KR200222639Y1 - PCB tray for a semiconductor memory body - Google Patents

Abstract

The body portion is formed in the body portion with a locking projection at each corner adjacent to each corner, and provided with a receiving portion having a plurality of insertion grooves formed integrally with the supporting projection on both sides of the bottom surface, another body portion is excessively laminated to the body by the locking projection Disclosed is a semiconductor memory body PCB tray which can prevent the coupling and prevent damage to the PCB contact terminals received by the support protrusions. The semiconductor memory body PCB tray according to the present invention has a body portion. The body portion is formed with a plurality of storage portions divided by a divider across the body portion, a plurality of partitions are arranged vertically spaced at a predetermined interval on the bottom surface of the housing portion, a semiconductor device between the partitions Insertion grooves in which the mounted PCB is inserted are formed. Each side wall of the body portion has a predetermined angle from the upper side to the lower side and extends away from each other, and the engaging protrusion is formed at the position adjacent to the central edge of the side wall. In addition, the support protrusion protrudes from the bottom surface of the insertion groove of the housing.

Description

Semiconductor memory body PCB tray {PCB tray for a semiconductor memory body}

The present invention relates to a semiconductor memory body PCB tray, and more particularly, a body portion having a locking projection at each corner adjacent position, a receiving portion formed in the body portion and having a plurality of insertion grooves integrally formed on both sides of the bottom surface. The present invention relates to a semiconductor memory body PCB tray capable of preventing an excessive stacking of another body part to a body part by a locking protrusion and preventing damage to a PCB contact terminal received by a support protrusion.

In general, semiconductor devices fabricated through various work processes are mounted on a PCB as a final step. The PCB on which the semiconductor device is mounted is stored in a predetermined tray and transferred to the next step. Such a tray has an accommodating portion divided by a plurality of partition walls inside a square body having an open top. PCBs in which semiconductor elements are mounted are fitted in the accommodating parts. When the PCB is accommodated in this way, a plurality of trays are stacked and transferred to the next step.

However, there is a problem in that the contact terminals are damaged because the contact terminals of the PCB are directly contacted on the bottom surface of the tray accommodating unit. In addition, a plurality of stacked trays are excessively stacked and coupled to another tray disposed on the lower side due to vibration generated during the load and transfer of the stored PCB.

The present invention is devised to solve the conventional problems as described above, the object of the present invention is formed in the body portion, the body portion is formed with a locking projection at each corner adjacent position, a plurality of base protrusions integrally formed on both sides of the bottom surface The semiconductor memory body PCB tray can be provided with an accommodating part having an insertion groove, which prevents the body from being excessively laminated to another body part by the locking protrusion and also prevents damage to the PCB contact terminal received by the support protrusion. To provide.

1 is a perspective view of a semiconductor memory body PCB tray according to the present invention,

2 is a cross-sectional view taken along line A-A of FIG. 1, and

3 is a cross-sectional view illustrating a stacked state of the semiconductor memory body PCB tray illustrated in FIG. 1.

<Description of the symbols on the main parts of the drawings>

100: PCB tray 110: body portion

114: side wall 116: locking projection

120: accommodating portion 122: partition

124: insertion groove 126: support protrusion

In order to achieve the object of the present invention as described above, the present invention,

A plurality of accommodating parts divided by a body part and a partition plate crossing the inside of the body part are provided, and a plurality of partition walls are disposed vertically on the bottom surface of the accommodating part at predetermined intervals, and a semiconductor is formed between the partition walls. A semiconductor memory body PCB tray having insertion grooves into which a PCB on which a device is mounted is inserted,

Each side wall of the body portion extends from the lower side to the upper side at a predetermined inclination angle and narrows, and is formed by concave front shearing at a position adjacent to the center edge of the side wall, and a support protrusion protrudes from the bottom surface of the insertion groove of the receiving unit. To provide a semiconductor memory body PCB tray formed.

As described above, according to the present invention, by having a receiving portion having a plurality of insertion grooves formed in the body portion, the body portion is formed in the body portion adjacent to each corner, the support protrusions integrally formed on both sides of the bottom surface, As a result, it is possible to prevent the body part from being excessively laminated and bonded to another body part, and to prevent the PCB contact terminal received by the support protrusion from being damaged.

Hereinafter, a semiconductor memory body PCB tray according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

1 is a perspective view of a semiconductor memory body PCB tray according to the present invention, Figure 2 is a cross-sectional view taken along the line AA of Figure 1, and Figure 3 shows a stacked state of the semiconductor memory body PCB tray shown in Figure 1 It is a cross section.

1 and 2, the semiconductor memory body PCB tray 100 according to the present invention has a rectangular parallelepiped shape, and has a body portion having a plurality of storage portions 120 divided by a partition plate 112 that traverses the inside. 110.

Each side wall 114 of the body portion 110 extends in a narrowed form by inclining at a predetermined inclination angle from the bottom to the top. The locking protrusion 116 is concavely sheared toward the accommodating part 120 at positions adjacent to the center edges of the sidewalls 114. At this time, a predetermined stacking portion 118 is formed between the side wall 114 and the housing 120.

On the other hand, a plurality of partitions 122 are formed vertically on the bottom surface of the housing 120. These partitions 122 are spaced apart at predetermined intervals. In this case, insertion grooves 124 into which PCBs (not shown) on which semiconductor elements are mounted are inserted are formed between the partition walls 122, and support protrusions 126 are formed on the bottom surfaces of the insertion grooves 124. do. The support protrusion 126 is formed to protrude upward from both end portions of the bottom surface of the insertion groove 124. Preferably, the support protrusion 126 is mounted on the outer side where the contact terminal of the PCB is not formed.

Hereinafter, a state in which the semiconductor memory body PCB trays 100 formed as described above are stacked will be briefly described. Referring to FIG. 3, another semiconductor memory body PCB tray 100a is stacked on the semiconductor memory body PCB tray 100 and transferred to the next step. At this time, the stacking portion 118a of the semiconductor memory body PCB tray 100a is stacked along the inner side surface of the sidewall 114 and the accommodating portion 120 of the semiconductor memory body PCB tray 100 disposed below. At this time, the latching protrusion 116a of the stacked semiconductor memory body PCB tray 100a is seated on the upper portion of the body portion 110 of the semiconductor memory body PCB tray 100 disposed at the bottom to prevent it from being excessively stacked and coupled. do.

As described above, the semiconductor memory body PCB tray 100 according to the present invention is another semiconductor memory body PCB tray 100a stacked by forming the engaging protrusion 116 at the position adjacent to the central edge of each sidewall 114. ) Has the advantage of preventing excessive stacking.

In addition, by forming the support protrusions 126 on both ends of the bottom surface of the insertion groove 124 formed in the housing 120, there is an advantage that can prevent the contact terminal of the PCB on which the semiconductor element is mounted.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the present invention described in the utility model registration claims. It will be appreciated.

Claims (2)

And a plurality of accommodating parts 120 divided by the partition part 112 crossing the inside of the body part 110 and the body part 110, and having a predetermined interval on the bottom surface of the accommodating part 120. In the semiconductor memory body PCB tray 100, a plurality of partition walls 122 are spaced apart from each other and formed vertically, and insertion grooves 124 into which PCBs on which semiconductor elements are mounted are inserted are inserted between the partition walls 122. In Each sidewall 114 of the body portion 110 is inclined at a constant inclination angle from the bottom to the top and extends in a narrowed shape, the engaging projection 116 is concave shear at a position adjacent to the central edge of the sidewall 114. And a support protrusion 126 is formed on the bottom surface of the insertion grooves 124 of the accommodating part 120. The semiconductor memory body PCB tray of claim 1, wherein the support protrusions 126 protrude upward from both end portions of the bottom surface of the insertion groove 124.