JPH02205588A - Semiconductor device retaining apparatus - Google Patents

Semiconductor device retaining apparatus

Info

Publication number
JPH02205588A
JPH02205588A JP1014787A JP1478789A JPH02205588A JP H02205588 A JPH02205588 A JP H02205588A JP 1014787 A JP1014787 A JP 1014787A JP 1478789 A JP1478789 A JP 1478789A JP H02205588 A JPH02205588 A JP H02205588A
Authority
JP
Japan
Prior art keywords
package
semiconductor device
recess
receiving tray
lower limiting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1014787A
Other languages
Japanese (ja)
Inventor
Shunichi Sumida
炭田 俊一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP1014787A priority Critical patent/JPH02205588A/en
Publication of JPH02205588A publication Critical patent/JPH02205588A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To permit an accurate reception of a package in lower limiting parts by providing a package supporting part in the nearly central part of a recess of a receiving tray, the lower limiting parts in the positions of the recess corresponding to the four corners of the package for a semiconductor device and sloping guide parts at the upper part thereof. CONSTITUTION:Lower limiting parts 8 are provided in the positions corresponding to the four corners 2a of a package 2 of a semiconductor device 1 in a recess part 9 and a supporting part 7 is provided in the nearly central part of the recess part 9. When the device 1 is received in the recess part 9, the lower limiting parts 8 provided as mentioned above restrain the package 2 from horizontal movement with a package bottom 2b supported by the supporting part 7. The package 2 thus limited in its movement can prevent the contact between leads 3 and a receiving tray 5. Sloping guide parts 8a at the upper parts of the lower limiting parts 8 allows the package 2 to be slid down into the lower limiting parts 8, without the leads 3 contacting with the receiving tray 5, even if the package 2 is received by the tray 5 less accurately.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、製品加工後の半導体装置の運搬等に用いら
れる半導体装置用保持具に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a semiconductor device holder used for transporting semiconductor devices after product processing.

〔従来の技術〕[Conventional technology]

従来の半導体装置用保持具を第4図および第5図に基づ
いて説明する。
A conventional semiconductor device holder will be explained based on FIGS. 4 and 5.

この半導体装置用保持具は、第4図および第5図に示す
ように、上側固定枠10を有する押さえ蓋4′と、半導
体装置1を収納する凹部9′と下側固定枠11とを有す
る受け皿5′とを備えている。2は半導体装置lのパッ
ケージを示し、3は半導体装W1のリードを示している
As shown in FIGS. 4 and 5, this semiconductor device holder has a holding lid 4' having an upper fixing frame 10, a recess 9' for housing the semiconductor device 1, and a lower fixing frame 11. and a saucer 5'. 2 indicates a package of the semiconductor device I, and 3 indicates a lead of the semiconductor device W1.

この半導体装置用保持具は、受け皿5′の下側固定枠1
1と押さえ蓋4′の上側固定枠lOとにより、パッケー
ジ2の下部と上部とを挾み込み、リード3が外部と接触
しないように保護している。
This semiconductor device holder consists of a lower fixing frame 1 of a receiving tray 5'.
1 and the upper fixing frame 10 of the holding lid 4' sandwich the lower and upper parts of the package 2 to protect the leads 3 from coming into contact with the outside.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来の半導体装置用保持具は、受け皿5′の下側固定枠
11をパッケージ2とリード3との間に位置するように
設け、リード3を受け皿5′と接触させずにパッケージ
2の下部を位置規制している。このため、下側固定枠1
1の寸法公差が少なくなり、半導体装lf1の受け皿5
′への収納時に、パッケージ2が下側固定枠11内に収
めにくく、また収まらないという問題があった。
In the conventional semiconductor device holder, the lower fixing frame 11 of the receiving tray 5' is provided to be located between the package 2 and the leads 3, and the lower part of the package 2 is fixed without bringing the leads 3 into contact with the receiving tray 5'. Location is regulated. For this reason, the lower fixed frame 1
1 is reduced, and the receiving tray 5 of the semiconductor device lf1 is reduced.
When the package 2 is stored in the lower fixing frame 11, there is a problem that it is difficult or impossible to fit the package 2 into the lower fixing frame 11.

したがって、この発明の目的は、簡単かつ確実に受け皿
の所定の位置へ半導体装置を収納することのできる半導
体装置用保持具を提供することである。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a holder for a semiconductor device that can easily and reliably store a semiconductor device in a predetermined position of a receiving tray.

〔課題を解決するための手段〕[Means to solve the problem]

この発明の半導体装置用保持具は、半導体装置のパッケ
ージの上部の水平方向の移動を規制する上部規制部を有
する押さえ蓋と、半導体装置を収納する凹部と、この凹
部の略中央部に設けたパッケージの底面の支持部と、パ
ッケージの四隅に対応する凹部の位置に設けてパンケー
ジの水平方向の移動を規制する下部規制部と、この下部
規制部の上端部に形成したガイド用傾斜部とを有する受
け皿とを備えた構成としている。
The holder for a semiconductor device of the present invention has a holding lid having an upper regulating portion for regulating horizontal movement of the upper part of a semiconductor device package, a recess for storing the semiconductor device, and a recess provided approximately in the center of the recess. A supporting part on the bottom surface of the package, a lower regulating part provided at the positions of the recesses corresponding to the four corners of the package to regulate horizontal movement of the pan cage, and a guide slope part formed at the upper end of the lower regulating part. The configuration includes a saucer having a container.

〔作 用〕[For production]

この発明の構成によれば、受け皿に設けられた凹部には
下部規制部が半導体装置のパッケージの四隅に対応した
位置に設けられ、凹部の略中央部に支持部が設けられて
いるので、半導体装置のパッケージが下部規制部により
水平方向の移動を規制され、半導体装置のパッケージ底
面が支持部により支持される。したがって、半導体装置
が下部規制部および支持部により位置規制され、リード
と受け皿との接触が防止される。しかも、下部規制部の
上端部にガイド用傾斜部を設けたので、半導体装置の凹
部への投入位置がずれたときでも、半導体装置のパッケ
ージの四隅が下部規制部のガイド用傾斜部に沿って滑り
込み、半導体装置を下部規制部内に確実に収納すること
ができる。
According to the configuration of the present invention, the lower regulating portions are provided in the recessed portion provided in the receiving tray at positions corresponding to the four corners of the package of the semiconductor device, and the supporting portion is provided approximately in the center of the recessed portion. The horizontal movement of the device package is restricted by the lower regulating portion, and the bottom surface of the semiconductor device package is supported by the supporting portion. Therefore, the position of the semiconductor device is regulated by the lower regulating part and the supporting part, and contact between the leads and the receiving tray is prevented. Moreover, since the guiding slope is provided at the upper end of the lower regulating part, even if the position of the semiconductor device inserted into the recess is misaligned, the four corners of the semiconductor device package will be aligned with the guiding inclined part of the lower regulating part. The semiconductor device can be slid into the lower regulating portion and reliably accommodated therein.

さらに、押さえ蓋の上部規制部により、半導体装置のパ
ッケージの上部の水平方向の移動が規制され、押さえ蓋
により半導体装置の上方向の移動が規制される。
Further, the upper regulating portion of the holding lid restricts horizontal movement of the upper part of the package of the semiconductor device, and the holding lid restricts upward movement of the semiconductor device.

〔実施例〕〔Example〕

この発明の半導体装置用保持具の一実施例を第1図ない
し第3図に基づいて説明する。
An embodiment of the semiconductor device holder of the present invention will be described with reference to FIGS. 1 to 3.

この半導体装置用保持具は、第1図ないし第3図に示す
ように、押さえ蓋4と受け皿5とを備えている。押さえ
蓋4は、半導体装置1のパッケージ2の上部2Cの水平
方向の移動を規制する上部規制部6を有している。受け
皿5は、半導体装置1を収納する凹部9と、この凹部9
の略中央部にパッケージ2の底面2bを支持する支持部
7と、パッケージ2の水平方向の移動を規制する下部規
制部8とを有している。また、下部規制部8は、パッケ
ージ2の四隅2aに対応する凹部9の位置に設けられ、
上端部にガイド用傾斜部8aが形成されている。3は半
導体装置lのリードを示している。
This semiconductor device holder includes a holding lid 4 and a receiving tray 5, as shown in FIGS. 1 to 3. The holding lid 4 has an upper restricting portion 6 that restricts movement of the upper portion 2C of the package 2 of the semiconductor device 1 in the horizontal direction. The tray 5 includes a recess 9 for storing the semiconductor device 1 and a recess 9.
It has a support part 7 that supports the bottom surface 2b of the package 2, and a lower restriction part 8 that restricts the movement of the package 2 in the horizontal direction. Further, the lower regulating portion 8 is provided at the position of the recessed portion 9 corresponding to the four corners 2a of the package 2,
A guiding inclined portion 8a is formed at the upper end. 3 indicates a lead of the semiconductor device l.

この半導体装置用保持具によれば、凹部9の半導体装置
1のパッケージ2の四隅2aに対応した位置に下部規制
部8を設け、凹部9の略中央部に支持部7を設けたので
、半導体装置1を受け皿5の凹部9に投入し収納したと
きに、パッケージ2の四隅2aが下部規制部8により位
置規制されてパッケージ2の水平方向の移動が規制され
、支持部7によりパッケージ2の底面2bが支持される
According to this semiconductor device holder, the lower regulating portions 8 are provided in the recess 9 at positions corresponding to the four corners 2a of the package 2 of the semiconductor device 1, and the supporting portion 7 is provided approximately in the center of the recess 9. When the device 1 is put into the recess 9 of the receiving tray 5 and stored, the four corners 2a of the package 2 are positionally regulated by the lower regulating part 8, and the horizontal movement of the package 2 is regulated, and the bottom surface of the package 2 is regulated by the supporting part 7. 2b is supported.

したがって、パッケージ2を下部規制部8および支持部
7により位置規制することができ、リード3と受け皿5
との接触を防止することができる。
Therefore, the position of the package 2 can be regulated by the lower regulating part 8 and the supporting part 7, and the lead 3 and the receiving tray 5
Contact with the person can be prevented.

しかも、下部規制部8の上端部にガイド用傾斜部8aを
形成したので、半導体装置lの受け皿5への投入位置精
度が悪くなったときでも、パッケージ2の四隅2aがガ
イド用傾斜部8aに沿って滑り込み、リード3が受け皿
5と接触することなく、パンケージ2が下部規制部8内
に収納される。したがって、リード3の変形がなく、簡
単かつ確実にパッケージ2を下部規制部8内へ収納する
ことができる。また、下部規制部8をパッケージ2の四
隅2aの位置に対応して設けたので、下部規制部8の高
さを高く設定することができ、半導体装置1の受け皿5
への投入時や搬送時の振動による半導体装1.1の下部
規制部8からの飛び出しを防止することができる。
In addition, since the guide slope part 8a is formed at the upper end of the lower regulating part 8, even when the accuracy of the placement position of the semiconductor device l into the receiving tray 5 deteriorates, the four corners 2a of the package 2 are aligned with the guide slope part 8a. The pan cage 2 is accommodated in the lower regulating portion 8 without the lead 3 coming into contact with the receiving tray 5. Therefore, there is no deformation of the leads 3, and the package 2 can be easily and reliably stored in the lower regulating portion 8. Further, since the lower regulating portions 8 are provided corresponding to the positions of the four corners 2a of the package 2, the height of the lower regulating portions 8 can be set high.
It is possible to prevent the semiconductor device 1.1 from popping out from the lower regulating portion 8 due to vibrations when being inserted into a container or transported.

さらに、押さえ!4にパッケージ2の上部2cの水平方
向の移動を規制する上部規制部6を設けたので、押さえ
蓋4により受け皿5を閉じたときに、上部規制部6によ
りパッケージ2の上部2cの水平方向の移動を規制でき
、かつ押さえ蓋4によりパッケージ2の上方向の移動も
規制することができ、半導体装置1の保持具からの飛び
出しを防止することができる。
Furthermore, hold it down! 4 is provided with an upper regulating part 6 that regulates the horizontal movement of the upper part 2c of the package 2, so when the tray 5 is closed with the presser lid 4, the upper regulating part 6 prevents the horizontal movement of the upper part 2c of the package 2. The upward movement of the package 2 can also be restricted by the holding lid 4, and the semiconductor device 1 can be prevented from jumping out from the holder.

このように、この半導体装置用保持具は、簡単かつ確実
に受け皿5の所定の位置へ半導体装置1を収納すること
ができ、しかも確実に半導体装置1のパッケージ2の位
置規制を行い、リード3の変形を防止することができる
In this way, this semiconductor device holder can easily and reliably store the semiconductor device 1 in the predetermined position of the receiving tray 5, and also reliably regulates the position of the package 2 of the semiconductor device 1, and securely controls the position of the package 2 of the semiconductor device 1. deformation can be prevented.

〔発明の効果〕〔Effect of the invention〕

この発明の半導体装置保持具によれば、受け皿の凹部の
略中央部にパッケージの底面の支持部を設け、凹部に半
導体装置のパッケージの四隅に対応する位置に下部規制
部を設け、この下部規制部の上端部にガイド用傾斜部を
形成したので、半導体装置の受け皿への投入位置がずれ
た場合でも、簡単かつ確実に下部規制部内にパッケージ
を収納することができる。さらに、押さえ蓋にパッケー
ジの上部の水平方向の移動を規制する上部規制部を設け
たので、半導体装置の飛び出しをなくすことができ、確
実にパッケージの位置規制を行うことができる。
According to the semiconductor device holder of the present invention, the supporting portion for the bottom surface of the package is provided at approximately the center of the recessed portion of the receiving tray, and the lower regulating portions are provided in the recessed portion at positions corresponding to the four corners of the package of the semiconductor device. Since the guiding inclined part is formed at the upper end of the lower regulating part, even if the position at which the semiconductor device is inserted into the receiving tray is shifted, the package can be easily and reliably stored in the lower regulating part. Further, since the holding lid is provided with an upper regulating portion that regulates the movement of the upper part of the package in the horizontal direction, it is possible to prevent the semiconductor device from popping out, and it is possible to reliably regulate the position of the package.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例の側断面図、第2図は第1
図の受け皿に半導体装置1を収納したときの平面図、第
3図は第2図のA−A’断面図、第4図は従来の半導体
装置用保持具の側断面図、第5図は第4図の受け皿に半
導体装置を収納したときの平面図である。
FIG. 1 is a side sectional view of one embodiment of the present invention, and FIG.
FIG. 3 is a sectional view taken along line AA' in FIG. 2, FIG. 4 is a side sectional view of a conventional semiconductor device holder, and FIG. FIG. 5 is a plan view when a semiconductor device is housed in the tray of FIG. 4;

Claims (1)

【特許請求の範囲】[Claims]  半導体装置のパッケージの上部の水平方向の移動を規
制する上部規制部を有する押さえ蓋と、前記半導体装置
を収納する凹部と、この凹部の略中央部に設けた前記パ
ッケージの底面の支持部と、前記パッケージの四隅に対
応する前記凹部の位置に設けて前記パッケージの水平方
向の移動を規制する下部規制部と、この下部規制部の上
端部に形成したガイド用傾斜部とを有する受け皿とを備
えた半導体装置用保持具。
a holding lid having an upper restricting portion that restricts horizontal movement of an upper portion of a package of a semiconductor device; a recess for housing the semiconductor device; and a support portion for the bottom surface of the package provided approximately in the center of the recess; A receiving tray having a lower regulating part provided at the position of the recess corresponding to the four corners of the package to regulate horizontal movement of the package, and a guide slope part formed at an upper end of the lower regulating part. A holder for semiconductor devices.
JP1014787A 1989-01-23 1989-01-23 Semiconductor device retaining apparatus Pending JPH02205588A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1014787A JPH02205588A (en) 1989-01-23 1989-01-23 Semiconductor device retaining apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1014787A JPH02205588A (en) 1989-01-23 1989-01-23 Semiconductor device retaining apparatus

Publications (1)

Publication Number Publication Date
JPH02205588A true JPH02205588A (en) 1990-08-15

Family

ID=11870767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1014787A Pending JPH02205588A (en) 1989-01-23 1989-01-23 Semiconductor device retaining apparatus

Country Status (1)

Country Link
JP (1) JPH02205588A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100400829B1 (en) * 2000-12-26 2003-10-08 앰코 테크놀로지 코리아 주식회사 Packing tray for semiconductor package

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099881A (en) * 1983-11-07 1985-06-03 松下電器産業株式会社 Carrier for flat type ic package
JPH0147685B2 (en) * 1982-03-08 1989-10-16 Mitsubishi Heavy Ind Ltd

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0147685B2 (en) * 1982-03-08 1989-10-16 Mitsubishi Heavy Ind Ltd
JPS6099881A (en) * 1983-11-07 1985-06-03 松下電器産業株式会社 Carrier for flat type ic package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100400829B1 (en) * 2000-12-26 2003-10-08 앰코 테크놀로지 코리아 주식회사 Packing tray for semiconductor package

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