JPH0471349B2 - - Google Patents
Info
- Publication number
- JPH0471349B2 JPH0471349B2 JP59108931A JP10893184A JPH0471349B2 JP H0471349 B2 JPH0471349 B2 JP H0471349B2 JP 59108931 A JP59108931 A JP 59108931A JP 10893184 A JP10893184 A JP 10893184A JP H0471349 B2 JPH0471349 B2 JP H0471349B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor light
- light emitting
- emitting chip
- ceramic plate
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 41
- 239000002184 metal Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000000919 ceramic Substances 0.000 claims description 16
- 230000000694 effects Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011295 pitch Substances 0.000 description 3
- 230000000087 stabilizing effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
【発明の詳細な説明】
（発明の技術分野）
この発明は、画像出力装置等に使用する半導体
光源の温度特性を安定化することにより、その発
光量を自熱効果に対して一定とすることができる
半導体光源装置に関する。[Detailed Description of the Invention] (Technical Field of the Invention) The present invention is directed to stabilizing the temperature characteristics of a semiconductor light source used in an image output device, etc., so that the amount of light emitted by the semiconductor light source is kept constant against self-heating effects. The present invention relates to a semiconductor light source device that can perform
（発明の技術的背景とその問題点）
第１図は半導体光源として広く用いられている
キヤンタイプ発光ダイオードの概略構成を示すも
のであり、半導体発光チツプ３が絶縁板４上に取
付けられて金属ケース１の中に固定されている。
そして、半導体発光チツプ３はリード線５Ａを介
して金属ケース１の低部に取付けられているリー
ド端子５に接続され、リード端子５から電力を供
給したときに半導体発光チツプ３が発光され、そ
の光が金属ケース１の頂部に嵌合されているレン
ズ２により収束され外部に照射されるようになつ
ている。第２図はこのような発光ダイオードに電
流を加えたときの発光量の変化を示すもので、同
図Ａに示すような短時間の矩形状電流パルスを
加えた場合、発光ダイオードの発光量Ｅは同図Ｂ
のように変化する。つまり、半導体発光チツプ３
に電流が供給されると自己発熱すると共に、半導
体発光チツプ３が負の温度特性をもつことから、
第２図Ｂのように発光量Ｅは次第に低下する。長
時間連続点灯していれば温度は安定したいくが、
画像出力装置のようにパルス電圧波形を加えて感
光材料を露光するような場合、光量の積分値で露
光量が決まることから、第２図Ｂのように途中か
らの発光量Ｅが低下してしまうと画像の出来上り
濃度に重大な影響が出てしまう。(Technical background of the invention and its problems) Figure 1 shows a schematic configuration of a can type light emitting diode widely used as a semiconductor light source, in which a semiconductor light emitting chip 3 is mounted on an insulating plate 4 and a metal It is fixed inside case 1.
The semiconductor light emitting chip 3 is connected to a lead terminal 5 attached to the lower part of the metal case 1 via a lead wire 5A, and when power is supplied from the lead terminal 5, the semiconductor light emitting chip 3 emits light. Light is converged by a lens 2 fitted to the top of a metal case 1 and irradiated to the outside. Figure 2 shows the change in the amount of light emitted when a current is applied to such a light emitting diode.When a short rectangular current pulse as shown in figure A is applied, the amount of light emitted by the light emitting diode E is the same figure B
It changes like this. In other words, the semiconductor light emitting chip 3
Since the semiconductor light emitting chip 3 self-heats when a current is supplied to it and has negative temperature characteristics,
As shown in FIG. 2B, the amount of light emitted E gradually decreases. If the lights are turned on continuously for a long time, the temperature will be stable, but
When a photosensitive material is exposed to light by applying a pulse voltage waveform, as in an image output device, the exposure amount is determined by the integral value of the light amount, so the light emission amount E decreases from the middle as shown in Figure 2B. If it is stored away, the resulting density of the image will be seriously affected.
そこで、一般的には発光ダイオードキヤンの上
から円筒状の放熱フイン６を図示のように被せる
等の対策により、放熱効果を上げて半導体発光チ
ツプ３の温度上昇を少なくしようとしている。し
かしながら、半導体発光チツプ３と絶縁板４の部
分で既に熱抵抗は大きくなつてしまつているため
に放熱フイン６の効果は薄く、第２図Ｂの発光量
Ｅの低下はほとんど防ぐことが出来ず、画像出力
装置による仕上り画像の濃度については満足でき
るものが得られなかつた。 Therefore, it is generally attempted to increase the heat dissipation effect and reduce the temperature rise of the semiconductor light emitting chip 3 by covering the light emitting diode can with a cylindrical heat dissipating fin 6 as shown in the figure. However, since the thermal resistance has already increased between the semiconductor light emitting chip 3 and the insulating plate 4, the effect of the heat dissipation fins 6 is weak, and the decrease in the amount of light emitted E shown in FIG. 2B can hardly be prevented. However, the density of the finished image produced by the image output device was not satisfactory.
（発明の目的）
この発明の目的は、半導体発光チツプを直接熱
容量の大きい金属に取付けて熱抵抗を小さくし、
半導体発光チツプの温度上昇を小さくすることに
より温度を早期の安定化して、画像出力装置等の
仕上り画像の色調を完全なものにするために最適
な半導体光源装置を提供することにある。(Object of the invention) The object of the invention is to directly attach a semiconductor light emitting chip to a metal with a large heat capacity to reduce thermal resistance.
An object of the present invention is to provide a semiconductor light source device which is optimal for stabilizing the temperature at an early stage by reducing the temperature rise of a semiconductor light emitting chip and perfecting the color tone of a finished image of an image output device or the like.
（発明の概要）
この発明は画像出力装置等に用いられる半導体
光源装置に関するもので、円筒形状ケースと、こ
のケースの頂部に設けられたレンズと、頂部に半
導体発光チツプが装着されると共に半導体発光チ
ツプの一つの電極リードを兼ねる金属フインと、
この金属フインを支持するセラミツクス板とから
成り、上記セラミツクス板が上記円筒形状ケース
内に取着されていることにより、熱抵抗を小さく
し、半導体発光チツプの発光時の温度特性を安定
させるようにしたものである。(Summary of the Invention) The present invention relates to a semiconductor light source device used in an image output device, etc., which includes a cylindrical case, a lens provided on the top of the case, a semiconductor light emitting chip mounted on the top, and a semiconductor light source device. A metal fin that also serves as one electrode lead of the chip,
and a ceramic plate that supports the metal fin, and the ceramic plate is installed inside the cylindrical case to reduce thermal resistance and stabilize the temperature characteristics of the semiconductor light emitting chip during light emission. This is what I did.
（発明の実施例）
この発明の半導体光源装置は第３図に示すよう
に、半導体発光チツプ３が円板の裏面に電極柱７
Ａを立設されている金属フイン７の上面に装着さ
れ、この金属フイン７は円板状のセラミツクス板
８に嵌着されている。金属フイン７は銅、白銅、
金等の熱伝導性が良く、伝導性のよい材料で形成
されており、セラミツクス板８はセラミツクスの
熱伝導性が良く、電気的には絶縁である特性を有
しており、セラミツクス板８の表面（半導体発光
チツプ３側）は黒色に着色されている。そして、
半導体発光チツプ３と電極柱７Ａにはそれぞれリ
ード線９Ａ及び９Ｂが接続されており、リード線
９Ａ及び９Ｂに電位差を与えることにより半導体
発光チツプ３が所定の色には発光するようになつ
ている。また、セラミツクス板８は円筒形状をし
た内面がネジピツチ１０Ａに螺刻されたケース１
０内に収められ、ネジピツチ１０Ａの終端に設け
られているストツパ１１で支えられると共に、ネ
ジピツチ１０Ａに螺合するリング状のリングネジ
１２で裏面を支持させている。なお、半導体発光
チツプ３で発光された光は、ケース１０に設けら
れているレンズ（図示せず）によつて収束される
ようになつており、リード線９Ａ及び９Ｂはリー
ド端子（図示せず）に接続されている。(Embodiment of the Invention) As shown in FIG. 3, the semiconductor light source device of the present invention has a semiconductor light emitting chip 3 on the back surface of a disk and an electrode pillar 7.
A is attached to the upper surface of a metal fin 7 which is erected, and this metal fin 7 is fitted onto a disc-shaped ceramic plate 8. The metal fin 7 is made of copper, cupronickel,
The ceramic plate 8 is made of a material with good thermal conductivity such as gold, and has good thermal conductivity and is electrically insulating. The surface (semiconductor light emitting chip 3 side) is colored black. and,
Lead wires 9A and 9B are connected to the semiconductor light emitting chip 3 and the electrode column 7A, respectively, and by applying a potential difference to the lead wires 9A and 9B, the semiconductor light emitting chip 3 emits light in a predetermined color. . In addition, the ceramic plate 8 has a cylindrical inner surface which is threaded into a case 1 with screw pitches 10A.
0 and is supported by a stopper 11 provided at the end of the screw pitch 10A, and the back surface is supported by a ring-shaped ring screw 12 screwed into the screw pitch 10A. Note that the light emitted by the semiconductor light emitting chip 3 is converged by a lens (not shown) provided in the case 10, and the lead wires 9A and 9B are connected to lead terminals (not shown). )It is connected to the.
このような構成において、電極を兼ねる金属フ
イン７は大きな熱容量をもち、またセラミツクス
板８は電気絶縁対が良いうえに良熱伝導体であ
り、セラミツクス板８がケース１０に収納されて
いることから、半導体発光チツプ３からケースに
至るまでの熱抵抗を小さくおさえることができ
る。このため第４図に示すように、同図Ａの一定
電流のパルス信号に対して発光量Ｅは同図Ｂの
ようにほぼ一定なものとなる。これは、半導体発
光チツプ３が発光して温度上昇しようとしても、
熱伝導体の良い金属フイン７及びセラミツクス板
８によつて吸収されてしまい、温度が安定化する
ためである。また、セラミツクス板８の表面は黒
色に着色されているので、反射光が少なく、半導
体発光チツプ３からの光の収束効果を上げること
ができる。 In such a configuration, the metal fins 7 that also serve as electrodes have a large heat capacity, and the ceramic plate 8 has good electrical insulation and is a good thermal conductor, and the ceramic plate 8 is housed in the case 10. , the thermal resistance from the semiconductor light emitting chip 3 to the case can be kept low. Therefore, as shown in FIG. 4, the amount of light emitted E becomes approximately constant as shown in FIG. 4B in response to the constant current pulse signal shown in FIG. 4A. This means that even if the semiconductor light emitting chip 3 emits light and tries to rise in temperature,
This is because the heat is absorbed by the metal fins 7 and the ceramic plate 8, which are good heat conductors, and the temperature becomes stable. Further, since the surface of the ceramic plate 8 is colored black, there is less reflected light, and the effect of converging light from the semiconductor light emitting chip 3 can be improved.
ここで、金属フイン７の材質としては熱伝導の
良いものであればある程良く、又各寸法も出来る
だけ大きくとることによりさらに効果を増すこと
ができる。そして、セラミツクス板８は半導体発
光チツプ３とケース１０を電気的に絶縁する必要
があり、併せて熱伝導性も良い材質ということか
らセラミツクス材料が選定されている。さらに、
このセラミツクスは容易に着色も可能であるの
で、たとえば黒色に着色しておくことにより反射
光を少なくできる利点を有している。なお、上述
では金属フイン７の上に１つの半導体発光チツプ
３を装着する例を示したが、第５図に示すように
たとえば４個のチツプ３Ａ〜３Ｄに分割して装着
するようにしても良い。この場合、各チツプ３Ａ
〜３Ｄにリード線を接続して直列又は並列に発光
することになるが、放熱効果は一層向上する。ま
た、１チツプを複数個に分割するのではなく、複
数個の半導体発光チツプを金属フイン７に装着し
て光源装置を構成すれば、より発光量の多い光源
を実現できる。さらに、金属フイン７の形状は
種々変更することができ、上部に半導体発光チツ
プを装着できるセラミツクス板に取付可能なもの
であればよい。 Here, the material of the metal fins 7 is better as long as it has good thermal conductivity, and the effect can be further enhanced by making each dimension as large as possible. Ceramic material is selected for the ceramic plate 8 because it is necessary to electrically insulate the semiconductor light emitting chip 3 and the case 10, and it also has good thermal conductivity. moreover,
Since this ceramic can be easily colored, it has the advantage that reflected light can be reduced by coloring it black, for example. In the above, an example was shown in which one semiconductor light emitting chip 3 is mounted on the metal fin 7, but as shown in FIG. good. In this case, each chip 3A
~3D lead wires are connected to emit light in series or parallel, but the heat dissipation effect is further improved. Moreover, if a light source device is constructed by attaching a plurality of semiconductor light emitting chips to the metal fin 7 instead of dividing one chip into a plurality of chips, a light source with a larger amount of light emission can be realized. Further, the shape of the metal fins 7 can be changed in various ways, as long as they can be attached to a ceramic plate on which a semiconductor light emitting chip can be attached.
（発明の効果）
以上のようにこの発明の光源装置によれば、半
導体発光チツプに対して直接的な放熱を行なうよ
うにしているので、短時間の一定電流パルスが入
力されたときにも発光量を安定化することができ
る。このため、画像出力装置等による仕上り画像
の濃度を完全なものとすることができ、高性能画
像出力装置を提供することが可能となる。(Effects of the Invention) As described above, according to the light source device of the present invention, heat is directly radiated to the semiconductor light emitting chip, so it emits light even when a short constant current pulse is input. The amount can be stabilized. Therefore, the density of the finished image produced by the image output device or the like can be made perfect, making it possible to provide a high-performance image output device.
第１図は従来の発光ダイオードの概略構造の一
例を示す断面構造図、第２図Ａ及びＢは従来の発
光ダイオードに電流を印加したときの発光量応答
例を説明するための図、第３図はこの発明の一実
施例を示す断面構造図、第４図はこの発明の半導
体光源に電流を印加したときの発光量の応答の例
を示す図、第５図は半導体発光チツプの一改善例
を示す図である。
１…金属ケース、２…レンズ、３…半導体発光
チツプ、４…絶縁板、５…リード線、６…放熱フ
イン、７…金属フイン、８…セラミツクス板、９
Ａ，９Ｂ…リード線、１０…ケース、１１…スト
ツパ。
FIG. 1 is a cross-sectional structure diagram showing an example of the schematic structure of a conventional light emitting diode, FIGS. 2A and B are diagrams for explaining an example of the light emission amount response when a current is applied to the conventional light emitting diode, and FIG. Figure 4 is a cross-sectional structural diagram showing one embodiment of the present invention, Figure 4 is a diagram showing an example of the response of the amount of light emitted when a current is applied to the semiconductor light source of the present invention, and Figure 5 is an improvement of the semiconductor light emitting chip. It is a figure which shows an example. DESCRIPTION OF SYMBOLS 1...Metal case, 2...Lens, 3...Semiconductor light emitting chip, 4...Insulating plate, 5...Lead wire, 6...Radiating fin, 7...Metal fin, 8...Ceramics plate, 9
A, 9B...Lead wire, 10...Case, 11...Stopper.
Claims (1)
られたレンズと、頂部に半導体発光チツプが装着
されると共に前記半導体発光チツプの一つの電極
リードを兼ねる金属フインと、この金属フインを
支持するセラミツクス板とから成り、前記セラミ
ツクス板が前記円筒形状ケース内に取着されてい
ることを特徴とする半導体光源装置。 ２ 前記半導体発光チツプが複数個に分離されて
設けられている特許請求の範囲第１項に記載の半
導体光源装置。 ３ 前記セラミツクス板の表面を黒色に着色した
特許請求の範囲第１項又は第２項に記載の半導体
光源装置。[Scope of Claims] 1. A cylindrical case, a lens provided on the top of the case, a metal fin on which a semiconductor light emitting chip is mounted and also serving as one electrode lead of the semiconductor light emitting chip, and this metal 1. A semiconductor light source device comprising: a ceramic plate supporting a fin, the ceramic plate being mounted within the cylindrical case. 2. The semiconductor light source device according to claim 1, wherein the semiconductor light emitting chip is separated into a plurality of pieces. 3. The semiconductor light source device according to claim 1 or 2, wherein the surface of the ceramic plate is colored black.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59108931A JPS60253284A (en) | 1984-05-29 | 1984-05-29 | Semiconductor light source device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59108931A JPS60253284A (en) | 1984-05-29 | 1984-05-29 | Semiconductor light source device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60253284A JPS60253284A (en) | 1985-12-13 |
| JPH0471349B2 true JPH0471349B2 (en) | 1992-11-13 |
Family
ID=14497282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59108931A Granted JPS60253284A (en) | 1984-05-29 | 1984-05-29 | Semiconductor light source device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60253284A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2751576B2 (en) * | 1990-06-14 | 1998-05-18 | 日立電線株式会社 | Light emitting diode / microchip mounting method |
| JP2002223007A (en) * | 2000-11-22 | 2002-08-09 | Matsushita Electric Ind Co Ltd | Light source unit and semiconductor light emitting illumination device using the same |
| US6481874B2 (en) * | 2001-03-29 | 2002-11-19 | Gelcore Llc | Heat dissipation system for high power LED lighting system |
| JP4740682B2 (en) * | 2005-08-01 | 2011-08-03 | 三菱電機株式会社 | LED lighting device |
-
1984
- 1984-05-29 JP JP59108931A patent/JPS60253284A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60253284A (en) | 1985-12-13 |
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