JPH0472680U - - Google Patents
Info
- Publication number
- JPH0472680U JPH0472680U JP11698990U JP11698990U JPH0472680U JP H0472680 U JPH0472680 U JP H0472680U JP 11698990 U JP11698990 U JP 11698990U JP 11698990 U JP11698990 U JP 11698990U JP H0472680 U JPH0472680 U JP H0472680U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wiring board
- printed wiring
- conductive hole
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11698990U JPH0472680U (ru) | 1990-11-06 | 1990-11-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11698990U JPH0472680U (ru) | 1990-11-06 | 1990-11-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0472680U true JPH0472680U (ru) | 1992-06-26 |
Family
ID=31864854
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11698990U Pending JPH0472680U (ru) | 1990-11-06 | 1990-11-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0472680U (ru) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS622697A (ja) * | 1985-06-26 | 1987-01-08 | ゼネラル セラミツクス インコ−ポレイテツド | 多層セラミツク回路盤とその製法 |
JPS6226896A (ja) * | 1985-07-26 | 1987-02-04 | 日本電気株式会社 | 電子回路パツケ−ジ |
JPS6337693A (ja) * | 1986-08-01 | 1988-02-18 | 日本電気株式会社 | 多層配線基板の製造方法 |
JPS6480524A (en) * | 1987-09-24 | 1989-03-27 | Matsushita Electric Works Ltd | Multi-layer printed wiring board |
JPH01100996A (ja) * | 1987-10-14 | 1989-04-19 | Canon Inc | 多層プリント配線基板 |
-
1990
- 1990-11-06 JP JP11698990U patent/JPH0472680U/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS622697A (ja) * | 1985-06-26 | 1987-01-08 | ゼネラル セラミツクス インコ−ポレイテツド | 多層セラミツク回路盤とその製法 |
JPS6226896A (ja) * | 1985-07-26 | 1987-02-04 | 日本電気株式会社 | 電子回路パツケ−ジ |
JPS6337693A (ja) * | 1986-08-01 | 1988-02-18 | 日本電気株式会社 | 多層配線基板の製造方法 |
JPS6480524A (en) * | 1987-09-24 | 1989-03-27 | Matsushita Electric Works Ltd | Multi-layer printed wiring board |
JPH01100996A (ja) * | 1987-10-14 | 1989-04-19 | Canon Inc | 多層プリント配線基板 |