JPH04758U - - Google Patents
Info
- Publication number
- JPH04758U JPH04758U JP4015290U JP4015290U JPH04758U JP H04758 U JPH04758 U JP H04758U JP 4015290 U JP4015290 U JP 4015290U JP 4015290 U JP4015290 U JP 4015290U JP H04758 U JPH04758 U JP H04758U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- view
- lead
- bonding
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 238000000034 method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案に係る半導体装置の実施例を示
す平面図、第２図は第１図のＸ−Ｘ線拡大断面図
、第３図は第２図のＹ−Ｙ線拡大断面図、第４図
は第３図の接着工程を示す断面図、第５図は第３
図の変形例を示す断面図、第６図は第５図の接着
工程を示す断面図、第７図は接続部分の部分拡大
平面図である。 ２……配線基板、３……外部導出入用リード、
６……樹脂接着材。
す平面図、第２図は第１図のＸ−Ｘ線拡大断面図
、第３図は第２図のＹ−Ｙ線拡大断面図、第４図
は第３図の接着工程を示す断面図、第５図は第３
図の変形例を示す断面図、第６図は第５図の接着
工程を示す断面図、第７図は接続部分の部分拡大
平面図である。 ２……配線基板、３……外部導出入用リード、
６……樹脂接着材。
Claims (1)
- 配線基板と外部導出入用リードとを接着手段に
より接続導通してなる半導体装置において、加熱
、加圧により加圧方向へのみ導電性を備える熱硬
化性の樹脂接着材を用いて接着することを特徴と
する半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4015290U JP2509098Y2 (ja) | 1990-04-13 | 1990-04-13 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4015290U JP2509098Y2 (ja) | 1990-04-13 | 1990-04-13 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04758U true JPH04758U (ja) | 1992-01-07 |
| JP2509098Y2 JP2509098Y2 (ja) | 1996-08-28 |
Family
ID=31549695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4015290U Expired - Lifetime JP2509098Y2 (ja) | 1990-04-13 | 1990-04-13 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2509098Y2 (ja) |
-
1990
- 1990-04-13 JP JP4015290U patent/JP2509098Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2509098Y2 (ja) | 1996-08-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |