JPH0476094U - - Google Patents
Info
- Publication number
- JPH0476094U JPH0476094U JP11936190U JP11936190U JPH0476094U JP H0476094 U JPH0476094 U JP H0476094U JP 11936190 U JP11936190 U JP 11936190U JP 11936190 U JP11936190 U JP 11936190U JP H0476094 U JPH0476094 U JP H0476094U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- heat dissipation
- board
- dissipation fin
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11936190U JPH0476094U (US08063081-20111122-C00044.png) | 1990-11-16 | 1990-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11936190U JPH0476094U (US08063081-20111122-C00044.png) | 1990-11-16 | 1990-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476094U true JPH0476094U (US08063081-20111122-C00044.png) | 1992-07-02 |
Family
ID=31867325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11936190U Pending JPH0476094U (US08063081-20111122-C00044.png) | 1990-11-16 | 1990-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476094U (US08063081-20111122-C00044.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003347783A (ja) * | 2002-05-31 | 2003-12-05 | Mitsubishi Electric Corp | 電力変換装置 |
| WO2008044485A1 (en) * | 2006-10-06 | 2008-04-17 | Kabushiki Kaisha Yaskawa Denki | Mounting structure for power module and motor control device having the same |
| JP2010086071A (ja) * | 2008-09-29 | 2010-04-15 | Toshiba Corp | 電子機器 |
| JP2015528214A (ja) * | 2012-08-06 | 2015-09-24 | ケーエムダブリュ・インコーポレーテッド | ヒートシンクを介した放熱装置 |
-
1990
- 1990-11-16 JP JP11936190U patent/JPH0476094U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003347783A (ja) * | 2002-05-31 | 2003-12-05 | Mitsubishi Electric Corp | 電力変換装置 |
| WO2008044485A1 (en) * | 2006-10-06 | 2008-04-17 | Kabushiki Kaisha Yaskawa Denki | Mounting structure for power module and motor control device having the same |
| US7872868B2 (en) | 2006-10-06 | 2011-01-18 | Kabushiki Kaisha Yaskawa Denki | Mounting structure for power module, and motor controller including the same |
| TWI403258B (zh) * | 2006-10-06 | 2013-07-21 | Yaskawa Denki Seisakusho Kk | The installation of the power module and the motor control device |
| JP2010086071A (ja) * | 2008-09-29 | 2010-04-15 | Toshiba Corp | 電子機器 |
| JP2015528214A (ja) * | 2012-08-06 | 2015-09-24 | ケーエムダブリュ・インコーポレーテッド | ヒートシンクを介した放熱装置 |
