manual attachment becomes cumbersome, and it is becoming difficult to meet requirements in terms of reliability and reliability of attachment. For this purpose, flat type IC
A package carrier that can stably hold a flat IC package and is suitable for automation is desired.

The carrier of the conventional flat IC package is
As shown in Figure 2, the specific configuration of the IC lead 1
Using the protrusion 3 for positioning, separate it from the upper surface of the side plate of the tray 4, and attach the tip 6 to the IC.
A tray 4 slightly protruding into the storage chamber 7 has been proposed.

This tray 4 is a flat type IC package 91
When the flat IC package 9 is stored in the storage chamber 7, the tip of the protrusion 3
is pushed down by the bottom surface of the flat IC package 9 and is fitted into the chamber while being deflected downward, and at the fitting completion position, the tip portion 6 is inserted into the chamber.
returns upward and locks the top surface of the flat IC package 9. In this way, the flat IC package 9 is prevented from falling off toward the opening of the upper surface of the tray 4.

However, with the above configuration, only one flat IC package 9 can be stored in one tray 4, which makes the management of the flat IC package 9 complicated. 6, the shape is complicated and the molding cost is high. Furthermore, flat type to tray 4
It is difficult to store the IC package 9 or take it out from the tray 4, which has the drawback of hindering automation.

Purpose of the Invention In view of the above-mentioned drawbacks, the present invention provides a carrier that allows flat IC packages to be easily stored and taken out, and at the same time allows for stable storage in a well-positioned storage format, and that is suitable for automation. This is what we provide.

Structure of the Invention The present invention has a plurality of recesses for accommodating a flat IC package at predetermined intervals in the longitudinal direction, and mechanical feeding engaging parts provided at predetermined intervals in the longitudinal direction, and further includes a plurality of recesses for storing a flat IC package at predetermined intervals in the longitudinal direction. It is characterized by having convex portions with sloped surfaces at predetermined angles at predetermined positions in each of the four directions on the inner bottom surface, and the flat IC package is supplied with its position regulated by a tray portion with a simple structure. It has the unique effect of facilitating automation, since it is also easy to take out the flat IC package from the tray section.

DESCRIPTION OF EMBODIMENTS Hereinafter, one embodiment of the present invention will be described in FIGS. 2 to 7.
This will be explained with reference to the figures. The flat IC package 10 is composed of a flat insulating plate 11 containing an IC and an IC lead wire 2 protruding horizontally from the side edge of the flat insulating plate 11. On the other hand, the carrier 12 that stores this is
As shown in the figure, it is composed of a flat tray 5 with IC storage chambers 8 at regular intervals in the center and a cover 13 for the toilet 5. A notch 14 is formed. The above-mentioned flat IC package is fitted into the IC storage chamber 8 from above and the IC lead wires 2 are stored in almost contact with the inner wall surfaces 15 in four directions, thereby adjusting the position and positioning each flat IC package. be.

Furthermore, the present invention utilizes the cover 13 as a means for preventing the flat IC package 10 from falling off from the upper opening of the IC storage chamber 8.

As shown in the embodiment of FIG. 3, when the flat IC package 10 is stored in the tray 5, the flat IC package comes into contact with the bottom surface 16 of the storage chamber due to the slope of the four inner walls 15 of the component storage chamber 8, and the flat IC package 10 is stored in the tray 5. When completed, the four directions will be regulated and positioned for each side. Further, by fitting the cover 13 into the tray 5, the stored flat IC package 10 is prevented from leaving the upper opening of the storage chamber 8 while remaining in a positioned state. On the other hand, when taking out the flat IC package 10, first remove the cover 13 as shown in FIG.
While the tray 5 is fixed, press one end of the tray 5 that is not covered by the cover 13 so that the notch 14 on the top surface of the side wall of the tray 5 comes out of the cover 13, and then press the notch 14 on the top surface of the side wall of the tray 5.
, a claw 18 provided at the tip of the automatic ejecting mechanism 17
10 by moving the claw 18 one pitch in this state.
automatically comes out of the cover 13. By sequentially repeating this operation, the flat IC packages 10 can be pulled out from the cover 13 one after another.

As described above, the present invention has IC storage chambers 8 and notches 14 at regular intervals, and by simply fitting the cover 13, it becomes a means for storing a flat IC package and preventing it from falling off. The means for taking out the IC package 10 can be easily configured, and the structure can be extremely simple without requiring any other modifications or additions. Furthermore, the slope of the four side walls of the flat IC package storage chamber 8 can be suitably used for positioning the flat IC package.

In this embodiment, the flat IC package 10 has lead wires in four directions, but it may have lead wires in two directions.

In addition, in this embodiment, the storage form of the flat IC package was such that the tips of the lead wires 2 were regulated by the four inner walls as shown in FIG.
As shown in FIGS. 10 and 10, the inner side 19 of the lead wire corner or the peripheral direction of the flat IC package main body 11 may be regulated.

Effects of the Invention As described above, the present invention has a plurality of recesses for accommodating flat IC packages at predetermined intervals in the longitudinal direction, and mechanical feeding engaging portions provided at predetermined intervals in the longitudinal direction. Further, the inner bottom surface of the recess is provided with protrusions having sloped surfaces at predetermined angles at predetermined positions in each of the four directions, and the inner slope of the protrusion holds the outer periphery of the leads of the IC package to be stored. The outer periphery of the main body of the IC package to be stored is held by the inner slope of the convex part, and the lead wire angle of the IC package to be stored is held by the outer slope of the convex part. It is characterized by holding the inner part,
It has the following effects.

(1) The positioning of the IC package does not depend on the shape of the concave part, but can be held at any position by the shape of the convex part. Therefore, IC package cages of various shapes can be placed at any position in the carrier recess.
For example, even in an asymmetrical package, the main body can be placed in the center of the recess.

(2) Regardless of the lead bending shape of the IC package,
It becomes possible to directly hold the sealing part without touching the leads.

(3) The lead part has relatively high strength and can directly hold the bent part of the lead.

[Brief explanation of drawings]

Figure 1 is a perspective view of a flat IC package.
Fig. 2 is a perspective view of a carrier of a conventional flat type IC package, Fig. 3 is a perspective view of a carrier of a flat type IC package according to the first embodiment of the present invention (with the cover removed), and Fig. 4 is a perspective view of a carrier of a flat type IC package according to the first embodiment of the present invention. A perspective view of the flat IC package used in the same example,
FIG. 5 is a perspective view showing the concept of an automatic ejecting mechanism for taking out components from the carrier of the flat IC package of the same embodiment, and FIG. 6 is a perspective view of the tray containing the flat IC package in FIG. 3 and its cover. , FIG. 7 is a perspective view showing a conceptual diagram of the operation of taking out the tray in FIG. 6 using the automatic take-out mechanism. FIG. 8 is a sectional view of the tray in this embodiment. FIG. 9 is a sectional view of a tray in a second embodiment in which the method of regulating the flat IC package is changed, and FIG. 10 is a sectional view of a tray in a third embodiment in which the method of regulating the flat IC package is also changed. It is. 2...Lead wire, 5...Tray, 8...Storage room, 10
...Flat type IC package, 13...Cover, 1
4...Notch, 15...Inner wall surface, 17...Automatic extraction mechanism.

Claims (1)

[Scope of Claims] 1. The tray is composed of a tray portion having a plurality of recesses for storing flat IC packages at predetermined intervals in the longitudinal direction, and a cylindrical cover that slidably encloses the tray portion, the tray comprising: The part includes a mechanical feeding engaging part provided on at least one of the longitudinal sides at the same interval as the recess, and a mechanical feeding engaging part provided inside the recess so as to be held from all four sides along the outer periphery of the lead of the IC package to be accommodated. The inner surface of the protrusion is flat so that it does not come into contact with the IC package when it is removed from the protrusion of the tray.
IC package carrier. 2. Consists of a tray section having a plurality of recesses for storing flat IC packages at predetermined intervals in the longitudinal direction, and a cylindrical cover that slidably envelops the tray section; A mechanical feeding engaging portion is provided on at least one of the side surfaces at the same interval as the recess, and the inside of the lead wire corner of the IC package housed inside the recess is held in position in four directions from the inside by its outer circumferential surface. , a flat type IC with a convex part provided along the inner surface of the corner of the lead wire so as not to come into contact with the IC package body.
Package carrier. 3. Consists of a tray section having a plurality of recesses for accommodating flat IC packages at predetermined intervals in the longitudinal direction, and a cylindrical cover that slidably envelops the tray section; A mechanical feeding engaging portion is provided on at least one side surface at the same interval as the recess, and a mechanical feed engaging portion is provided inside the recess to hold the main body of the IC package to be stored in position from four directions around the IC package. Along the lower surface,
A carrier for a flat type IC package, which has a convex part provided so as not to come into contact with the leads of the IC package, and the inner surface of the convex part is sloped to the extent that it does not come into contact with the leads when the IC package is taken out from inside the tray part.