JPS6342512Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a chip component in which a lead wire led out from the chip component body is directly used as an electrode for external connection.

First, when a conventional chip component 1 is shown in FIGS. 1a and 1b, lead wires 2a and 2b are connected to the chip component body 3
For example, it is led out from one side made of a resin case or a resin molded body, and is disposed along the bottom of the main body 3. In such a structure, deformation such as bending occurs in the lead wires 2a and 2b when the chip part 1 is transported or handled, and the chip part 1 may be bent or otherwise deformed.
Not only could it not be automatically loaded onto a printed wiring board, but there was also the risk of soldering defects.

However, the present invention provides a chip component having a shape in which the lead wires do not shift in position.

As shown in FIGS. 2a, b, and c, lead wires 24a and 24b are introduced into the bottom 23 of the main body 22 of a chip component 21 such as a chip capacitor, for example, from the front 25 to the back 26. Lead wire guide grooves 27a, 27b for accommodating lead wires 24a, 24b are formed, and the side portions 28, 28 of the main body 22 are formed from the guide grooves 27a, 27b.
Slits 30a, 30b are formed across 29. Also, the lead wires 24a and 24b are connected to the front 25
Immediately after being led out from the lead wire guide groove 27, it is bent toward the bottom 23 and further bent.
a, 27b and positioned. Note that the state in which the lead wires 24a and 24b are housed in the lead wire guide grooves 27a and 27b is as follows.
In terms of reliable soldering of the lead wires 24a, 24b, it is preferable for the lead wires 24a, 24b to be slightly protruded outward from the guide grooves 27a, 27b rather than completely buried in the guide grooves 27a, 27b.

According to such a structure, the lead wires 24a, 2
Since the lead wires 4b are accommodated in the lead wire guide grooves 27a, 27b, the lead wires 24a, 24b can be prevented from being deformed when the chip component 21 is transported or handled. Further, soldering of the lead wires 24a, 24b can be easily confirmed by visually observing through the slits 30a, 30b. Note that the shape of the lead wire guide grooves 27a and 27b may be a rectangular recess as shown in FIG. 2c, or a semi-cylindrical recess as shown in FIG. Other shapes may also be used.

[Brief explanation of the drawing]

Figures 1a and 1b are front and side views showing a conventional example;
FIGS. 2a, b, and c are a front view, a side view, and a perspective view showing one embodiment of the present invention, and FIG. 3 is a perspective view showing another embodiment of the present invention. In the figure, 27a, 27b... lead wire guide grooves, 30a, 30b... slits.

Claims (1)

[Scope of utility model registration request] In a chip component in which a lead wire led out from the chip component body is used as an electrode for external connection, a guide groove for the lead wire is provided at the bottom of the chip component body, and a guide groove for the lead wire is provided at the bottom of the chip component body. A chip component characterized in that a slit for checking the soldering state of the lead wire is provided across the chip, and the lead wire is mounted in the guide groove for the lead wire.