JPH0447103Y2 - - Google Patents

Description

[Detailed explanation of the idea] [Industrial application field]

This invention relates to a tray formed of a thin plate molded product, and particularly to a tray that can safely accommodate a hybrid integrated circuit device and that occupies a small volume when empty.

[Conventional technology]

A hybrid integrated circuit device has electrical components mounted on a circuit board, and a large number of terminals protruding from both sides of the circuit board. In order to transport and store these hybrid integrated circuit devices, the containers in which they are stored are subject to unreasonable loads on the electrical components mounted on the circuit board and the terminals led out from the circuit board. It is required that the terminals do not bend or become loose. In addition, it is desirable to have a container that can occupy a small volume when empty and has high storage and transportation efficiency. Conventionally, such hybrid integrated circuit devices have been stored in plastic trays, but if the devices were simply stored in the recesses of the tray, the lead terminals would hit the bottom or walls of the tray, causing damage during storage and transport. The lead terminal may be bent. Therefore, as seen in Japanese Utility Model Application Publication No. 60-76098, for example, a protrusion that supports the integrated circuit device is provided protruding from the bottom of the concave storage portion of the tray, thereby holding the main body of the integrated circuit device. However, devices have been proposed in which no load is applied to the lead terminals during storage.

[Problem that the idea aims to solve]

However, in the conventional tray,
Even if it is possible to prevent the lead terminal from bending,
When trays are stacked one above the other, the bottom surfaces of the upper and lower trays cannot be spaced apart from each other, so the gravity of the upper tray directly acts on the integrated circuit device housed in the lower tray. For this reason, in the case of a hybrid integrated circuit device in which electronic components are mounted on a circuit board, the gravity of the upper tray directly applies to the electronic components mounted on the circuit board, causing the electronic components to bend or bend. It may tilt. For this reason, troubles such as breakage of lead wires connecting the components and damage to the components are likely to occur. Furthermore, when empty trays are stored one on top of the other after the hybrid integrated circuit devices inside are taken out, in the conventional trays, the protrusions that hold the main bodies of the integrated circuit devices get in the way and the trays are stacked closely together. I can't match it. As a result, the empty tray becomes bulky and occupies a large volume, resulting in poor storage efficiency during storage and transportation. Therefore, in view of the problems of the conventional tray, the purpose of the present invention is to store a hybrid integrated circuit device in a tray,
When stacked, no direct load is applied to both the electronic components mounted on the circuit board and the lead terminals led out from the circuit board, and when empty trays are stacked, they are stacked closely, resulting in a small footprint. An object of the present invention is to provide a tray for a hybrid integrated circuit that can be used.

[Means to solve the problem]

That is, in the present invention, in order to achieve the above object, a plurality of parallel convex ribs 14a, 1 are formed by bending a thin plate in its thickness direction.
4b, 14c, 14d, and these ribs 14a, 1
4b, 14c, 14d and a plurality of parallel convex ribs 17a, 17b, and these ribs 14a, 14b, 14c, 14d, 17a, 17
In the tray for a hybrid integrated circuit device formed with a concave storage section 11 for storing a hybrid integrated circuit device a partitioned by b, the circuit board d of the hybrid integrated circuit device a to be stored in the storage section 11 faces the circuit board d of the hybrid integrated circuit device a. A stepped portion 13 formed on the opposing side walls 12, 12 of the ribs 17a, 17b to support the pair of both sides,
13, and recesses 15 and 16 of mutually different depths formed at point-symmetrical positions with respect to the planar center of the tray on the ribs 14a and 14b, and the stepped portion 1
The height from the bottom surface of the storage section 11 of No. 3 is set higher than the length l from the bottom surface of the circuit board d to the tips of the terminals b, b..., and the recesses 15 and 16
The difference l in depth between
, mounted components c with reference to the bottom surface of the circuit board d,
To provide a tray for a hybrid integrated circuit device, characterized in that the tray is set larger than the maximum height h of c...

[Effect]

Since this tray is made by bending a thin plate in its thickness direction, the ribs 14a, 14b, 17a, 17b formed in a convex shape on the upper side are
The housing portion 11, which is formed in a concave shape on the upper side, appears as a concave portion on the lower surface side as it is as a convex portion. Therefore, if trays molded in the same shape are aligned in the same direction and stacked, the unevenness of the upper and lower trays will match, and the trays can be stacked closely together. On the other hand, when storing the hybrid integrated circuit device a in the storage section 11 of this tray, a pair of parallel ribs 17
A pair of opposite side sides of the circuit board d are supported by stepped portions 13 and 13 formed on opposite side walls 12 and 12 of the storage portion 11 formed by the storage portion a and 17b. Then, the height H of the stepped portions 13, 13
is higher than the length l of the terminals b, b... protruding from the circuit board d, so the tips of the terminals b, b are in the housing part 1.
1, and the load of the hybrid integrated circuit device is not directly applied to the terminals b and b. Furthermore, from the above-mentioned state in which the trays are all aligned in the same direction and stacked, the trays are rotated 180° on a plane every other row, and these trays are stacked one on top of the other. Then, since the recesses 15 and 16 formed on the ribs 14a and 14b have different depths and are arranged point-symmetrically with respect to the center on the plane of the tray, the deep recesses of the upper tray 15 corresponds to the shallow recess 16 of the lower tray, and the shallow recess 16 of the upper tray corresponds to the deep recess 15 of the lower tray. As already mentioned, such unevenness on the upper surface of the tray appears as the opposite unevenness on the lower surface, so the deep recess 15 of the upper tray is placed above the shallow recess 16 of the lower tray.
is placed thereon, and a gap approximately corresponding to the difference l in depth between the recesses 15 and 16 is formed between the bottom surfaces of the storage portions 11 of the upper and lower trays. The difference l between the depths of the recesses 15 and 16 that form this interval is determined by the height H of the step from the bottom of the storage 11, and the electrical components c, c, etc. with respect to the bottom surface of the circuit board d. Since the size is set slightly larger than the dimension H+h, which is the sum of the maximum height h, the bottom of the storage section 11 of the upper tray does not touch the electrical components c, c, . . . of the hybrid integrated circuit device a. Therefore, when the trays are stacked in this manner, the load of the upper tray is not directly applied to the electronic components c, c, . . . of the hybrid integrated circuit device.

【Example】

Next, an embodiment of this invention will be described with reference to FIGS. 1 to 3. First, to explain the embodiment shown in FIGS. 1 and 2, the illustrated tray is made by bending and molding a synthetic resin sheet in its thickness direction.
Ridge-shaped ribs 14a and 14b that become convex portions on the upper surface side
and ridge-shaped 17a, 1 which is a convex portion on the upper surface side and is formed perpendicularly to the ribs 14a, 14b.
7b are formed, and these ribs 14a, 14b,
17a and 17b partition four storage portions 11 each having a recessed portion on the upper surface side. In this way, since the tray is made by bending and forming a thin plate, the ribs 14a formed in a convex shape on the upper side,
14b, 17a, and 17b appear as they are as concave portions on the lower surface side, and the storage portion 11 formed in a concave shape on the upper side appears as it is as a convex portion on the lower surface side.
In addition, in FIG. 1, CC indicates the storage section 11,
11, and this virtual line C
Ribs parallel to -C are 17a, 17b, and ribs perpendicular to -C are 14a, 14b. Ribs 17a, 17 parallel to the former virtual line C-C
A stepped portion 13 is formed on the opposing side walls 12, 12 of the storage portion 11 formed by b. Second
As shown in the figure, the stepped portion 13 is for supporting both opposing sides of the circuit board d of the hybrid integrated circuit device a stored in the storage portion 11 from below, and is attached to the opposing side walls 12, 12. Formed step portion 13,1
The interval 3 is formed in accordance with the width of the circuit board d. In addition, the storage section 1 of the same stage sections 13, 13
The height H from the bottom of the circuit board d is set slightly higher than the length l of the terminals b, b, . . . protruding from the circuit board d. In addition, a gap 18 is formed in the middle of the horizontal ribs 17b extending across the center, where the ribs 17b are partially interrupted. This gap 18 is slightly wider than the width of a finger, and a finger can be inserted through this gap in order to take out the hybrid integrated circuit device a fitted in the storage section 11. FIG. 2 shows a state in which a hybrid integrated circuit device a is housed in the storage section 11, and a pair of opposite side sides of a circuit board d of the hybrid integrated circuit device a are placed on the step portions 13 and supported. show. When the hybrid integrated circuit device a is stored in the storage section 11 in this way,
Terminals b, b, . . . do not touch the bottom surface of the storage section 11. In addition, ribs 14a, 1 perpendicular to the virtual line C-C
4b has two types of recesses 15 and 16 with different depths.
is formed. One of the recesses 15 is deeper than the other recess 16, and this difference in depth l is determined by the height H of the stepped portion and the maximum height of the electrical components c, c... based on the bottom surface of the circuit board d. H+h plus sah
It is slightly deeper than the dimensions of. Further, these recesses 15 and 16 are arranged such that the deep and shallow recesses are respectively located at positions that are point symmetrical with respect to the center on the plane of the tray. That is, the shallow recess 16 is arranged at a position that is point symmetrical to the position of a certain deep recess 15 with respect to the center on the plane of the tray. As already mentioned, the tray is made by bending and molding a synthetic resin sheet in the thickness direction, so as shown in Figure 2, the convex part on the top side becomes the concave part on the bottom side. Thus, a concave portion on the upper surface side becomes a convex portion on the lower surface side. Therefore, the deep recess 15 on the upper surface side becomes a Takai protrusion on the lower surface side, and the shallow recess 16 on the upper surface side becomes a low protrusion on the lower surface side.
Therefore, when trays to be stacked one on top of the other are aligned in the same direction, the unevenness on the upper surface appears as unevenness on the lower surface, allowing the trays to be stacked closely. On the other hand, from this state, when one of the trays corresponding to the upper and lower sides is rotated 180 degrees around the center on the plane, the deep groove 15 (high downward protrusion) on the upper tray becomes the shallow groove 16 on the lower tray. , the latter is placed on top of the former, and the recesses 15 and 1 are approximately located between the bottom surfaces of the storage portions 11 of the upper and lower trays.
A spacing corresponding to a depth difference l of 6 is formed. Then, this depth difference l is determined by the step 1 of the storage section 11.
As shown in Fig. 2, the height H of the circuit board d is set larger than the maximum height h of the mounted components c, c, etc., based on the bottom surface of the circuit board d. Furthermore, even if another tray is stacked on top of the hybrid integrated circuit device a stored in the storage portion 11, the upper tray will not hit the electronic component c due to the spacing between the bottom surfaces of the storage portion 11. Next, the embodiment shown in FIG. 3 will be described. In this embodiment, the ribs 14a, 14b, 1
4c, 14d, and these ribs 14a, 14b, 14
There are six horizontal storage sections 11, 11... partitioned by c, 14d and orthogonal 17a, 17b,
There are 24 locations in total, 4 in each row. Opposing side walls 12 of the storage section 11 formed by ribs 17a and 17b parallel to the imaginary line C-C,
12, step portions 13, 13 similar to those in the previous embodiment are formed. Further, a gap 18 is formed in the intermediate rib 17b by partially cutting off the rib 17b. On the other hand, the rib 14b perpendicular to the imaginary line C-C has a deep recess 1 similar to the embodiment described above.
5 and a shallow recess 16 are formed.

[Effect of the idea]

As explained above, according to the tray of this invention, the hybrid integrated circuit device a can be stored in the storage portion 11 without any load being applied to the terminals b, b, . . . The trays can be stacked in several stages so that the load of the upper tray is not directly applied to the electronic components c, c, . . . mounted on the board d. On the other hand, in an empty state in which no hybrid integrated circuit device a is housed, the trays can be stacked closely. Therefore, when storing the hybrid integrated circuit device a, the electrical components c, c...
It is possible to prevent the terminals b, b, .

[Brief explanation of the drawing]

Fig. 1 is a perspective view of the separated state of the trays showing an embodiment of this invention, and Fig. 2 is a perspective view of the trays in the stacked state.
FIG. 3 is an end view of the cut portion taken along the line A--A in the figure, and FIG. 3 is a perspective view of the tray in a separated state showing another embodiment. 11... Storage portion, 12... Side wall, 13... Step portion, 14a, 14b, 17a, 17b... Rib,
15...deep recess, 16...shallow recess, a...hybrid integrated circuit device, b...terminal, c...mounted component,
d...Circuit board.

Claims (1)

[Claims for Utility Model Registration] By bending a thin plate in its thickness direction, a plurality of convex ribs 14a, 1 parallel to each other are formed.
4b, 14c, 14d, and these ribs 14a, 1
4b, 14c, 14d and a plurality of parallel convex ribs 17a, 17b, and these ribs 14a, 14b, 14c, 14d, 17a, 17
In the tray for a hybrid integrated circuit device formed with a concave storage section 11 for storing a hybrid integrated circuit device a partitioned by b, the hybrid integrated circuit device a is stored in the storage section 11.
The opposing side walls 12, 1 of the ribs 17a, 17b are used to support the pair of opposing sides of the circuit board d.
2, and recesses 15 and 16 of mutually different depths, which are formed at points symmetrical positions with respect to the center of the tray on the ribs 14a and 14b, The height of the portion 13 from the bottom surface of the storage portion 11 is set higher than the length l from the bottom surface of the circuit board d to the tips of the terminals b, b..., and the depth of the recesses 15 and 16 is The difference l is set to be larger than the sum of the height H of the step portions 13, 13 and the maximum height h of the mounted components c, c, etc. based on the bottom surface of the circuit board d. A tray for hybrid integrated circuit devices.