JPH047138U - - Google Patents
Info
- Publication number
- JPH047138U JPH047138U JP4649790U JP4649790U JPH047138U JP H047138 U JPH047138 U JP H047138U JP 4649790 U JP4649790 U JP 4649790U JP 4649790 U JP4649790 U JP 4649790U JP H047138 U JPH047138 U JP H047138U
- Authority
- JP
- Japan
- Prior art keywords
- head
- support member
- heat sink
- heat
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
- Electronic Switches (AREA)
Description
第１図は本考案の一実施例のサーマルヘツド２
１の斜視図、第２図はサーマルヘツド２１の断面
図、第３図はサーマルヘツド２１の当接位置４４
付近の拡大断面図、第４図はサーマルヘツド２１
全体の断面図、第５図は本実施例の作用を説明す
る断面図、第６図は典型的な従来のサーマルヘツ
ド１の断面図、第７図は従来例の問題点を説明す
る断面図、第８図は従来例の問題点を説明する平
面図である。
２１……サーマルヘツド、２２ａ，２２ｂ……
ヘツド基板、２３……発熱抵抗体、２８……軟性
接着剤、２９ａ，２９ｂ……放熱板、３０……支
持板、４７……調整部材、４８……段差。
Figure 1 shows a thermal head 2 of an embodiment of the present invention.
1 is a perspective view, FIG. 2 is a sectional view of the thermal head 21, and FIG. 3 is a contact position 44 of the thermal head 21.
An enlarged sectional view of the vicinity, Figure 4 shows the thermal head 21
5 is a sectional view explaining the operation of this embodiment, FIG. 6 is a sectional view of a typical conventional thermal head 1, and FIG. 7 is a sectional view explaining problems of the conventional example. , FIG. 8 is a plan view illustrating the problems of the conventional example. 21...Thermal head, 22a, 22b...
Head board, 23...heating resistor, 28...soft adhesive, 29a, 29b...heat sink, 30...support plate, 47...adjustment member, 48...step difference.
Claims (1)
数の発熱抵抗体が配列された複数のヘツド基板を
配置するとともに、上記各ヘツド基板の上表面同
士が単一の平坦面を構成すべく、ヘツド基板と放
熱板間または放熱板と上記支持部材間の少なくと
もいずれか一方に段差調整用の調整板を介装して
成るサーマルヘツド。 A plurality of head substrates each having a large number of heat generating resistors arranged thereon are arranged on a plurality of heat sinks placed on a support member, and the upper surfaces of each of the head substrates form a single flat surface. In order to achieve this, a thermal head is provided in which an adjustment plate for adjusting the level difference is interposed between the head substrate and the heat sink or between the heat sink and the support member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4649790U JPH047138U (en) | 1990-04-28 | 1990-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4649790U JPH047138U (en) | 1990-04-28 | 1990-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH047138U true JPH047138U (en) | 1992-01-22 |
Family
ID=31561629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4649790U Pending JPH047138U (en) | 1990-04-28 | 1990-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH047138U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02212157A (en) * | 1989-02-14 | 1990-08-23 | Rohm Co Ltd | Thermal head and production thereof |
-
1990
- 1990-04-28 JP JP4649790U patent/JPH047138U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02212157A (en) * | 1989-02-14 | 1990-08-23 | Rohm Co Ltd | Thermal head and production thereof |