CN210109315U

CN210109315U - Laser radar heat abstractor

Info

Publication number: CN210109315U
Application number: CN201920578198.XU
Authority: CN
Inventors: 张庆舜; 疏达; 李�远
Original assignee: Benewake Beijing Co Ltd
Current assignee: Benewake Beijing Co Ltd
Priority date: 2019-04-25
Filing date: 2019-04-25
Publication date: 2020-02-21
Anticipated expiration: 2029-04-25

Abstract

The application relates to a laser radar heat dissipation technology, in particular to a laser radar heat dissipation device. The laser radar heat dissipation device comprises a radar element, a heat dissipation base and a PCB (printed circuit board), wherein the radar element and the PCB are arranged on one surface of the heat dissipation base, and the radar element is connected with the PCB through a metal wire. This application is connected the radar component is direct with the heat dissipation base, and the heat that the radar component produced is conducted away through the heat dissipation base, need not pass through PCB board conduction again, can satisfy the temperature rise situation of key components and parts for ambient temperature under the unchangeable condition of current power and heat radiation structure, and maneuverability is strong, and the suitability is strong.

Description

Laser radar heat abstractor

Technical Field

The utility model discloses the application relates to laser radar heat dissipation technology especially relates to a laser radar heat abstractor.

Background

At present, the laser radar is composed of an active light source, a beam shaping system, a receiving lens, a photosensitive element, a signal control unit and a data processing unit. The active light source emits signal light, and the photosensitive device is started simultaneously to calculate the time difference of the signal light returned by the detected obstacle (or indirectly by testing the modulation phase), so that the distance information of the obstacle can be calculated. In order to realize long-distance detection and detection of a large field angle (a horizontal field angle and a vertical field angle), the power value of the active light source is multiplied, and the performance of the emitting light source and the photosensitive element is greatly influenced by the heat dissipation problem.

In the existing heat dissipation method, the laser radar is provided with an emission light source, a photosensitive element and other elements on a PCB, the PCB is connected with a heat dissipation part, the emission light source, the photosensitive element and other elements are packaged independently, and heat generated by the emission light source and the photosensitive element is dissipated through the PCB and the heat dissipation part. In order to improve the heat dissipation efficiency, the copper coating rate of the PCB needs to be generally improved, and the heat conduction efficiency of the PCB to the heat dissipation part is increased. Under the heat dissipation mode, the heat of each element is conducted through the PCB, and the heat dissipation efficiency is low.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application lies in providing a laser radar heat abstractor, solves the lower problem of prior art radiating efficiency, for reaching this purpose, the utility model discloses the application embodiment adopts following technical scheme:

on the one hand, the laser radar heat dissipation device comprises a radar element, a heat dissipation base and a PCB (printed Circuit Board), wherein the radar element and the PCB are arranged on one surface of the heat dissipation base, and the radar element is connected with the PCB through a metal wire.

In a possible implementation manner, when the radar element is a laser or a photosensitive element or a diffusion element or a binary optical device, an encapsulation layer is arranged outside the radar element.

In a possible implementation manner, the encapsulation layer is a high temperature resistant resin layer or a glass-sealed inert gas.

In a possible implementation manner, the radar element is connected with the heat dissipation base in a welding or direct fixing mode.

In a possible realization, the direct fixing is a snap-fit or screw connection.

In a possible implementation manner, the laser is a VCSEL laser or an LD or a solid-state laser or a gas laser.

In a possible implementation manner, the heat dissipation base is an aluminum substrate or a heat dissipation fin.

In a possible implementation manner, when the heat dissipation base is an aluminum substrate, the aluminum substrate and the PCB are integrated.

In a possible implementation manner, the cross section of the heat dissipation fin is in a fan shape, a rectangular shape or a triangular shape.

In a possible implementation manner, the heat dissipation fins are arranged side by side.

This application embodiment is through being connected the radar component directly with the heat dissipation base, and the heat that the radar component produced is conducted away through the heat dissipation base, need not pass through the PCB board conduction again, can satisfy key components and parts for ambient temperature's temperature rise situation under the unchangeable condition of current power and heat radiation structure, and maneuverability is strong, and the suitability is strong.

Drawings

Fig. 1 is a front view of an embodiment of the present application.

Fig. 2 is a top view of an encapsulation layer according to an embodiment of the present application.

Fig. 3 is a cross-sectional view of an embodiment of the present application after applying a packaging layer.

In the figure: 1. a radar element; 2. a heat dissipation base; 3. a PCB circuit board; 4. a metal wire; 5. a packaging layer; 6. and (4) radiating fins.

Detailed Description

The technical scheme of the application is further explained by the specific implementation mode in combination with the attached drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, apparatus, article, or device that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or device.

As shown in fig. 1, a laser radar heat abstractor, includes radar component 1, heat dissipation base 2, PCB circuit board 3, radar component 1, PCB circuit board 3 set up on heat dissipation base 2 one side, radar component 1 is connected with PCB circuit board 3 through metal wire 4.

The radar element 1 in this embodiment is directly mounted on the heat-dissipating base 2, and the radar element 1 is connected to the PCB board 3 through the metal wire 4. The material of the metal wire 4 is preferably gold, copper or aluminum can be selected, the radar element 1 is connected with the PCB 3 through the metal wire 4, and the connection mode is preferably ball-shaped welding. At this moment, the heat power consumption generated by the radar element 1 is directly conducted to the peripheral heat dissipation base 2 through the bottom of the radar element 1, and under the condition that the power of the whole machine is certain, heat dissipation is not needed through the PCB 3, so that the influence of heat conduction of the PCB 3 is reduced, the effects of improving the heat dissipation efficiency and reducing the temperature of key elements are achieved, the service temperature of the whole machine is improved, and the service life of the radar element is prolonged.

In the prior art, when each radar element 1 is packaged independently, thermal resistance is introduced when each device is connected. According to the technical scheme, each radar element 1 is directly arranged on the heat dissipation base 2, so that thermal resistance is not required to be introduced, the structure is simplified, and the cost is reduced.

The radar element is divided into a device sensitive to the conventional environment and a device insensitive to the conventional environment.

For devices that are not sensitive to the normal environment, no encapsulation layer needs to be applied over the device.

As shown in fig. 2 and 3, the radar and the case are lasers or photosensitive elements or diffusion elements or binary optical devices, because the radar elements are sensitive to the normal environment, and an encapsulation layer 5 is disposed outside the radar elements.

The packaging layer 5 is a high-temperature-resistant resin layer or glass-sealed inert gas.

Adopt encapsulation layer 5, can completely cut off the influence of air to the radar component, guarantee radar component normal work.

The radar element 1 is connected with the heat dissipation base 2 through welding or direct fixing.

The direct fixation is clamping connection or screw connection.

The laser is a VCSEL laser, an LD laser, an LED laser, a solid laser or a gas laser.

The laser is fixed on the heat dissipation base 2 through welding, clamping or screw connection. Under the spiro union mode, the laser instrument can be dismantled.

The heat dissipation base 2 is an aluminum substrate or a heat dissipation fin.

The aluminum substrate is a PCB circuit board with an aluminum substrate and mainly bears an environment with high heat dissipation requirements.

When the heat dissipation base 2 is an aluminum substrate, the aluminum substrate and the PCB are integrated. The circuit can be directly printed on the aluminum substrate, and the function of a PCB is achieved.

The radiating fin comprises a plurality of radiating fins 6, and the cross section of each radiating fin 6 is fan-shaped, rectangular or triangular.

The radiating fins 6 are arranged side by side.

The technical principles of the present application have been described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the present application and is not to be construed in any way as limiting the scope of the application. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present application without inventive effort, which shall fall within the scope of the present application.

Claims

1. The laser radar heat dissipation device is characterized by comprising a radar element, a heat dissipation base and a PCB (printed circuit board), wherein the radar element and the PCB are arranged on one surface of the heat dissipation base, and the radar element is connected with the PCB through a metal wire.

2. The lidar heat sink of claim 1, wherein when the radar element is a laser, a photosensitive element, a diffusing element, or a binary optical device, an encapsulation layer is disposed outside the radar element.

3. The lidar heat sink of claim 2, wherein the encapsulation layer is a high temperature resistant resin layer or a glass-sealed inert gas.

4. The lidar heat sink of claim 2 or 3, wherein the radar element is coupled to the heat sink base by welding or direct attachment.

5. The lidar heat sink of claim 4, wherein the direct attachment is a snap or screw connection.

6. The lidar heat sink of claim 5, wherein the laser is a VCSEL laser or an LD or a solid laser or a gas laser.

7. The lidar heat dissipation device of claim 1, wherein the heat dissipation base is an aluminum substrate or a heat sink.

8. The lidar heat dissipation device of claim 7, wherein when the heat dissipation base is an aluminum substrate, the aluminum substrate is integrated with a PCB.

9. The lidar heat sink of claim 8, wherein the heat sink comprises fins having a cross-sectional shape of a sector, a rectangle, or a triangle.

10. The lidar heat sink of claim 9, wherein the fins are arranged side-by-side.